Diode packaging structure not easy to damage

Abstract

The utility model relates to the technical field of diode packaging, and discloses a diode packaging structure not easy to damage, which comprises a heat dissipation substrate, a diode is arranged in the middle of the top of the heat dissipation substrate, a first colloid layer is arranged on the outer side of the diode, and a second colloid layer is arranged on the other side of the first colloid layer. A first colloid layer is arranged on one side of the first colloid layer, a second colloid layer is arranged on the other side of the first colloid layer, an outer wrapping colloid layer is arranged on the other side of the second colloid layer, heat dissipation grooves are formed in the outer side of the outer wrapping colloid layer, heat dissipation holes are formed in the positions, corresponding to the heat dissipation grooves, of the first colloid layer, the second colloid layer and the outer wrapping colloid layer, heat conduction strips are inserted into the heat dissipation holes, and heat dissipation fins are arranged in the heat dissipation grooves. According to the diode packaging structure not easy to damage, heat dissipation is carried out on the bottom of the diode through the heat dissipation substrate, heat on the side edge of the diode is absorbed through the heat conduction strips, the heat is guided into the heat dissipation fins, finally, the absorbed heat is dissipated through the heat dissipation fins, internal heat is guided to the outside, the heat dissipation efficiency is high, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of diode packaging, in particular to a diode packaging structure that is not easily damaged. Background Art

[0002] Diode packaging in electronics not only plays the role of installation, fixing, sealing, protecting chips and enhancing electrical and thermal performance, but also connects the contacts on the chip to the pins of the package shell with wires. These pins are connected to other devices through wires on the printed circuit board, thereby realizing the connection between the internal chip and the external circuit. However, overheating of this type of diode package will damage the internal chip and reduce its service life. Therefore, a diode packaging structure that is not easily damaged is proposed. Utility Model Content

[0003] In view of the deficiencies in the prior art, the utility model provides a diode packaging structure that is not easily damaged, has the advantages of conducting internal heat to the outside, high heat dissipation efficiency, and extended service life, etc., and solves the problem that overheating may damage the internal chip and reduce the service life.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a diode packaging structure that is not easily damaged, including a heat dissipation substrate, a diode is arranged in the middle of the top of the heat dissipation substrate, and the bottom of the diode is dissipated by the heat dissipation substrate, a first colloid layer is arranged on the outside of the diode, a second colloid layer is arranged on the other side of the first colloid layer, an outer colloid layer is arranged on the other side of the second colloid layer, a heat dissipation groove is opened on the outside of the outer colloid layer, heat dissipation holes are opened at the positions of the first colloid layer, the second colloid layer and the outer colloid layer corresponding to the heat dissipation groove, a thermal conductive strip is inserted into the inside of the heat dissipation hole, and a heat sink is arranged inside the heat dissipation groove.

[0005] Preferably, one end of the thermally conductive strip is connected to the diode, and the other end of the thermally conductive strip is connected to the heat sink. The heat on the side of the diode is absorbed by the thermally conductive strip and the heat is introduced into the heat sink. Finally, the absorbed heat is dissipated through the heat sink.

[0006] Preferably, the heights between the first colloid layer, the second colloid layer and the outer colloid layer are designed to be in a stepped state with the outer side higher and the inner side lower, so as to fill the first transparent silicone layer, the second transparent silicone layer and the fluorescent colloid layer.

[0007] Preferably, a No. 1 transparent silica gel layer is provided between the No. 1 colloid layer and the diode, and a fluorescent colloid layer is provided on top of the No. 1 transparent silica gel layer and the No. 1 colloid layer.

[0008] Preferably, a No. 2 transparent silica gel layer is provided on top of the fluorescent colloid layer and the No. 2 colloid layer.

[0009] Compared with the prior art, the utility model provides a diode packaging structure that is not easily damaged and has the following beneficial effects:

[0010] 1. The diode packaging structure is not easy to damage. The bottom of the diode is cooled by the heat dissipation substrate, the heat on the side of the diode is absorbed by the heat conductive strip, and the heat is introduced into the heat sink. Finally, the absorbed heat is dissipated by the heat sink, and the internal heat is conducted to the outside. The heat dissipation efficiency is high and the service life is extended.

[0011] 2. The diode packaging structure that is not easily damaged is designed to have a stepped state with a high outer side and a low inner side so as to fill the No. 1 transparent silicone layer, the No. 2 transparent silicone layer and the fluorescent colloid layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structural section of the utility model;

[0013] Figure 2 It is a schematic cross-sectional view of a local structure of the utility model;

[0014] Figure 3 It is a schematic cross-sectional view of a local structure of the utility model.

