High-vacuum transmission valve for semiconductor CVD (Chemical Vapor Deposition) equipment

Abstract

The utility model discloses a high vacuum transfer valve for semiconductor CVD (chemical vapor deposition) equipment, which relates to the technical field of semiconductor manufacturing and comprises a valve body and a connecting component, a side connector is arranged on the right surface of the upper end of the valve body, a lower connector is arranged at the bottom of the valve body, and the connecting component is arranged on the surface of the side connector. And the connecting assembly comprises threaded mounting grooves, threaded mounting rings, a connecting pipe, a sealing clamping pipe, a cross-shaped opening dustproof film, reinforcing rings and reinforcing bolts, the threaded mounting grooves are formed in the right surface of the side connecting opening and the lower surface of the lower connecting opening, and the threaded mounting rings are in threaded connection with the inner sides of the threaded mounting grooves. According to the high-vacuum transmission valve for the semiconductor CVD equipment, rapid connection between the valve body and the connecting pipe can be achieved through the connecting assembly, connection is stable and not prone to loosening, the overall stability is improved, automatic pressure relief can be achieved through the pressure relief assembly when the pressure is too large, and the high-vacuum transmission valve is convenient to use. And pressure relief or gas flow control can be realized at any time through the pneumatic telescopic rod.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a high vacuum transmission valve for semiconductor CVD equipment. Background Art

[0002] Semiconductor CVD equipment is an important manufacturing tool in the semiconductor industry. It deposits materials on substrates through chemical vapor deposition technology to manufacture semiconductor devices. The vacuum transfer valve is an indispensable part of semiconductor CVD equipment. Its function is to control gas flow and pressure to ensure the normal operation of semiconductor equipment. However, the current vacuum transfer valve still has the following shortcomings:

[0003] For example, the patent document with application number 202022987891.8 discloses a vacuum valve with compensation function. The vacuum valve with compensation function can automatically compensate for the gap between the valve head and the valve port, ensure good sealing between the valve head and the valve port, avoid the reduction of the vacuum degree between the inner and outer tanks, and avoid the reduction of the thermal insulation performance of the inner tank. However, it is not convenient to quickly connect with the connecting pipe, and the connection is not stable enough, which easily causes gas leakage, resulting in its inability to be used normally.

[0004] Therefore, in view of this, the existing structural deficiencies are studied and improved, and a high vacuum transfer valve for semiconductor CVD equipment is proposed. Utility Model Content

[0005] The utility model aims to provide a high vacuum transfer valve for semiconductor CVD equipment to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high vacuum transfer valve for semiconductor CVD equipment, comprising a valve body and a connecting assembly, a side connecting port is arranged on the right surface of the upper end of the valve body, a lower connecting port is arranged on the bottom of the valve body, the connecting assembly is arranged on the surface of the side connecting port, and the connecting assembly comprises a threaded mounting groove, a threaded mounting ring, a connecting pipe, a sealing clamping pipe, a cross-opening dustproof film, a reinforcement ring and a reinforcement bolt, the threaded mounting groove is opened on the right surface of the side connecting port and the lower surface of the lower connecting port, and a threaded mounting ring is threadedly connected to the inner side of the threaded mounting groove, a connecting pipe is installed on the outer end of the threaded mounting ring, and a sealing clamping pipe is arranged on the inner end surface of the connecting pipe, and the sealing clamping pipe is clamped and connected with the inner side of the side connecting port and the inner side of the lower connecting port.

[0007] Furthermore, a cross-opening dust-proof film is provided on the inner side of the outer end of the side connection port and the lower connection port, and a reinforcement ring is provided on the outer surface of the side connection port and the lower connection port.

[0008] Furthermore, the reinforcement ring is a hard steel structure, and reinforcement bolts are provided on the surface of the reinforcement ring.

[0009] Furthermore, the valve body is an integrally formed steel structure, and a pressure relief component for automatic pressure relief is arranged inside the valve body.

[0010] Furthermore, the pressure relief assembly includes a main connecting rod, a movable cavity, a fixed baffle ring, a high-pressure spring, a secondary connecting rod, a movable baffle ring, a sealing baffle and an elastic sealing ring, and the main connecting rod is slidably connected to the inner side of the upper end of the valve body, and a movable cavity is opened at the lower end of the main connecting rod, and a fixed baffle ring is installed at the lower end of the inner side of the movable cavity.

[0011] Furthermore, a high-pressure spring is arranged on the inner upper surface of the movable cavity, and a secondary connecting rod is installed at the bottom of the high-pressure spring, and a movable retaining ring is arranged on the upper end surface of the secondary connecting rod.

