Microphone

Abstract

The utility model provides a microphone. The circuit board covers and is fixed on the shell, and a first cavity and a second cavity are defined by the circuit board and the shell; the first chip assembly is fixed on one side, close to the shell, of the circuit board and is positioned in the first cavity; the second chip assembly is fixed on one side, close to the shell, of the circuit board and is positioned in the second cavity; the first chip assembly comprises a first AISC chip and a first MEMS chip, and the second chip assembly comprises a second AISC chip and a second MEMS chip; the microphone further comprises a first metal layer which is fixed on one side, close to the shell, of the circuit board and respectively surrounds the first chip assembly and the second chip assembly. The microphone provided by the utility model can avoid the problem that the performance of other devices is affected by the heat generated by the working of the AISC chip through the heat conduction of the substrate of the circuit board or the heat dissipation of the heat movement of the air.

Description

Technical Field

[0001] The utility model relates to the technical field of sound-to-electricity conversion, in particular to a new microphone. Background Art

[0002] A microphone is an circulator that converts sound into electronic signals, and mainly includes a housing, a circuit board that is surrounded by the housing to form a plurality of cavities, and a MEMS chip or a plurality of AISC chips respectively housed in the plurality of cavities.

[0003] When multiple MEMS chips and multiple AISC chips in the related technology work together, the AISC chip will generate a lot of heat, which will be dissipated through the substrate of the circuit board or through the thermal movement of the air in the cavity. Both heat dissipation methods will affect the performance of other devices, especially devices that are easily affected by heat.

[0004] Therefore, it is necessary to provide a new microphone to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a new microphone to solve the problem that the microphone in the related art easily affects the performance of other devices by heat conduction of the substrate of the circuit board or heat movement of the air to dissipate heat.

[0006] In order to solve the above problems, the utility model provides a microphone, which includes a shell, a circuit board fixed to the shell and together enclosing a first cavity and a second cavity, a first chip assembly fixed to the circuit board close to the shell and located in the first cavity, and a second chip assembly fixed to the circuit board close to the shell and located in the second cavity; the first chip assembly includes a first AISC chip and a first MEMS chip, the second chip assembly includes a second AISC chip and a second MEMS chip, and the first cavity and the second cavity are connected to each other; the microphone also includes a first metal layer fixed to the circuit board close to the shell and arranged around the first chip assembly and the second chip assembly respectively, and the shell is fixed to the side of the first metal layer away from the circuit board.

[0007] Preferably, the shell includes a shell with an annular structure and fixed to the first metal layer, a partition protruding from one side of the shell to the other side of the shell and fixed to the first metal layer, and a cover plate simultaneously covering the side of the shell away from the circuit board and the side of the partition away from the circuit board; the cover plate and the circuit board are respectively located on opposite sides of the shell and together form a cavity, and the partition divides the cavity into the first cavity and the second cavity; the microphone also includes a second metal layer simultaneously fixed to the side of the shell close to the circuit board and the side of the partition close to the circuit board, and / or a third metal layer simultaneously fixed to the side of the shell away from the circuit board and the side of the partition away from the circuit board, the second metal layer is adhered and fixed to the first metal layer, and the cover plate is covered on the side of the third metal layer away from the circuit board; the second metal layer fixed on the partition and / or the third metal layer fixed on the partition are provided with a notch, and the notch connects the first cavity and the second cavity.

[0008] Preferably, the second metal layer fixed on the partition and the third metal layer fixed on the partition are respectively provided with the notches.

[0009] Preferably, the total area of ​​all the notches is less than 6400um 2 .

[0010] Preferably, the orthographic projections of the second metal layer and / or the third metal layer in the direction of the circuit board overlap with the first metal layer respectively.

[0011] Preferably, the housing further comprises a through hole penetrating the partition and connecting the first cavity and the second cavity, and the area of ​​the through hole is less than 6400um. 2 .

[0012] Preferably, the shell is rectangular, and the partition is formed by extending from a middle area on one side of the shell to a middle area on the other side thereof.

[0013] Preferably, the inner side of the shell close to the first cavity and the second cavity is a metal side wall.

[0014] Preferably, the first MEMS chip is fixed to a side of the first AISC chip away from the circuit board.

[0015] Preferably, a sound inlet hole is provided through the circuit board at a position corresponding to the second MEMS chip, and the sound inlet hole connects the second MEMS chip with the outside.

[0016] Compared with the prior art, the microphone of the present invention arranges the first AISC chip and the first MEMS chip in the first chip assembly in the first cavity, arranges the second AISC chip and the second MEMS chip in the second chip assembly in the second cavity, and fixes the first metal layer respectively arranged around the first chip assembly and the second chip assembly on the circuit board, so that the area of ​​the first chip assembly and the area of ​​the second chip assembly can be separated by the first metal layer, so as to avoid the problem that the heat generated by the AISC chip during operation affects the performance of other devices by heat conduction of the substrate of the circuit board or thermal movement of the air. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0018] Figure 1 A schematic diagram of the three-dimensional structure of a microphone provided in an embodiment of the utility model;

[0019] Figure 2 A schematic diagram of the structural decomposition of a microphone provided by an embodiment of the utility model;

[0020] Figure 3 for Figure 1 Section view along line AA.