[0015] Among them: 1. heat dissipation substrate; 2. diode; 3. No. 1 colloid layer; 4. No. 2 colloid layer; 5. outer colloid layer; 6. heat dissipation groove; 7. heat dissipation hole; 8. thermal conductive strip; 9. heat sink; 10. No. 1 transparent silicone layer; 11. fluorescent colloid layer; 12. No. 2 transparent silicone layer. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] See also Figure 1-3The utility model provides the following technical solutions: a diode packaging structure that is not easy to be damaged, including a heat dissipation substrate 1, a diode 2 is arranged in the middle of the top of the heat dissipation substrate 1, and the bottom of the diode 2 is dissipated by the heat dissipation substrate 1, a first colloid layer 3 is arranged on the outside of the diode 2, a second colloid layer 4 is arranged on the other side of the first colloid layer 3, an outer colloid layer 5 is arranged on the other side of the second colloid layer 4, a heat dissipation groove 6 is opened on the outside of the outer colloid layer 5, and heat dissipation holes 7 are opened at the positions of the first colloid layer 3, the second colloid layer 4 and the outer colloid layer 5 corresponding to the heat dissipation groove 6, a heat conduction strip 8 is inserted in the heat dissipation hole 7, and a heat sink 9 is arranged in the heat dissipation groove 6;

[0018] One end of the heat conducting strip 8 is connected to the diode 2, and the other end of the heat conducting strip 8 is connected to the heat sink 9. The heat conducting strip 8 absorbs the heat from the side of the diode 2 and conducts the heat to the heat sink 9. Finally, the absorbed heat is dissipated through the heat sink 9.

[0019] The heights between the first colloid layer 3, the second colloid layer 4 and the outer colloid layer 5 are designed to be in a stepped state with the outer side higher and the inner side lower, so as to fill the first transparent silicone layer 10, the second transparent silicone layer 12 and the fluorescent colloid layer 11;

[0020] A first transparent silica gel layer 10 is disposed between the first colloid layer 3 and the diode 2 , and a fluorescent colloid layer 11 is disposed on top of the first transparent silica gel layer 10 and the first colloid layer 3 .

[0021] When in use, the bottom of the diode 2 is cooled by the heat dissipation substrate 1, the heat on the side of the diode 2 is absorbed by the heat conductive strip 8, and the heat is introduced into the heat sink 9, and finally the absorbed heat is dissipated by the heat sink 9, and the internal heat is conducted to the outside, with high heat dissipation efficiency and extended service life. The stepped state with the outer side higher than the inner side is designed to fill the No. 1 transparent silicone layer 10, the No. 2 transparent silicone layer 12 and the fluorescent colloid layer 11.

[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A diode packaging structure that is not prone to damage, comprising a heat dissipation substrate (1), characterized in that: A diode (2) is arranged in the middle of the top of the heat dissipation substrate (1); a first colloid layer (3) is arranged on the outside of the diode (2); a second colloid layer (4) is arranged on the other side of the first colloid layer (3); an outer colloid layer (5) is arranged on the other side of the second colloid layer (4); a heat dissipation groove (6) is provided on the outside of the outer colloid layer (5); heat dissipation holes (7) are provided at positions of the first colloid layer (3), the second colloid layer (4) and the outer colloid layer (5) corresponding to the heat dissipation groove (6); a heat conducting strip (8) is inserted into the interior of the heat dissipation hole (7); and a heat sink (9) is provided inside the heat dissipation groove (6).

2. The non-damageable diode packaging structure according to claim 1, characterized in that: One end of the thermally conductive strip (8) is connected to the diode (2), and the other end of the thermally conductive strip (8) is connected to the heat sink (9).

3. The non-damageable diode packaging structure according to claim 1, characterized in that: The heights between the first colloid layer (3), the second colloid layer (4) and the outer colloid layer (5) are designed to be in a stepped state with the outer side higher and the inner side lower.

4. The non-damageable diode packaging structure according to claim 1, characterized in that: A first transparent silica gel layer (10) is arranged between the first colloid layer (3) and the diode (2), and a fluorescent colloid layer (11) is arranged on top of the first transparent silica gel layer (10) and the first colloid layer (3).

5. The non-damageable diode packaging structure according to claim 4, characterized in that: A second transparent silica gel layer (12) is arranged on the top of the fluorescent colloid layer (11) and the second colloid layer (4).

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