Plastic packaging device for chip production

Abstract

The utility model discloses a plastic packaging device for chip production, which comprises a case, an injection molding cover is fixedly arranged in the middle of the upper part of the case, the upper end of the injection molding cover is connected with an injection molding pipe, the lower part of the inner side of the injection molding cover is provided with a plurality of injection molding heads, and the lower wall of the inner side of the upper part of the case is connected with a material bearing plate through an adjusting structure. According to the plastic packaging device for chip production, through the combined action of the spring, the pressing plate, the scraping plate and the waste material groove, after a chip on the material bearing plate is subjected to injection molding through the injection molding head, the upper surface of the chip is likely to protrude to form a cambered surface due to excessive injection molding, and after injection molding, the bearing plate continues to move forwards along with the material bearing plate; when the material bearing plate moves to the position of the scraper, the pressing plate makes contact with the scraper, the material bearing plate moves downwards under the action of the bottom plate and the four springs, the upper surface of the material bearing plate makes contact with the scraper, redundant materials on the upper surface of the material bearing plate are scraped away, and the scraper scrapes the redundant materials into a waste box on the rear portion of the material bearing plate when the material bearing plate passes through.

Description

Technical Field

[0001] The utility model relates to the field of chip processing, in particular to a plastic sealing device for chip production. Background Art

[0002] In the field of integrated circuit technology, chip packaging is one of the most basic processes, and chip packaging is divided into many types. According to the nature of the packaging materials, it often includes plastic packaging, ceramic packaging, and metal packaging, etc. Among them, plastic packaging is a packaging structure with low cost, simple process, and high reliability. It is often used in the field of consumer electronics and has the highest market share;

[0003] In the existing chip injection packaging device, during the injection molding process, the injection port may not be closed in time after the injection molding is completed, causing too much material to flow out, resulting in too much injection material on the chip, forming an arc surface on the chip surface, and the thickness of the existing injection mold cannot be changed. It is not suitable for chips of different thicknesses, and the thickness of the discharge trough cannot be adjusted according to the required injection amount. Utility Model Content

[0004] The main purpose of the utility model is to provide a plastic packaging device for chip production, which can effectively solve the technical problems in the background technology.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A plastic packaging device for chip production, comprising a chassis, an injection molding cover is fixedly installed in the middle position of the upper part of the chassis, an injection molding tube is connected to the upper end of the injection molding cover, a plurality of injection molding heads are arranged at the lower inner part of the injection molding cover, and a material receiving plate is connected to the lower inner wall of the upper inner part of the chassis through an adjusting structure;

[0007] The adjustment structure includes a receiving plate, which is movably mounted on the lower wall on the inner side of the upper part of the chassis. Four springs are provided on the upper part of the receiving plate. The upper parts of the four springs are fixedly connected to connecting blocks. The upper parts of the four springs are detachably mounted with a bottom plate. Four studs penetrate the bottom plate, and the other ends of the four studs are fixedly connected to the receiving plate.

[0008] As a further solution of the utility model, one side of the chassis is rotatably connected to a screw via two connecting seats, one end of the screw is provided with an output motor, the other side of the chassis is fixedly connected to a guide rod via two connecting seats, the two sides of the receiving plate are connected to the screw and the guide rod via connecting plates, and the connecting plates connected to the screw and the screw are threadedly connected.

[0009] As a further solution of the utility model, the upper ends of the four springs are fixedly mounted with connecting blocks, the lower part of the base plate is provided with four mounting grooves at positions corresponding to the four connecting blocks, and the four connecting blocks are respectively located in the four mounting grooves.

[0010] As a further solution of the utility model, a scraper structure is provided at the front of the material receiving plate, and the scraper structure includes a scraper and a pressure plate. The pressure plate is fixedly connected to the front of the material receiving plate, and the scraper is located on the inner side of the upper part of the chassis, and the two ends of the scraper are fixedly connected to the two walls on the inner side of the upper part of the chassis.

[0011] As a further solution of the utility model, a waste box is fixedly connected to the rear portion of the receiving plate.