[0021] 100. Microphone; 1. Shell; 101. Shell; 102. Partition; 103. Cover; 104. First cavity; 105. Second cavity; 2. Circuit board; 201. Sound inlet; 3. First chip assembly; 301. First AISC chip; 302. First MEMS chip; 4. Second chip assembly; 401. Second AISC chip; 402. Second MEMS chip; 5. First metal layer; 6. Third metal layer; 7. Notch; 8. Pad; 9. Connecting wire. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] The present invention provides a microphone 100, Figures 1 to 3 As shown, it includes a shell 1, a circuit board 2 which is fixed to the shell 1 and together encloses a first cavity 104 and a second cavity 105, a first chip assembly 3 which is fixed to the side of the circuit board 2 close to the shell 1 and located in the first cavity 104, and a second chip assembly 4 which is fixed to the side of the circuit board 2 close to the shell 1 and located in the second cavity 105; the first chip assembly 3 includes a first AISC chip 301 and a first MEMS chip 302, the second chip assembly 4 includes a second AISC chip 401 and a second MEMS chip 402, and the first cavity 104 and the second cavity 105 are connected to each other.

[0024] The inner side of the housing 1 close to the first cavity 104 and the second cavity 105 is a metal side wall. This design can meet the anti-radio frequency interference requirements of the microphone 100.

[0025] A sound inlet hole 201 is provided at a position of the circuit board 2 corresponding to the second MEMS chip 402 , and the sound inlet hole 201 connects the second MEMS chip 402 with the outside.

[0026] The first MEMS chip 302 is fixed to a side of the first AISC chip 301 away from the circuit board.

[0027] The first MEMS chip 302 and the first AISC chip 301 are respectively provided with a plurality of pads 8 on the side away from the circuit board 2. The first MEMS chip 302 and the first AISC chip 301 are electrically connected through a plurality of connecting wires 9, and the two ends of each connecting wire 9 are respectively connected to a pad 8 on the corresponding first MEMS chip 302 and a pad 8 on the first AISC chip 301; the circuit board 2 is also provided with a plurality of pads 8, and the first AISC chip 301 and the circuit board 2 are electrically connected through a plurality of connecting wires 9, and the two ends of each connecting wire 9 are respectively connected to a pad 8 on the corresponding first AISC chip 301 and a pad 8 on the circuit board 2. The electrical connection method between the corresponding second MEMS chip 402, the second AISC chip 401 and the circuit board 2 is the same or similar to the electrical connection method between the first MEMS chip 302, the first AISC chip 301 and the circuit board 2, and will not be repeated here.

[0028] Specifically, the housing 1 includes a shell 101 in an annular structure and fixed to the first metal layer 5, a partition 102 protruding from one side of the shell 101 to the other side of the shell 101 and fixed to the first metal layer 5, and a cover plate 103 that is simultaneously provided on the side of the shell 101 away from the circuit board 2 and the side of the partition 102 away from the circuit board 2, the cover plate 103 and the circuit board 2 are respectively located on opposite sides of the shell 101 and together form a cavity, and the partition 102 separates the cavity into a first cavity 104 and a second cavity 105. This design can achieve physical isolation of the first chip assembly 3 and the second chip assembly 4 with different functions.

[0029] The housing 1 is rectangular, and the partition 102 is formed by extending from the middle area of ​​one side of the housing 1 to the middle area of ​​the other side thereof. Of course, the housing 1 can also be designed into other shapes, such as triangle, ellipse, trapezoid, etc., according to actual needs.

[0030] The housing 1 further includes a perforation penetrating the partition 102 and connecting the first cavity 104 and the second cavity 105; the area of ​​the perforation is less than 6400um 2 .

[0031] Specifically, the microphone 100 further includes a first metal layer 5 fixed to a side of the circuit board 2 close to the housing 1 and arranged around the first chip assembly 3 and the second chip assembly 4 respectively, and the housing 1 is fixed to a side of the first metal layer 5 away from the circuit board 2. In this way, the area of ​​the first chip assembly 3 and the area of ​​the second chip assembly 4 can be separated by the first metal layer 5.

[0032] The first metal layer 5 is a metal coating applied on the circuit board 2 .

[0033] Specifically, the microphone 100 further includes a second metal layer fixed to both the side of the housing 101 close to the circuit board 2 and the side of the partition 102 close to the circuit board 2, and / or a third metal layer 6 fixed to both the side of the housing 101 away from the circuit board 2 and the side of the partition 102 away from the circuit board 2, the second metal layer is bonded and fixed to the first metal layer 5, and the cover plate 103 is covered on the side of the third metal layer 6 away from the circuit board 2; the second metal layer fixed on the partition 102 and / or the third metal layer 6 fixed on the partition 102 are provided with a notch 7, and the notch 7 connects the first cavity 104 and the second cavity 105. Such a design can meet the ventilation requirements of the microphone 100 and reduce the number of perforations on the housing 1, so as to facilitate the design of the back-end application and save the cost of the back-end application.

