Chip mounting device for semiconductor chip processing

Abstract

The utility model relates to the technical field of chip processing, and discloses a chip mounting device for semiconductor chip processing, which comprises a base, the surface of the base is provided with a chip mounting assembly, the chip mounting assembly comprises a stand column, the stand column is fixedly connected to the surface of the base, the side wall of the stand column is provided with a sliding chute, and the sliding chute is provided with a sliding groove. Two groups of cross beams are symmetrically arranged, the two groups of cross beams are in threaded connection through a two-way threaded rod, the surfaces of the cross beams are fixedly connected with air pumps, and the two sides of the cross beams are fixedly connected with spray heads. And the spray head is fixedly connected with the output end of the air pump through a hose. According to the utility model, the motor drives the bidirectional threaded rod to rotate, so that the two groups of cross beams move in opposite directions and drive the two groups of chip mounting heads to be attached to the bottom surface and the surface of the semiconductor chip, thereby simultaneously processing the two surfaces of the semiconductor chip and improving the working efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a chip mounting device for semiconductor chip processing. Background Art

[0002] The integrated circuit (IC) industry is a high-speed growth point in the current global economic development. Among them, the advancement of semiconductor manufacturing technology and the rapid growth of market demand for tiny chips have made the chip I / O density higher and higher, and the chip lead spacing and pad diameter continue to decrease. At the same time, in order to improve production efficiency, the packaging speed has increased year by year, which has put forward extremely high requirements on the positioning accuracy and operating speed of post-packaging equipment. The chip mounting equipment determines the accuracy, efficiency and stability of the chip mounting process and is the key equipment in the chip packaging process.

[0003] After searching, the Chinese patent announcement number: CN217740503U discloses a patch device for semiconductor chip processing. The device starts the second electric telescopic rod to drive the second motor to rise and fall to a suitable position, and then starts the second motor to drive the triangular plate to rotate. The triangular plate drives the second gear to revolve and rotate at the same time, so that the cleaning brush rotates to clean the dust on the surface of the semiconductor chip, thereby making it easier to clean the dust on the surface of the semiconductor chip, thereby avoiding the situation where too much dust affects the patch effect during the patch process.

[0004] The above device has certain defects during use. When performing chip placement processing on semiconductor chips, it needs to be turned over manually or through other equipment, which significantly reduces production efficiency. Therefore, a chip placement device for semiconductor chip processing is proposed to solve the above problems. Utility Model Content

[0005] In order to remedy the above shortcomings, the utility model provides a chip placement device for semiconductor chip processing, aiming to improve the problem in the prior art that semiconductor chips need to be flipped manually or through other equipment during chip placement processing, which significantly reduces production efficiency.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a patch device for semiconductor chip processing, comprising a base, a patch assembly is arranged on the surface of the base, the patch assembly includes a column, the column is fixedly connected to the surface of the base, the side wall of the column is provided with a slide groove, the interior of the slide groove is slidably connected with a cross beam, the bottom surface of the cross beam is fixedly connected with a patch head, the cross beam is symmetrically arranged in two groups, and the two groups of cross beams are threadedly connected by a bidirectional threaded rod.

[0007] As a further description of the above technical solution:

[0008] Four groups of symmetrically arranged supporting legs are fixedly connected to the surface of the base, a fixing frame is fixedly connected to the top of the supporting legs, a clamping assembly is arranged inside the fixing frame, and the clamping assembly includes two groups of symmetrically arranged clamping blocks, the clamping blocks are slidably connected to the inner wall of the fixing frame, and a telescopic rod is fixedly connected between the clamping blocks and the inner wall of the fixing frame.

[0009] As a further description of the above technical solution:

[0010] An air pump is fixedly connected to the surface of the crossbeam, and nozzles are fixedly connected to both sides of the crossbeam. The nozzles are fixedly connected to the output end of the air pump through a hose.

[0011] As a further description of the above technical solution:

[0012] A motor is fixedly connected to the surface of the column, and an output shaft of the motor penetrates and is rotatably connected to the inner wall of the slide slot, and the output shaft of the motor is fixedly connected to the end of the bidirectional threaded rod.

[0013] As a further description of the above technical solution:

[0014] A return spring is sleeved on the outer wall of the telescopic rod, one end of the return spring is fixedly connected to the inner wall of the fixed frame, and the other end of the return spring is fixedly connected to the side wall of the clamping block.

