MCU testing device

Abstract

The utility model discloses an MCU testing device, the MCU testing device comprises a device main body, a bearing assembly, a testing assembly and a fixing assembly, the device main body comprises a device body, the bearing assembly is arranged on the device body in a manner that a to-be-tested plate can be placed on the device body, the testing assembly comprises at least one adapter plate and at least one detection integrated plate, the adapter plate is electrically connected to the detection integrated plate, and the fixing assembly is electrically connected to the adapter plate. The detection integrated board can be electrically connected to a board to be detected and is arranged on the device body, the fixing assembly comprises at least one downward pressing component and at least one attaching component, the downward pressing component is movably arranged on the device body, the attaching component comprises an expansion board and a plurality of abutting pieces, the expansion board is arranged on the downward pressing component and located at a preset position above the board to be detected, and the abutting pieces abut against the expansion board. The adapter plate can be electrically connected to the to-be-tested plate and is arranged on the expansion plate, the plurality of abutting pieces are telescopically arranged on the expansion plate, the abutting pieces are used for pressing the to-be-tested plate on the bearing plate, and the pressing component is used for pressing the expansion plate to the to-be-tested plate located on the bearing plate.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit test fixtures, in particular to an MCU test device. Background Art

[0002] The test device is a device that is specially used to test the relevant functions, power calibration, life and performance of the product. Among them, the MCU test device is used to test whether the predetermined functions of the MCU test board meet the expectations, so as to ensure that the components on the surface of the MCU test board are accurately welded to the MCU test board, thereby ensuring the welding quality of the components of the MCU test board.

[0003] The two surfaces of the MCU test board have multiple test points and multiple connection points respectively. When the MCU test board is set in the MCU test device, the test points and connection points of the MCU test board will be abutted against multiple pins of the test component of the MCU test device, so as to test the function of the MCU test board through the test component of the MCU test device. When the function of the MCU test board is lost, it means that the components on the surface of the MCU test board are not properly welded.

[0004] However, in the existing MCU testing device, the test points and connection points of the MCU test board are brought into contact with multiple pins of the test component through a pressing member of the MCU testing device. When the moving distance of the pressing member is too large, the multiple pins of the test component will be too tightly pressed against the test points and connection points of the MCU test board, which will cause multiple pins to bend due to pressure, thereby making the pins unusable, and even causing the test points and connection points of the MCU test board to be poked through holes by multiple pins, thereby damaging the MCU test board.

[0005] Secondly, the existing MCU testing device cannot display the data changes of different circuit channels when the MCU test board is tested, resulting in the inability to determine the location of the problem in the MCU test board after the MCU test board is tested to have a function problem. As a result, when the MCU test board with the function problem needs to be repaired, the MCU test board needs to be tested again, which is time-consuming. Utility Model Content

[0006] In order to solve the above technical problems and achieve at least one advantage of the present invention, the present invention provides an MCU testing device, wherein the MCU testing device comprises:

[0007] A device body, the device body comprising a device body;

[0008] A receiving assembly, the receiving assembly comprising at least one receiving plate and at least one return member, the receiving plate being movably arranged on the device body through the return member, the receiving plate being formed with a through opening, the receiving plate being used to place the board to be tested, and a plurality of lower connection points of the board to be tested being arranged at the through opening of the receiving plate;

[0009] A test assembly, the test assembly comprising at least one adapter board and at least one detection integrated board, the adapter board being electrically connected to the detection integrated board, the detection integrated board being disposed on the device body, the detection integrated board being disposed at a predetermined position below the receiving board, and the detection integrated board being used to detect whether there is a problem with the function of the board to be tested; and

[0010] A fixing component, the fixing component includes at least one pressing member and at least one fitting member, the pressing member is movably arranged on the device body, the fitting member includes an extension plate and a plurality of abutting members, the extension plate is arranged on the pressing member, the extension plate is arranged at a predetermined position above the board to be tested, the adapter plate is arranged on the extension plate, a plurality of abutting members are telescopically arranged on the extension plate, the extension direction of the abutting members is arranged toward the board to be tested, the abutting members are used to press the board to be tested against the receiving plate, and the pressing member is used to press the extension plate toward the board to be tested located on the receiving plate.

