High-temperature film high-temperature strain sensor lead structure free of curdling and sintering

Abstract

The utility model discloses a curdling-sintering-free lead structure of a high-temperature film high-temperature strain sensor, and belongs to the technical field of electrical connection equipment. The curdling-sintering-free high-temperature film high-temperature strain sensor lead structure comprises a bottom plate, a cover plate and a connecting piece, and further comprises a contact used for pressing a platinum sheet on an electrode of a high-temperature strain sensor; the sliding chute is arranged along the width direction of the high-temperature strain sensor; the left clamping block abuts against the left side wall of the high-temperature strain sensor; the right clamping block abuts against the right side wall of the high-temperature strain sensor; and the driving structure is used for driving the left clamping block and the right clamping block to clamp the high-temperature strain sensor when the contact compresses the platinum sheet on the electrode of the high-temperature strain sensor. The curdling-sintering-free lead structure of the high-temperature film high-temperature strain sensor can limit the high-temperature strain sensor from shaking along the width direction of the high-temperature strain sensor, and ensures stable electric connection between the platinum sheet and the high-temperature strain sensor.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical connection equipment, in particular to a high-temperature film high-temperature strain sensor lead structure free of slurry sintering. Background Art

[0002] High temperature strain sensors work in high temperature environments, converting the strain changes of the measured object into changes in resistance. They are often used in high temperature, high pressure and strong erosion complex environments such as the aerospace industry. The operating temperature of ordinary commercial high temperature sheets is within 200°C, and the gate and lead are connected with solder.

[0003] For high-temperature strain sensors used above 500°C, conductive silver paste is often used to connect electrodes and wires, and the lead wires and electrodes are connected by heating and curing the silver paste. Conductive silver paste is composed of conductive particles, dispersants, stabilizers, and solvents. It has a certain viscosity and needs to be diluted, sprayed, or dotted for printing when used.

[0004] However, the connection strength of silver paste is related to the substrate it is attached to. The sintering and curing process of silver paste will produce bubbles. The external measurement environment of the high-temperature strain sensor will cause the lead to shake slightly in the paste hole, causing a sudden change in resistance, which will lead to unstable electrical connection between the platinum sheet and the electrode of the high-temperature strain sensor. In addition, different degrees of heating and curing are required after the paste is applied. After the measurement, the residual lumps after the silver paste is sintered adhere to the electrode surface and cannot be removed. There will be sintered protruding paste blocks at the electrode of the high-temperature strain sensor after the paste is applied, which cannot be used a second time. The paste application and lead wire application steps are cumbersome and complicated. The heating and curing process will cause oxidation of some sensitive gate materials, resulting in irreversible performance changes. Utility Model Content

[0005] The purpose of the utility model is to overcome the problems in the prior art and provide a high-temperature thin film high-temperature strain sensor lead structure without slurry sintering, which can ensure stable electrical connection between the platinum sheet and the high-temperature strain sensor and improve the stability of the high-temperature strain sensor when it is powered on.

[0006] The utility model provides a lead structure of a high-temperature thin film high-temperature strain sensor without slurry sintering, including a base plate, a cover plate and a connector, and also includes:

[0007] A contact, disposed at the bottom end of the cover plate, and used to press the platinum sheet onto the electrode on the high-temperature strain sensor;

[0008] A slide groove is provided at the upper end of the bottom plate, and the slide groove is provided along the width direction of the high temperature strain sensor;

[0009] A left clamping block is slidably connected in the slide groove, and the left clamping block abuts against a left side wall of the high temperature strain sensor;

[0010] A right clamping block is slidably connected in the slide groove, and the right clamping block abuts against the right side wall of the high temperature strain sensor;

[0011] The driving structure is connected to the left clamping block and the right clamping block, and is used to drive the left clamping block and the right clamping block to clamp the high-temperature strain sensor when the contact presses the platinum sheet onto the electrode on the high-temperature strain sensor.

[0012] Preferably, the driving structure includes a left wedge block and a right wedge block, both of which are connected to the bottom end of the cover plate, and both of the left clamping block and the right clamping block are provided with wedge surfaces, the left wedge block abuts against the wedge surface on the left clamping block, and the left wedge block is used to apply a thrust to the left clamping block toward the right clamping block, and the right wedge block abuts against the wedge surface on the right clamping block, and the right wedge block is used to apply a thrust to the right clamping block toward the left clamping block.

[0013] Preferably, a groove is provided on the bottom plate, an elastic sheet is provided in the groove, one end of the elastic sheet abuts against the left clamping block, and the other end of the elastic sheet abuts against the right clamping block, and the elastic sheet is used to apply an elastic force to move the left clamping block and the right clamping block away from each other.

