Automatic solder ball adding device
By designing the slope and flip device in the automatic solder ball device, the uniform flow of the solder ball is achieved, and the problems of uneven ball output and insufficient early warning are solved, which improves production efficiency and reduces rework.
Patent Information
- Application Number
- CN202420096099.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-15
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-01-15
AI Technical Summary
The existing automatic ball-adding device is unevenly released during the ball-adding process, resulting in the problem of reworking few solder balls, and the number of solder balls cannot be intuitively confirmed, and the lack of early warning mechanism.
An automatic solder ball device is designed, including a box body, a first channel, a second channel and an inner cavity. The bottom surface of the inner cavity is a slope surface, the first channel is in communication with the opening groove, the second channel is in communication with the outside, and is passed through a flip device Achieve uniform flow of solder balls, and a transparent side panel and solder ball induction device are provided on the sides for induction and early warning.
Through the design of slope and flip device, the uniform flow of solder balls is achieved, reducing the problem of reworking less balls, improving production efficiency, and promptly warning through induction devices to avoid reworking caused by the lack of solder balls.
Smart Images
Figure CN222260963U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductors, in particular to an automatic solder ball adding device. Background Art
[0002] Wafer-level ball placement machine is a high-end semiconductor packaging equipment used to accurately place solder balls on wafers that have been printed with flux. The diameter of the solder balls currently used by wafer-level ball placement machines is generally in the range of 75μm to 300μm. A large number of solder balls are required for ball placement, and ball supply is one of its key technologies. Figure 1A , Figure 1B 1 is a structural diagram of an automatic ball adding device in the prior art, and the automatic ball adding device comprises: a tubular ball supply box 11 and a ball supply tube 12. The tubular ball supply box 11 is a vertical tube, and the tubular ball supply box 11 can be moved up and down by a cylinder; the ball supply tube 12 is connected to the bottom of the tubular ball supply box 11. When the cylinder pushes the tubular ball supply box 11 down, Figure 1A As shown, the ball supply tube 12 is bent, and the solder balls 13 in the tubular ball supply box 11 are blocked in the ball supply tube 12; when the cylinder pushes the tubular ball supply box 11 to rise, as shown in FIG. Figure 1B As shown, the ball supply tube 12 is straightened, and the tin balls 13 in the tubular ball supply box 11 flow out through the ball supply tube 12 under the action of their own gravity to achieve ball addition. However, when the cylinder drives the tubular ball supply box 11 to move up and down, the different degrees of bending of the ball supply tube 12 will cause uneven ball output of the tin balls 13 through the ball supply tube 12, resulting in excessive or insufficient balls, which can easily cause product rework. In addition, the tubular ball supply box 11 in the prior art is made of metal, and the presence or absence of tin balls cannot be visually confirmed from the outside, and there is no sensor inside to confirm the presence or absence of tin balls. If there are no balls inside, the machine cannot issue an early warning, and the product will be reworked due to insufficient balls, requiring manual confirmation of whether there are balls in the tubular ball supply box.
[0003] How to improve the problems of unstable ball adding amount and inability to detect ball amount in the automatic ball adding device of the ball planting machine has become an urgent problem to be solved. Summary of the invention
[0004] The technical problem to be solved by the utility model is to provide an automatic solder ball adding device, so as to improve the problem of uneven ball output of the automatic solder ball adding device, thereby reducing the problem of rework due to insufficient solder balls.
[0005] In order to solve the above problems, the utility model provides an automatic solder ball adding device, comprising: a box body, comprising a first channel, a second channel, and an inner cavity; the bottom surface of the inner cavity is a slope, and the bottom of the slope has an open groove; the first channel is located at the bottom of the box body, the head end of the first channel is connected to the open groove, and is connected to the inner cavity through the open groove; the head end of the second channel is connected to the tail end of the first channel, the tail end of the second channel is connected to the outside, and the tail end of the second channel is higher than the open groove.
[0006] In some embodiments, a flipping device is further included, the box body is connected to the flipping device, the solder balls in the inner cavity can flow from the opening groove into the first channel, and the box body is flipped by the flipping device to enable the solder balls to flow out from the second channel.
[0007] In some embodiments, a transparent side panel is provided on at least one side of the box body, and the transparent side panel is used to close the inner cavity, the first channel and the second channel.
[0008] In some embodiments, a detachable transparent side panel is provided on at least one side of the box body.
[0009] In some embodiments, the tail end of the first channel is inclined in a direction away from the inner cavity so that the first channel forms an angle with a horizontal plane.
[0010] In some embodiments, in the extension direction of the open slot, the width of the first channel is the same as the width of the inner cavity.