[0012] Furthermore, a sealing baffle is installed at the bottom of the auxiliary connecting rod, and an elastic sealing ring is connected to the outer surface of the sealing baffle.

[0013] Furthermore, a pneumatic telescopic rod is installed on the top of the valve body, and the bottom of the pneumatic telescopic rod is connected to the upper surface of the main connecting rod.

[0014] The utility model provides a high vacuum transfer valve for semiconductor CVD equipment, which has the following beneficial effects:

[0015] 1. The utility model provides a connecting component, which includes a threaded mounting groove, a threaded mounting ring, a connecting pipe, a sealing clamping pipe, a cross-opening dustproof film, a reinforcement ring and a reinforcement bolt. When in use, the connecting pipe is connected to the side connecting port and the lower connecting port of the valve body through the threaded connection of the threaded mounting ring and the threaded mounting groove. At the same time, the sealing clamping pipe passes through the cross-opening dustproof film and is engaged with the inner side of the side connecting port and the lower connecting port. The reinforcement ring is then fixed to the surface of the side connecting port and the lower connecting port by the reinforcement bolt to further reinforce the connection. The cross-opening dustproof film has a dustproof effect and has great elasticity. After the connecting pipe is disassembled, the cross-opening dustproof film can rebound and reset, so that the device can realize the rapid connection between the valve body and the connecting pipe, and the connection is firm and not easy to loosen, thereby improving the overall stability.

[0016] 2. The utility model provides a pressure relief component, which includes a main connecting rod, a movable cavity, a fixed baffle ring, a high-pressure spring, a secondary connecting rod, a movable baffle ring, a sealing baffle plate and an elastic sealing ring. When in use, when the pressure in the connected pipe is too large, the air pressure will compress the sealing baffle plate to lift, and at this time, the secondary connecting rod will be driven to move upward along the inner side of the movable cavity, so that the high-pressure spring will be compressed and contracted, so that the pressure can be released from the lower connecting port to the side connecting port. After the pressure is restored, the high-pressure spring rebounds, driving the secondary connecting rod to reset downward along the inner side of the movable cavity, and then driving the sealing baffle plate to reset and seal the inner side of the lower connecting port. The elastic sealing ring can improve the sealing performance. When the pneumatic telescopic rod drives the main connecting rod to rise, the movable baffle ring resists the fixed baffle ring, which can drive the secondary connecting rod to continue to rise, and then drive the sealing baffle plate to rise and release the pressure, so that the device can realize automatic pressure relief when the pressure is too large, and can also realize pressure relief or control of gas flow at any time through the pneumatic telescopic rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional structural diagram of a connection assembly of a high vacuum transfer valve for semiconductor CVD equipment of the utility model;

[0018] Figure 2 This is a three-dimensional structural schematic diagram of a high vacuum transfer valve for semiconductor CVD equipment of the utility model;

[0019] Figure 3 This is a schematic diagram of a three-dimensional cross-sectional structure of a valve body of a high vacuum transfer valve for semiconductor CVD equipment of the utility model;

[0020] Figure 4 The utility model is a schematic diagram of the three-dimensional structure of a pressure relief component of a high vacuum transfer valve for semiconductor CVD equipment.

[0021] In the figure: 1. valve body; 2. side connection port; 3. lower connection port; 4. connection assembly; 401. threaded mounting groove; 402. threaded mounting ring; 403. connecting pipe; 404. sealing clamp pipe; 405. cross-opening dust-proof membrane; 406. reinforcement ring; 407. reinforcement bolt; 5. pressure relief assembly; 501. main connecting rod; 502. movable cavity; 503. fixed retaining ring; 504. high-pressure spring; 505. auxiliary connecting rod; 506. movable retaining ring; 507. sealing baffle; 508. elastic sealing ring; 6. pneumatic telescopic rod. DETAILED DESCRIPTION

[0022] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0023] like Figures 1 to 4As shown, a high vacuum transfer valve for semiconductor CVD equipment includes a valve body 1 and a connecting component 4. A side connecting port 2 is provided on the right surface of the upper end of the valve body 1, and a lower connecting port 3 is provided at the bottom of the valve body 1. The connecting component 4 is provided on the surface of the side connecting port 2, and the connecting component 4 includes a threaded mounting groove 401, a threaded mounting ring 402, a connecting pipe 403, a sealing clamping pipe 404, a cross-opening dustproof film 405, a reinforcement ring 406 and a reinforcement bolt 407. The threaded mounting groove 401 is opened on the right surface of the side connecting port 2 and the lower surface of the lower connecting port 3, and the threaded mounting ring 402 is threadedly connected to the inner side of the threaded mounting groove 401, and a connecting pipe 403 is installed on the outer end of the threaded mounting ring 402, and a sealing clamping pipe 404 is provided on the inner end surface of the connecting pipe 403, and the sealing clamping pipe 404 is clamped and connected with the inner side of the side connecting port 2 and the inner side of the lower connecting port 3.