[0011] According to an embodiment of the utility model, the abutment member includes a fixed column and a movable column, the fixed column is arranged on the expansion plate, the movable column is telescopically arranged on the fixed column, and the extension direction of the movable column is arranged toward the board to be tested.

[0012] According to one embodiment of the utility model, the adapter board has multiple adapter pins, and the multiple adapter pins are arranged to correspond to the multiple upper test points of the board to be tested. The detection integrated board has multiple detection pins, and the multiple detection pins are arranged to correspond to the multiple lower connection points of the board to be tested located at the through port.

[0013] According to an embodiment of the utility model, the fitting component also includes a plurality of limit members, which are arranged on the extension board and are arranged toward the board to be tested, and are used to prevent the transfer pins from being bent and to prevent the board to be tested from being penetrated by the transfer pins.

[0014] According to one embodiment of the utility model, the pressing member includes an extension frame, at least one mounting member, at least one pressing member, at least one connecting member and at least one moving member, the extension frame is arranged on the device body, the mounting member is arranged on the extension frame, a limiting through hole is formed at the lower end of the mounting member, the pressing member is rotatably arranged at the high end of the mounting member away from the limiting through hole, the moving member is connected to the pressing member through the connecting member, the moving member is arranged in the limiting through hole so as to pass through the limiting through hole, and one end of the moving member away from the connecting member is connected to the expansion plate.

[0015] According to an embodiment of the utility model, the receiving assembly further includes a plurality of protective members, wherein the protective members are disposed between the board to be tested and the receiving plate, and the protective members are used to prevent the components of the board to be tested from being pressed against the receiving plate.

[0016] According to an embodiment of the utility model, the receiving assembly further includes at least two positioning columns, the positioning columns are arranged on the receiving plate, the plate to be tested has at least two limiting holes adapted to the positioning columns, and the positioning columns are arranged to pass through the limiting holes of the plate to be tested.

[0017] According to an embodiment of the present invention, the return member is implemented to include a spring.

[0018] According to an embodiment of the present invention, the protective member is implemented as a rubber pad made of rubber.

[0019] According to an embodiment of the present invention, the device body further includes a burning component, which is arranged on the device body and is used for burning the board to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A three-dimensional schematic diagram of a preferred embodiment of the utility model is shown.

[0021] Figure 2 Shows Figure 1 Schematic diagram of the enlarged view of point A in the middle.

[0022] Figure 3 A schematic top view of some components in a preferred embodiment of the utility model is shown.

[0023] Figure 4 A schematic three-dimensional diagram of the receiving assembly in a preferred embodiment of the utility model is shown.

[0024] Figure 5 A schematic perspective view of the board to be tested is shown.

[0025] Figure 6A schematic diagram showing the electrical connection relationship of a preferred embodiment of the utility model DETAILED DESCRIPTION

[0026] The following description is used to disclose the utility model so that those skilled in the art can implement the utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the utility model defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the utility model.

[0027] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0028] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0029] Refer to the attached figure Figures 1 to 6 The MCU testing device according to a preferred embodiment of the present invention will be described in detail below, wherein the MCU testing device includes a device body 10, a receiving component 20, a fixing component 30 and a testing component 40.

[0030] The device body 10 includes a device body 11. The receiving assembly 20 includes at least one receiving plate 21 and at least one return member 22. The receiving plate 21 is formed with a through opening 2101. The receiving plate 21 is movably arranged on the device body 11 through the return member 22. The receiving plate 21 is used to place a board to be tested 90. After the board to be tested 90 is placed on the receiving plate 21, a plurality of lower connection points 92 of the board to be tested 90 will be arranged at one end of the through opening 2101 of the receiving plate 21.