[0011] In some embodiments, in the extension direction of the open slot, the width of the first channel is smaller than the width of the inner cavity.
[0012] In some embodiments, in the extension direction of the open slot, the width of the second channel is the same as the width of the first channel.
[0013] In some embodiments, a solder ball sensing device is disposed in the inner cavity.
[0014] In some embodiments, the solder ball sensing device is disposed above the opening groove.
[0015] In some embodiments, the second channel can rotate along the tail end of the first channel, and the solder balls can flow out of the second channel by rotating the second channel to change the position of the tail end.
[0016] The above technical solution is to set a first channel, a second channel, and an inner cavity in the box body, wherein the first channel is located at the bottom of the box body, the head end of the second channel is connected to the tail end of the first channel, the tail end of the second channel is connected to the outside, and the tail end of the second channel is higher than the opening groove, the bottom surface of the inner cavity is a slope, and the bottom of the slope has an opening groove, the head end of the first channel is connected to the opening groove, so that the solder balls in the inner cavity enter the first channel under the action of gravity, and when the tail end position of the second channel changes, the solder balls in the first channel flow out through the second channel, and because the angles of the slope and the first channel when they are stationary are fixed, the automatic solder ball adding device can evenly flow out a fixed amount of solder balls each time it is stationary and turned over, thereby improving the problem of uneven ball output of the automatic ball adding device, thereby reducing the problem of rework of insufficient solder balls and improving production efficiency.
[0017] It should be understood that the above general description and the detailed description below are only exemplary and explanatory and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments of the utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0019] Figure 1A , Figure 1B It is a structural schematic diagram of an automatic solder ball adding device in the prior art;
[0020] Figure 2 It is a structural schematic diagram of an automatic solder ball adding device provided by the first embodiment of the utility model;
[0021] Figure 3A It is a cross-sectional schematic diagram of a box body of an automatic solder ball adding device provided in the first embodiment of the utility model;
[0022] Figure 3B It is a top view schematic diagram of a box body of the automatic solder ball adding device provided by the first embodiment of the utility model;
[0023] Figure 4 It is a schematic structural diagram of a static box body of the automatic solder ball adding device provided by the first embodiment of the utility model;
[0024] Figure 5It is a structural schematic diagram of the box body of the automatic solder ball adding device provided by the first embodiment of the utility model being flipped;
[0025] Figure 6 It is a cross-sectional schematic diagram of a box body of an automatic solder ball adding device provided in a second embodiment of the utility model;
[0026] Figure 7 It is a structural schematic diagram of a device for automatically adding solder balls when the second channel is in an initial state provided by the third embodiment of the utility model;
[0027] Figure 8 It is a structural schematic diagram of a device for automatically adding solder balls when the second channel is rotated to a final state provided by the third embodiment of the utility model. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0029] Please also read Figure 2 , Figure 3A , Figure 3B , Figure 2 It is a structural schematic diagram of an automatic solder ball adding device provided by the first embodiment of the utility model; Figure 3A It is a cross-sectional schematic diagram of a box body of an automatic solder ball adding device provided in the first embodiment of the utility model; Figure 3B It is a top view schematic diagram of the box body of the automatic solder ball adding device provided by the first embodiment of the utility model.
[0030] like Figure 2 As shown, the automatic solder ball adding device comprises: a box body 21. Figure 3A As shown, the box body 21 includes a first channel 212, a second channel 213, and an inner cavity 211; the bottom surface of the inner cavity 211 is a slope 2111, and the bottom of the slope 2111 has an opening groove 2112; the first channel 212 is located at the bottom of the box body 21, the head end of the first channel 212 is connected to the opening groove 2112, and is connected to the inner cavity 211 through the opening groove 2112; the head end of the second channel 213 is connected to the tail end of the first channel 212, the tail end of the second channel 213 is connected to the outside, and the tail end of the second channel 213 is higher than the opening groove 2112.
[0031] like Figure 3AAs shown, the tail end of the second channel 213 includes an opening 2131 communicating with the outside. Figure 3B As shown, the width of the opening 2131 along the extension direction Z of the opening slot 2112 is the same as that of the opening slot 2112 .
