Miniaturized module power supply
The miniaturized module power supply with a double-layer PCB structure and copper shell addresses the issues of size and noise in traditional designs, achieving high power density and reduced ripple noise while maintaining thermal efficiency.
Patent Information
- Application Number
- CN202420665744.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-04-02
AI Technical Summary
Traditional 15W DC-DC module power supplies are large in volume, have low power density, poor thermal conductivity and shielding, and high ripple noise, failing to meet the demands of miniaturized customer equipment.
A miniaturized module power supply with a double-layer PCB structure, copper shell, FR-4 fiberglass gusset plate, and high-conductivity silicone cloth insulator, featuring a separate control and filter circuit, and a copper-plated design for improved thermal conductivity and shielding, reducing ripple noise and volume.
The design achieves a 50% reduction in volume and doubles power density, with ripple noise reduced to 0.5% of the original, and maintains effective heat dissipation and EMC characteristics.
Smart Images
Figure CN222215519U_ABST
Abstract
Description
Technical Field
[0001] The utility model specifically relates to a miniaturized module power supply. Background Art
[0002] The traditional 15W DC-DC module power supply has the following problems:
[0003] The standard volume is 25.4mm×25.4mm×12.7mm, which is relatively large and has low power density. It adopts an aluminum shell plus plastic buckle plate design, has poor thermal conductivity and shielding, and has a single-layer board structure inside, with high ripple noise. As customers' own equipment is gradually miniaturized, they prefer to use products with higher power density and smaller volume. Utility Model Content
[0004] In view of the defects in the prior art, the utility model provides a miniaturized module power supply with small size, easy maintenance, high power density and low ripple noise.
[0005] The utility model provides a miniaturized module power supply, comprising a shell and a buckle plate, wherein an insulator is provided on the inner bottom surface of the shell, an upper printed board and a lower printed board are provided in the shell, the upper printed board and the lower printed board are fixedly connected through external output pins and internal connection pins, a power device is provided below the lower printed board, a control circuit is provided above the upper printed board, a filter circuit is provided below the upper printed board, the filter circuit is close to the output pin, and a pin hole corresponding to the output pin position is provided on the buckle plate.
[0006] Furthermore, the gusset plate is made of FR-4 fiberglass board, and copper foil is laid on the gusset plate.
[0007] Furthermore, the thickness of the gusset plate is 0.5 mm.
[0008] Furthermore, the outer shell is made of copper.
[0009] Furthermore, the wall thickness of the copper shell is 0.5 mm.
[0010] Furthermore, the insulator is a high-conductivity silicone cloth.
[0011] Furthermore, the upper printed board and the lower printed board are welded and then placed into a housing, and the housing is filled with potting silica gel.
[0012] Furthermore, the gusset plate and the shell are fixed at their joints using epoxy fixing glue.
[0013] Beneficial effects of the utility model:
[0014] The utility model provides a miniaturized module power supply, which adopts a double-layer printed circuit board structure and uses miniaturized devices, has a small size and high power density. The printed circuit board design with separate control circuit, filter circuit and control circuit is convenient for maintenance and greatly reduces the ripple noise amplitude of the product. The FR-4 glass fiber printed circuit board gusset plate and copper shell design are adopted to reduce the temperature rise of the internal power device while achieving the effect of six-sided metal shielding, thereby improving the EMC characteristics of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the specific implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the specific implementation or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.
[0016] Figure 1 A schematic diagram of the structure of a miniaturized module power supply provided by an embodiment of the utility model;
[0017] Figure 2 An exploded diagram of a miniaturized module power supply provided by an embodiment of the utility model;
[0018] Figure 3 This is a schematic diagram of the structure after the upper printed board and the lower printed board are welded. DETAILED DESCRIPTION
[0019] The following embodiments of the technical solution of the utility model are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and are therefore only used as examples, and cannot be used to limit the protection scope of the utility model.
[0020] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which the utility model belongs.
