Testing device of semiconductor laser

Abstract

The utility model discloses a semiconductor laser testing device, which comprises an adjusting module, a supporting module and a power-up module, the adjusting module comprises a first sliding assembly, a second sliding assembly and a third sliding assembly, the second sliding assembly is respectively connected with a non-sliding side of the first sliding assembly and a first connecting end of the third sliding assembly, and the second sliding assembly is connected with a second connecting end of the third sliding assembly. The first sliding assembly is used for sliding in the first direction, the second sliding assembly is used for sliding in the second direction, the third sliding assembly is used for sliding in the third direction, the supporting module comprises a first supporting arm and a second supporting arm, and one end of the first supporting arm is connected with the second connecting end of the third sliding assembly; and the other end of the first supporting arm is rotatably connected with one end of the second supporting arm, the other end of the second supporting arm is connected with the power-up module, and the power-up module is provided with a power-up end for performing a power-up test on the semiconductor laser. By adopting the embodiment of the utility model, the power-up test can be carried out on the semiconductor laser of which the pumping source chip is arranged in different arrangement modes.

Description

Technical Field

[0001] The utility model relates to the technical field of laser testing, in particular to a testing device for a semiconductor laser. Background Art

[0002] During the coupling and testing process of semiconductor lasers, each semiconductor laser needs to be powered on so that the semiconductor laser can emit laser light for coupling and testing.

[0003] The pump source chip in a conventional semiconductor laser is arranged horizontally. The power-on test device used in the related art uses a spring probe to be crimped on the positive and negative electrodes of the semiconductor laser in the vertical direction to energize for testing or coupling. It is impossible to test a semiconductor laser in which the pump source chip is arranged in a non-horizontal manner.

[0004] Therefore, there is an urgent need for a new type of power-on test device to meet the power-on test requirements of semiconductor lasers with pump source chips arranged in different arrangements. Utility Model Content

[0005] The utility model aims to provide a semiconductor laser testing device to solve the technical problem that the existing semiconductor laser power-on testing device cannot meet the power-on testing requirements of semiconductor lasers with pump source chips arranged in different arrangements.

[0006] To achieve the above-mentioned purpose, the embodiment of the utility model provides a semiconductor laser testing device, comprising: an adjustment module, a support module and a power-on module;

[0007] The adjustment module includes a first sliding component, a second sliding component and a third sliding component, wherein the first connection end of the second sliding component is connected to the non-sliding side of the first sliding component, the first connection end of the third sliding component is connected to the second connection end of the second sliding component, the first sliding component is used to slide in a first direction, the second sliding component is used to slide in a second direction, and the third sliding component is used to slide in a third direction, and the first direction, the second direction and the third direction are all different;

[0008] The support module comprises a first support arm and a second support arm, one end of the first support arm is connected to the second connection end of the third sliding assembly, and the other end of the first support arm is rotatably connected to one end of the second support arm, so that the second support arm can rotate relative to the first support arm;

[0009] The other end of the second supporting arm is connected to the power-on module. The power-on module is provided with a power-on terminal, and the power-on terminal is used for performing a power-on test on the semiconductor laser.

[0010] In an embodiment of the utility model, the first sliding assembly includes a first sliding rail, a first sliding block and a first sliding block connecting plate;

[0011] One end of the first slider is slidably connected to the first slide rail, the other end of the first slider is fixedly connected to one end of the first slider connecting plate, and the other end of the first slider connecting plate is fixedly connected to the first connecting end of the second sliding assembly.

[0012] In the embodiment of the utility model, the first sliding assembly further includes a bottom plate, a limit stop plate and a first clamping plate;

[0013] The first slide rail is fixed to one side of the bottom plate in the first direction, two ends of the first slide rail are respectively fixedly connected to the limit baffle, and the limit baffle is also fixedly connected to one side of the bottom plate;

[0014] The first clamping plate is respectively connected to the side wall of the first slider connecting plate and the side wall of the bottom plate, and is used to fix the position of the first slider on the first slide rail.

[0015] In an embodiment of the utility model, the second sliding assembly includes a second slide rail and a second slide block;

[0016] The connecting end of the second slider is fixedly connected to the connecting plate of the first slider, and the sliding end of the second slider is slidably connected to the second slide rail.

[0017] In the embodiment of the utility model, the third sliding assembly includes a third sliding rail, a third sliding block and a second clamping plate;

[0018] The side wall of the third slider is fixedly connected to the non-sliding surface of the second slide rail, and the sliding end of the third slider on a surface adjacent to the side wall is slidably connected to the third slide rail;

[0019] One end of the second clamping plate is fixedly connected to the non-sliding surface of the third slide rail.

[0020] In an embodiment of the utility model, the first support arm includes a connecting shaft and a connecting arm, one end of the connecting arm is provided with a through hole for the connecting shaft to pass through, and a locking structure for locking the connecting shaft in the through hole;

[0021] The connecting shaft passes through the through hole and is connected to the connecting arm through the locking structure. After passing through the through hole, the connecting shaft is fixedly connected to the other end of the second clamping plate.

[0022] In an embodiment of the utility model, the other end of the connecting arm and one end of the second supporting arm are respectively provided with a plurality of threaded holes;

[0023] The connecting arm passes through any through hole on the other end of the connecting arm and one end of the second supporting arm through a screw, so that the connecting arm is rotatably connected to the second supporting arm;

[0024] The connecting arm is fixedly connected to the second supporting arm by at least two screws passing through the other end of the connecting arm and at least two through holes on one end of the second supporting arm respectively.