[0032] In this embodiment, a flipping device is further included, and the box body 21 is connected to the flipping device, so that the solder balls in the inner cavity 211 can flow from the opening groove 2112 into the first channel 212, and the box body 21 is flipped by the flipping device to enable the solder balls to flow out from the opening 2131 of the second channel 213. As an example, this embodiment provides a structural diagram of a flipping device, as shown in FIG. Figure 2 As shown, the flipping device is arranged outside the box body 21, and the flipping device is composed of a mechanical component 23 wrapped on the surface of the box body 21, a connecting rod 28, and a telescopic cylinder 29. The mechanical component 23 is connected to the telescopic cylinder 29 through the connecting rod 28. The bottom of the mechanical component 23 has a pin 25 and a stop block 27, and the stop block 27 includes a rotating shaft 271 along the extension direction Z of the opening groove 2112. When the machine receives the instruction to add solder balls, the telescopic cylinder 29 pushes the slider along the horizontal direction X, driving the connecting rod 28 to move the box body 21 along the horizontal direction X. Since the bottom of the mechanical component 23 is connected to the stop block 27, the mechanical component 23 and the box body 21 wrapped therein can only make an arc movement, so that the mechanical component 23 and the box body 21 wrapped therein can make an arc flip, and the solder balls flow out from the second channel 213. When the slider of the telescopic cylinder 29 is retracted in the reverse direction of the horizontal direction X, the box body 21 is reversed and returned to its original position. The ejector pin 25 tilts the box body 21, which is not only conducive to the solder balls flowing through the opening groove 2112 to enter the first channel 212, but also can be used for shock absorption when the box body 21 is retracted to a static state.
[0033] In some embodiments, a transparent side panel 22 is provided on at least one side of the box body 21, and the transparent side panel 22 is used to seal the inner cavity 211, the first channel 212 and the second channel 213. Figure 3B As shown, transparent side panels 22 are provided on both sides of the box body 21, and the transparent side panels 22 are used to close the inner cavity 211, the first channel 212 and the second channel 213. Figure 2 As shown, the transparent side panel 22 is fixed to the box body 21 by a plurality of screws 24. The transparent side panel 22 and the box body 21 form a three-dimensional structure, and the inner cavity 211, the first channel 212 and the second channel 213 are sealed inside the three-dimensional structure.
[0034] In this embodiment, by providing the transparent side panel 22 on the side of the box body 21, the inner cavity 211, the first channel 212, and the second channel 213 can be observed, and the distribution amount of solder balls inside the inner cavity 211, the first channel 212, and the second channel 213 and the movement of solder balls can be directly observed, which is convenient for staff to control the situation of solder balls inside the automatic solder ball adding device. Figure 2 The transparent side panel 22 shown in the figure is a transparent thin plate, and the shape of the transparent side panel 22 is basically consistent with the cross-section of the box body 21, and can close the inner cavity 211, the first channel 212 and the second channel 213. In one embodiment, the material of the transparent side panel 22 is acrylic material.
[0035] In this embodiment, a detachable transparent side panel 22 is provided on at least one side of the box body 21 . Figure 2 The transparent side panel 22 is fixed to the box body 21 by the screws 24. The transparent side panel 22 can be disassembled by unscrewing the screws 24, so as to facilitate cleaning of the inner cavity 211 and the first channel 212 and the second channel 213 of the box body 21.
[0036] In some embodiments, the transparent side panel 22 is disposed on one side of the box body 21, and the material of the other side panel is not limited, and is used to close the inner cavity 211, the first channel 212 and the second channel 213. Specifically, one side of the box body 21 is integrally formed with the box body 21 itself, and the other side is formed by disposing the transparent side panel 22. The material of the box body 21 is metal, which can be easily integrated.
[0037] In this embodiment, the tail end of the first channel 212 is inclined in a direction away from the inner cavity 211, so that the first channel 212 forms an angle β with the horizontal plane O. Specifically, Figure 3A As shown, there is an angle β between the first channel 212 and the horizontal plane O, and the slope 2111 forms an angle α with the horizontal plane O, so that the solder balls in the inner cavity 211 can quickly flow from the head end of the first channel 212 to the tail end of the first channel 212 after passing through the opening groove 2112 under the action of gravity, so that the first channel 212 is filled with solder balls. In this embodiment, the bottom surface of the box body 21 is parallel to the first channel 212, so the bottom surface of the box body 21 also forms an angle β with the horizontal plane O. Figure 2 The angle β is formed by setting the ejector pin 25 .
[0038] Continue to refer Figure 3A , Figure 3BIn this embodiment, in the extension direction Z of the opening groove, the width of the first channel 212 is the same as the width of the inner cavity 211. The above structure enables the solder balls in the inner cavity 211 located at any position near the opening groove 2112 to quickly enter the first channel 212, that is, the above structure enables the solder balls in the inner cavity 211 to enter the first channel 212 more evenly and quickly through the opening groove 2112.