[0034] The second metal layer and the third metal layer 6 are metal coatings coated on the housing 101 and the partition 10 respectively.

[0035] The orthographic projections of the second metal layer and / or the third metal layer 6 in the direction of the circuit board 2 respectively overlap with the first metal layer 5 .

[0036] The total area of ​​all slots 7 is less than 6400um 2 .

[0037] In this embodiment, only the third metal layer 6 fixed on the partition 102 is provided with the notch 7. Of course, according to actual needs, only the second metal layer fixed on the partition 102 may be provided with the notch 7, or the second metal layer fixed on the partition 102 and the third metal layer 6 fixed on the partition 102 may be provided with the notch 7 respectively.

[0038] As another optional embodiment of the cover plate 103, a fourth metal layer corresponding to the first metal layer 5 is fixed to the area of ​​the cover plate 103 close to the circuit board 2 and corresponding to the first metal layer 5, and the fourth metal layer is fixed to the third metal layer 6 on the side away from the cover plate 103. This design can cooperate with the first metal layer 5 to better separate the area of ​​the first chip assembly 3 and the area of ​​the second chip assembly 4.

[0039] The microphone 100 of this embodiment fixes the first AISC chip 301 and the first MEMS chip 302 in the first chip assembly 3 in the first cavity 104, respectively, and sets the second AISC chip 401 and the second MEMS chip 402 in the second chip assembly 4 in the second cavity 105, respectively. A first metal layer 5 that surrounds the first chip assembly 3 and the second chip assembly 4 is fixed on the circuit board 2. In this way, the area of ​​the first chip assembly 3 and the area of ​​the second chip assembly 4 can be separated by the first metal layer 5 to avoid the problem that the heat generated by the AISC chip during operation affects the performance of other devices by heat conduction through the substrate of the circuit board 2 or heat movement of the air.

[0040] The above is only an implementation method of the present invention. It should be pointed out that a person skilled in the art can make improvements without departing from the inventive concept of the present invention, but these improvements are all within the protection scope of the present invention.

Claims

1. A microphone, comprising a housing, a circuit board fixed to the housing and forming a first cavity and a second cavity with the housing, a first chip assembly fixed to a side of the circuit board close to the housing and located in the first cavity, and a second chip assembly fixed to a side of the circuit board close to the housing and located in the second cavity; the first chip assembly comprises a first AISC chip and a first MEMS chip, the second chip assembly comprises a second AISC chip and a second MEMS chip, and the first cavity and the second cavity are connected to each other; characterized in that The microphone further comprises a first metal layer fixed to a side of the circuit board close to the housing and respectively arranged around the first chip component and the second chip component, and the housing is fixed to a side of the first metal layer away from the circuit board.

2. The microphone according to claim 1, wherein: The shell includes a shell with an annular structure and fixed to the first metal layer, a partition protruding from one side of the shell to the other side of the shell and fixed to the first metal layer, and a cover plate simultaneously covering the side of the shell away from the circuit board and the side of the partition away from the circuit board; the cover plate and the circuit board are respectively located on opposite sides of the shell and together form a cavity, and the partition divides the cavity into the first cavity and the second cavity; the microphone also includes a second metal layer simultaneously fixed to the side of the shell close to the circuit board and the side of the partition close to the circuit board, and / or a third metal layer simultaneously fixed to the side of the shell away from the circuit board and the side of the partition away from the circuit board, the second metal layer is adhered and fixed to the first metal layer; the cover plate covers the side of the third metal layer away from the circuit board; the second metal layer fixed on the partition and / or the third metal layer fixed on the partition are provided with a notch, and the notch connects the first cavity and the second cavity.

3. The microphone according to claim 2, characterized in that The second metal layer fixed on the partition plate and the third metal layer fixed on the partition plate are respectively provided with the notches.

4. The microphone according to claim 2, characterized in that The total area of ​​all the notches is less than 6400um 2 .

5. The microphone according to claim 2, characterized in that The orthographic projections of the second metal layer and / or the third metal layer toward the circuit board overlap with the first metal layer respectively.

6. The microphone according to claim 2, characterized in that The housing further comprises a through hole penetrating the partition and connecting the first cavity and the second cavity, and the area of ​​the through hole is less than 6400um 2 .

7. The microphone according to claim 2, characterized in that The shell is rectangular, and the partition is formed by extending from a middle area on one side of the shell to a middle area on the other side thereof.

8. The microphone according to claim 1, wherein: The inner side of the shell close to the first cavity and the second cavity is a metal side wall.

9. The microphone according to claim 1, wherein: The first MEMS chip is fixed to a side of the first AISC chip away from the circuit board.

10. The microphone according to claim 1, wherein A sound inlet hole is provided on the circuit board at a position corresponding to the second MEMS chip, and the sound inlet hole connects the second MEMS chip with the outside.

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