Multicolor integrated light source

Abstract

The utility model discloses a multicolor integrated light source which comprises a substrate, a light-emitting chip set, a CSP-LED set and a transparent adhesive layer, the light-emitting chip set, the CSP-LED set and the transparent adhesive layer are arranged on the first surface of the substrate, and the light-emitting chip set and the CSP-LED set form a light-emitting array on the first surface of the substrate; on the first surface of the substrate, the transparent adhesive layer wraps the surface and the side face of the light-emitting chip set, and the surface of the CSP-LED set is exposed out of the transparent adhesive layer. The multicolor integrated light source, the light-emitting chips and the CSP-LEDs are combined for use, so that high-density integration is facilitated, and the manufacturing cost can be greatly reduced; only the light-emitting chip is wrapped by the transparent adhesive layer, and the surface of the CSP-LED is exposed and is not covered by the transparent adhesive layer, so that the light guide effect of the transparent adhesive layer can be greatly reduced, and impure color possibly caused by excitation of fluorescent powder on the nearby CSP-LED by light emitted by the light-emitting chip is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of luminous light sources, in particular to a multi-color integrated light source. Background Art

[0002] Multi-color LED integrated light sources have been widely used in stage, landscape, photography and other fields.

[0003] There is a common multi-color LED integrated light source, including a substrate and a warm white CSP-LED, a cold white CSP-LED, a green light chip, a blue light chip and a transparent adhesive layer arranged on the substrate, and the transparent adhesive layer covers the warm white CSP-LED, the cold white CSP-LED, the green light chip and the blue light chip. The warm white CSP-LED is a blue light chip covered with warm white phosphor, and the cold white CSP-LED is a blue light chip covered with cold white phosphor. When the blue light chip is lit, the blue light it emits will excite the nearby warm white and cold white phosphors through the photoconductive effect of the transparent adhesive layer, and the light generated by the warm white phosphor and the cold white phosphor will be mixed in the pure blue light emitted by the blue light chip, resulting in impure blue light color. The transparent adhesive layer covering the warm white CSP-LED and the cool white CSP-LED will also cause the transparent layer to selectively absorb light of different wavelengths, causing the warm white light and cool white light produced by the multi-color LED integrated light source to deviate from the color of the warm white CSP-LED and the cool white CSP-LED themselves, bringing uncontrollable variables to the color of the warm white light and the cool white light.

[0004] Another common multi-color LED integrated light source, different from the above light sources, is composed of individually packaged CSP-LEDs, which can completely avoid mutual interference between different colors of light. However, due to the relatively large size of individually packaged CSP-LEDs, it is difficult to achieve high-density integration of multi-color light sources and cannot improve the central illumination of directional projection lighting fixtures. Packaging blue light chips and green light chips into green light CSP-LEDs and blue light CSP-LEDs will also lead to additional costs.

[0005] Obviously, the existing multi-color LED integrated light sources have essential defects and deficiencies, and cannot solve the problems faced by the multi-color LED integrated light sources, such as high-density integration without mutual interference, high cost, and difficult color control. Utility Model Content

[0006] The technical problem to be solved by the utility model is to provide an improved multi-color integrated light source.

[0007] The technical solution adopted by the utility model to solve the technical problem is: to provide a multi-color integrated light source, including a substrate having a first surface and a second surface opposite to each other, a light-emitting chip group, a CSP-LED group and a transparent adhesive layer arranged on the first surface of the substrate, wherein the light-emitting chip group and the CSP-LED group form a light-emitting array on the first surface of the substrate;

[0008] On the first surface of the substrate, the transparent adhesive layer wraps the surface and side surfaces of the light-emitting chip group, and the surface of the CSP-LED group is exposed outside the transparent adhesive layer.

[0009] Preferably, on the first surface of the substrate, the height of the CSP-LED group is greater than the height of the light-emitting chip group and the transparent adhesive layer.

[0010] Preferably, the light emitting chip group includes at least one light emitting chip, and the light emitting chip is at least one of an ultraviolet chip, a cyan chip, a blue chip, a green chip, an orange chip, a red chip, and an infrared chip;

[0011] The CSP-LED group includes at least one CSP-LED.

