Electronic chip with heat dissipation plate structure

Abstract

The utility model belongs to the technical field of electronic chips, and particularly relates to an electronic chip with a heat dissipation plate structure, which comprises a heat conduction plate and two supporting seats, a chip body is arranged at the top of the heat conduction plate, heat dissipation fins are arranged at the bottom of the heat conduction plate, and the two supporting seats are arranged at the top of the heat conduction plate. The side wall of the supporting seat is provided with a through hole, and an insertion rod is embedded in the through hole, in the use process of the electronic chip, the electronic chip and the heat dissipation plate can be conveniently and rapidly disassembled, the subsequent maintenance operation of the electronic chip is facilitated, the disassembly process is simple, installation is also convenient, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic chips, in particular to an electronic chip with a heat dissipation plate structure. Background Art

[0002] An electronic chip is a way to miniaturize a circuit and is often manufactured on the surface of a semiconductor wafer. The circuit is formed on a silicon substrate. The circuit has at least one output pad or input pad. A fixed sealing ring is formed on the silicon substrate and surrounds the circuit and the output pad or input pad.

[0003] In the existing technology, the current electronic chip uses a heat sink to dissipate heat. When the electronic chip fails and needs to be repaired, it is inconvenient to disassemble the electronic chip and the heat sink, and the disassembly process is troublesome, which reduces work efficiency. Utility Model Content

[0004] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the name of the utility model of this application to avoid blurring the purpose of this section, the abstract of the specification and the name of the utility model, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In view of the above problems and / or problems existing in existing electronic chips, the present utility model is proposed.

[0006] Therefore, the purpose of the utility model is to provide an electronic chip with a heat sink structure, which can facilitate the quick disassembly of the electronic chip and the heat sink during the use of the electronic chip, which is beneficial to the subsequent maintenance operation of the electronic chip. The disassembly process is simple and easy to install, thereby improving work efficiency.

[0007] In order to solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:

[0008] An electronic chip with a heat dissipation plate structure comprises a heat conducting plate and a support seat, wherein a chip body is arranged on the top of the heat conducting plate, heat dissipation fins are arranged on the bottom of the heat conducting plate, two support seats are arranged on the top of the heat conducting plate, through holes are arranged on the side walls of the support seats, a plug rod is embedded and installed in the through holes, a pull ring is arranged at one end of the plug rod, a spring is arranged on the side wall of the pull ring, one end of the spring is connected to the side wall of the support seat, connecting blocks are arranged on the left and right side walls of the chip body, a socket corresponding to the plug rod is arranged on the side wall of the connecting block, and heat dissipation holes are arranged on the heat conducting plate.

[0009] As a preferred solution of an electronic chip with a heat dissipation plate structure described in the utility model, a bellows is provided at the bottom of the heat dissipation fins, a fan is provided on the side wall of the bellows, an air inlet is provided on the inner wall of the bellows, the air inlet is connected to the fan, and a plurality of exhaust holes are provided on the top of the bellows.

[0010] As a preferred solution of the electronic chip with a heat dissipation plate structure described in the utility model, the side wall of the pull ring is provided with an anti-slip coating, and the anti-slip coating is bonded to the side wall of the pull ring.

[0011] As a preferred solution of the electronic chip with a heat dissipation plate structure described in the utility model, thermal conductive silicone grease is provided at the bottom of the chip body, and the thermal conductive silicone grease is bonded to the bottom of the chip body.

[0012] As a preferred solution of the electronic chip with a heat dissipation plate structure described in the utility model, wherein: the through hole is arranged corresponding to the plug hole, and one end of the plug rod passes through the through hole and is embedded in the plug hole.

[0013] As a preferred solution of the electronic chip with a heat dissipation plate structure described in the utility model, wherein: the support seat and the connecting block are connected by a plug rod and a plug hole.

[0014] As a preferred solution of the electronic chip with a heat dissipation plate structure described in the utility model, there are a plurality of heat dissipation fins and heat dissipation holes.

