Wafer carrying platform and wafer film coating equipment
By setting movable cleaning rings and blow holes on the wafer stage, the problem of particulate matter pressing caused by the residual film layer during wafer filming is solved, and the cleaning of the placement stage is achieved, avoiding chip cracking and improving The quality and efficiency of wafer film are obtained.
Patent Information
- Application Number
- CN202421010953.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-10
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-05-10
AI Technical Summary
Before wafer cutting, there is easy to remain in the film layer during the protective film on the front of the wafer, resulting in the problem of chip cracking caused by particulate matter on the front of the wafer.
Design a wafer stage, including a base and a cleaning ring that can be moved in the axial direction, with a blow hole on the cleaning ring, which is used to purge the residual adhesive layer on the placement table after the film is pasted, so as to realize the placement table clean. The stage is equipped with a blow hole and an intake pipe to remove residues through the airflow to prevent particulate matter from being pressed.
It effectively reduces chip cracks caused by particulate matter pressing on the front of the wafer, improves the cleanliness and quality of the wafer film pasting process, and ensures the normal progress of the next round of film pasting operations.
Smart Images
Figure CN222233607U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor equipment, and in particular to a wafer carrier and a wafer coating device. Background Art
[0002] Usually before wafer cutting, it is necessary to apply a protective film to the front of the wafer to protect it from contamination of the chip on the front of the wafer. The protective film is applied by covering the wafer platform with a layer of adhesive film, and then placing the wafer on the wafer platform with the front facing the adhesive film. The adhesive film layer is bonded to the front of the wafer through the process of heating and cooling the surface temperature of the wafer platform to achieve film application on the front of the wafer. It is easy for the adhesive film layer to remain on the surface of the wafer platform, which directly leads to the hidden cracks of the chip caused by the pressing of particles on the front of the wafer during the application process. Utility Model Content
[0003] The utility model aims to provide a wafer carrier and a wafer coating device, which can clean the wafer placement table and reduce the residual film layer, thereby avoiding the hidden cracks of the chip caused by the pressing of particles on the front side of the wafer.
[0004] The embodiment of the utility model is achieved as follows:
[0005] In a first aspect, the utility model provides a wafer stage, comprising:
[0006] A base, wherein a placing table is provided on the base; the placing table is used to carry the wafer;
[0007] A cleaning ring is connected to the base and can move along the axial direction of the base; a blowing hole is provided on the cleaning ring, and the blowing hole is used to blow air toward the placement table.
[0008] In an optional embodiment, the base and the cleaning ring are coaxially arranged, and one of the base and the cleaning ring is provided with a fixed shaft, and the other is provided with an axial hole; the fixed shaft is movably installed in the axial hole.
[0009] In an optional embodiment, an air inlet pipe is provided in the shaft hole, and a through hole communicating with the blowing hole is provided on the fixed shaft; the air inlet pipe is communicated with the through hole.
[0010] In an optional embodiment, an air inlet pipe is provided on the base, and the air inlet pipe is connected to the air hole.
[0011] In an optional embodiment, the cleaning ring includes an inner circumferential surface and a first outer circumferential surface that are arranged opposite to each other, and the blowing hole passes through the inner circumferential surface and the first outer circumferential surface.
[0012] In an optional embodiment, heat dissipation holes are provided on the placement platform.
[0013] In an optional embodiment, the heat dissipation holes are radially opened on the second outer peripheral surface of the placement table.
[0014] In an optional embodiment, the heat dissipation hole passes through the center of the placement platform and penetrates the placement platform.
[0015] In an optional embodiment, the placement table is provided with a heating wire.
[0016] In a second aspect, the utility model provides a wafer coating device, comprising a compressed gas source and a wafer carrier as described in any one of the aforementioned embodiments, wherein the compressed gas source provides gas for the blowing holes.
[0017] The beneficial effects of the embodiments of the utility model include:
[0018] The wafer carrier provided by the embodiment of the utility model has a placement table for placing the wafer on the base. A cleaning ring is also provided on the base. The cleaning ring can move along the axial direction of the base. After the wafer film is attached, the cleaning ring can move away from the base so that the airflow in the air hole can sweep the placement table, thereby removing the residual film layer on the placement table and achieving the purpose of cleaning the placement table. In the next round of wafer film attachment, it can avoid the hidden cracks of the chip caused by the pressing of particles on the front side of the wafer.