[0025] In an embodiment of the utility model, the second support arm includes a first connection block, a guide shaft, an elastic structure, a second connection block and an adjustment structure;

[0026] One end of the first connecting block is rotatably connected to the other end of the connecting arm, and the other end is fixedly connected to one end of the guide shaft;

[0027] The other end of the guide shaft passes through the second connecting block and is fixedly connected to the adjusting structure. The elastic structure is sleeved on the guide shaft between the first connecting block and the second connecting block and abuts against the first connecting block and the second connecting block respectively. The adjusting structure is used to adjust the distance between the second connecting block and the adjusting structure so that the second connecting block moves on the guide shaft.

[0028] The second connection block is provided with a port connected to the power-on module, and the second connection block is fixedly connected to the power-on module via the port.

[0029] In the embodiment of the utility model, the power-on module includes a cover plate, a power-on ejector pin, a spring and an isolation ceramic, wherein the power-on ejector pin is in a cross shape, the top of the power-on ejector pin is provided with a power connection hole, and the bottom end is a power-on end;

[0030] The springs are respectively provided on the left and right sides of the powered ejector pin and abut against one end of the spring;

[0031] The isolation ceramic is arranged between the two powered ejectors and is connected to a connection structure preset in the cover plate to fix the isolation ceramic and the two powered ejectors in the cover plate, and the other end of the spring is abutted against the top end of the inner wall of the cover plate, while the power connection holes on the two powered ejectors are exposed outside the cover plate.

[0032] In an embodiment of the utility model, the powered ejector pin is an integrated copper sheet.

[0033] The utility model provides a semiconductor laser test device, which is connected to the non-sliding side of the first sliding component and the first connecting end of the third sliding component respectively through the second sliding component, the first sliding component is used to slide in the first direction, the second sliding component is used to slide in the second direction, and the third sliding component is used to slide in the third direction. One end of the first support arm is connected to the second connecting end of the third sliding component, and the other end is rotatably connected to one end of the second support arm, which can realize the multi-dimensional adjustment function of the semiconductor laser test device; and, the other end of the second support arm is connected to the power-on module, and the power-on module is provided with a power-on end to perform power-on test on the semiconductor laser. By changing the installation direction of the power-on module, the same semiconductor laser test device can be used to perform power-on test on semiconductor lasers with pump source chips arranged in different arrangements. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0035] Figure 1 This is a schematic diagram of the structure of a semiconductor laser testing device provided by an embodiment of the utility model;

[0036] Figure 2 This is a structural schematic diagram of a support module provided by an embodiment of the utility model;

[0037] Figure 3 This is a structural schematic diagram of a power-on module provided by an embodiment of the utility model;

[0038] Figure 4 This is another working state schematic diagram of the semiconductor laser testing device provided by the embodiment of the utility model;

[0039] Among them, the numbers in the accompanying drawings are:

[0040] 1000. Testing device for semiconductor laser;

[0041] 1100, adjustment module;

[0042] 1110, first sliding assembly; 1111, first sliding rail; 1112, first sliding block; 1113, first sliding block connecting plate; 1114, bottom plate; 1115, limit baffle; 1116, first clamping plate; 1117, locking member / screw;

[0043] 1120, second sliding assembly; 1121, second sliding rail / dovetail groove guide rail in Z-axis direction; 1122, second sliding block; 1123, first spiral knob; 1124, screw; 1125, screw;

[0044] 1130, third sliding assembly; 1131, third sliding rail / dovetail groove guide rail in Y-axis direction; 1132, third sliding block; 1133, second clamping plate; 1134, second spiral knob;

[0045] 1200, support module;

[0046] 1210, first support arm; 1211, connecting shaft; 1212, connecting arm; 1213, locking structure / screw; 1214, screw;

[0047] 1220, second support arm; 1221, first connection block; 1222, guide shaft; 1223, elastic structure; 1224, second connection block; 1225, adjustment structure; 1226, cam pin; 1227, cam; 1228, adjustment handle; 1229, screw;

[0048] 1300, power-on module;

[0049] 1310, cover plate; 1311, lower cover plate; 1312, upper cover plate; 1320, power-on ejector pin; 1321, power-on end / end face; 1322, power-on hole; 1330, spring; 1340, isolation ceramic; 1350, screw;

[0050] 2000, test platform;

[0051] 3000. A semiconductor laser to be powered on for testing; 3100. A pump source chip. DETAILED DESCRIPTION

[0052] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0053] It should be noted that the directional terms mentioned in this application, such as [up], [down], [front], [back], [left], [right], [inside], [outside], [side], etc., are only reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present application, rather than to limit the present application. In the drawings, units with similar structures are represented by the same reference numerals. In addition, the thickness and shape in the drawings of the present application do not reflect the actual proportions, and the purpose is only to illustrate the contents of the embodiments of the present application.

[0054] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0055] In the embodiment of the utility model, during the coupling and testing operation of the semiconductor lasers, each semiconductor laser needs to be powered on so that the semiconductor lasers can emit laser light for coupling and testing.