[0031] The fixing assembly 30 includes at least one pressing member 31 and at least one fitting member 32. The fitting member 32 includes an extension plate 321, which is disposed on the pressing member 31, and the extension plate 321 is disposed at a predetermined position above the board to be tested 90. The pressing member 31 is movably disposed on the device body 11. The pressing member 31 is used to move the extension plate 321 toward the board to be tested 90 located on the receiving plate 21, so as to press the board to be tested 90 against the receiving plate 21.

[0032] The test assembly 40 includes at least one adapter board 41 and at least one detection integrated board 42. The adapter board 41 is electrically connected to the detection integrated board 42, and the detection integrated board 42 is used to detect whether there is a problem with the function of the board to be tested 90.

[0033] The adapter board 41 is disposed on the expansion board 321, and the adapter board 41 has a plurality of adapter pins 411, and the plurality of adapter pins 411 are disposed corresponding to the plurality of upper test points 91 of the board to be tested 90. In the process of the downward pressing member 31 moving the expansion board 321 toward the board to be tested 90, the plurality of adapter pins 411 of the adapter board 41 located on the expansion board 321 will abut against the plurality of upper test points 91 of the board to be tested 90, and a portion of the components in the board to be tested 90 are electrically connected to the adapter board 41 through the upper test points 91, and the functions of a portion of the components in the board to be tested 90 are tested through the detection integrated board 42 electrically connected to the adapter board 41.

[0034] Specifically, the detection integrated board 42 is arranged on the device body 11 and is located at a predetermined position below the receiving plate 21. The detection integrated board 42 has a plurality of detection pins 421, and the plurality of detection pins 421 are arranged to correspond to the plurality of lower connection points 92 of the board to be tested 90 located at the through opening 2101. When the board to be tested 90 is pressed by the expansion board 321, the return member 22 will be compressed so that the detection pins 421 of the detection integrated board 42 will pass through the through opening 2101 and abut against the lower connection points 92 of the board to be tested 90. Finally, another part of the components in the board to be tested 90 is electrically connected to the detection integrated board 42 through the lower connection points 92, and then the functions of another part of the components of the board to be tested 90 are detected through the detection integrated board 42.

[0035] Preferably, the detection integrated board 42 is implemented as a simplified power amplifier board.

[0036] Preferably, the return member 22 is implemented to include a spring.

[0037] It is worth mentioning that another part of the components in the board to be tested 90 is electrically connected to the detection integrated board 42 through the lower connection point 92, and after the detection integrated board 42 completes the operation of detecting the functions of another part of the components of the board to be tested 90, the pressing member 31 controls and drives the extension board 321 away from the board to be tested 90, so that the board to be tested 90 is no longer pressed by the extension board 321. The return member 22 will rebound from the compressed state, and the receiving plate 21 will drive the board to be tested 90 to move away from the detection integrated board 42 under the elastic force of the return member 22, and the electrical connection between the detection pin 421 of the detection integrated board 42 and the lower connection point 92 of the board to be tested 90 will be disconnected. This avoids the situation in which the testing pins 421 collide with the board to be tested 90 when the board to be tested 90 located on the receiving plate 21 is removed after the function of the board to be tested 90 is tested, thereby damaging the board to be tested 90 and the testing pins 421 .

[0038] Specifically, the pressing member 31 includes an extension frame 311, at least one mounting member 312, at least one pressing member 313, at least one connecting member 314 and at least one moving member 315. The extension frame 311 is arranged on the device body 11. The mounting member 312 is arranged on the extension frame 311, and a limiting through hole is formed at the lower end of the mounting member 312. The pressing member 313 is rotatably arranged at the high end of the mounting member 312 away from the limiting through hole. The moving member 315 is connected to the pressing member 313 through the connecting member 314, and the moving member 315 is arranged in the limiting through hole so as to pass through the limiting through hole. One end of the moving member 315 away from the connecting member 314 is connected to the expansion plate 321.