[0019] The wafer coating device provided by the embodiment of the utility model includes the above-mentioned wafer carrier. Before the wafer is coated, the placement table can be purged to achieve the purpose of cleaning the placement table. Thereby reducing foreign matter and residual film layer on the placement table, and avoiding the hidden cracks of the chip caused by the pressing of particles on the front side of the wafer during the coating process. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0021] Figure 1 A schematic diagram of the structure of a wafer carrier provided in an embodiment of the utility model;
[0022] Figure 2 A schematic diagram of the exploded structure of a wafer carrier provided in an embodiment of the utility model;
[0023] Figure 3 A schematic diagram of the structure of the cleaning ring blowing state of the wafer carrier provided by an embodiment of the utility model;
[0024] Figure 4 A schematic structural diagram of a base of a wafer carrier provided in an embodiment of the utility model;
[0025] Figure 5 A schematic structural diagram of a cleaning ring of a wafer carrier provided by an embodiment of the utility model from a first perspective;
[0026] Figure 6 A schematic structural diagram of a cleaning ring of a wafer carrier provided by an embodiment of the utility model from a second perspective;
[0027] Figure 7 A structural schematic diagram of a wafer film attaching process on a wafer carrier provided in an embodiment of the utility model.
[0028] Icons: 100-wafer carrier; 110-base; 120-placing table; 121-heat dissipation hole; 123-second outer peripheral surface; 130-axis hole; 131-inlet pipe; 140-cleaning ring; 141-blowing hole; 143-inner peripheral surface; 145-first outer peripheral surface; 150-fixed axis; 151-through hole; 200-wafer; 210-film layer. DETAILED DESCRIPTION
[0029] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0031] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0032] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0033] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0034] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0035] Please refer to Figures 1 to 3 The present embodiment provides a wafer carrier 100, including a base 110 and a cleaning ring 140. A placement table 120 is provided on the base 110. The placement table 120 is used to carry a wafer 200 (see Figure 7 ). The cleaning ring 140 is connected to the base 110 and can move along the axial direction of the base 110. The cleaning ring 140 is provided with a blowing hole 141, and the blowing hole 141 is used to blow air toward the placement table 120 to achieve purging and cleaning of the placement table 120. After the wafer 200 is filmed, the cleaning ring 140 can move away from the base 110, so that the airflow in the blowing hole 141 can purge the placement table 120, thereby removing the residual film layer and other foreign matter and impurities on the placement table 120, and avoiding the hidden cracks of the chip caused by the pressing of particles on the front side of the wafer 200 during the filming process.
[0036] The base 110 and the cleaning ring 140 are coaxially arranged. One of the base 110 and the cleaning ring 140 is provided with a fixed shaft 150, and the other is provided with an axial hole 130. The fixed shaft 150 is movably installed in the axial hole 130, so that the cleaning ring 140 can move axially relative to the base 110, thereby changing the relative position of the cleaning ring 140 and the placement table 120. This makes it easier for the cleaning ring 140 to purge the placement table 120. After the purge is completed, the cleaning ring 140 moves axially toward the base 110 and fits with the base 110. This will not affect the film pasting operation of the wafer 200.
[0037] Combination Figures 4 to 6 In this embodiment, the base 110 is provided with an axial hole 130, and the cleaning ring 140 is provided with a fixed shaft 150. Of course, in some other embodiments, the axial hole 130 may be provided on the cleaning ring 140, and the fixed shaft 150 may be provided on the base 110, which is not specifically limited here.
[0038] Optionally, an air inlet pipe 131 is provided in the shaft hole 130, and a through hole 151 communicating with the air blowing hole 141 is provided on the fixed shaft 150. The air inlet pipe 131 is communicated with the through hole 151. In this embodiment, the air inlet pipe 131 is provided in the shaft hole 130. The fixed shaft 150 is provided with a through hole 151 along the axial direction. The through hole 151 serves as a gas flow channel. With this arrangement, the structure is more compact. And it is easy to install. When the fixed shaft 150 is inserted into the shaft hole 130, the air inlet pipe 131 and the through hole 151 are automatically communicated, and no separate assembly is required.