[0056] The pump source chip in a conventional semiconductor laser is arranged horizontally. The power-on test device used in the related art uses a spring probe to be crimped on the positive and negative electrodes of the semiconductor laser in the vertical direction to energize for testing or coupling. It is impossible to test a semiconductor laser in which the pump source chip is arranged in a non-horizontal manner.

[0057] Therefore, there is an urgent need for a new type of power-on test device to meet the power-on test requirements of semiconductor lasers with pump source chips arranged in different arrangements.

[0058] In order to solve the above technical problems, an embodiment of the utility model provides a semiconductor laser testing device 1000 , and the semiconductor laser testing device 1000 is described in detail below.

[0059] See also Figure 1 , Figure 1 Schematic diagram of a semiconductor laser testing device provided by an embodiment of the utility model. Figure 1 As shown, the semiconductor laser testing device 1000 includes: an adjustment module 1100, a support module 1200 and a power-on module 1300;

[0060] Among them, the adjustment module 1100 includes a first sliding component 1110, a second sliding component 1120 and a third sliding component 1130, the first connecting end of the second sliding component 1120 is connected to the non-sliding side of the first sliding component 1110, the first connecting end of the third sliding component 1130 is connected to the second connecting end of the second sliding component 1120, the first sliding component 1110 is used to slide in a first direction, the second sliding component 1120 is used to slide in a second direction, and the third sliding component 1130 is used to slide in a third direction, and the first direction, the second direction and the third direction are all different.

[0061] The support module 1200 includes a first support arm 1210 and a second support arm 1220, one end of the first support arm 1210 is connected to the second connecting end of the third sliding assembly 1130, and the other end of the first support arm 1210 is rotatably connected to one end of the second support arm 1220 so that the second support arm 1220 can rotate relative to the first support arm 1210.

[0062] The other end of the second support arm 1220 is connected to the power-on module 1300 . The power-on module 1300 is provided with a power-on terminal 1321 . The power-on terminal 1321 is used to perform a power-on test on the semiconductor laser.

[0063] In this embodiment, the first direction provided in this embodiment can be the X-axis direction, the second direction can be the Z-axis direction, and the third direction can be the Y-axis direction. The rotation direction between the first support arm 1210 and the second support arm 1220 can be a direction different from the X-axis, Y-axis, and Z-axis. In this way, the multi-dimensional adjustment function of the semiconductor laser testing device 1000 can be realized.

[0064] The second sliding component 1120 is connected to the non-sliding side of the first sliding component 1110 and the first connecting end of the third sliding component 1130 respectively, the first sliding component 1110 is used to slide in the first direction, the second sliding component 1120 is used to slide in the second direction, and the third sliding component 1130 is used to slide in the third direction. One end of the first support arm 1210 is connected to the second connecting end of the third sliding component 1130, and the other end is rotatably connected to one end of the second support arm 1220, so that the multi-dimensional adjustment function of the semiconductor laser test device 1000 can be realized; and the other end of the second support arm 1220 is connected to the power-on module 1300, and the power-on module 1300 is provided with a power-on end 1321 for power-on testing the semiconductor laser. By changing the installation direction of the power-on module 1300, the same semiconductor laser test device 1000 can be used to power on semiconductor lasers with pump source chips arranged in different arrangements.

[0065] In the embodiment of the present utility model, please continue to refer to Figure 1 The first sliding component 1110 provided in this embodiment may include a first sliding rail 1111, a first slider 1112 and a first slider connecting plate 1113; wherein, one end of the first slider 1112 provided in this embodiment is slidingly connected to the first sliding rail 1111, the other end of the first slider 1112 is fixedly connected to one end of the first slider connecting plate 1113, and the other end of the first slider connecting plate 1113 is fixedly connected to the first connecting end of the second sliding component 1120.

[0066] Among them, the first slide rail 1111 provided in this embodiment can be a single slide rail, a double slide rail, or a plurality of slide rails. The number of slide rails in the first slide rail 1111 can be set according to actual application requirements and is not specifically limited here.

[0067] Similarly, after determining the number of rails in the first rail 1111, the first slider 1112 provided in this embodiment also needs to correspond to the number of rails in the first rail 1111, and each first slider 1112 is slidably connected to one of the rails in the first rail 1111. At the same time, when the number of first sliders 1112 provided in this embodiment is multiple, the first slider connecting plate 1113 provided in this embodiment needs to be fixedly connected to multiple first sliders 1112 at the same time. Specifically, the multiple first sliders 1112 provided in this embodiment can be fixedly connected to the first slider connecting plate 1113 on the first rail 1111 in an aligned manner, or can be fixedly connected to the first slider connecting plate 1113 on the first rail 1111 in an unaligned manner. As long as the multiple first sliders 1112 can be fixedly connected to the first slider connecting plate 1113 and can ensure that the first slider connecting plate 1113 can move with the movement of the multiple sliders, no specific limitation is made here.

[0068] In this embodiment, the connection method / fixed connection method provided in this embodiment can be bonding with glue or fastening with screws, as long as the connection relationship between the two can be guaranteed, and no specific limitation is made here.

