Wafer mapping mechanism

Abstract

The utility model belongs to the technical field of semiconductor detection, and discloses a wafer mapping mechanism. The wafer mapping mechanism comprises a rack, an upper supporting plate, an in-situ detection assembly, a reflection sensor and a driving mechanism. The upper supporting plate is arranged on the rack, the in-place detection assembly is arranged on the upper supporting plate, and the driving mechanism drives the reflection sensor located at the output end of the driving mechanism to move in the height direction of the wafer container to conduct wafer detection after the in-place detection assembly detects that the wafer container is placed on the upper supporting plate. According to the wafer mapping mechanism, wafer mapping can be carried out by using the reflection sensor, and the reflection sensor and the wafer can be arranged at an interval, so that the wafer is prevented from being scratched; meanwhile, by arranging the in-place detection assembly and the driving mechanism, after the in-place detection assembly detects that the wafer container is placed, the driving mechanism drives the reflection sensor to move in the height direction of the wafer container and detects the wafer to complete wafer mapping, that is, the wafer mapping can be automatically completed after the wafer container is placed, manual operation is reduced, and the working efficiency is improved. And convenience and rapidness are realized.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor detection, in particular to a wafer mapping mechanism. Background Art

[0002] Wafers need to be processed during semiconductor production, and wafer mapping is required during wafer processing. Wafer mapping refers to the use of sensors to detect the status of each layer in the wafer box, which serves as the basis for the wafer robot to pick up and place the wafer. At the same time, it is also used to detect whether there is any abnormal placement of the wafer in the wafer box, so as to perform corresponding prompt processing or treatment measures. To realize the wafer mapping function, the corresponding wafer detection system needs to detect the wafer storage status inside the wafer cassette.

[0003] The common wafer mapping method in the prior art is to use the front end of the robotic arm to map the wafer from both sides of the wafer. This method has the risk of the robotic arm being too close to the wafer and easily scratching the wafer. In addition, the wafer mapping equipment in the prior art requires manual operation, making it difficult to automate wafer mapping and complicated to use. Utility Model Content

[0004] The utility model aims to provide a wafer mapping mechanism to avoid scratching the wafer during wafer inspection and automatically complete wafer mapping after placing the wafer container, which is more convenient and quick.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A wafer mapping mechanism, characterized by comprising:

[0007] frame;

[0008] An upper support plate is provided on the frame and is used to carry the wafer container;

[0009] An in-situ detection component is provided on the upper support plate and is used to detect whether a wafer container is placed on the upper support plate, and a plurality of wafers are placed at intervals along the height direction of the wafer container;

[0010] A reflective sensor for detecting the position of the wafer;

[0011] The driving mechanism, the reflection sensor is connected to the output end of the driving mechanism, the driving mechanism is communicatively connected with the in-situ detection component, and can drive the reflection sensor to move along the height direction of the wafer container to detect multiple wafers at different positions in the wafer container.

[0012] Preferably, the wafer mapping mechanism further includes a through-beam sensor and a grating rack. The through-beam sensor can move together with the reflective sensor. The grating rack and the through-beam sensor are arranged opposite to each other so that the position of the reflective sensor can be detected by the through-beam sensor.

[0013] Preferably, the driving mechanism comprises a rodless cylinder, which is arranged below the upper support plate. The rodless cylinder comprises a slider, which can move along the height direction of the wafer container, and the reflection sensor is connected to the slider via a connecting rod.

[0014] Preferably, a sensor fixing plate is provided on the sliding block, and the through-beam sensor is fixed on the sensor fixing plate.

[0015] Preferably, the upper support plate is provided with an avoidance groove for allowing the reflection sensor to pass through.

[0016] Preferably, the wafer mapping mechanism further comprises a lower support plate, which is arranged at one end of the frame away from the upper support plate, and the rodless cylinder and the grating rack are both located between the upper support plate and the lower support plate.

[0017] Preferably, the in-situ detection component includes a pressing component and a sensor. The sensor is arranged at one end of the pressing component. The wafer container can drive the pressing component to abut against the sensor, so that the sensor sends a sensing signal.

[0018] Preferably, the in-situ detection component also includes a fixing frame arranged under the upper support plate, the pressing assembly includes a pressing rod and a spring mounted outside the pressing rod, the fixing frame includes a fixing plate, the pressing rod is passed through the fixing plate and supported on the fixing plate by a spring, and the spring can make the pressing rod elastically extend out of the upper support plate; the sensor is arranged under the fixing plate, and the wafer container can drive the pressing rod to retract under the lower support plate so that the pressing rod abuts against the sensor.