[0024] The specific operation is as follows. When in use, the connecting pipe 403 is connected to the side connecting port 2 and the lower connecting port 3 of the valve body 1 through the threaded connection between the threaded mounting ring 402 and the threaded mounting groove 401. At the same time, the sealing clamping pipe 404 passes through the cross-opening dust-proof film 405 and is engaged with the inner side of the side connecting port 2 and the lower connecting port 3. The reinforcing ring 406 is then fixed to the surface of the side connecting port 2 and the lower connecting port 3 through the reinforcing bolt 407 to further strengthen the connection.

[0025] Please refer to Figure 1 to Figure 2 A cross-opening dust-proof film 405 is provided on the inner side of the outer end of the side connection port 2 and the lower connection port 3, and a reinforcement ring 406 is provided on the outer surface of the side connection port 2 and the lower connection port 3. The reinforcement ring 406 is a hard steel structure, and a reinforcement bolt 407 is provided on the surface of the reinforcement ring 406. A pneumatic telescopic rod 6 is installed on the top of the valve body 1, and the bottom of the pneumatic telescopic rod 6 is connected to the upper surface of the main connecting rod 501;

[0026] The specific operation is as follows: when in use, the cross-opening dustproof membrane 405 has a dust-proof effect and has great elasticity. After the connecting tube 403 is disassembled, the cross-opening dustproof membrane 405 can rebound and reset, and the pneumatic telescopic rod 6 is started to drive the main connecting rod 501 to rise and fall, and then drive the sealing baffle 507 to rise and fall through the secondary connecting rod 505, thereby realizing the function of controlling gas flow and pressure.

[0027] Please refer to Figure 4The valve body 1 is an integrally formed steel structure, and a pressure relief assembly 5 for automatic pressure relief is arranged inside the valve body 1, and the pressure relief assembly 5 includes a main connecting rod 501, an active cavity 502, a fixed baffle ring 503, a high-pressure spring 504, a secondary connecting rod 505, a movable baffle ring 506, a sealing baffle plate 507 and an elastic sealing ring 508, and the main connecting rod 501 is slidably connected to the inner side of the upper end of the valve body 1, and an active cavity 502 is opened at the lower end of the main connecting rod 501, and a fixed baffle ring 503 is installed at the lower end of the inner side of the active cavity 502, a high-pressure spring 504 is arranged on the upper surface of the inner side of the active cavity 502, and a secondary connecting rod 505 is installed at the bottom of the high-pressure spring 504, and a movable baffle ring 506 is arranged on the upper end surface of the secondary connecting rod 505, a sealing baffle plate 507 is installed at the bottom of the secondary connecting rod 505, and an elastic sealing ring 508 is connected to the outer surface of the sealing baffle plate 507;

[0028] The specific operation is as follows. During use, when the pressure in the connected pipe is too high, the air pressure will compress the sealing baffle 507 to lift up. At this time, it will drive the secondary connecting rod 505 to move upward along the inner side of the movable cavity 502, causing the high-pressure spring 504 to shrink under pressure, so that the pressure can be released from the lower connecting port 3 to the side connecting port 2. After the pressure is restored, the high-pressure spring 504 rebounds, driving the secondary connecting rod 505 to reset downward along the inner side of the movable cavity 502, thereby driving the sealing baffle 507 to reset and seal the inner side of the lower connecting port 3. The elastic sealing ring 508 can improve the sealing performance. When the pneumatic telescopic rod 6 drives the main connecting rod 501 to rise, when the movable baffle ring 506 resists the fixed baffle ring 503, it can drive the secondary connecting rod 505 to continue to rise, thereby driving the sealing baffle 507 to rise and release pressure.