[0021] Please refer to Figure 1-3The first embodiment of the utility model provides a miniaturized module power supply, including a shell 1 and a gusset plate 2, an upper printed board 3 and a lower printed board 4 are arranged in the shell, the upper printed board 3 and the lower printed board 4 are fixedly connected through an external output pin 5 and an internal connection pin 6, a power device 7 is arranged below the lower printed board 4, a control circuit 8 is arranged above the upper printed board 3, a filter circuit 9 is arranged below the upper printed board 3, the filter circuit 9 is close to the output pin, and a pin hole corresponding to the output pin position is arranged on the gusset plate 2. In this embodiment, the power supply circuit adopts the traditional single-ended flyback circuit topology, and the power supply adopts a double-layer PCB stacking structure inside, which reduces the volume of the original 15w module power supply by half and doubles the power density. The power device is placed on the lower printed board, and the power MOS tube can be attached to the shell for heat dissipation. The control circuit and the filter circuit are placed on the upper printed board, and the filter circuit is close to the output pin. The output ripple noise of this structure is 50% of the existing module power supply, and can reach 0.5% of the output voltage.
[0022] In order to increase the thermal conductivity, the outer shell 1 is made of copper. The wall thickness of the copper shell is 0.5mm. The gusset plate 2 is made of FR-4 fiberglass board, and the thickness of the gusset plate 2 is 0.5mm. In order to ensure the metal shielding of the six sides of the product, the pinhole and the surrounding 1mm area are removed on the gusset plate 2, and the other areas are designed with copper foil.
[0023] The inner bottom surface of the shell is provided with an insulator 12, which is a high-conductivity silicone cloth. After the upper printed board 3 and the lower printed board 4 are welded, they are placed in the shell as a whole, and the shell is filled with potting silica gel 10. The connection between the gusset plate 1 and the shell 2 is fixed by high-temperature baking with epoxy fixing glue 11.
[0024] The utility model provides a miniaturized module power supply, in which power devices are placed on the lower printed board, and the power MOS tube can be attached to the outer shell for heat dissipation. The control circuit and the filter circuit are placed on the upper printed board, and the filter circuit is close to the output pin. The output ripple noise of this structure is 50% of the existing module power supply, and can reach 0.5% of the output voltage. At the same time, the design of potting silicone, high-conductivity silicone cloth and copper shell greatly reduces the thermal resistance between the internal power devices and the outer shell. The internal devices dissipate heat evenly, with low temperature rise, and can work at an ambient temperature above 70 degrees. The gusset plate adopts a copper-plated design of FR-4 glass fiber printed circuit board, which is low in cost and good in shielding, and improves the EMC characteristics of the product.
[0025] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and specification of the present invention.
Claims
1. A miniaturized module power supply, comprising a housing and a buckle plate, characterized in that: The inner bottom surface of the shell is provided with an insulator, an upper printed board and a lower printed board are provided in the shell, the upper printed board and the lower printed board are fixedly connected through external pins and internal connection pins, and a power supply is provided under the lower printed board. A rate device is provided, a control circuit is arranged on the upper printed board, a filter circuit is arranged below the upper printed board, the filter circuit is close to the pin, and a pin hole corresponding to the pin position is arranged on the buckle plate.
2. The miniaturized modular power supply according to claim 1, characterized in that: The gusset plate is made of FR-4 fiberglass board, and copper foil is laid on the gusset plate.
3. The miniaturized modular power supply according to claim 2, characterized in that: The thickness of the gusset plate is 0.5 mm.
4. The miniaturized modular power supply according to claim 1, characterized in that: The shell is made of copper.
5. The miniaturized modular power supply according to claim 4, characterized in that: The wall thickness of the copper shell is 0.5 mm.
6. The miniaturized modular power supply according to any one of claims 1 to 5, characterized in that: The insulator is a high-conductivity silicone cloth.
7. The miniaturized modular power supply according to claim 6, characterized in that: After the upper printed board and the lower printed board are welded, they are placed in a shell, and potting silica gel is filled in the shell.
8. The miniaturized modular power supply according to claim 7, characterized in that: The gusset plate and the shell are fixed at their joints by using epoxy fixing glue.