[0039] In some embodiments, in the extension direction Z of the opening groove, the width of the first channel 212 is smaller than the width of the inner cavity 211. Specifically, the width of the opening groove 2112 is smaller than the width of the inner cavity 211, the inner cavity 211 is funnel-shaped, and the width of the first channel 212 is also smaller than the width of the inner cavity 211. In another embodiment, the width of the opening groove 2112 is the same as the width of the inner cavity 211, and both are larger than the width of the first channel 212. At least one side of the first channel 212 along the flow direction of the solder ball is closed by the transparent side panel 22.
[0040] In this embodiment, in the extension direction Z of the opening groove, the width of the second channel 213 is the same as the width of the first channel 212. The second channel 213 is connected to the first channel 212 and together constitutes a channel for the solder ball to flow out. The second channel 213 is the same as the first channel 212 in width, which can ensure that the speed at which the solder ball moves in the second channel 213 and the first channel 212 remains stable.
[0041] In this embodiment, the angle α between the slope 2111 and the horizontal plane O is less than 30 degrees. When the box body 21 is stationary, due to the existence of the angle α, the solder balls in the inner cavity 211 can move toward the open groove 2112 under the action of their own gravity. When the angle between the bottom surface of the box body 21 and the horizontal plane O remains unchanged, the larger the angle α, the faster the solder balls flow toward the open groove 2112. In some embodiments, the angle α is greater than 30 degrees, but when the angle α is too large, the angle between the slope 2111 and the horizontal plane O is too large, which easily causes the solder balls to accumulate near the open groove 2112.
[0042] In this embodiment, a solder ball sensing device is provided in the inner cavity 211. In this embodiment, the solder ball sensing device is provided above the open groove 2112. When the solder ball sensing device senses that the open groove 2112 is not fully covered with solder balls, it indicates that the inner cavity 211 is about to be emptied. In some embodiments, the solder ball sensing device has a 360-degree sensing function and can sense the distribution of solder balls at any position in the inner cavity 211, and the solder ball sensing device is provided at other positions in the inner cavity 211.
[0043] In this embodiment, the solder ball sensing device can give a cavity alarm of the inner cavity 211. The solder ball sensing device can communicate with external machine equipment. After the solder ball sensing device finds a cavity, it can issue an alarm through the external machine equipment to promptly notify the staff to add solder balls to avoid rework of the product due to insufficient solder balls.
[0044] Figure 4 The schematic diagram of the structure of the box body of the automatic solder ball adding device provided by the first embodiment of the utility model is static. Figure 2 Similarly, the cross-sectional schematic diagram of the box body of the automatic solder ball adding device is similar to Figure 3A Same. Please refer to Figure 2 , Figure 3A ,as well as Figure 4 When the box body of the automatic solder ball adding device is stationary, the slope 2111 forms an angle α with the horizontal plane O, and the first channel 212 forms an angle β with the horizontal plane O. The angle α and the angle β allow the solder balls 26 in the inner cavity 211 to enter the first channel 212 along the slope 2111 and the opening groove 2112 under the action of gravity. Since one end of the second channel 213 connected to the first channel 212 is upward and higher than the two ends of the first channel 212, the solder balls 26 in the first channel 212 will not flow out.
[0045] Figure 5 FIG. 1 is a schematic diagram of the structure of the box body of the automatic solder ball adding device provided by the first embodiment of the utility model being flipped. Figure 5 As shown, when the box body 21 of the automatic solder ball adding device is turned over, under the action of gravity, the solder balls 26 in the first channel 212 flow out after passing through the second channel 213. Each time the box body 21 is turned over, the solder balls 26 in the first channel 212 can be poured out at once. Figure 4 As shown, when the box body 21 is stationary, the angle α and the angle β are fixed, so the number of the solder balls 26 poured out each time is fixed. After the automatic solder ball adding device is adopted, the rework problem caused by the problem of insufficient balls is significantly improved.
[0046] Figure 6 2 is a schematic cross-sectional view of the box body of the automatic solder ball adding device provided by the second embodiment of the present utility model. Figure 6As shown, the bottom surface of the box body 31 is parallel to the horizontal plane O, and there is an angle between the bottom surface of the box body 31 and the first channel 312, and the size of the angle is the same as the angle between the first channel 312 and the horizontal plane O. Since there is an angle β between the first channel 312 and the horizontal plane O, there is an angle α between the slope 3111 and the horizontal plane O. When the box body 31 is stationary, the solder ball can enter the first channel 312 from the inner cavity 311 along the slope 3111 through the opening groove 3112.
[0047] In the above embodiment, the box body 31 is flipped by the flipping device, so that the solder balls flow out of the second channel 313. In some embodiments, the second channel can rotate along the tail end of the first channel, and the solder balls flow out of the second channel by rotating the second channel to change the position of the tail end.