[0015] Compared with the prior art: In the present application document, 1. The heat generated by the chip body during operation is conveniently conducted to the heat dissipation fins through the heat conduction plate, and the heat is dissipated through a plurality of heat dissipation fins to improve the heat dissipation efficiency. A pull ring is used to pull out the insertion rod, so that one end of the insertion rod is conveniently recovered in the through hole, thereby facilitating the installation of the chip body on the heat conduction plate. Then, the pull ring is released, and the insertion rod is driven to be inserted into the corresponding socket through the elasticity of the spring. The connection seat and the connection block are connected and positioned through the matching connection of the insertion rod and the socket, so that the chip body and the heat conduction plate are connected and fixed, so that the heat conduction plate will not deviate. When disassembling the chip body, it is only necessary to operate the pull ring to pull out the insertion rod. One end of the plug rod is detached from the socket, so that it is convenient to detach the chip body from the heat conduction plate, and the disassembly is completed. The heat dissipation holes are convenient to increase the contact area between the heat conduction plate and the air, thereby improving the heat dissipation. Therefore, during the use of the electronic chip, it is convenient to quickly disassemble the electronic chip and the heat dissipation plate, which is beneficial to the subsequent maintenance operation of the electronic chip. The disassembly process is simple and easy to install, thereby improving work efficiency. 2. The wind is generated by the fan and transported to the bellows through the air inlet, so as to provide air volume in the bellows. The air is gathered in the bellows and discharged through the exhaust holes, so as to accelerate the heat dissipation effect of the heat sink, thereby further improving the heat dissipation efficiency of the electronic chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the implementation of the utility model, the utility model will be described in detail below in combination with the drawings and detailed implementation. Obviously, the drawings described below are only some implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0017] Figure 1 This is a schematic diagram of the structure of an electronic chip with a heat dissipation plate structure according to the utility model;

[0018] Figure 2 This is an exploded view of the structure of an electronic chip with a heat dissipation plate structure according to the utility model;

[0019] Figure 3 This is a structural cross-sectional view of an electronic chip with a heat dissipation plate structure according to the utility model;

[0020] Figure 4 The utility model is a schematic diagram of an exhaust hole of an electronic chip with a heat dissipation plate structure.

[0021] In the figure: 100 heat conducting plate, 110 chip body, 120 heat dissipating fins, 200 support seat, 210 through hole, 220 plug rod, 230 pull ring, 240 spring, 250 connecting block, 260 plug hole, 270 heat dissipating hole, 300 bellows, 310 fan, 320 air inlet hole, 330 air exhaust hole. DETAILED DESCRIPTION

[0022] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0023] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.

[0024] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the implementation of the present invention, for the sake of convenience, the cross-sectional diagram showing the device structure will not be partially enlarged according to the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0025] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0026] The utility model provides an electronic chip with a heat dissipation plate structure. Figure 1-Figure 4 , including a heat conducting plate 100 and a support seat 200, the top of the heat conducting plate 100 is connected to a chip body 110, the bottom of the heat conducting plate 100 is fixedly installed with a heat dissipation fin 120, two support seats 200 are fixedly installed on the top of the heat conducting plate 100, the side wall of the support seat 200 is provided with a through hole 210, a plug rod 220 is embedded and installed in the through hole 210, a pull ring 230 is fixedly installed at one end of the plug rod 220, a spring 240 is connected to the side wall of the pull ring 230, and one end of the spring 240 is connected to the side wall of the support seat 200, the left and right side walls of the chip body 110 are both installed with connecting blocks 250, and the side wall of the connecting block 250 is provided with a socket 260 corresponding to the plug rod 220, and the heat conducting plate 100 is provided with a heat dissipation hole 270. Specifically, the heat generated by the chip body 110 during operation is conveniently exported to the heat dissipation fin 120 through the heat conducting plate 100, and a plurality of heat dissipation fins 120 are used. The heat is dissipated to improve the heat dissipation efficiency. The pull ring 230 is used to pull the insertion rod 220, so that one end of the insertion rod 220 is recovered in the through hole 210, so as to facilitate the installation of the chip body 110 on the heat conducting plate 100. Then the pull ring 230 is released, and the elasticity of the spring 240 drives the insertion rod 220 to be inserted into the corresponding insertion hole 260. The insertion rod 220 and the insertion hole 260 are matched and connected, so that the connecting seat and the connecting block 250 are connected and positioned, so that the chip body 110 and the heat conducting plate 100 are connected and fixed, so that the heat conducting plate 100 will not deviate. When disassembling the chip body 110, it is only necessary to operate the pull ring 230 to pull the insertion rod 220 and disengage one end of the insertion rod 220 from the insertion hole 260, so as to facilitate the separation of the chip body 110 from the heat conducting plate 100, and the disassembly can be completed. The heat dissipation hole 270 is convenient to increase the contact area between the heat conducting plate 100 and the air, thereby improving the heat dissipation.

[0027] The side wall of the pull ring 230 is provided with an anti-skid coating, and the anti-skid coating is bonded to the side wall of the pull ring 230. Specifically, the anti-skid coating makes it easy to take the pull ring 230 and is convenient to use.

[0028] The bottom of the chip body 110 is provided with thermal grease, and the thermal grease is bonded to the bottom of the chip body 110. Specifically, the thermal grease is used to increase the thermal conductivity and efficiency of the chip body 110 and facilitate heat dissipation.

[0029] The through hole 210 is arranged corresponding to the socket 260, and one end of the plug rod 220 passes through the through hole 210 and is embedded in the socket 260. Specifically, it is convenient to insert the plug rod 220 into the socket 260, so as to connect and position the support seat 200 and the connecting block 250.