[0012] Preferably, the transparent adhesive layer is a transparent adhesive layer doped with fluorescent powder.

[0013] Preferably, the multi-color integrated light source further comprises a dam; the dam is arranged on the first surface of the substrate and surrounds the light-emitting array.

[0014] Preferably, the multicolor integrated light source further comprises a reflective insulating layer; the reflective insulating layer is arranged on the first surface of the substrate and surrounds the periphery of the light-emitting chip group and the CSP-LED group, and the transparent adhesive layer covers the reflective insulating layer.

[0015] Preferably, the multi-color integrated light source further comprises a conductive circuit, the conductive circuit is arranged on the first surface of the substrate, and the light-emitting chip group and the CSP-LED group are connected in series and / or in parallel via the conductive circuit.

[0016] Preferably, the multi-color integrated light source further comprises a first external soldering pad and a second external soldering pad which are arranged on the substrate and are conductively connected to the conductive circuit.

[0017] Preferably, the first external pad and the second external pad are arranged on the first surface of the substrate.

[0018] Preferably, at least one of the first external pad and the second external pad is disposed on the second surface of the substrate and is conductively connected to the conductive circuit via a conductive through hole penetrating the substrate.

[0019] Preferably, the multi-color integrated light source further comprises a thermally conductive pad, and the thermally conductive pad is arranged on the second surface of the substrate.

[0020] The beneficial effects of the utility model are as follows: the combined use of the light-emitting chip and the CSP-LED not only facilitates high-density integration, but also significantly reduces manufacturing costs; by wrapping only the light-emitting chip with the transparent adhesive layer, the surface of the CSP-LED is exposed and not covered by the transparent adhesive layer, which can significantly reduce the photoconductive effect of the transparent adhesive layer and avoid the color impurity that may be caused by the light emitted by the light-emitting chip exciting the phosphor on the nearby CSP-LED.

[0021] Since the transparent adhesive layer does not cover the CSP-LED, the influence of the transparent adhesive layer on the color of the CSP-LED is avoided, which can greatly improve the color control ability in the process of manufacturing multi-color integrated light sources, and then greatly improve the yield rate and material rate, and further reduce costs.

[0022] The multi-color integrated light source of the utility model is suitable for directional projection type intelligent color-changing lighting lamps and the like. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0024] Figure 1 This is a schematic diagram of the structure of a multi-color integrated light source according to an embodiment of the present utility model;

[0025] Figure 2 It is a structural schematic diagram of a multi-color integrated light source according to another embodiment of the utility model. DETAILED DESCRIPTION

[0026] In order to have a clearer understanding of the technical features, purposes and effects of the present utility model, the specific implementation methods of the present utility model are now described in detail with reference to the accompanying drawings.

[0027] like Figure 1 As shown, a multi-color integrated light source according to an embodiment of the present invention may include a substrate 10 , a light-emitting chip group disposed on the substrate 10 , a CSP-LED group, a transparent adhesive layer 40 and a dam 50 .

[0028] The substrate 10 may be, but is not limited to, a ceramic substrate such as an alumina ceramic plate, an aluminum nitride ceramic plate, a metal substrate or a substrate made of other materials. The substrate 10 has a first surface and a second surface opposite to each other, and the light-emitting chip group, the CSP-LED group, the transparent adhesive layer 40 and the dam 50 are specifically arranged on the first surface of the substrate 10. The light-emitting chip group and the CSP-LED group form a light-emitting array on the first surface of the substrate 10, and the dam 50 is on the first surface of the substrate 10 and surrounds the light-emitting array.

[0029] It can be understood that on the first surface of the substrate 10, the light emitting chip group can be one or more groups, and the CSP-LED group can be one or more groups. Each light emitting chip group includes at least one light emitting chip 20, and the light emitting chip 20 is at least one of an ultraviolet chip, a cyan chip, a blue chip, a green chip, an orange chip, a red chip, and an infrared chip. When the light emitting chip group includes two or more light emitting chips 20, the light emitting chips 20 can be light emitting chips that emit the same color of light, or can be light emitting chips that emit different colors of light.