[0019] Preferably, the upper support plate is provided with a wafer container placement position for placing the wafer container.

[0020] Preferably, a limiting component is provided at the wafer container placement position, and the limiting component is used to limit the placement position of the wafer container.

[0021] Beneficial effects of the utility model:

[0022] The wafer mapping mechanism provided by the utility model maps the wafer by using a reflection sensor. The reflection sensor can be arranged at a distance from the wafer to avoid scratching the wafer. At the same time, an in-situ detection component and a driving mechanism are arranged, so that after the wafer container is placed in place, the in-situ detection component performs detection and sends a signal, so that the driving mechanism drives the reflection sensor arranged on the driving mechanism to move along the height direction of the wafer container, detects the wafer and completes wafer mapping. Wafer mapping can be automatically completed after the wafer container is placed, reducing manual operation and being more convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is an overall view of the wafer mapping mechanism provided by the utility model;

[0024] Figure 2 This is a front view of the wafer mapping mechanism provided by the utility model when no wafer detection is performed;

[0025] Figure 3 This is a front view of the wafer mapping mechanism provided by the utility model when performing wafer detection;

[0026] Figure 4 It is a side view of the wafer mapping mechanism provided by the utility model when no wafer detection is performed;

[0027] Figure 5 It is a schematic diagram of an in-situ detection component of a wafer mapping mechanism provided by the utility model.

[0028] In the figure: 10-frame; 11-upper support plate; 111-limiting assembly; 112-avoidance groove; 12-lower support plate; 20-wafer container; 21-wafer; 30-in-situ detection assembly; 301-pressing rod; 302-spring; 303-fixed frame; 3031-support plate; 3032-fixed plate; 3033-connecting plate; 304-sensor; 31-control assembly; 40-driving mechanism; 50-sensor fixing plate; 51-through-beam sensor; 52-grating rack; 60-reflection sensor. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0030] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0032] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0033] like Figure 1 and Figure 2 As shown, a wafer mapping mechanism provided in this embodiment can map the wafer 21 by using a reflection sensor 60. The reflection sensor 60 is spaced apart from the wafer 21 and has a sufficient distance to avoid scratching the wafer 21 when the distance is too close to the wafer 21. At the same time, the wafer mapping can be automatically completed after the wafer container 20 is placed, which reduces manual operations and is more convenient and quick. The wafer mapping mechanism mainly includes a frame 10, an upper support plate 11, an in-situ detection component 30, a reflection sensor 60 and a driving mechanism 40.

[0034] The upper pallet 11 in this embodiment is arranged on the frame 10, and is used to carry the wafer container 20. Specifically, the frame 10 is four support rods, and the four support rods are arranged in a rectangular shape to jointly support the upper pallet 11. The in-situ detection component 30 is arranged on the upper pallet 11, and is used to detect whether a wafer container 20 is placed on the upper pallet 11, and a plurality of wafers 21 are placed in the wafer container 20 at intervals along the height direction of the wafer container 20. Specifically, the wafer container 20 is a wafer cassette or a wafer box. The reflection sensor 60 is arranged on one side of the wafer container 20, and can detect the position of the wafer 21 located in the wafer container 20 to complete the wafer mapping. Specifically, the wafer container 20 has an opening on the side facing the reflection sensor 60, so that the light emitted by the reflection sensor 60 is convenient for irradiating the wafer 21. Furthermore, the reflection sensor 60 is connected to the output end of the driving mechanism 40, and the driving mechanism 40 is communicatively connected with the in-situ detection component 30. After the in-situ detection component 30 detects that a wafer container 20 is placed on the upper support plate 11, the driving mechanism 40 can drive the reflection sensor 60 to move along the height direction of the wafer container 20, so that the reflection sensor 60 can automatically detect multiple wafers 21 at different positions in the wafer container 20.