[0012] As a further solution of the utility model, a plurality of material discharging troughs are provided on the upper part of the material receiving plate, a plurality of columns are provided on the upper part of the bottom plate, and the columns correspond to the positions of the material discharging troughs and are adaptively matched.

[0013] As a further solution of the utility model, the outsides of the four studs are all threadedly connected with nuts, and the nuts are located at the lower part of the bottom plate.

[0014] The beneficial effects of the utility model are as follows:

[0015] The utility model sets a spring, and the pressure plate, the scraper plate and the waste material groove work together. After the chip on the material receiving plate is injected by the injection molding head, the upper surface may be raised to form an arc surface due to excessive injection molding. After the injection molding, the receiving plate continues to move the material receiving plate forward. When it moves to the position of the scraper plate, the pressure plate contacts the scraper plate. The material receiving plate moves downward under the action of the bottom plate and four springs, so that the upper surface of the material receiving plate contacts the scraper plate, and the excess material on the upper surface of the material receiving plate is scraped off. When the material receiving plate passes by, the scraper plate scrapes the excess material into the waste material box at the rear of the material receiving plate.

[0016] By rotating the nuts outside the four studs, the position of the base plate that fits with the upper part of the nuts can be moved up and down, and the columns arranged on the upper part of the base plate are adaptively matched with the discharge groove of the receiving plate. Therefore, when the height of the base plate is changed, the distance between the upper surface of the base plate columns and the upper surface of the receiving plate is changed, and finally the thickness of the discharge groove of the receiving plate is changed, so that the device can adjust the thickness of the discharge groove according to the required injection molding amount, thereby improving practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of a plastic packaging device for chip production according to the utility model;

[0018] Figure 2 This is an enlarged view of a material receiving plate of a plastic sealing device for chip production according to the utility model;

[0019] Figure 3This is a cross-sectional view of a material receiving plate of a plastic sealing device for chip production according to the utility model;

[0020] Figure 4 This is a rear view of the overall structure of a plastic packaging device for chip production according to the utility model;

[0021] Figure 5 The utility model is a cross-sectional view of a chassis of a plastic packaging device for chip production.

[0022] In the figure: 1. chassis; 2. injection molding cover; 3. injection molding tube; 4. connecting seat; 5. screw; 6. output motor; 7. receiving plate; 8. scraper structure; 9. receiving plate; 10. scraper; 11. waste box; 12. connecting plate; 13. pressure plate; 14. spring; 15. adjustment structure; 16. bottom plate; 17. stud; 18. nut; 19. connecting block; 20. guide rod; 21. injection molding head. DETAILED DESCRIPTION

[0023] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0024] like Figure 1-5 As shown, a plastic packaging device for chip production includes a chassis 1, an injection molding cover 2 is fixedly installed in the middle position of the upper part of the chassis 1, an injection molding tube 3 is connected to the upper end of the injection molding cover 2, a plurality of injection molding heads 21 are arranged at the lower inner part of the injection molding cover 2, and a material receiving plate 7 is connected to the lower wall of the upper inner side of the chassis 1 through an adjusting structure 15;

[0025] The adjustment structure 15 includes a receiving plate 9, which is movably mounted on the lower wall of the inner upper part of the chassis 1. Four springs 14 are provided on the upper part of the receiving plate 9. The upper parts of the four springs 14 are fixedly connected with connecting blocks 19. The upper parts of the four springs 14 are detachably mounted with a bottom plate 16. The bottom plate 16 is penetrated by four studs 17, and the other ends of the four studs 17 are fixedly connected to the receiving plate 7.

[0026] In this embodiment, one side of the chassis 1 is rotatably connected to a screw rod 5 through two connecting seats 4, one end of the screw rod 5 is provided with an output motor 6, and the other side of the chassis 1 is fixedly connected to a guide rod 20 through two connecting seats 4. The two sides of the receiving plate 9 are connected to the screw rod 5 and the guide rod 20 through connecting plates 12, and the connecting plates 12 connected to the screw rod 5 and the screw rod 5 are threadedly connected.