[0030] The light emitting chip 20 may further be a flip chip, a vertical chip or a face-up chip. The light emitting chip 20 is preferably a flip chip, which does not require wire bonding and helps to achieve high-density integration. Alternatively, the light emitting chip 20 may be disposed on the first surface of the substrate 10 and electrically connected to the conductive circuit on the substrate 10 by, but not limited to, reflow soldering, eutectic soldering, and pressure soldering.

[0031] The CSP-LED group includes at least one CSP-LED 30. The CSP-LED 30 includes but is not limited to at least one of a warm white CSP-LED, a cool white CSP-LED, and a CSP-LED of other colors. Alternatively, the CSP-LED 30 may be disposed on the first surface of the substrate 10 and conductively connected to the conductive circuit on the substrate 10 by, but not limited to, reflow soldering.

[0032] When the CSP-LED group includes two or more CSP-LEDs 30 , the CSP-LEDs 20 may be CSP-LEDs emitting light of the same color or may be CSP-LEDs emitting light of different colors.

[0033] On the first surface of the substrate 10 , specifically in the area surrounded by the dam 50 , the light emitting chips 20 and the CSP-LEDs 30 may be arranged in any combination, for example, the light emitting chips 20 are arranged alternately between the CSP-LEDs 30 .

[0034] On the first surface of the substrate 10, the transparent adhesive layer 40 wraps the surface and side of the light-emitting chip 20 of the light-emitting chip group, which can protect the light-emitting chip 20 from the influence of the external environment and improve reliability and service life. The surface of the CSP-LED group is exposed outside the transparent adhesive layer 40 and is not wrapped by the transparent adhesive layer 40, so that the photoconductive effect of the transparent adhesive layer 40 can be greatly reduced, and the light emitted by the light-emitting chip group can be prevented from exciting the phosphor on the nearby CSP-LED group, which may cause impure color. In addition, since the transparent adhesive layer 40 does not cover the CSP-LED group, the influence of the transparent adhesive layer 40 on the color of the CSP-LED group is avoided, so that the color control ability in the process of manufacturing multi-color integrated light sources can be greatly improved, and then the yield rate can be greatly improved, and the cost can be further reduced.

[0035] In addition, the combined use of the light emitting chip 20 and the CSP-LED 30 not only facilitates high-density integration, but also can substantially reduce manufacturing costs by replacing the corresponding CSP-LED 30 with the light emitting chip 20 .

[0036] In order to prevent the surface of the CSP-LED group from being wrapped by the transparent adhesive layer 40, on the first surface of the substrate 10, the height of the CSP-LED group is set to be greater than the height of the light-emitting chip group and the transparent adhesive layer 40, so that the portion of the CSP-LED group higher than the transparent adhesive layer 40 is exposed outside the transparent adhesive layer 40. Alternatively, when the height of the CSP-LED group is equivalent to the height of the light-emitting chip group and / or the transparent adhesive layer 40, the transparent adhesive layer 40 is set so that the transparent adhesive layer 40 avoids the position where the CSP-LED group is located or an opening is set to expose the surface of the CSP-LED group.

[0037] The transparent adhesive layer 40 is preferably formed of silicone or epoxy resin. The transparent adhesive layer 40 can preferably, but not limited to, wrap the surface and side of the light emitting chip in a dispensing or mask spraying manner.

[0038] Further, as required, one or more phosphors may be added into the transparent adhesive layer 40. The phosphors include common phosphors or quantum dot phosphors; the common phosphors may be, but are not limited to, one or more of YAG phosphors, oxide phosphors, nitride phosphors, fluoride phosphors, aluminate phosphors, silicate phosphors, and nitrogen oxide phosphors; the quantum dot phosphors may be, but are not limited to, one or more of silicon quantum dots, germanium quantum dots, cadmium sulfide quantum dots, cadmium selenide quantum dots, cadmium telluride quantum dots, zinc selenide quantum dots, lead sulfide quantum dots, lead selenide quantum dots, indium phosphide quantum dots, and indium arsenide quantum dots.