[0035] like Figure 2-Figure 4 As shown, the wafer mapping mechanism in this embodiment also includes a through-beam sensor 51 and a grating rack 52. The through-beam sensor 51 can move together with the reflective sensor 60, that is, the relative positions of the two will not change. The grating rack 52 is arranged along the height direction of the wafer container 20, that is, the length direction of the grating rack 52 is arranged parallel to the moving direction of the output end of the driving mechanism 40. The grating rack 52 is arranged opposite to the through-beam sensor 51, and the through-beam sensor 51 obtains the height position of the through-beam sensor 51 itself by performing height detection with the notch on the grating rack 52. Since the relative positions of the through-beam sensor 51 and the reflective sensor 60 will not change, the height position of the reflective sensor 60 can be obtained from the height position of the through-beam sensor 51 to judge the detection situation of the reflective sensor 60 on the wafer 21. Specifically, the center position of the through-beam sensor 51 moves along the center line of the width direction of the grating rack 52 to ensure the effect of height detection. In some other embodiments, the motion path of the center position of the through-beam sensor 51 may be located at different positions in the width direction of the grating rack 52, and the two can cooperate to meet the height measurement requirements.

[0036] In this embodiment, the driving mechanism 40 is a linear driving mechanism, specifically, the linear driving mechanism is a rodless cylinder. The rodless cylinder is arranged below the upper support plate 11, and the rodless cylinder includes a slider, which can move along the height direction of the wafer container 20, that is, the slider can move up and down in the vertical direction. The reflection sensor 60 is connected to the slider through a connecting rod. When the slider slides, it drives the reflection sensor 60 to move along the height direction of the wafer container 20, so that the reflection sensor 60 can detect wafers 21 at different heights to complete wafer mapping. In some other embodiments, the driving mechanism 40 can be a linear driving mechanism such as a lead screw nut linear drive motor, a cylinder or an electric push rod.

[0037] The slider in this embodiment is also provided with a sensor fixing plate 50, and the through-beam sensor 51 is fixed to the sensor fixing plate 50. When the slider moves along the height direction of the wafer container 20, the through-beam sensor 51 moves with the slider and the relative position of the two does not change. Since the reflection sensor 60 also moves with the slider, the relative position of the reflection sensor 60 and the slider does not change, and the relative position of the through-beam sensor 51 and the reflection sensor 60 does not change either.

[0038] The driving mechanism 40 in this embodiment is located below the upper support plate 11. Specifically, the orthographic projection of the upper support plate 11 from a top view covers the orthographic projection of the driving mechanism 40 from a top view. At this time, the upper support plate 11 is provided with an avoidance groove 112 for the reflection sensor 60 to pass through. The avoidance groove 112 is set to be rectangular in shape and is sized to allow the reflection sensor 60 to pass through. In some other embodiments, the driving mechanism 40 and the reflection sensor 60 extend from one side of the upper support plate 11 through a mounting structure, and the driving mechanism 40 can drive the reflection sensor 60 to move up and down from the outside of the upper support plate 11 to a corresponding position without providing an avoidance groove 112.

[0039] The in-situ detection component 30 in this embodiment is used to detect whether the wafer container 20 is placed on the upper support plate 11. The in-situ detection component 30 includes a pressing component and a sensor 304. The sensor 304 is arranged at one end of the pressing component. The wafer container 20 can drive the pressing component to abut against the sensor 304, so that the sensor 304 sends a sensing signal. Specifically, the abutment between the pressing component and the sensor 304 can change the on-off state of the circuit where the sensor 304 is located, and generate a corresponding signal.

[0040] like Figure 5As shown, the in-situ detection component 30 in this embodiment also includes a fixing frame 303 arranged below the upper support plate 11, the pressing component includes a pressing rod 301 and a spring 302 mounted outside the pressing rod 301, the fixing frame 303 includes a fixing plate 3032, the pressing rod 301 is passed through the fixing plate 3032, and is supported on the fixing plate 3032 by the spring 302, the spring 302 can make the pressing rod 301 elastically extend out of the upper support plate 11; the sensor 304 is arranged below the fixing plate 3032, and the wafer container 20 can drive the pressing rod 301 to retract below the upper support plate 11, so that the pressing rod 301 abuts against the sensor 304. Specifically, both upper and lower ends of the pressing rod 301 are provided with limiting rings. The lower end of the pressing rod 301 passes through the fixing plate 3032 and then penetrates into the housing of the sensor 304. The spring 302 is provided between the limiting ring at the upper end of the pressing rod 301 and the fixing plate 3032. Under the elastic action of the spring 302, the upper end of the pressing rod 301 can extend out of the upper support plate 11. The fixing frame 303 also includes a [-shaped support plate 3031 and a connecting plate 3033. The upper end of the [-shaped support plate 3031 is connected to the lower surface of the upper support plate 11, and the lower end is provided with a connecting plate 3033 extending upward. The end of the connecting plate 3033 away from the [-shaped support plate 3031 is connected to the fixing plate 3032. The sensor 304 is fixed on the connecting plate 3033 and is located below the fixing plate 3032. When the wafer container 20 is placed on the upper support plate 11, pressure is generated on the upper end of the pressing rod 301 located above the upper support plate 11, and the spring 302 is compressed by the limit ring at the upper end of the pressing rod 301, and the pressing rod 301 moves downward until the lower end of the pressing rod 301 contacts the sensor 304 to generate a signal. When the wafer container 20 is removed from the upper support plate 11, under the action of the elastic restoring force of the spring 302, the pressing rod 301 moves upward to the initial position, and the lower end of the pressing rod 301 is separated from the sensor 304, and the sensor 304 stops generating signals. At the same time, the limit ring at the lower end of the pressing rod 301 abuts against the inner wall of the outer shell of the sensor 304 to prevent the pressing rod 301 from moving away from the sensor 304 as a whole.