[0039] Optionally, the cleaning ring 140 is in a circular ring shape. The cleaning ring 140 includes an inner circumferential surface 143 and a first outer circumferential surface 145 that are relatively arranged, and the blowing holes 141 penetrate the inner circumferential surface 143 and the first outer circumferential surface 145. The blowing holes 141 are opened along the radial direction of the cleaning ring 140 and are designed as through holes, which are conducive to the flow of gas, improve the blowing effect, and also have certain heat dissipation performance. The shape, number and distribution position of the blowing holes 141 are not limited and can be flexibly designed according to actual conditions. As long as the placement table 120 can be purged and cleaned, it can be used.
[0040] Of course, in some embodiments, the air hole 141 may not be designed as a through hole. The air hole 141 is opened on the inner circumference 143 of the cleaning ring 140 and does not penetrate the first outer circumference 145. As long as the air hole 141 is connected to the through hole 151 on the fixed shaft 150, it will be fine.
[0041] Optionally, the base 110 is provided with an air inlet pipe 131, and the air inlet pipe 131 is connected to the air blowing hole 141. In some embodiments, the air inlet pipe 131 and the shaft hole 130 can be arranged separately and at intervals. In other words, the base 110 is provided with an air inlet pipe 131 and the shaft hole 130 at intervals. The cleaning ring 140 is provided with a fixed shaft 150 and a flow channel hole at intervals. Among them, the fixed shaft 150 and the shaft hole 130 correspond one to one. The flow channel hole and the air inlet pipe 131 are connected one to one. The flow channel hole is connected to the air blowing hole 141 on the cleaning ring 140. In this way, the cleaning ring 140 can move axially along the base 110. In addition, the gas can also pass through the air inlet pipe 131, the flow channel hole and the air blowing hole 141 to purge and clean the placement table 120.
[0042] Optionally, the placement table 120 is provided with heat dissipation holes 121. The placement table 120 has a second outer peripheral surface 123. The second outer peripheral surface 123 of the placement table 120 is provided with heat dissipation holes 121 in the radial direction. The shape, number and distribution position of the heat dissipation holes 121 are not limited and can be flexibly designed according to actual conditions. The heat dissipation holes 121 can achieve rapid heat dissipation and rapid temperature reduction of the placement table 120, thereby improving the quality and efficiency of the wafer 200 film bonding.
[0043] In this embodiment, the heat dissipation hole 121 passes through the center of the placement platform 120 and penetrates the placement platform 120 . That is, the heat dissipation hole 121 is opened along the diameter direction of the placement platform 120 .
[0044] Optionally, the placement table 120 is provided with a heating wire (not shown). The heating wire is used to heat the placement table 120 to soften the adhesive film layer 210 (see Figure 7 ), so as to facilitate the application of the adhesive film layer 210 to the front of the wafer 200. The heating wire can be arranged inside or on the outer peripheral surface of the placement platform 120. It will not directly contact with the adhesive film layer 210, and can ensure that the surface of the adhesive film layer 210 on the placement platform 120 is smooth and flat, so as to improve the quality of the wafer 200 film.
[0045] Optionally, a positioning part is further provided on the base 110. The positioning part is used to connect with the machine platform. The positioning part includes but is not limited to at least one of a positioning hole and a positioning block.
[0046] The wafer coating device provided by the embodiment of the utility model comprises a machine platform, a compressed air source and a wafer carrier 100 as in any one of the above embodiments, wherein the compressed air source provides gas to the blowing holes 141. The base 110 is fixed on the machine platform.
[0047] The working principle of the wafer stage 100 is as follows:
[0048] The cleaning ring 140 is coaxially mounted on the base 110. Before film pasting, the cleaning ring 140 moves axially in a direction away from the base 110 so that the blowing hole 141 of the cleaning ring 140 is aligned with the surface of the placement table 120. The compressed gas source is turned on, and the gas enters the blowing hole 141 from the air inlet pipe 131 of the base 110 through the through hole 151 of the cleaning ring 140, and the gas is ejected from the blowing hole 141 to purge and clean the placement table 120. After the purge is completed, the cleaning ring 140 moves axially to the base 110. When the cleaning ring 140 and the base 110 are in a state of being in contact with each other, the cleaning ring 140 is exposed from the placement table 120. The cleaning ring 140 will not interfere with the film pasting operation of the wafer 200.
