Mounting structure of semiconductor chilling plate

Abstract

The utility model discloses a mounting structure of a semiconductor chilling plate in the technical field of semiconductor chilling plates, which comprises a mounting plate, fixing frames are welded at two ends of the bottom of the mounting plate and two ends of the mounting plate, a rotating shaft is rotatably connected to the middle of each fixing frame, and a rotating plate is fixedly sleeved on the outer side of each rotating shaft. The device comprises a rotating plate, a balancing weight is installed at one end of the top of the rotating plate through a screw, compression springs are welded to the positions, away from the balancing weight, of the two ends of the top of the rotating plate, and the tops of the two compression springs are connected through a connecting plate. The heat dissipation box and the semiconductor chilling plate are convenient to mount and dismount and can be mounted through the heat dissipation box and the semiconductor chilling plate, the mounting and dismounting efficiency of the heat dissipation box and the semiconductor chilling plate is improved, and the problem that in existing life, mounting is conducted through screws, and mounting is not convenient is solved. And the installation efficiency of the heat dissipation box and the semiconductor chilling plate is low.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration sheets, in particular to an installation structure of a semiconductor refrigeration sheet. Background Art

[0002] Semiconductor refrigerator, also called thermoelectric refrigerator, is a heat pump. Its advantage is that it has no sliding parts. It is used in some places where space is limited, reliability is high, and there is no refrigerant pollution. It uses the Peltier effect of semiconductor materials. When direct current passes through a couple made of two different semiconductor materials in series, heat can be absorbed and released at both ends of the couple respectively, thereby achieving the purpose of cooling. It is a refrigeration technology that produces negative thermal resistance. It is characterized by no moving parts and relatively high reliability. In current life, semiconductor refrigerators are installed by screws.

[0003] Although installing semiconductor refrigeration plates by screws in current life has met the user's needs to a certain extent, there are still certain defects in the use process. The specific problems are as follows: when installing by screws, the semiconductor refrigeration plate needs to be aligned with the mounting holes on the mounting frame, and then installed by screws, which leads to the problem of inconvenience in installing the semiconductor refrigeration plate. The installation by screws leads to low installation efficiency of the semiconductor refrigeration plate. Based on this, the utility model designs a mounting structure for semiconductor refrigeration plates to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a mounting structure of a semiconductor refrigeration sheet to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor cooling plate installation structure, comprising a mounting plate, both ends of the bottom of the mounting plate and both ends of the mounting plate are welded with fixing frames, a heat sink is arranged on the top of the mounting plate, and a semiconductor cooling plate is arranged in the middle of the bottom end of the mounting plate;

[0006] The mounting plate is connected to the heat sink and the semiconductor cooling plate through a mounting connection mechanism, and the mounting connection mechanism includes a rotating shaft, a rotating plate, a counterweight, a compression spring, a connecting plate, a clamping block and a clamping slot;

[0007] A rotating shaft is rotatably connected to the middle part of the fixed frame, a rotating plate is fixedly sleeved on the outer side of the rotating shaft, a counterweight block is installed at one end of the top of the rotating plate by means of screws, compression springs are welded at both ends of the top of the rotating plate away from the counterweight block, the tops of the two compression springs are connected by a connecting plate, a clamping block is welded at the bottom of the connecting plate, and clamping slots are provided at both ends of the semiconductor refrigeration plate and the heat sink.

[0008] Preferably, the longitudinal section of the clamping block is arc-shaped, and the positions of the clamping block and the clamping slot correspond to each other.

[0009] Preferably, the compression spring is welded to the connecting plate, and a corresponding groove is provided on the fixing frame at a position corresponding to the rotating plate.

[0010] Preferably, a support assembly is installed at the bottom of the fixing frame, and the support assembly includes a moving groove, a moving block, a threaded cylinder, a threaded rod and a support rod;

[0011] Both ends of the bottom surface of the mounting plate are provided with moving grooves, a moving block is slidably connected inside the moving groove, a threaded barrel is fixedly installed at the bottom of the moving block, a threaded rod is threadedly connected inside the threaded barrel, and a support rod is movably installed at the bottom of the threaded rod.

[0012] Preferably, the longitudinal sections of the moving groove and the moving block are both T-shaped, and the inner wall of the moving groove is in contact with the outer side of the moving block.