[0039] Further, as an option, the multi-color integrated light source of this embodiment may also include a reflective insulating layer 60 to improve light extraction efficiency. The reflective insulating layer 60 is disposed on the first surface of the substrate 10 and surrounds the periphery of the light-emitting chip group and the CSP-LED group, that is, the reflective insulating layer 60 is disposed on the first surface of the substrate 10 where the light-emitting chip 20 and the CSP-LED 30 are not disposed. The transparent adhesive layer 40 covers the reflective insulating layer 60.

[0040] The reflective insulating layer 60 is preferably, but not limited to, ink or white glue.

[0041] The multi-color integrated light source of this embodiment may further include a conductive circuit (not shown), an external soldering pad, a heat-conducting soldering pad 13 and the like.

[0042] The conductive circuit is disposed on the first surface of the substrate 10, and the light-emitting chip group and the CSP-LED group are connected in series and / or in parallel through the conductive circuit. Specifically, the light-emitting chips 20 of the light-emitting chip group can be connected in series and / or in parallel through the conductive circuit, the CSP-LEDs 30 of the CSP-LED group can be connected in series and / or in parallel through the conductive circuit, and the light-emitting chips 20 and the CSP-LEDs 30 can be connected in series and / or in parallel through the conductive circuit.

[0043] The external solder pad is used to connect the multi-color integrated light source to an external power source. Corresponding to the positive and negative electrodes, the external solder pad includes a first external solder pad 11 and a second external solder pad 12. Figure 1 In this embodiment, at least one of the first external pad 11 and the second external pad 12 is disposed on the second surface of the substrate 10 and is conductively connected to the conductive circuit via a conductive through hole 101 penetrating the substrate 10 .

[0044] When the substrate 10 is a ceramic substrate, a thermal pad 13 is provided on the second surface of the substrate 10. The thermal pad 13 is used to contact the surface of the multi-color integrated light source installation position to conduct heat generated by the light emitting chip 20 and the CSP-LED 30 to achieve heat dissipation.

[0045] When the substrate 10 is a metal substrate, it is not necessary to provide a thermally conductive pad.

[0046] like Figure 2 As shown, a multi-color integrated light source according to another embodiment of the present invention may include a substrate 10 , a light-emitting chip group disposed on the substrate 10 , a CSP-LED group, a transparent adhesive layer 40 and a dam 50 .

[0047] The substrate 10 may be, but is not limited to, a ceramic substrate such as an alumina ceramic plate, an aluminum nitride ceramic plate, a metal substrate or a substrate made of other materials. The substrate 10 has a first surface and a second surface opposite to each other, and the light-emitting chip group, the CSP-LED group, the transparent adhesive layer 40 and the dam 50 are specifically arranged on the first surface of the substrate 10. The light-emitting chip group and the CSP-LED group form a light-emitting array on the first surface of the substrate 10, and the dam 50 is on the first surface of the substrate 10 and surrounds the light-emitting array.

[0048] On the first surface of the substrate 10, the light emitting chip group may be one or more groups, and the CSP-LED group may be one or more groups. Each light emitting chip group includes at least one light emitting chip 20, and the light emitting chip 20 is at least one of an ultraviolet chip, a cyan chip, a blue chip, a green chip, an orange chip, a red chip, and an infrared chip. When the light emitting chip group includes two or more light emitting chips 20, the light emitting chips 20 may be light emitting chips emitting the same color light, or light emitting chips emitting different colors light.

[0049] The light emitting chip 20 may further be a flip chip, a vertical chip or a face-up chip. The light emitting chip 20 is preferably a flip chip, which does not require wire bonding and helps to achieve high-density integration. Alternatively, the light emitting chip 20 may be disposed on the first surface of the substrate 10 and electrically connected to the conductive circuit on the substrate 10 by, but not limited to, reflow soldering, eutectic soldering, and pressure soldering.

[0050] The CSP-LED group includes at least one CSP-LED 30. The CSP-LED 30 includes, but is not limited to, at least one of a warm white CSP-LED, a cool white CSP-LED, and a CSP-LED of other colors.