[0069] Please continue to see Figure 1, the first sliding assembly 1110 provided in this embodiment may also include a base plate 1114, a limit baffle 1115 and a first clamping plate 1116; wherein, the first slide rail 1111 provided in this embodiment is fixed to one side of the base plate 1114 in the first direction (X-axis direction), and the two ends of the first slide rail 1111 are respectively fixedly connected to the limit baffle 1115, and the limit baffle 1115 is also fixedly connected to one side of the base plate 1114; the first clamping plate 1116 is respectively connected to the side wall of the first slider connecting plate 1113 and the side wall of the base plate 1114, for fixing the position of the first slider 1112 on the first slide rail 1111.

[0070] In addition, a locking piece 1117 can be further provided on the first clamping plate 1116 provided in the present embodiment. The first clamping plate 1116 can be fixedly connected to the side wall of the first slider connecting plate 1113 by means of screws, and connected to the side wall of the bottom plate 1114 by means of the locking piece 1117. By adjusting the locking state and the unlocking state of the locking piece 1117, the first slider 1112 can be moved and fixed on the first slide rail 1111, thereby achieving the purpose of limiting the first slider 1112.

[0071] Specifically, Figure 1 As shown, the first sliding assembly 1110 provided in this embodiment can be assembled in the following manner: a bottom plate 1114 is placed flat, two linear slide rails are installed on it, and screws are used to fasten them. A travel limit baffle 1115 is then installed at the end positions of the two linear slide rails, and two first sliders 1112 are connected and screwed together. A first clamping plate 1116 is then installed on the side of the first slider connecting plate 1113, and a locking member 1117, such as a screw, is screwed in, thereby obtaining the first sliding assembly 1110.

[0072] Please continue to see Figure 1 The second sliding assembly 1120 provided in this embodiment may include a second sliding rail 1121 and a second slider 1122; wherein, the connecting end of the second slider 1122 provided in this embodiment is fixedly connected to the first slider connecting plate 1113, and the sliding end of the second slider 1122 is slidingly connected to the second sliding rail 1121.

[0073] As an optional embodiment, the second slider 1122 provided in this embodiment can be an inverted Z-shaped structure, the bottom end of the second slider 1122 of the inverted Z-shaped structure is a connecting end, and is fixedly connected to the first slider connecting plate 1113 through the connecting end; the right end of the second slider 1122 of the inverted Z-shaped structure is a sliding end, and is slidably connected to the second slide rail 1121 through the sliding end. Specifically, the second slide rail 1121 provided in this embodiment can be a dovetail groove guide rail, and the second slider 1122 is adapted to the dovetail groove guide rail to enable the second slider 1122 to move in the dovetail groove guide rail.

[0074] As another optional embodiment, the second slide rail 1121 provided in this embodiment may also be provided with a first spiral knob 1123 for adjusting the movement of the second slider 1122 in the second slide rail 1121. Through the first spiral knob 1123, the position of the semiconductor laser testing device 1000 in the second direction (i.e., the Z axis) can be arbitrarily adjusted to meet different application requirements of users.

[0075] Specifically, Figure 1 As shown, the assembly method of the second sliding component 1120 provided in this embodiment can be: install the second sliding block 1122 of the reverse Z-shaped structure above the first sliding block connecting plate 1113, and install the dovetail groove guide rail 1121 in the Z-axis direction on its side, and fasten it with screws 1124, so as to obtain the second sliding component 1120.

[0076] Please continue to see Figure 1 The third sliding assembly 1130 provided in this embodiment may include a third sliding rail 1131, a third slider 1132 and a second clamping plate 1133; wherein, the side wall of the third slider 1132 provided in this embodiment is fixedly connected to the non-sliding surface of the second sliding rail 1121, and the sliding end of the third slider 1132 adjacent to the side wall is slidingly connected to the third sliding rail 1131; one end of the second clamping plate 1133 is fixedly connected to the non-sliding surface of the third sliding rail 1131.

[0077] Similarly, the third slide rail 1131 provided in this embodiment may also be a dovetail groove guide rail, and the third slider 1132 is adapted to the dovetail groove guide rail to enable the third slider 1132 to move in the dovetail groove guide rail. In addition, the third slide rail 1131 provided in this embodiment may also be provided with a second spiral knob 1134 for adjusting the movement of the third slider 1132 in the third slide rail 1131. Through the second spiral knob 1134, the position of the semiconductor laser test device 1000 in the third direction (i.e., the Y axis) may be arbitrarily adjusted to meet different application requirements of users.

[0078] Specifically, Figure 1As shown, the third sliding assembly 1130 provided in this embodiment can be assembled by installing the third sliding block 1132 in the Y-axis direction on the dovetail groove guide rail 1121 in the Z-axis direction, and installing the dovetail groove guide rail 1131 in the Y-axis direction on the third sliding block 1132, and fastening with screws. Then, the second clamping plate 1133 is installed on the dovetail groove guide rail 1131 in the Y-axis direction, and fastened with screws, thereby obtaining the third sliding assembly 1130, and then obtaining the adjustment module 1100 provided in this embodiment.

[0079] In the embodiments of the present invention, see Figure 2 , Figure 2 is a structural schematic diagram of a support module provided by an embodiment of the utility model, such as Figure 2 As shown, the first support arm 1210 in the support module 1200 provided in this embodiment may include a connecting shaft 1211 and a connecting arm 1212, one end of the connecting arm 1212 is provided with a through hole (not shown in the figure) for the connecting shaft 1211 to pass through, and a locking structure 1213 for locking the connecting shaft 1211 in the through hole; the connecting shaft 1211 passes through the through hole and is connected to the connecting arm 1212 through the locking structure 1213, and the connecting shaft 1211 is fixedly connected to the other end of the second clamping plate 1133 after passing through the through hole.