[0030] The support base 200 and the connection block 250 are connected by the insertion rod 220 and the insertion hole 260, which is convenient for installation and positioning of the chip body 110 and the heat conducting plate 100 and convenient for operation.

[0031] A plurality of heat dissipation fins 120 and heat dissipation holes 270 are provided, specifically, to increase the heat dissipation effect and improve the heat dissipation efficiency.

[0032] Combination Figure 1-Figure 4 In the present embodiment, an electronic chip with a heat dissipation plate structure is used in the following specific process: during the use of the electronic chip, the pull ring 230 is used to pull out the insertion rod 220, so that one end of the insertion rod 220 is recovered in the through hole 210, thereby installing the chip body 110 on the heat conducting plate 100, and then the pull ring 230 is released, and the elasticity of the spring 240 drives the insertion rod 220 to be inserted into the corresponding insertion hole 260, and the insertion rod 220 is connected with the insertion hole 260 through the matching connection, so that the connection seat is connected and positioned with the connection block 250, thereby The chip body 110 and the heat conducting plate 100 are connected and fixed so that the heat conducting plate 100 will not shift. The heat generated by the chip body 110 during operation is conducted to the heat dissipating fins 120 by using the heat conducting plate 100. The heat is dissipated through a plurality of heat dissipating fins 120 to improve the heat dissipation efficiency. When disassembling the chip body 110, it is only necessary to operate the pull ring 230 to pull out the insertion rod 220 and detach one end of the insertion rod 220 from the insertion hole 260, thereby detaching the chip body 110 from the heat conducting plate 100, and the quick disassembly can be completed, thereby improving the work efficiency.

[0033] Figure 3-Figure 4 The structure diagram of the second embodiment of the electronic chip with a heat dissipation plate structure of the utility model is shown. Figure 3-Figure 4 Different from the above embodiment, a bellows 300 is provided at the bottom of the heat dissipation fin 120, a fan 310 is provided on the side wall of the bellows 300, an air inlet 320 is provided on the inner wall of the bellows 300, the air inlet 320 is connected to the fan 310, and a plurality of air exhaust holes 330 are provided on the top of the bellows 300. Specifically, wind is generated by the fan 310 and transported into the bellows 300 through the air inlet 320, so as to provide air volume in the bellows 300, gather in the bellows 300 and be discharged through the air exhaust holes 330, so as to accelerate the heat dissipation effect of the heat dissipation fin 120 and further improve the heat dissipation efficiency of the electronic chip.

[0034] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An electronic chip with a heat sink structure, characterized in that: The invention comprises a heat conducting plate (100) and a support seat (200), wherein a chip body (110) is arranged on the top of the heat conducting plate (100), a heat dissipation fin (120) is arranged on the bottom of the heat conducting plate (100), two support seats (200) are arranged on the top of the heat conducting plate (100), a through hole (210) is arranged on the side wall of the support seat (200), a plug rod (220) is embedded and installed in the through hole (210), and the plug rod (220) is installed in the through hole (210). 0) is provided with a pull ring (230) at one end, a spring (240) is provided on the side wall of the pull ring (230), one end of the spring (240) is connected to the side wall of the support seat (200), the left and right side walls of the chip body (110) are both provided with connecting blocks (250), the side walls of the connecting blocks (250) are provided with plug holes (260) corresponding to the plug rod (220), and the heat conduction plate (100) is provided with heat dissipation holes (270).

2. The electronic chip with a heat dissipation plate structure according to claim 1, characterized in that: A bellows (300) is disposed at the bottom of the heat dissipation fin (120), a fan (310) is disposed on the side wall of the bellows (300), an air inlet (320) is disposed on the inner wall of the bellows (300), the air inlet (320) is connected to the fan (310), and a plurality of air exhaust holes (330) are disposed on the top of the bellows (300).

3. The electronic chip with a heat dissipation plate structure according to claim 1, characterized in that: The side wall of the pull ring (230) is provided with an anti-slip coating, and the anti-slip coating is bonded to the side wall of the pull ring (230).

4. The electronic chip with a heat dissipation plate structure according to claim 1, characterized in that: The bottom of the chip body (110) is provided with thermal conductive silicone grease, and the thermal conductive silicone grease is bonded to the bottom of the chip body (110).

5. The electronic chip with a heat sink structure according to claim 1, characterized in that: The through hole (210) is arranged corresponding to the insertion hole (260), and one end of the insertion rod (220) passes through the through hole (210) and is embedded in the insertion hole (260).

6. The electronic chip with a heat sink structure according to claim 1, characterized in that: The support seat (200) and the connection block (250) are connected in cooperation with each other through the insertion rod (220) and the insertion hole (260).

7. The electronic chip with a heat dissipation plate structure according to claim 1, characterized in that: A plurality of the heat dissipation fins (120) and heat dissipation holes (270) are provided.

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