[0049] The adhesive film layer 210 is applied to the surface of the placement table 120, and the wafer 200 is placed on the placement table 120 with the front side facing the placement table 120. The heating wire heats the placement table 120, and the adhesive film layer 210 softens and bonds to the front side of the wafer 200. Then the placement table 120 is quickly cooled down to complete the film application on the front side of the wafer 200. Figure 7 shown.
[0050] After the wafer 200 with film attached is removed, the cleaning ring 140 is moved axially again in a direction away from the base 110, so that the blowing hole 141 of the cleaning ring 140 is aligned with the surface of the placement table 120. The compressed air source is turned on to purge and clean the surface of the placement table 120 to remove the residual film layer and other impurities and foreign matter on the placement table 120. After the purge is completed, the cleaning ring 140 is moved axially to the base 110. The next round of wafer 200 film attachment operation is carried out.
[0051] In summary, the wafer stage 100 and the wafer coating device provided by the embodiment of the utility model have the following beneficial effects, including:
[0052] The wafer carrier 100 provided by the embodiment of the utility model has a placement table 120 for placing the wafer 200 on the base 110. A cleaning ring 140 is also provided on the base 110. The cleaning ring 140 can move axially along the base 110. After the wafer 200 is filmed, the cleaning ring 140 can move in a direction away from the base 110, so that the airflow in the blowing hole 141 can purge the placement table 120, thereby removing the residual film layer on the placement table 120, and achieving the purpose of cleaning the placement table 120. When the next round of wafer 200 is filmed, it can avoid the hidden cracks of the chip caused by the pressing of particles on the front side of the wafer 200. The placement table 120 is provided with a heat dissipation hole 121, which is convenient for the rapid cooling of the placement table 120. The setting of the blowing hole 141 on the cleaning ring 140 can not only purge and clean the placement table 120, but also have a certain heat dissipation and cooling effect on the placement table 120.
[0053] The wafer coating device provided by the embodiment of the utility model includes the above-mentioned wafer carrier 100. Before the wafer 200 is coated, the placement table 120 can be purged to achieve the purpose of cleaning the placement table 120. In this way, foreign matter and residual film layer on the placement table 120 are reduced, and the front side of the wafer 200 is prevented from being pressed by particles during the coating process, thereby preventing hidden cracks in the chip.
[0054] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A wafer stage, characterized in that: include: A base, wherein a placing table is provided on the base; the placing table is used to carry the wafer; A cleaning ring is connected to the base and can move along the axial direction of the base; a blowing hole is provided on the cleaning ring, and the blowing hole is used to blow air toward the placement table.
2. The wafer stage according to claim 1, characterized in that: The base and the cleaning ring are coaxially arranged. One of the base and the cleaning ring is provided with a fixed shaft, and the other is provided with an axial hole. The fixed shaft is movably installed in the axial hole.
3. The wafer stage according to claim 2, characterized in that: An air inlet pipe is arranged in the shaft hole, and a through hole communicating with the air blowing hole is arranged on the fixed shaft; the air inlet pipe is communicated with the through hole.
4. The wafer stage according to claim 1, characterized in that: An air inlet pipe is arranged on the base, and the air inlet pipe is communicated with the air blowing hole.
5. The wafer stage according to claim 1, characterized in that: The cleaning ring comprises an inner circumferential surface and a first outer circumferential surface which are arranged opposite to each other, and the blowing hole penetrates through the inner circumferential surface and the first outer circumferential surface.
6. The wafer stage according to claim 1, characterized in that: The placement platform is provided with heat dissipation holes.
7. The wafer stage according to claim 6, characterized in that: The heat dissipation holes are radially arranged on the second outer peripheral surface of the placement table.
8. The wafer stage according to claim 6, characterized in that: The heat dissipation hole passes through the center of the placement platform and penetrates the placement platform.
9. The wafer stage according to any one of claims 1 to 8, characterized in that: The placing table is provided with a heating wire.
10. A wafer coating device, characterized in that: It comprises a compressed gas source and a wafer carrier as claimed in any one of claims 1 to 9, wherein the compressed gas source provides gas for the blowing holes.