[0080] In this embodiment, the locking structure 1213 provided in this embodiment can be a screw 1213, and the connecting shaft 1211 can be locked in the through hole by screw fastening. In this way, the connecting arm 1212 can be arbitrarily adjusted to any height position on the connecting shaft 1211 through the locking structure 1213, thereby meeting the application needs of different users.

[0081] Specifically, after passing through the through hole, the connecting shaft 1211 provided in this embodiment can be embedded into a preset groove (not shown in the figure) on the other end of the second clamping plate 1133 in an embedded manner for fixed connection.

[0082] Please continue to see Figure 2 The other end of the connecting arm 1212 provided in this embodiment is respectively provided with a plurality of threaded holes corresponding to one end of the second support arm 1220; the connecting arm 1212 is passed through the other end of the connecting arm 1212 and any one of the through holes on one end of the second support arm 1220 by a screw, so that the connecting arm 1212 and the second support arm 1220 are rotatably connected; the connecting arm 1212 is passed through the other end of the connecting arm 1212 and at least two through holes on one end of the second support arm 1220 by at least two screws, so that the connecting arm 1212 and the second support arm 1220 are fixedly connected.

[0083] The connecting arm 1212 is connected to the second supporting arm 1220 by means of different numbers of screws, so that the second supporting arm 1220 can be switched between two fixed states, horizontal and vertical, relative to the connecting arm 1212, thereby meeting the application requirements of different users.

[0084] As an optional embodiment, the second support arm 1220 provided in this embodiment may include a first connecting block 1221, a guide shaft 1222, an elastic structure 1223, a second connecting block 1224 and an adjustment structure 1225; one end of the first connecting block 1221 is rotatably connected to the other end of the connecting arm 1212, and the other end is fixedly connected to one end of the guide shaft 1222; the other end of the guide shaft 1222 passes through the second connecting block 1224 and is fixedly connected to the adjustment structure 1225, and the elastic structure 1223 is sleeved on the first connecting block The adjusting structure 1225 is arranged on the guide shaft 1222 between the first connecting block 1221 and the second connecting block 1224, and respectively abuts against the first connecting block 1221 and the second connecting block 1224. The adjusting structure 1225 is used to adjust the distance between the second connecting block 1224 and the adjusting structure 1225 so that the second connecting block 1224 can move on the guide shaft 1222. The second connecting block 1224 is provided with a port connected to the power-on module 1300, and the second connecting block 1224 is fixedly connected to the power-on module 1300 through the port.

[0085] The elastic structure 1223 provided in this embodiment may be a spring or other structure with elastic properties. In this embodiment, the distance between the second connection block 1224 and the adjustment structure 1225 can be adjusted through the adjustment structure 1225, so that the second connection block 1224 can be moved on the guide shaft 1222. Optionally, an eccentric wheel may be provided on the adjustment structure 1225 provided in this embodiment, and the eccentric wheel is adjusted through the adjustment structure 1225 to push the second connection block 1224 to move toward the connecting arm 1212. Specifically, the eccentric wheel on the adjusting structure 1225 can be adjusted so that the protruding part of the eccentric wheel abuts against the second connecting block 1224, so that the second connecting block 1224 moves toward the connecting arm 1212 and compresses the elastic structure 1223 at the same time; when the second connecting block 1224 needs to be restored to a position close to the adjusting structure 1225, the eccentric wheel on the adjusting structure 1225 can be adjusted to contract so that the elastic structure 1223 releases elastic potential energy, thereby pushing the second connecting block 1224 toward the adjusting structure 1225, thereby realizing the adjustment function of the second connecting block 1224.

[0086] Specifically, Figure 2As shown, the support module 1200 provided in this embodiment can be assembled in the following manner: insert the connecting shaft 1211 into the through hole of the connecting arm 1212, and lock and clamp it with a screw 1213. Assemble the T-shaped first connecting block 1221 at the other end of the connecting arm 1212, and tighten it with a screw 1214. Then, insert two guide shafts 1222 into the T-shaped first connecting block 1221, and tighten it with a screw. Continue to put two elastic structures 1223 such as springs on the outside of the guide shaft 1222, and then put the second connecting block 1224 and the adjustment structure 1225 on the guide shaft 1222, and tighten it with a screw. Insert a cam pin 1226 as an eccentric wheel in the middle of the adjustment structure 1225, and tighten it with a screw. Finally, the cam 1227 can also be installed and screwed through and fixed on the adjustment structure 1225, and the adjustment handle 1228 can be screwed into the side of the cam 1227. In this way, the support module 1200 provided in this embodiment can be obtained.

[0087] Please also refer to Figure 1 and Figure 2 The support module 1200 provided in this embodiment can be inserted into the preset circular hole of the second clamping plate 1133 above the adjustment module 1100 through the lower end of the connecting shaft 1211, and tightened with the screw 1125, so as to achieve a fixed connection between the adjustment module 1100 and the support module 1200.