[0048] Figure 7 It is a structural schematic diagram of a device for automatically adding solder balls when the second channel is in an initial state provided by the third embodiment of the utility model; Figure 8 It is a structural schematic diagram of a device for automatically adding solder balls when the second channel is rotated to a final state provided by the third embodiment of the utility model.
[0049] like Figure 7 As shown, the bottom surface of the box body 41 is parallel to the horizontal plane O, an angle β exists between the first channel 412 and the horizontal plane O, and an angle α exists between the slope 4111 and the horizontal plane O. When the box body 41 is stationary, the solder ball 46 enters the first channel 412 from the inner cavity 411. The second channel 413 is arranged in a plate-like structure 414. The enlarged schematic diagram of the connection 4141 between the tail end of the first channel 412 and the plate-like structure 414 is shown in the dotted box in the lower right corner. The connection 4141 is arc-shaped with an open connection groove on the top. When the angle of the tail end of the plate-like structure 414 is such that the open connection groove of the connection 4141 is not connected to the tail end of the first channel 412, and the tail of the second channel 413 is facing upward, the solder ball 46 will not flow out. Figure 8 As shown, the plate-like structure 414 rotates along the connection 4141, and when the open connection groove at the top of the connection 4141 is connected to the tail end of the first channel 412 and the tail of the second channel 413 is downward, the solder ball 46 flows out through the second channel 413 under the action of gravity.
[0050] The above technical solution is to set a first channel, a second channel, and an inner cavity in the box body, wherein the first channel is located at the bottom of the box body, the head end of the second channel is connected to the first channel, the tail end of the second channel is connected to the outside, and the tail end of the second channel is higher than the opening groove, and the bottom surface of the inner cavity is a slope, and the bottom of the slope has an opening groove. The first channel is connected to the inner cavity through the opening groove, so that the solder balls in the inner cavity enter the first channel under the action of gravity, and when the tail end position of the second channel changes, the solder balls in the first channel flow out through the second channel. Since the angles of the slope and the first channel when they are stationary are fixed, the automatic solder ball adding device can evenly flow out a fixed amount of solder balls each time it is stationary and turned over, thereby improving the problem of uneven ball output of the automatic ball adding device, thereby reducing the problem of rework of insufficient solder balls and improving production efficiency.
[0051] It should be noted that, in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion. The various embodiments in this specification are described in a related manner, and the same and similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.
[0052] The above is only a preferred embodiment of the utility model, and is not intended to limit the protection scope of the utility model. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the utility model, and these improvements and modifications should also be regarded as the protection scope of the utility model.
Claims
1. An automatic solder ball adding device, characterized in that: include: The box body comprises a first channel, a second channel, and an inner cavity; The bottom surface of the inner cavity is a slope, and the bottom of the slope has an open groove; The first channel is located at the bottom of the box body, and the first end of the first channel is connected to the opening groove, and is connected to the inner cavity through the opening groove; The head end of the second channel is communicated with the tail end of the first channel, the tail end of the second channel is communicated with the outside, and the tail end of the second channel is higher than the opening groove.
2. The automatic solder ball adding device according to claim 1, characterized in that: It also includes a flipping device, the box body is connected to the flipping device, the solder balls in the inner cavity can flow into the first channel from the opening groove, and the box body is flipped by the flipping device to enable the solder balls to flow out from the second channel.
3. The automatic solder ball adding device according to claim 1, characterized in that: A transparent side panel is provided on at least one side of the box body, and the transparent side panel is used to close the inner cavity, the first channel and the second channel.
4. The automatic solder ball adding device according to claim 3, characterized in that: The detachable transparent side panel is arranged on at least one side of the box body.
5. The automatic solder ball adding device according to claim 1, characterized in that: The tail end of the first channel is inclined in a direction away from the inner cavity, so that the first channel forms an angle with a horizontal plane.
6. The automatic solder ball adding device according to claim 1, characterized in that: In the extending direction of the opening groove, the width of the first channel is less than or equal to the width of the inner cavity.
7. The automatic solder ball adding device according to claim 1, characterized in that: In the extending direction of the opening groove, the width of the second channel is the same as the width of the first channel.
8. The automatic solder ball adding device according to claim 1, characterized in that: A solder ball sensing device is arranged in the inner cavity.
9. The automatic solder ball adding device according to claim 8, characterized in that: The solder ball sensing device is arranged above the opening groove.
10. The automatic solder ball adding device according to claim 1, characterized in that: The second channel can rotate along the tail end of the first channel, and the solder balls can flow out of the second channel by rotating the second channel to change the position of the tail end.