[0029] In summary, if Figures 1 to 4As shown, the high vacuum transfer valve for semiconductor CVD equipment is used. First, the connecting pipe 403 is connected to the side connecting port 2 and the lower connecting port 3 of the valve body 1 through the threaded connection of the threaded mounting ring 402 and the threaded mounting groove 401. At the same time, the sealing clamping pipe 404 passes through the cross-opening dustproof film 405 and is engaged with the inner side of the side connecting port 2 and the lower connecting port 3. Then, the reinforcing ring 406 is fixed to the surface of the side connecting port 2 and the lower connecting port 3 through the reinforcing bolt 407 to further strengthen the connection. The cross-opening dustproof film 405 has a dustproof effect and has a large elasticity. After the connecting pipe 403 is disassembled, the cross-opening dustproof film 405 can rebound and reset. When the pressure in the connected pipeline is too large, the air pressure will compress the sealing baffle. When the spring 507 is lifted, the secondary connecting rod 505 will be driven to move upward along the inner side of the movable cavity 502, so that the high-pressure spring 504 will be compressed and contracted, so that the pressure can be released from the lower connecting port 3 to the side connecting port 2. After the pressure is restored, the high-pressure spring 504 rebounds, driving the secondary connecting rod 505 to return downward along the inner side of the movable cavity 502, thereby driving the sealing baffle 507 to return to its original position, and sealing the inner side of the lower connecting port 3. The elastic sealing ring 508 can improve the sealing performance, and the pneumatic telescopic rod 6 is started. When the pneumatic telescopic rod 6 drives the main connecting rod 501 to rise, when the movable baffle ring 506 resists the fixed baffle ring 503, it can drive the secondary connecting rod 505 to continue to rise, thereby driving the sealing baffle 507 to rise and release the pressure, thereby achieving the function of controlling the gas flow and pressure.

[0030] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A high vacuum transfer valve for semiconductor CVD equipment, comprising a valve body (1) and a connecting assembly (4), Features: The right surface of the upper end of the valve body (1) is provided with a side connection port (2), and the bottom of the valve body (1) is provided with a lower connection port (3). The connection component (4) is provided on the surface of the side connection port (2), and the connection component (4) comprises a threaded mounting groove (401), a threaded mounting ring (402), a connection pipe (403), a sealing clamping pipe (404), a cross-opening dustproof film (405), a reinforcement ring (406) and a reinforcement bolt (407). The threaded mounting groove (401) is provided on the right surface of the side connection port (2) and the lower surface of the lower connection port (3), and the inner side of the threaded mounting groove (401) is threadedly connected with a threaded mounting ring (402). The outer end of the threaded mounting ring (402) is provided with a connection pipe (403), and the inner end surface of the connection pipe (403) is provided with a sealing clamping pipe (404), and the sealing clamping pipe (404) is snap-fitted and connected with the inner side of the side connection port (2) and the inner side of the lower connection port (3).

2. A high vacuum transfer valve for semiconductor CVD equipment according to claim 1, It is characterized in that A cross-opening dustproof film (405) is provided on the inner side of the outer ends of the side connection port (2) and the lower connection port (3), and a reinforcement ring (406) is provided on the outer surface of the side connection port (2) and the lower connection port (3).

3. A high vacuum transfer valve for semiconductor CVD equipment according to claim 1, It is characterized in that The reinforcement ring (406) is a hard steel structure, and a reinforcement bolt (407) is arranged on the surface of the reinforcement ring (406).

4. A high vacuum transfer valve for semiconductor CVD equipment according to claim 1, It is characterized in that The valve body (1) is an integrally formed steel structure, and a pressure relief component (5) for automatic pressure relief is arranged inside the valve body (1).

5. A high vacuum transfer valve for semiconductor CVD equipment according to claim 4, It is characterized in that The pressure relief assembly (5) comprises a main connecting rod (501), a movable cavity (502), a fixed baffle ring (503), a high-pressure spring (504), a secondary connecting rod (505), a movable baffle ring (506), a sealing baffle plate (507) and an elastic sealing ring (508), wherein the main connecting rod (501) is slidably connected to the inner side of the upper end of the valve body (1), the lower end of the main connecting rod (501) is provided with a movable cavity (502), and the lower end of the inner side of the movable cavity (502) is installed with a fixed baffle ring (503).

6. A high vacuum transfer valve for semiconductor CVD equipment according to claim 5, It is characterized in that A high-pressure spring (504) is arranged on the inner upper surface of the movable cavity (502), and a secondary connecting rod (505) is installed at the bottom of the high-pressure spring (504), and a movable retaining ring (506) is arranged on the upper end surface of the secondary connecting rod (505).

7. A high vacuum transfer valve for semiconductor CVD equipment according to claim 6, It is characterized in that A sealing baffle (507) is installed at the bottom of the secondary connecting rod (505), and an elastic sealing ring (508) is connected to the outer surface of the sealing baffle (507).

8. The high vacuum transfer valve for semiconductor CVD equipment according to claim 1, It is characterized in that A pneumatic telescopic rod (6) is installed on the top of the valve body (1), and the bottom of the pneumatic telescopic rod (6) is connected to the upper surface of the main connecting rod (501).

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