[0041] In this embodiment, a plurality of in-situ detection components 30 are provided, and the plurality of in-situ detection components 30 jointly detect whether the wafer container 20 is placed on the upper support plate 11. Specifically, there are two in-situ detection components 30 in this embodiment, and the specific positions are as follows: Figure 3 and Figure 4 In some other embodiments, the in-situ detection component 30 may be set to one, and the setting position is based on the in-situ detection component 30 being able to generate a corresponding signal when the wafer container 21 is placed on the upper support plate 11.

[0042] Specifically, the upper support plate 11 in this embodiment is provided with a wafer container placement position for placing the wafer container 20, so that the wafer container 20 has a fixed placement position, which is convenient for detection by the in-situ detection component 30 and the reflection sensor 60. A limit component 111 is also provided at the wafer container placement position, and the limit component 111 includes a plurality of limit blocks for determining the placement position of the wafer container 20. After the wafer container 20 is placed, the limit blocks limit the position of the wafer container 20 to prevent it from being displaced on the upper support plate 11.

[0043] The wafer mapping mechanism of this embodiment also includes a lower support plate 12, which is arranged at one end of the frame 10 away from the upper support plate 11, and the rodless cylinder and the grating rack 52 are both arranged between the upper support plate 11 and the lower support plate 12. Specifically, the upper ends of the rodless cylinder and the grating rack 52 are fixed to the lower surface of the upper support plate 11, and the lower ends of the rodless cylinder and the grating rack 52 are fixed to the upper surface of the lower support plate 12. At the same time, a control component 31 is also fixed on the lower support plate 12, and the control component 31 is used to receive the signal sent by the in-situ detection component 30, and control the rodless cylinder to drive the reflection sensor 60 to rise and fall, so that the reflection sensor 60 completes the wafer mapping. Specifically, the upper support plate 11, the frame 10 and the lower support plate 12 are integrated, and the upper support plate 11 and the lower support plate 12 are respectively located at the two ends of the frame 10. It can be seen from the above working content that the wafer mapping mechanism in this embodiment is different from the two-side facing mechanism in the prior art that uses two sensors to shoot at both sides of the wafer to complete wafer mapping. Instead, it uses a single reflection sensor 60 to use the light signals emitted and reflected back to perform wafer mapping.

[0044] Therefore, since the wafer mapping mechanism in this embodiment is a single reflection mechanism installed on the side of the wafer cassette, wafer mapping can be completed by positionally controlling a single reflection sensor 60. The structure is simple and efficient, and it is convenient to modify semiconductor detection equipment to obtain the wafer mapping function.