[0027] Start the output motor 6 to drive the screw 5 to rotate. The receiving plate 9 is threadedly connected to the screw 5 through the connecting plate 12. Therefore, as the screw 5 rotates, the receiving plate 9 will drive the upper receiving plate 7 to move forward, so that the receiving plate 7 can inject the chip through the injection molding cover 2, and then carry out subsequent work.

[0028] In this embodiment, a connection block 19 is fixedly mounted on the upper ends of the four springs 14 , and four installation grooves are provided at the lower portion of the base plate 16 at positions corresponding to the four connection blocks 19 , and the four connection blocks 19 are respectively located in the four installation grooves.

[0029] When the receiving plate 9 moves with the receiving plate 7 and the chip processing on the receiving plate 7 is completed, the bottom plate 16 and the receiving plate 7 are removed to wait for the molded chips to solidify, and another bottom plate 16 connected to the receiving plate 7 is installed on the device to continue the chip injection work.

[0030] In this embodiment, a scraper structure 8 is provided at the front of the material receiving plate 7, and the scraper structure 8 includes a scraper 10 and a pressure plate 13. The pressure plate 13 is fixedly connected to the front of the material receiving plate 7, and the scraper 10 is located on the inner side of the upper part of the chassis 1, and the two ends of the scraper 10 are fixedly connected to the two walls on the inner side of the upper part of the chassis 1.

[0031] After the chip on the receiving plate 7 is injection molded by the injection molding head 21, the upper surface may be raised to form an arc surface due to excessive injection molding. After injection molding, the receiving plate 9 continues to move the receiving plate 7 forward. When it moves to the position of the scraper 10, the pressure plate 13 contacts the scraper 10. Since the pressure plate 13 is wedge-shaped and four springs 14 are provided between the bottom plate 16 and the receiving plate 9, the receiving plate 7 will move downward under the action of pressure, so that the upper surface of the receiving plate 7 contacts the scraper 10, and the excess material on the upper surface of the receiving plate 7 is scraped off.

[0032] In this embodiment, a waste box 11 is fixedly connected to the rear of the receiving plate 7 .

[0033] When the material receiving plate 7 passes by, the scraper 10 scrapes the excess material into the waste box 11 at the rear of the material receiving plate 7 .

[0034] In this embodiment, a plurality of material discharging troughs are provided on the upper portion of the material receiving plate 7, and a plurality of upright posts are provided on the upper portion of the bottom plate 16, and the upright posts correspond to the positions of the material discharging troughs and are adaptively matched.

[0035] In this embodiment, the exteriors of the four studs 17 are all threadedly connected with nuts 18 , and the nuts 18 are located at the lower portion of the bottom plate 16 .

[0036] By rotating the nuts 18 outside the four studs 17, the position of the base plate 16 that is in contact with the upper part of the nuts 18 moves up and down, and the columns arranged on the upper part of the base plate 16 are adaptively matched with the discharge groove of the receiving plate 7. Therefore, when the height of the base plate 16 is changed, the distance between the upper surface of the columns of the base plate 16 and the upper surface of the receiving plate 7 is changed, and finally the thickness of the discharge groove of the receiving plate 7 is changed.

[0037] It should be noted that the utility model is a plastic sealing device for chip production. When in use, the nuts 18 outside the four studs 17 are rotated according to the thickness of the chip to be injected, so that the position of the bottom plate 16 that is in contact with the upper part of the nuts 18 moves up and down, and the columns arranged on the upper part of the bottom plate 16 are adaptively matched with the discharge groove of the receiving plate 7. Therefore, when the height of the bottom plate 16 is changed, the distance between the upper surface of the columns of the bottom plate 16 and the upper surface of the receiving plate 7 is changed, and finally the thickness of the discharge groove of the receiving plate 7 is changed, and the chip is placed in the discharge groove of the receiving plate 7, and the external machine is started to fill the injection material into the injection tube 3, and the output motor 6 is started. The output motor 6 drives the screw rod 5 to rotate, and the receiving plate 9 is threadedly connected to the screw 5 through the connecting plate 12. Therefore, as the screw 5 rotates, the receiving plate 9 will drive the upper receiving plate 7 to move forward, so that the receiving plate 7 passes through the injection cover 2 to perform injection molding on the chip;