[0015] As a further description of the above technical solution:

[0016] The side wall of the clamping block is fixedly connected with a screw rod, and the screw rod penetrates and is rotatably connected to the side wall of the fixing frame.

[0017] As a further description of the above technical solution:

[0018] A threaded sleeve is threadedly connected on the outer wall of the screw rod.

[0019] The utility model has the following beneficial effects:

[0020] 1. In the utility model, the bidirectional threaded rod is driven by a motor to rotate, so that the two groups of beams move toward each other, and drive the two groups of patch heads to fit the bottom and surface of the semiconductor chip, so that both sides of the semiconductor chip can be processed at the same time, thereby improving work efficiency.

[0021] 2. In the utility model, the length of the screw rod can be controlled by rotating the threaded sleeve, so that the moving distance of the clamping block can be controlled, thereby effectively avoiding the large elastic force of the reset spring from damaging the semiconductor chip and improving the safety of the semiconductor core during the processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1This is a three-dimensional schematic diagram of a chip mounting device for semiconductor chip processing proposed by the utility model;

[0023] Figure 2 This is a structural schematic diagram of a chip mounting assembly of a chip mounting device for semiconductor chip processing proposed by the utility model;

[0024] Figure 3 The utility model is a schematic structural diagram of a clamping assembly of a chip mounting device for semiconductor chip processing.

[0025] Legend:

[0026] 1. Base; 2. Patch assembly; 21. Column; 22. Slide; 23. Beam; 24. Patch head; 25. Air pump; 26. Nozzle; 27. Hose; 28. Threaded rod; 29. ​​Motor; 3. Support leg; 4. Fixed frame; 5. Clamping assembly; 51. Clamping block; 52. Telescopic rod; 53. Reset spring; 54. Screw; 55. Threaded sleeve. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Reference Figure 1-3 The utility model provides an embodiment: a patch device for semiconductor chip processing, including a base 1, the base 1 provides a basic support structure for the patch device, is used to fix other components and ensure the stability of the patch device, the surface of the base 1 is provided with a patch component 2, the patch component 2 is used for double-sided patching of semiconductor chips to improve processing efficiency.

[0029] Reference Figure 1-3The patch assembly 2 includes a column 21, which is a supporting structure of the patch assembly 2. The column 21 is fixedly connected to the surface of the base 1. The side wall of the column 21 is provided with a slide groove 22. The interior of the slide groove 22 is slidably connected with a crossbeam 23. The bottom surface of the crossbeam 23 is fixedly connected with a patch head 24. The slide groove 22 is used to provide a moving track for two groups of crossbeams 23. The crossbeam 23 is used to install the patch head 24, the air pump 25 and the nozzle 26. The crossbeam 23 is symmetrically arranged in two groups, and there is a gap between the two groups of crossbeams 23. The surface of the column 21 is fixedly connected with a motor 29 through a two-way threaded rod 28, and the output shaft of the motor 29 penetrates and is rotatably connected to the inner wall of the slide 22. The output shaft of the motor 29 is fixedly connected to the end of the two-way threaded rod 28. The motor 29 is used to drive the two-way threaded rod 28 to rotate, so that the two groups of beams 23 move toward each other, and drive the two groups of patch heads 24 to fit the bottom and surface of the semiconductor chip, so as to process both sides of the semiconductor chip at the same time, thereby improving work efficiency. The surface of the beam 23 is fixedly connected with an air pump 25, and both sides of the beam 23 are fixedly connected with a nozzle 26. The nozzle 26 is fixedly connected to the output end of the air pump 25 through a hose 27. The air pump 25 is used to provide air pressure, and flows to the nozzle 26 through the hose 27, and the airflow is sprayed onto the semiconductor chip to clean up dust particles.