[0045] like Figure 2 and Figure 3 As shown, the specific working process of the wafer mapping mechanism in this embodiment is as follows:

[0046] When the wafer container 20 is not placed on the upper support plate 11, the slider on the rodless cylinder is at the lowest position, and the reflection sensor 60 is connected to the slider and is below the upper support plate 11. When the wafer container 20 is placed on the upper support plate 11, the restricted block is limited to a fixed position and pressed on the in-place detection component 30. The pressing component in the in-place detection component 30 moves downward under the pressure and stimulates the sensor 304 to generate a corresponding signal and send the signal to the control component 31. The control component 31 located on the lower support plate 12 receives the signal and sends an instruction to control the rodless cylinder. The slider in the rodless cylinder is controlled to move upward, and the reflection sensor 60 and the corresponding sensor 51 move upward with the slider. The reflection sensor 60 passes through the avoidance groove 112 and moves to the top of the upper support plate 11. At this time, the corresponding sensor 51 detects the height position through the notch on the grating rack 52 to obtain the height position of the reflection sensor 60 and transmits the result back to the control component 31, so that the control component 31 can accurately control the height of the reflection sensor 60. The reflective sensor 60 at an appropriate height detects the state of the wafer 21 by sending a light signal to the wafer 21 and reflecting it back, completing wafer mapping. After the detection is completed, the control component 31 controls the slider of the rodless cylinder to move downward to restore to the initial position when the wafer container 20 is not placed.

[0047] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A wafer mapping mechanism, characterized in that: include: Rack (10); An upper support plate (11) is disposed on the frame (10) and is used to carry the wafer container (20); an in-situ detection component (30) disposed on the upper support plate (11) and used to detect whether the wafer container (20) is placed on the upper support plate (11), wherein a plurality of wafers (21) can be placed on the wafer container (20) at intervals along a height direction; A reflection sensor (60) for detecting the position of the wafer (21); A driving mechanism (40), wherein the reflection sensor (60) is connected to an output end of the driving mechanism (40), the driving mechanism (40) is communicatively connected to the in-situ detection component (30), and is capable of driving the reflection sensor (60) to move along the height direction of the wafer container (20) so as to detect a plurality of wafers (21) at different positions in the wafer container (20).

2. The wafer mapping mechanism according to claim 1, characterized in that: The wafer mapping mechanism further comprises a counter-beam sensor (50) and a grating rack (52); the counter-beam sensor (50) can move together with the reflective sensor (60); the grating rack (52) and the counter-beam sensor (50) are arranged opposite to each other so as to detect the position of the reflective sensor (60) through the counter-beam sensor (50).

3. The wafer mapping mechanism according to claim 2, characterized in that: The driving mechanism (40) comprises a rodless cylinder, the rodless cylinder is arranged below the upper support plate (11), the rodless cylinder comprises a slider, the slider can move along the height direction of the wafer container (20), and the reflection sensor (60) is connected to the slider via a connecting rod.

4. The wafer mapping mechanism according to claim 3, characterized in that: A sensor fixing plate (51) is provided on the sliding block, and the through-beam sensor (50) is fixed to the sensor fixing plate (51).

5. The wafer mapping mechanism according to claim 3, characterized in that: The upper support plate (11) is provided with an avoidance groove (112) for allowing the reflection sensor (60) to pass through.

6. The wafer mapping mechanism according to claim 3, characterized in that: The wafer mapping mechanism further comprises a lower support plate (12), wherein the lower support plate (12) is arranged at one end of the frame (10) away from the upper support plate (11), and the rodless cylinder and the grating rack (52) are both located between the upper support plate (11) and the lower support plate (12).

7. The wafer mapping mechanism according to any one of claims 1 to 6, characterized in that: The in-situ detection component (30) comprises a pressing component and a sensor (304), wherein the sensor (304) is arranged at one end of the pressing component, and the wafer container (20) can drive the pressing component to abut against the sensor (304), so that the sensor (304) sends a sensing signal.

8. The wafer mapping mechanism according to claim 7, characterized in that: The in-situ detection component (30) further comprises a fixing frame (303) arranged below the upper support plate (11); the pressing component comprises a pressing rod (301) and a spring (302) sleeved outside the pressing rod (301); the fixing frame (303) comprises a fixing plate (3032); the pressing rod (301) is passed through the fixing plate (3032) and supported on the fixing plate (3032) by the spring (302); the spring (302) can make the pressing rod (301) elastically extend out of the upper support plate (11); the sensor (304) is arranged below the fixing plate (3032); the wafer container (20) can drive the pressing rod (301) to retract to below the upper support plate (11) so that the pressing rod (301) abuts against the sensor (304).

9. The wafer mapping mechanism according to any one of claims 1 to 6, characterized in that: The upper support plate (11) is provided with a wafer container placement position for placing the wafer container (20).

10. The wafer mapping mechanism according to claim 9, characterized in that: The wafer container placement position is provided with a limit component (111), and the limit component (111) is used to limit the placement position of the wafer container (20).

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