[0039] It can be understood by those skilled in the art that when the pressing member 313 is pulled, the connecting member 314 will be driven by the pressing member 313, thereby causing the moving member 315 connected to the connecting member 314 to pass through the limiting through hole of the mounting member 312, so that the extension plate 321 connected to the moving member 315 can be moved downward or upward, thereby achieving the purpose of moving the adapter plate 41 provided on the extension plate 321 toward the board to be tested 90 located on the receiving plate 21. In this way, the multiple adapter pins 411 of the adapter plate 41 will abut against the multiple upper test points 91 of the board to be tested 90, and a part of the components in the board to be tested 90 will be electrically connected to the adapter plate 41 through the upper test points 91, and the functions of a part of the components in the board to be tested 90 will be detected through the detection integrated board 42 electrically connected to the adapter plate 41.

[0040] It should be noted that when the return member 22 is compressed, the elastic force of the return member 22 will be transmitted to the board to be tested 90 through the receiving plate 21, causing the upper test point 91 to abut against the adapter pin 411 too tightly. The adapter pin 411 may be bent due to pressure, causing the adapter pin 411 to be unable to be used normally, or the adapter pin 411 may penetrate the board to be tested 90, causing the board to be tested 90 to be damaged.

[0041] Specifically, the fitting member 32 further includes a plurality of abutting members 322, and the plurality of abutting members 322 are telescopically disposed on the extension plate 321. The abutting member 322 includes a fixed column 3221 and a movable column 3222, the fixed column 3221 is disposed on the extension plate 321, and the movable column 3222 is telescopically disposed on the fixed column 3221, and the extending direction of the movable column 3222 is disposed toward the board to be tested 90.

[0042] It can be understood by those skilled in the art that, in the process of the moving member 315 of the pressing member 31 pushing the expansion plate 321 toward the board to be tested 90, the moving column 3222 of the abutting member 322 will first contact the board to be tested 90 and press the board to be tested 90 against the receiving plate 21. In the process of continuous downward pressure of the expansion plate 321, the return member 22 will be compressed, and the detection pin 421 of the detection integrated board 42 will pass through the through-port 2101 and abut against the lower connection point 92 of the board to be tested 90. At the same time, the moving column 3222 of the abutting member 322 will enter the fixed column 3221 due to pressure, and the transfer pin 411 of the transfer plate 41 located on the expansion plate 321 will abut against the upper test point 91 of the board to be tested 90. Since the force transmitted to the receiving plate 21 by the movable column 3222 through the board to be tested 90 will offset part of the elastic force transmitted to the receiving plate 21 by the return member 22, the transfer pin 411 of the transfer plate 41 is abutted against the upper test point 91 of the board to be tested 90, thereby preventing the transfer pin 411 from bending due to pressure or penetrating the board to be tested 90.

[0043] It should be noted that, when the pressing member 31 drives the adapter plate 41 located on the extension plate 321 to move toward the board to be tested 90 and makes the multiple adapter pins 411 of the adapter plate 41 abut against the multiple upper test points 91 of the board to be tested 90, there may be a situation where the movement distance of the extension plate 321 exceeds the predetermined distance. At this time, after the adapter pin 411 of the adapter plate 41 abuts against the upper test point 91 of the board to be tested 90, the adapter pin 411 will continue to move toward the upper test point 91, and the adapter pin 411 will bend due to the pressure, thereby causing the adapter pin 411 to be unable to continue to be used, and even causing the board to be tested 90 to be penetrated by the adapter pin 411, and the board to be tested 90 will be damaged.

[0044] Preferably, the fitting member 32 further includes a plurality of stoppers 323, which are disposed on the extension plate 321 and are disposed toward the board to be tested 90. The stoppers 323 are used to prevent the transfer pins 411 from bending due to pressure or the board to be tested 90 from being penetrated by the transfer pins 411 after the extension plate 321 moves beyond a predetermined distance. In other words, the stoppers 323 are used to prevent the transfer pins 411 from being pushed by the extension plate 321 and further moving toward the upper test point 91 after abutting against the upper test point 91 of the board to be tested 90.

[0045] Specifically, the receiving assembly 20 further includes a plurality of protective members 23, and the protective members 23 are disposed between the board to be tested 90 and the receiving plate 21. The protective members 23 are used to prevent the components of the upper test point 91 from being pressed against the receiving plate 21 and being damaged when the board to be tested 90 is pressed against the receiving plate 21.