[0030] Reference Figure 1-3 The surface of the base 1 is fixedly connected with four groups of symmetrically arranged support legs 3, the top of the support legs 3 is fixedly connected with a fixing frame 4, and a clamping assembly 5 is arranged inside the fixing frame 4 for clamping and fixing the semiconductor chip. The clamping assembly 5 includes two groups of symmetrically arranged clamping blocks 51, the shape of the clamping blocks 51 is I-shaped, and the grooves are respectively fitted with the surface and the bottom surface of the fixing frame 4, which are used to guide the clamping blocks 51 so that the clamping blocks 51 can move stably. The clamping block 51 is slidably connected to the inner wall of the fixed frame 4, and a telescopic rod 52 is fixedly connected between the clamping block 51 and the inner wall of the fixed frame 4. A return spring 53 is sleeved on the outer wall of the telescopic rod 52, one end of the return spring 53 is fixedly connected to the inner wall of the fixed frame 4, and the other end of the return spring 53 is fixedly connected to the side wall of the clamping block 51. The return spring 53 is used to provide elastic support for the clamping block 51, so that the two groups of clamping blocks 51 can play a clamping and fixing role on the semiconductor chip, and the side wall of the clamping block 51 is fixedly connected to the screw rod 54, the screw rod 54 penetrates and is rotatably connected to the side wall of the fixed frame 4, and a threaded sleeve 55 is threadedly connected to the outer wall of the screw rod 54. By rotating the threaded sleeve 55, the length of the screw rod 54 can be controlled, so that the moving distance of the clamping block 51 can be controlled, thereby effectively avoiding the large elastic force of the return spring 53 from damaging the semiconductor chip, improving the safety of the semiconductor core during processing, so that the clamping block 51 can clamp and fix semiconductor chips of different sizes.

[0031] Working principle: When in use, the length of the screw rod 54 can be controlled by rotating the threaded sleeve 55, so that the moving distance of the clamping block 51 can be controlled, thereby effectively avoiding the large elastic force of the reset spring 53 from damaging the semiconductor chip, improving the safety of the semiconductor core during processing, and allowing the clamping block 51 to clamp and fix semiconductor chips of different sizes. The reset spring 53 is used to provide elastic support for the clamping block 51, so that the two groups of clamping blocks 51 can clamp and fix the semiconductor chip.

[0032] The motor 29 drives the bidirectional threaded rod 28 to rotate, so that the two sets of beams 23 move toward each other. The air pump 25 is used to provide air pressure, and the air flows to the nozzle 26 through the hose 27, and the air flow is sprayed onto the semiconductor chip to clean the dust particles. It also drives the two sets of patch heads 24 to fit the bottom and surface of the semiconductor chip, so that both sides of the semiconductor chip can be processed at the same time, improving work efficiency.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip bonding device for semiconductor chip processing, comprising a base (1), characterized in that: The surface of the base (1) is provided with a patch assembly (2), the patch assembly (2) comprising a column (21), the column (21) being fixedly connected to the surface of the base (1), a slide groove (22) being provided on the side wall of the column (21), a crossbeam (23) being slidably connected inside the slide groove (22), a patch head (24) being fixedly connected to the bottom surface of the crossbeam (23), two groups of the crossbeams (23) being symmetrically provided, and the two groups of the crossbeams (23) being threadedly connected via a bidirectional threaded rod (28).

2. The chip bonding device for semiconductor chip processing according to claim 1, characterized in that: Four groups of symmetrically arranged support legs (3) are fixedly connected to the surface of the base (1); the top ends of the support legs (3) are fixedly connected to a fixed frame (4); a clamping assembly (5) is arranged inside the fixed frame (4); the clamping assembly (5) comprises two groups of symmetrically arranged clamping blocks (51); the clamping blocks (51) are slidably connected to the inner wall of the fixed frame (4); and a telescopic rod (52) is fixedly connected between the clamping blocks (51) and the inner wall of the fixed frame (4).

3. The bonding device for semiconductor chip processing according to claim 1, characterized in that: An air pump (25) is fixedly connected to the surface of the crossbeam (23), and nozzles (26) are fixedly connected to both sides of the crossbeam (23), wherein the nozzles (26) are fixedly connected to the output end of the air pump (25) via a hose (27).

4. The chip bonding device for semiconductor chip processing according to claim 1, characterized in that: A motor (29) is fixedly connected to the surface of the column (21), an output shaft of the motor (29) penetrates and is rotatably connected to the inner wall of the slide groove (22), and the output shaft of the motor (29) is fixedly connected to the end of the bidirectional threaded rod (28).

5. The chip bonding device for semiconductor chip processing according to claim 2, characterized in that: A return spring (53) is sleeved on the outer wall of the telescopic rod (52), one end of the return spring (53) is fixedly connected to the inner wall of the fixed frame (4), and the other end of the return spring (53) is fixedly connected to the side wall of the clamping block (51).

6. The chip bonding device for semiconductor chip processing according to claim 2, characterized in that: A screw rod (54) is fixedly connected to the side wall of the clamping block (51), and the screw rod (54) penetrates and is rotatably connected to the side wall of the fixed frame (4).

7. The chip bonding device for semiconductor chip processing according to claim 6, characterized in that: A threaded sleeve (55) is threadedly connected to the outer wall of the screw rod (54).

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