[0051] When the CSP-LED group includes two or more CSP-LEDs 30 , the CSP-LEDs 20 may be CSP-LEDs emitting light of the same color or may be CSP-LEDs emitting light of different colors.

[0052] Alternatively, the CSP-LED 30 may be disposed on the first surface of the substrate 10 and conductively connected to the conductive circuit on the substrate 10 by, but not limited to, reflow soldering.

[0053] On the first surface of the substrate 10 , specifically in the area surrounded by the dam 50 , the light emitting chips 20 and the CSP-LEDs 30 may be arranged in any combination, for example, the light emitting chips 20 are arranged alternately between the CSP-LEDs 30 .

[0054] On the first surface of the substrate 10, the transparent adhesive layer 40 wraps the surface and side of the light-emitting chip 20 of the light-emitting chip group, which can protect the light-emitting chip 20 from the influence of the external environment and improve reliability and service life. The surface of the CSP-LED group is exposed outside the transparent adhesive layer 40 and is not wrapped by the transparent adhesive layer 40, so that the photoconductive effect of the transparent adhesive layer 40 can be greatly reduced, and the light emitted by the light-emitting chip group can be prevented from exciting the phosphor on the nearby CSP-LED group, which may cause impure color. In addition, since the transparent adhesive layer 40 does not cover the CSP-LED group, the influence of the transparent adhesive layer 40 on the color of the CSP-LED group is avoided, so that the color control ability in the process of manufacturing multi-color integrated light sources can be greatly improved, and then the yield rate can be greatly improved, and the cost can be further reduced.

[0055] In addition, the combined use of the light emitting chip 20 and the CSP-LED 30 not only facilitates high-density integration, but also can substantially reduce manufacturing costs by replacing the corresponding CSP-LED 30 with the light emitting chip 20 .

[0056] In order to prevent the surface of the CSP-LED group from being wrapped by the transparent adhesive layer 40, on the first surface of the substrate 10, the height of the CSP-LED group is set to be greater than the height of the light-emitting chip group and the transparent adhesive layer 40, so that the portion of the CSP-LED group higher than the transparent adhesive layer 40 is exposed outside the transparent adhesive layer 40. Alternatively, when the height of the CSP-LED group is equivalent to the height of the light-emitting chip group and / or the transparent adhesive layer 40, the transparent adhesive layer 40 is set so that the transparent adhesive layer 40 avoids the position where the CSP-LED group is located or an opening is set to expose the surface of the CSP-LED group.

[0057] The transparent adhesive layer 40 is preferably formed of silicone or epoxy resin. The transparent adhesive layer 40 can preferably, but not limited to, wrap the surface and side of the light emitting chip in a dispensing or mask spraying manner.

[0058] Further, as required, one or more phosphors may be added into the transparent adhesive layer 40. The phosphors include common phosphors or quantum dot phosphors; the common phosphors may be, but are not limited to, one or more of YAG phosphors, oxide phosphors, nitride phosphors, fluoride phosphors, aluminate phosphors, silicate phosphors, and nitrogen oxide phosphors; the quantum dot phosphors may be, but are not limited to, one or more of silicon quantum dots, germanium quantum dots, cadmium sulfide quantum dots, cadmium selenide quantum dots, cadmium telluride quantum dots, zinc selenide quantum dots, lead sulfide quantum dots, lead selenide quantum dots, indium phosphide quantum dots, and indium arsenide quantum dots.

[0059] Further, as an option, the multi-color integrated light source of this embodiment may also include a reflective insulating layer 60 to improve light extraction efficiency. The reflective insulating layer 60 is disposed on the first surface of the substrate 10 and surrounds the periphery of the light-emitting chip group and the CSP-LED group, that is, the reflective insulating layer 60 is disposed on the first surface of the substrate 10 where the light-emitting chip group and the CSP-LED group are not disposed. The transparent adhesive layer 40 covers the reflective insulating layer 60.

[0060] The reflective insulating layer 60 is preferably, but not limited to, ink or white glue.

[0061] The multi-color integrated light source of this embodiment may further include a conductive circuit (not shown), an external soldering pad, a heat-conducting soldering pad 13 and the like.