[0088] In the embodiments of the present invention, see Figure 3 , Figure 3 is a schematic diagram of a structure of a power-on module provided by an embodiment of the utility model, such as Figure 3 As shown, the power-on module 1300 provided in this embodiment may include a cover plate 1310, a power-on ejector pin 1320, a spring 1330 and an isolation ceramic 1340, wherein the power-on ejector pin 1320 is in a cross shape, and a power-on hole 1322 is provided at the top of the power-on ejector pin 1320, and a power-on end 1321 is provided at the bottom; the springs 1330 are provided on the left and right sides of the power-on ejector pin 1320, respectively, and abut against one end of the spring 1330; the isolation ceramic 1340 is arranged between the two power-on ejector pins 1320, and is connected to the connection structure preset in the cover plate 1310 to fix the isolation ceramic 1340 and the two power-on ejector pins 1320 in the cover plate 1310, and the other end of the spring 1330 abuts against the top of the inner wall of the cover plate 1310, and at the same time, the power-on holes 1322 on the two power-on ejector pins 1320 are exposed outside the cover plate 1310.

[0089] The cover plate 1310 provided in this embodiment may include an upper cover plate 1312 and a lower cover plate 1311. Specifically, the assembly method of the power-on module 1300 provided in this embodiment may be: the lower cover plate 1311 is placed flat, a cross-shaped power-on ejector pin 1320 is installed in the lower cover plate 1311, springs 1330 are installed on both sides of the power-on ejector pin 1320, and then the isolation ceramic 1340 is covered. In the same manner as described above, the upper cover plate 1312 is placed flat, a cross-shaped power-on ejector pin 1320 is installed in the upper cover plate 1312, springs 1330 are installed on both sides of the power-on ejector pin 1320, and then it is buckled to one side of the lower cover plate 1311 and locked with screws 1350, while the power-on holes 1322 on the two power-on ejector pins 1320 are exposed outside the upper cover plate 1312 and the lower cover plate 1311.

[0090] Please also refer to Figure 2 and Figure 3 The power-on module 1300 provided in this embodiment can be assembled to the lower end of the second connecting block 1224 on the supporting module 1200 and tightened with screws 1229 to achieve a fixed connection between the power-on module 1300 and the supporting module 1200.

[0091] In the related art, as the light output power of a single semiconductor laser increases, the current loaded on the semiconductor laser becomes larger and larger. The powered probe in the related art is no longer suitable for the coupling and testing of current semiconductor lasers due to its limited rated current carrying capacity. Therefore, in order to solve this technical problem, the powered pin 1320 provided in this embodiment can be set as an integrated copper sheet, so as to increase the current carrying capacity by increasing the powered current conducting cross-sectional area, thereby improving the technical problem of insufficient current carrying capacity of the powered probe in the related art and meeting the large current demand required for semiconductor laser testing.

[0092] In some embodiments, see also Figure 1 and Figure 4 , Figure 4 This is another working state schematic diagram of the semiconductor laser testing device provided by an embodiment of the utility model.

[0093] In one embodiment, Figure 1 FIG. 1 shows a working state of the semiconductor laser testing device 1000 provided in this embodiment, in which a semiconductor laser arranged vertically is powered on to test the pump source chip 3100. Specifically, Figure 1As shown, the semiconductor laser 3000 to be tested with power on can be placed on the test platform 2000, and the pump source chip 3100 in the semiconductor laser 3000 to be tested with power on is in a vertical arrangement state. In this way, the semiconductor laser test device 1000 provided in this embodiment can be placed horizontally, and the position in the X-axis direction can be adjusted by adjusting the first slider 1112; the position in the Y-axis direction can be adjusted by adjusting the second spiral knob 1134 on the dovetail groove guide rail 1131 in the Y-axis direction; the position in the Z-axis direction can be adjusted by adjusting the first spiral knob 1123 on the dovetail groove guide rail 1121 in the Z-axis direction; and the deflection angle of the connecting arm 1212 relative to the connecting shaft 1211 can be adjusted by the screw 1213. In this way, the adjustment of the semiconductor laser test device 1000 is completed, so as to perform a power-on test on the semiconductor laser 3000 to be tested with power on.

[0094] The specific implementation of power-on test for the semiconductor laser with the pump source chip 3100 in a vertical arrangement state can be: keep the screws on the first clamping plate 1116 and the screws 1213 in a loose state. Move the first slider 1112 to a suitable position, translate and deflect the connecting arm 1212 along the Z-axis direction to ensure that the end face 1321 of the power-on pin 1320 on the power-on module 1300 can be aligned with the pump source chip 3100. The best state of adjustment is to keep the end face 1321 of the power-on pin 1320 parallel to the pump source chip 3100. Then, tighten the screws on the first clamping plate 1116 to keep the first slider 1112 fixed in the X-axis direction, and tighten the screws 1213 to keep the connecting arm 1212 fixed.

[0095] Then, fine adjustment is performed by adjusting the second spiral knob 1134 on the dovetail groove guide rail 1131 in the Y-axis direction and the first spiral knob 1123 on the dovetail groove guide rail 1121 in the Z-axis direction. The second spiral knob 1134 is adjusted to make the distance between the end face 1321 of the power-on ejector pin 1320 and the plane of the pump source chip 3100 (preferably 5 mm to 8 mm), and the first spiral knob 1123 is adjusted to make the end face 1321 of the power-on ejector pin 1320 on the power-on module 1300 be aligned with the pump source chip 3100. Finally, the adjustment handle 1228 is turned, and the cam 1227 drives the cam ejector pin 1226 to make the end face 1321 of the power-on ejector pin 1320 in good contact with the plane of the pump source chip 3100, and the power-on ejector pin 1320 is powered on, thereby completing the power-on test of the semiconductor laser 3000 to be tested.