[0046] Preferably, the protective member 23 is implemented as a rubber pad.

[0047] Specifically, the receiving assembly 20 further includes at least two positioning posts 24, and the positioning posts 24 are arranged on the receiving plate 21, and the board to be tested 90 has at least two limiting holes 9001 adapted to the positioning posts 24. The positioning posts 24 are arranged to pass through the limiting holes 9001 of the board to be tested 90, so as to prevent the board to be tested 90 from shaking during the pressing process when the board to be tested 90 is placed on the receiving plate 21, thereby providing a guarantee for the transfer pin 411 to accurately abut against the upper test point 91 and the detection pin 421 to accurately abut against the lower connection point 92.

[0048] Preferably, the device body 10 further comprises a burning component 12, which is arranged on the device body 11 and is used to burn the board to be tested 90. When the detection integrated board 42 detects that there is a problem with the function of the board to be tested 90, the burning component 12 can re-burn the board to be tested 90.

[0049] Specifically, the test assembly 40 further includes a switch element 43 , which is disposed on the expansion board 321 and is electrically connected to the adapter board 41 . The switch element 43 is used to control connectivity of an internal circuit of the adapter board 41 .

[0050] Preferably, the test assembly 40 includes a wiring board 44, the wiring board 44 is disposed on the device body 11, and the wiring board 44 is connected to the detection integrated board 42 through the board to be tested 90, and the wiring board 44 is used to convert the interface connected to the board to be tested 90 into a plurality of different interfaces to output the data and results when the detection integrated board 42 detects the board to be tested 90. The device body 10 also includes a display 13, at least one prompt light 14, a plurality of indicator light groups 15 and at least one buzzer 16. The display 13, the prompt light 14, the indicator light group 15 and the buzzer 16 are all disposed on the device body 11.

[0051] The warning light 14 is electrically connected to the wiring board 44, so as to be connected to the detection integrated board 42 through the wiring board 44 and the board to be tested 90. The warning light 14 is used to emit a bright light when the adapter pin 411 abuts against the upper test point 91 and the detection pin 421 abuts against the lower connection point 92, so as to prompt that a part of the components in the board to be tested 90 is successfully electrically connected to the adapter board 41 through the upper test point 91, and another part of the components in the board to be tested 90 is successfully electrically connected to the detection integrated board 42 through the lower connection point 92. Avoid mistakenly thinking that there is a functional problem in the board to be tested 90 because the upper test point 91 and the lower connection point 92 of the board to be tested 90 are not connected.

[0052] The display element 13 and the plurality of indicator light groups 15 are electrically connected to the wiring board 44, so as to be connected to the detection integrated board 42 through the wiring board 44 and the board to be tested 90. The indicator light group 15 includes a plurality of indicator lights, and the data and results of the RF test performed by the detection integrated board 42 on the board to be tested 90 will be displayed in real time through the display element 13, and the path of the component in the board to be tested 90 that has a problem in the RF test will be intuitively displayed by lighting up the indicator lights in one of the indicator light groups 15, so as to facilitate repairing the path of the component with the problem.

[0053] The buzzer 16 is electrically connected to the cable board 44, so as to be connected to the detection integrated board 42 through the cable board 44 and the board to be tested 90. The buzzer 16 is used to emit a buzzer when the detection integrated board 42 detects that there is a functional problem in the board to be tested 90, so as to warn the outside world. This prevents the tester from not seeing the indication of the warning light 14 and the indicator light group 15 clearly, resulting in the board to be tested 90 with a functional problem being undetected and entering the market.

[0054] Specifically, the test assembly 40 further includes a storage connection board 45, and the storage connection board 45 is electrically connected to the cable connection board 44, so as to be connected to the detection integrated board 42 through the cable connection board 44 and the board to be tested 90. The device body 10 further includes a storage member 17, and the storage member 17 is arranged on the storage connection board 45, and the storage member 17 is used to store information of the board to be tested 90 during the test process, so as to facilitate the search for the test results of the board to be tested 90 that has completed the test, and to facilitate the repair of the board to be tested 90 with functional problems.