[0038] After the chip on the receiving plate 7 is injection molded by the injection molding head 21, the upper surface may be raised to form an arc surface due to excessive injection molding. After the injection molding, the receiving plate 9 continues to move the receiving plate 7 forward. When it moves to the position of the scraper 10, the pressure plate 13 contacts the scraper 10. Since the pressure plate 13 is wedge-shaped and four springs 14 are arranged between the bottom plate 16 and the receiving plate 9, the receiving plate 7 will move downward under the action of pressure, so that the upper surface of the receiving plate 7 contacts the scraper 10, and the excess material on the upper surface of the receiving plate 7 is scraped off. When the receiving plate 7 passes by, the scraper 10 scrapes the excess material into the waste box 11 at the rear of the receiving plate 7;

[0039] After the receiving plate 9 moves with the receiving plate 7 to process the chips on the receiving plate 7, the bottom plate 16 and the receiving plate 7 are removed to wait for the chips after injection molding to solidify, and another bottom plate 16 connected to the receiving plate 7 is installed on the device to continue the chip injection molding work.

[0040] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A plastic packaging device for chip production, characterized in that: It comprises a chassis (1), an injection molding cover (2) is fixedly installed at the middle position of the upper part of the chassis (1), the upper end of the injection molding cover (2) is connected to an injection molding tube (3), the lower inner part of the injection molding cover (2) is provided with a plurality of injection molding heads (21), and the lower inner wall of the upper part of the chassis (1) is connected to a material receiving plate (7) via an adjustment structure (15); The adjustment structure (15) comprises a receiving plate (9), the receiving plate (9) being movably mounted on the lower wall of the inner side of the upper part of the chassis (1), the upper part of the receiving plate (9) being provided with four springs (14), the upper parts of the four springs (14) being fixedly connected with connecting blocks (19), the upper parts of the four springs (14) being detachably mounted with a bottom plate (16), the bottom plate (16) being penetrated by four studs (17), and the other ends of the four studs (17) being fixedly connected with the receiving plate (7).

2. A chip production plastic packaging device according to claim 1, characterized in that: One side of the chassis (1) is rotatably connected to a screw rod (5) via two connecting seats (4); one end of the screw rod (5) is provided with an output motor (6); the other side of the chassis (1) is fixedly connected to a guide rod (20) via the two connecting seats (4); both sides of the receiving plate (9) are connected to the screw rod (5) and the guide rod (20) via connecting plates (12); and the connecting plates (12) connected to the screw rod (5) and the screw rod (5) are threadedly connected.

3. A chip production plastic packaging device according to claim 1, characterized in that: A connecting block (19) is fixedly mounted on the upper ends of the four springs (14), and four mounting grooves are arranged at positions of the lower part of the base plate (16) corresponding to the four connecting blocks (19), and the four connecting blocks (19) are respectively located in the four mounting grooves.

4. The chip production plastic packaging device according to claim 1, characterized in that: A scraper structure (8) is provided at the front of the material receiving plate (7), and the scraper structure (8) comprises a scraper plate (10) and a pressure plate (13). The pressure plate (13) is fixedly connected to the front of the material receiving plate (7). The scraper plate (10) is located on the inner side of the upper part of the chassis (1), and the two ends of the scraper plate (10) are fixedly connected to the two walls on the inner side of the upper part of the chassis (1).

5. A chip production plastic packaging device according to claim 4, characterized in that: A waste box (11) is fixedly connected to the rear portion of the material receiving plate (7).

6. The chip production plastic packaging device according to claim 1, characterized in that: The upper part of the material receiving plate (7) is provided with a plurality of material discharging troughs, and the upper part of the bottom plate (16) is provided with a plurality of upright posts, and the upright posts correspond to the positions of the material discharging troughs and are adaptively matched.

7. The chip production plastic packaging device according to claim 1, characterized in that: The outsides of the four studs (17) are all threadedly connected with nuts (18), and the nuts (18) are located at the lower part of the bottom plate (16).

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