[0062] The conductive circuit is disposed on the first surface of the substrate 10, and the light-emitting chip group and the CSP-LED group are connected in series and / or in parallel through the conductive circuit. Specifically, the light-emitting chips 20 of the light-emitting chip group can be connected in series and / or in parallel through the conductive circuit, the CSP-LEDs 30 of the CSP-LED group can be connected in series and / or in parallel through the conductive circuit, and the light-emitting chips 20 and the CSP-LEDs 30 can be connected in series and / or in parallel through the conductive circuit.

[0063] The external solder pad is used to connect the multi-color integrated light source to an external power source. Corresponding to the positive and negative electrodes, the external solder pad includes a first external solder pad 11 and a second external solder pad 12. In this embodiment, Figure 2 As shown, the first external pad 11 and the second external pad 12 are arranged on the substrate 10 and are respectively conductively connected to the conductive circuit. Figure 1 In the illustrated embodiment, there is no need to provide a conductive through hole penetrating the substrate 10 .

[0064] When the substrate 10 is a ceramic substrate, a thermal pad 13 may be provided on the second surface of the substrate 10. The thermal pad 13 is used to contact the surface of the multi-color integrated light source installation position to conduct heat generated by the light emitting chip 20 and the CSP-LED 30 to achieve heat dissipation.

[0065] When the substrate 10 is a metal substrate, it is not necessary to provide a thermally conductive pad.

[0066] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A multicolor integrated light source, characterized in that: The invention comprises a substrate having a first surface and a second surface opposite to each other, a light emitting chip group, a CSP-LED group and a transparent adhesive layer arranged on the first surface of the substrate, wherein the light emitting chip group and the CSP-LED group form a light emitting array on the first surface of the substrate; On the first surface of the substrate, the transparent adhesive layer wraps the surface and side surfaces of the light-emitting chip group, and the surface of the CSP-LED group is exposed outside the transparent adhesive layer.

2. The multicolor integrated light source according to claim 1, characterized in that: On the first surface of the substrate, the height of the CSP-LED group is greater than the heights of the light-emitting chip group and the transparent adhesive layer.

3. The multicolor integrated light source according to claim 1, characterized in that: The light-emitting chip group includes at least one light-emitting chip, and the light-emitting chip is at least one of an ultraviolet chip, a cyan chip, a blue chip, a green chip, an orange chip, a red chip, and an infrared chip; The CSP-LED group includes at least one CSP-LED.

4. The multicolor integrated light source according to claim 1, characterized in that: The transparent adhesive layer is a transparent adhesive layer doped with fluorescent powder.

5. The multicolor integrated light source according to any one of claims 1 to 4, characterized in that: The multi-color integrated light source further includes a dam; the dam is disposed on the first surface of the substrate and surrounds the light-emitting array.

6. The multicolor integrated light source according to any one of claims 1 to 4, characterized in that: The multicolor integrated light source further comprises a reflective insulating layer; the reflective insulating layer is arranged on the first surface of the substrate and surrounds the periphery of the light-emitting chip group and the CSP-LED group, and the transparent adhesive layer covers the reflective insulating layer.

7. The multicolor integrated light source according to any one of claims 1 to 4, characterized in that: The multi-color integrated light source further comprises a conductive circuit, which is arranged on the first surface of the substrate. The light-emitting chip group and the CSP-LED group are connected in series and / or in parallel via the conductive circuit.

8. The multicolor integrated light source according to claim 7, characterized in that: The multi-color integrated light source further includes a first external soldering pad and a second external soldering pad which are disposed on the substrate and are conductively connected to the conductive circuit.

9. The multicolor integrated light source according to claim 8, characterized in that: The first external pad and the second external pad are arranged on the first surface of the substrate; or, At least one of the first external pad and the second external pad is disposed on the second surface of the substrate and is conductively connected to the conductive circuit via a conductive through hole penetrating the substrate.

10. The multicolor integrated light source according to any one of claims 1 to 4, characterized in that: The multi-color integrated light source further includes a thermally conductive pad, and the thermally conductive pad is disposed on the second surface of the substrate.

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