[0096] In another embodiment, Figure 4 FIG. 1 shows a working state of the semiconductor laser testing device 1000 provided in this embodiment, in which a horizontally arranged semiconductor laser is used to perform a power-on test on the pump source chip 3100. Specifically, as shown in FIG. Figure 4As shown, the semiconductor laser 3000 to be powered on can be placed on the test platform 2000, and the pump source chip 3100 is in a horizontal arrangement state. As in the aforementioned assembly method, the assembly direction of the T-shaped first connecting block 1221 of the support module 1200 is adjusted to the vertical direction, and the other parts and components are arranged in the same way as in the above embodiment, so that the power-on ejector pin 1320 in the power-on module 1300 is in a vertical direction. Specifically, the semiconductor laser test device 1000 provided in this embodiment is placed horizontally, and the position in the X-axis direction is adjusted by adjusting the first slider 1112; the position in the Y-axis direction is adjusted by adjusting the second spiral knob 1134 on the dovetail groove guide rail 1131 in the Y-axis direction; the position in the Z-axis direction is adjusted by adjusting the first spiral knob 1123 on the dovetail groove guide rail 1121 in the Z-axis direction; and the deflection angle of the connecting arm 1212 relative to the connecting shaft 1211 is adjusted by the screw 1213.

[0097] The specific implementation of power-on test for the semiconductor laser with the pump source chip 3100 in a horizontal arrangement state can be: keep the screws on the first clamping plate 1116 and the screws 1213 in a loose state. Move the first slider 1112 to a suitable position, translate and deflect the connecting arm 1212 along the Z-axis direction to ensure that the end face 1321 of the power-on pin 1320 on the power-on module 1300 can be aligned with the pump source chip 3100. The best state of adjustment is to keep the end face 1321 of the power-on pin 1320 parallel to the pump source chip 3100. Then, tighten the screws on the first clamping plate 1116 to keep the first slider 1112 fixed in the X-axis direction, and tighten the screws 1213 to keep the connecting arm 1212 fixed.

[0098] Then, fine adjustment is performed by adjusting the second spiral knob 1134 on the dovetail groove guide rail in the Y-axis direction and the first spiral knob 1123 on the dovetail groove guide rail 1121 in the Z-axis direction. The second spiral knob 1134 is adjusted to make the distance between the end face 1321 of the power-on ejector pin 1320 and the plane of the pump source chip 3100 (preferably 5 mm to 8 mm), and the first spiral knob 1123 is adjusted to make the end face 1321 of the power-on ejector pin 1320 on the power-on module 1300 be aligned with the pump source chip 3100. Finally, the adjustment handle 1228 is turned, and the cam 1227 drives the cam ejector pin 1226 to make the end face 1321 of the power-on ejector pin 1320 in good contact with the plane of the pump source chip 3100, and the power-on ejector pin 1320 is powered on, thereby completing the power-on test of the semiconductor laser 3000 to be tested.

[0099] In this way, the semiconductor laser testing device provided by the embodiment of the utility model can realize four-dimensional adjustment (X-axis, Y-axis, Z-axis movement and the deflection angle of the connecting arm relative to the connecting axis) by reasonably clamping the power-on module, and by changing the installation direction of the power-on module, the same device can be used to test both horizontally arranged pump source chips and non-horizontally arranged pump source chips.

[0100] In summary, the embodiment of the utility model provides a semiconductor laser test device, including: an adjustment module, a support module and a power-on module; the adjustment module includes a first sliding component, a second sliding component and a third sliding component, the first connection end of the second sliding component is connected to the non-sliding side of the first sliding component, the first connection end of the third sliding component is connected to the second connection end of the second sliding component, the first sliding component is used to slide in a first direction, the second sliding component is used to slide in a second direction, and the third sliding component is used to slide in a third direction, and the first direction, the second direction and the third direction are all different; the support module includes a first support arm and a second support arm, one end of the first support arm is connected to the second connection end of the third sliding component, and the other end of the first support arm is rotatably connected to one end of the second support arm, so that the second support arm can rotate relative to the first support arm; the other end of the second support arm is connected to the power-on module, and the power-on module is provided with a power-on end, and the power-on end is used to perform power-on testing on the semiconductor laser.

[0101] By adopting the embodiments of the present utility model, the following beneficial effects can be achieved:

[0102] The second sliding component is respectively connected to the non-sliding side of the first sliding component and the first connecting end of the third sliding component, the first sliding component is used to slide in the first direction, the second sliding component is used to slide in the second direction, and the third sliding component is used to slide in the third direction. One end of the first support arm is connected to the second connecting end of the third sliding component, and the other end is rotatably connected to one end of the second support arm, so that the multi-dimensional adjustment function of the semiconductor laser test device can be realized; and the other end of the second support arm is connected to the power-on module, and the power-on module is provided with a power-on end to perform power-on test on the semiconductor laser. By changing the installation direction of the power-on module, the same semiconductor laser test device can perform power-on test on semiconductor lasers with pump source chips arranged in different arrangements.