[0013] Preferably, a T-block is rotatably embedded inside the bottom end of the threaded rod, and the support rod is fixedly installed at the bottom of the T-block.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. An installation connection mechanism is provided to facilitate the installation and disassembly of the heat sink and the semiconductor refrigeration sheet, and the installation of the heat sink and the semiconductor refrigeration sheet can be realized through the heat sink and the semiconductor refrigeration sheet, thereby improving the efficiency of the installation and disassembly of the heat sink and the semiconductor refrigeration sheet, and solving the problem of low installation efficiency of the heat sink and the semiconductor refrigeration sheet caused by the installation of screws in the existing life.

[0016] 2. A support assembly is provided. On the one hand, it can make the support rod contact with the end face of the fixed frame, squeeze and support the end face of the support rod, enhance the connection strength of the support rod, and make the semiconductor refrigeration plate more stably fixed. On the other hand, it can also make the support rod contact with the plane to support the entire device and ensure the stability of the device when it is used. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2This is a schematic diagram of the structure of the installation connection mechanism of the utility model;

[0020] Figure 3 For this utility model Figure 2 A schematic diagram of the enlarged structure of area;

[0021] Figure 4 This is a schematic diagram of the support assembly structure of the utility model.

[0022] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0023] 1. Mounting plate; 2. Fixing frame; 3. Heat sink; 4. Semiconductor cooling sheet;

[0024] 5. Install the connecting mechanism; 501, rotating shaft; 502, rotating plate; 503, counterweight; 504, compression spring; 505, connecting plate; 506, clamping block; 507, clamping slot;

[0025] 6. Support assembly; 601. Moving groove; 602. Moving block; 603. Threaded cylinder; 604. Threaded rod; 605. Support rod. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-4 The utility model provides a technical solution: a semiconductor cooling plate installation structure, including a mounting plate 1, a fixing frame 2 is welded to both ends of the bottom of the mounting plate 1 and both ends of the mounting plate 1, a heat sink 3 is arranged on the top of the mounting plate 1, and a semiconductor cooling plate 4 is arranged in the middle of the bottom end of the mounting plate 1;

[0028] The mounting plate 1 is connected to the heat sink 3 and the semiconductor cooling sheet 4 through a mounting connection mechanism 5, and the mounting connection mechanism 5 includes a rotating shaft 501, a rotating plate 502, a counterweight 503, a compression spring 504, a connecting plate 505, a clamping block 506 and a clamping slot 507;

[0029] A rotating shaft 501 is rotatably connected to the middle part of the fixed frame 2, and a rotating plate 502 is fixedly sleeved on the outer side of the rotating shaft 501. A counterweight block 503 is installed at one end of the top of the rotating plate 502 by screws. Compression springs 504 are welded at both ends of the top of the rotating plate 502 away from the counterweight block 503. The compression spring 504 is welded and connected to the connecting plate 505. A corresponding groove is opened at the position of the fixed frame 2 corresponding to the rotating plate 502, which is convenient for driving the connecting plate 505 to move and for facilitating the rotation of the rotating plate 502. The tops of the two compression springs 504 are connected by the connecting plate 505. A clamping block 506 is welded at the bottom of the connecting plate 505. The longitudinal section of the clamping block 506 is arc-shaped. The positions of the clamping block 506 and the clamping slot 507 correspond to each other, which is convenient for the rotation of the clamping block 506 and for moving the clamping block 506 into the inside of the clamping slot 507, thereby facilitating the fixing of the semiconductor cooling plate 4 and the heat sink 3. The semiconductor cooling plate 4 and the heat sink 3 are both provided with clamping slots 507 at both ends.

[0030] A support assembly 6 is installed at the bottom of the fixed frame 2, and the support assembly 6 includes a moving groove 601, a moving block 602, a threaded cylinder 603, a threaded rod 604 and a support rod 605;

[0031] Movable grooves 601 are provided at both ends of the bottom surface of the mounting plate 1, and a movable block 602 is slidably connected inside the movable groove 601. The longitudinal sections of the movable groove 601 and the movable block 602 are both T-shaped, and the inner wall of the movable groove 601 contacts the outer side of the movable block 602 to prevent the movable block 602 from falling off and to ensure the stability of the movement of the movable block 602. A threaded cylinder 603 is fixedly installed at the bottom of the movable block 602, and a threaded rod 604 is threadedly connected inside the threaded cylinder 603. A T-block is rotatably embedded in the bottom end of the threaded rod 604, and a support rod 605 is fixedly installed at the bottom of the T-block to facilitate the rotation of the threaded rod 604 and to facilitate the adjustment of the angle of the support rod 605 to avoid the problem of the support rod 605 falling off. A support rod 605 is movably installed at the bottom of the threaded rod 604.