[0055] Preferably, the storage connection board 45 is implemented as an SD card main board. The storage component 17 is implemented as an SD card.

[0056] The device body 10 further includes an oscilloscope 18 , which is electrically connected to the detection integrated board 42 , so as to detect through the detection integrated board 42 whether the waveforms of the components in the board to be tested 90 are in accordance with expectations.

[0057] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The advantages of the present invention have been fully and effectively realized. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. MCU test device, characterized in that: The MCU test device comprises: A device body, the device body comprising a device body; A receiving assembly, the receiving assembly comprising at least one receiving plate and at least one return member, the receiving plate being movably arranged on the device body through the return member, the receiving plate being formed with a through opening, the receiving plate being used to place the board to be tested, and a plurality of lower connection points of the board to be tested being arranged at the through opening of the receiving plate; A test assembly, the test assembly comprising at least one adapter board and at least one detection integrated board, the adapter board being electrically connected to the detection integrated board, the detection integrated board being disposed on the device body, the detection integrated board being disposed at a predetermined position below the receiving board, and the detection integrated board being used to detect whether there is a problem with the function of the board to be tested; and A fixing component, the fixing component includes at least one pressing member and at least one fitting member, the pressing member is movably arranged on the device body, the fitting member includes an extension plate and a plurality of abutting members, the extension plate is arranged on the pressing member, the extension plate is arranged at a predetermined position above the board to be tested, the adapter plate is arranged on the extension plate, a plurality of abutting members are telescopically arranged on the extension plate, the extension direction of the abutting members is arranged toward the board to be tested, the abutting members are used to press the board to be tested against the receiving plate, and the pressing member is used to press the extension plate toward the board to be tested located on the receiving plate.

2. The MCU testing device according to claim 1, characterized in that: The abutment member comprises a fixed column and a movable column, wherein the fixed column is arranged on the extension plate, and the movable column is telescopically arranged on the fixed column, and the extending direction of the movable column is arranged toward the board to be tested.

3. The MCU testing device according to claim 2, characterized in that: The adapter board has a plurality of adapter pins, which are arranged to correspond to a plurality of upper test points of the board to be tested; the detection integrated board has a plurality of detection pins, which are arranged to correspond to a plurality of lower connection points of the board to be tested located at the through port.

4. The MCU testing device according to claim 3, characterized in that: The fitting component further includes a plurality of limiters, which are arranged on the extension board and are arranged toward the board to be tested, and are used to prevent the transfer pins from being bent and to prevent the board to be tested from being penetrated by the transfer pins.

5. The MCU testing device according to claim 4, characterized in that: The pressing member includes an extension frame, at least one mounting member, at least one pressing member, at least one connecting member and at least one moving member, the extension frame is arranged on the device body, the mounting member is arranged on the extension frame, a limiting through hole is formed at the lower end of the mounting member, the pressing member is rotatably arranged at the high end of the mounting member away from the limiting through hole, the moving member is connected to the pressing member through the connecting member, the moving member is arranged in the limiting through hole so as to pass through the limiting through hole, and one end of the moving member away from the connecting member is connected to the expansion plate.

6. The MCU testing device according to claim 5, characterized in that: The receiving assembly further includes a plurality of protection members, wherein the protection members are disposed between the board to be tested and the receiving plate, and are used to prevent the components of the board to be tested from being pressed against the receiving plate.

7. The MCU testing device according to claim 6, characterized in that: The receiving assembly further includes at least two positioning posts, which are arranged on the receiving plate. The plate to be tested has at least two limiting holes matched with the positioning posts, and the positioning posts are arranged to pass through the limiting holes of the plate to be tested.

8. The MCU testing device according to claim 7, characterized in that: The return element is embodied to include a spring.

9. The MCU testing device according to claim 8, characterized in that: The protective element is implemented as a rubber pad made of rubber.

10. The MCU testing device according to claim 9, characterized in that: The device body further comprises a burning component, which is arranged on the device body and is used for burning the board to be tested.

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