[0103] In addition to the above embodiments, the present application may also have other implementation modes. Any technical solution formed by equivalent replacement or equivalent replacement falls within the protection scope required by the present application.

[0104] Although the preferred embodiments of the present application have been disclosed as above, the above preferred embodiments are not intended to limit the present application. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined in the claims.

Claims

1. A semiconductor laser testing device, characterized in that: include: Adjustment module, support module and power module; The adjustment module includes a first sliding component, a second sliding component and a third sliding component, wherein the first connection end of the second sliding component is connected to the non-sliding side of the first sliding component, the first connection end of the third sliding component is connected to the second connection end of the second sliding component, the first sliding component is used to slide in a first direction, the second sliding component is used to slide in a second direction, and the third sliding component is used to slide in a third direction, and the first direction, the second direction and the third direction are all different; The support module comprises a first support arm and a second support arm, one end of the first support arm is connected to the second connection end of the third sliding assembly, and the other end of the first support arm is rotatably connected to one end of the second support arm, so that the second support arm can rotate relative to the first support arm; The other end of the second supporting arm is connected to the power-on module. The power-on module is provided with a power-on terminal, and the power-on terminal is used for performing a power-on test on the semiconductor laser.

2. The semiconductor laser testing device according to claim 1, characterized in that: The first sliding assembly includes a first sliding rail, a first sliding block and a first sliding block connecting plate; One end of the first slider is slidably connected to the first slide rail, the other end of the first slider is fixedly connected to one end of the first slider connecting plate, and the other end of the first slider connecting plate is fixedly connected to the first connecting end of the second sliding assembly.

3. The semiconductor laser testing device according to claim 2, characterized in that: The first sliding assembly also includes a bottom plate, a limit stopper and a first clamping plate; The first slide rail is fixed to one side of the bottom plate in the first direction, two ends of the first slide rail are respectively fixedly connected to the limit baffle, and the limit baffle is also fixedly connected to one side of the bottom plate; The first clamping plate is respectively connected to the side wall of the first slider connecting plate and the side wall of the bottom plate, and is used to fix the position of the first slider on the first slide rail.

4. The semiconductor laser testing device according to claim 3, characterized in that: The second sliding assembly includes a second sliding rail and a second sliding block; The connecting end of the second slider is fixedly connected to the connecting plate of the first slider, and the sliding end of the second slider is slidably connected to the second slide rail.

5. The semiconductor laser testing device according to claim 4, characterized in that: The third sliding assembly includes a third sliding rail, a third sliding block and a second clamping plate; The side wall of the third slider is fixedly connected to the non-sliding surface of the second slide rail, and the sliding end of the third slider on a surface adjacent to the side wall is slidably connected to the third slide rail; One end of the second clamping plate is fixedly connected to the non-sliding surface of the third slide rail.

6. The semiconductor laser testing device according to claim 5, characterized in that: The first supporting arm comprises a connecting shaft and a connecting arm, one end of the connecting arm is provided with a through hole for the connecting shaft to pass through, and a locking structure for locking the connecting shaft in the through hole; The connecting shaft passes through the through hole and is connected to the connecting arm through the locking structure. After passing through the through hole, the connecting shaft is fixedly connected to the other end of the second clamping plate.

7. The semiconductor laser testing device according to claim 6, characterized in that: The other end of the connecting arm and one end of the second supporting arm are respectively provided with a plurality of threaded holes; The connecting arm passes through any through hole on the other end of the connecting arm and one end of the second supporting arm through a screw, so that the connecting arm is rotatably connected to the second supporting arm; The connecting arm is fixedly connected to the second supporting arm by at least two screws passing through the other end of the connecting arm and at least two through holes on one end of the second supporting arm respectively.

8. The semiconductor laser testing device according to claim 6, characterized in that: The second supporting arm comprises a first connecting block, a guide shaft, an elastic structure, a second connecting block and an adjusting structure; One end of the first connecting block is rotatably connected to the other end of the connecting arm, and the other end is fixedly connected to one end of the guide shaft; The other end of the guide shaft passes through the second connecting block and is fixedly connected to the adjusting structure. The elastic structure is sleeved on the guide shaft between the first connecting block and the second connecting block and abuts against the first connecting block and the second connecting block respectively. The adjusting structure is used to adjust the distance between the second connecting block and the adjusting structure so that the second connecting block moves on the guide shaft. The second connection block is provided with a port connected to the power-on module, and the second connection block is fixedly connected to the power-on module via the port.

9. The semiconductor laser testing device according to claim 8, characterized in that: The power-on module includes a cover plate, a power-on ejector pin, a spring and an isolation ceramic. The power-on ejector pin is in a cross shape. The top of the power-on ejector pin is provided with a power connection hole, and the bottom is a power-on terminal. The springs are respectively provided on the left and right sides of the powered ejector pin and abut against one end of the spring; The isolation ceramic is arranged between the two powered ejectors and is connected to a connection structure preset in the cover plate to fix the isolation ceramic and the two powered ejectors in the cover plate, and the other end of the spring is abutted against the top end of the inner wall of the cover plate, while the power connection holes on the two powered ejectors are exposed outside the cover plate.

10. The semiconductor laser testing device according to claim 9, characterized in that: The powered ejector pin is an integrated copper sheet.

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