[0032] When installing the heat sink 3, the personnel move the heat sink 3 to between the two fixing frames 2. At this time, the heat sink 3 pushes the rotating plate 502 to rotate, thereby driving the block 506 to rotate. After the two ends of the heat sink 3 are completely moved into the two fixing frames 2, the block 506 moves into the slot 507 to fix the heat sink 3. When the heat sink 3 needs to be taken away, the personnel move the connecting plate 505 to compress the spring 504, thereby driving the block 506 to move and remove the block 506 from the slot 507, thereby realizing the disassembly of the heat sink 3. The semiconductor cooling plate 4 can be installed and disassembled by operating the semiconductor cooling plate 4 in the same way as above.

[0033] After the personnel fix the mounting plate 1 at the required position, the personnel can then rotate the threaded rod 604 to move the threaded rod 604 inside the threaded tube 603, thereby driving the support rod 605 to move, and through the rotation of the moving block 602, the support rod 605 can be brought into contact with the end face of the fixing frame 2, squeezing and supporting the end face of the support rod 605, thereby enhancing the connection strength of the support rod 605, making the semiconductor refrigeration plate 4 more stably fixed, and also allowing the support rod 605 to be brought into contact with the plane to support the entire device and ensure the stability of the device when in use.

[0034] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0035] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor cooling sheet installation structure, comprising a mounting plate (1), fixing frames (2) are welded to both ends of the bottom of the mounting plate (1) and both ends of the mounting plate (1), a heat dissipation box (3) is arranged on the top of the mounting plate (1), and a semiconductor cooling sheet (4) is arranged in the middle of the bottom end of the mounting plate (1); Features: The mounting plate (1) is connected to the heat sink (3) and the semiconductor cooling plate (4) via a mounting connection mechanism (5), wherein the mounting connection mechanism (5) comprises a rotating shaft (501), a rotating plate (502), a counterweight (503), a compression spring (504), a connecting plate (505), a clamping block (506) and a clamping slot (507); The middle part of the fixed frame (2) is rotatably connected to a rotating shaft (501), and a rotating plate (502) is fixedly sleeved on the outer side of the rotating shaft (501). A counterweight (503) is installed at one end of the top of the rotating plate (502) by means of screws. Compression springs (504) are welded at both ends of the top of the rotating plate (502) away from the counterweight (503). The tops of the two compression springs (504) are connected by a connecting plate (505), and a clamping block (506) is welded at the bottom of the connecting plate (505). Clamping slots (507) are provided at both ends of the semiconductor refrigeration plate (4) and the heat sink (3).

2. The semiconductor refrigeration chip installation structure according to claim 1, characterized in that: The longitudinal section of the clamping block (506) is in the shape of an arc, and the positions of the clamping block (506) and the clamping slot (507) correspond to each other.

3. The semiconductor cooling plate installation structure according to claim 1, characterized in that: The compression spring (504) is welded to the connecting plate (505), and a corresponding groove is provided on the fixing frame (2) at a position corresponding to the rotating plate (502).

4. The semiconductor cooling plate installation structure according to claim 1, characterized in that: A support assembly (6) is installed at the bottom of the fixed frame (2), and the support assembly (6) comprises a moving groove (601), a moving block (602), a threaded cylinder (603), a threaded rod (604) and a support rod (605); Both ends of the bottom surface of the mounting plate (1) are provided with movable grooves (601), a movable block (602) is slidably connected inside the movable groove (601), a threaded cylinder (603) is fixedly installed at the bottom of the movable block (602), a threaded rod (604) is threadedly connected inside the threaded cylinder (603), and a support rod (605) is movably installed at the bottom of the threaded rod (604).

5. The semiconductor cooling plate installation structure according to claim 4, characterized in that: The longitudinal sections of the moving groove (601) and the moving block (602) are both T-shaped, and the inner wall of the moving groove (601) and the outer side of the moving block (602) are in contact with each other.

6. The semiconductor cooling plate installation structure according to claim 4, characterized in that: A T-shaped block is rotatably embedded inside the bottom end of the threaded rod (604), and the support rod (605) is fixedly installed at the bottom of the T-shaped block.

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