[0014] Preferably, under the compression of the left wedge block and the right wedge block, the middle part of the elastic sheet can protrude from the groove and abut against the lower end surface of the high temperature strain sensor.

[0015] Preferably, an anti-slip groove is provided on the upper end surface of the middle portion of the elastic sheet along the length direction of the slide groove.

[0016] Preferably, the bottom ends of the left clamping block and the right clamping block are both provided with dovetail tenons, the slide groove is a dovetail groove, and the left clamping block and the right clamping block are slidably connected to the slide groove via the dovetail tenons thereon.

[0017] Preferably, the left clamping block is provided with a rubber layer on one end surface close to the right clamping block, and the right clamping block is provided with a rubber layer on one end surface close to the left clamping block, and both the left clamping block and the right clamping block abut against the side wall of the high temperature strain sensor through the rubber layers thereon.

[0018] Preferably, the connecting member includes a bolt and a nut sleeve, and threaded holes are provided on the cover plate and the bottom plate. The bolt passes through the threaded holes on the cover plate and the bottom plate and is connected to the nut sleeve.

[0019] Preferably, the left wedge block and the cover plate as well as the right wedge block and the cover plate are detachably connected.

[0020] Preferably, the left wedge block and the right wedge block are both provided with a wear-resistant coating.

[0021] Compared with the prior art, the utility model has the following beneficial effects: the utility model has a lead structure of a high-temperature thin film high-temperature strain sensor without point slurry sintering, which can apply a clamping force to the high-temperature strain sensor to limit the shaking of the high-temperature strain sensor along its width direction, ensure the stable electrical connection between the platinum sheet and the high-temperature strain sensor, and improve the stability of the high-temperature strain sensor when it is powered on. After the measurement is completed, there will be no problem of residual lumps on the electrodes of the high-temperature strain sensor, so that the high-temperature strain sensor can be reused many times.

[0022] By setting the left wedge block and the right wedge block, under the drive of the left wedge block or the right wedge block, a stable extrusion force can be applied to the left clamping block or the right clamping block, thereby improving the stability of the left clamping block and the right clamping block clamping the high temperature strain sensor, thereby further improving the stability of the high temperature strain sensor being powered on. By setting the elastic sheet, under normal conditions, under the action of the elastic force of the elastic sheet, the left clamping block and the right clamping block are away from each other, so that it is convenient for the user to clamp the high temperature strain sensor between the left clamping block and the right clamping block, thereby improving the convenience of the operation of the entire lead structure. Under the extrusion of the left wedge block and the right wedge block, the middle part of the elastic sheet can protrude the groove and abut against the lower end surface of the high temperature strain sensor, which can further improve the stability of the high temperature strain sensor clamping, thereby further improving the stability of the high temperature strain sensor being powered on. By setting the anti-skid groove, the anti-skid groove can prevent the high temperature strain gauge from moving along the width direction of the slide groove, that is, the width direction of the bottom plate and the cover plate, thereby further improving the stability of the high temperature strain sensor clamping and ensuring the stability of the high temperature strain sensor being powered on. By setting the dovetail tenon, the left clamping block and the right clamping block slide in the slide groove through the dovetail tenon connected thereto, which can prevent the left clamping block and the right clamping block from escaping from the slide groove, thereby ensuring the normal operation of the entire lead structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a structural schematic diagram of the first working state of the utility model;

[0024] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0025] Figure 3 This is a structural schematic diagram of the second working state of the utility model;

[0026] Figure 4 It is a structural schematic diagram of the AA surface of the utility model.

[0027] Description of reference numerals:

[0028] 1. High temperature strain sensor, 101. Base plate, 102. Cover plate, 103. Connector, 104. Contact, 105. Platinum sheet, 106. Electrode, 107. Slide groove, 108. Left clamping block, 109. Right clamping block, 110. Driving structure, 201. Left wedge block, 202. Right wedge block, 301. Groove, 302. Elastic sheet, 4. Anti-slip groove, 5. Dovetail tenon, 6. Rubber layer, 701. Bolt, 702. Nut sleeve. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-Figure 4 , the specific implementation of the utility model is described in detail, but it should be understood that the protection scope of the utility model is not limited by the specific implementation. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0030] like Figure 1-Figure 4 As shown, the utility model provides a lead structure of a high-temperature thin film high-temperature strain sensor without point sintering, including a base plate 101, a cover plate 102 and a connector 103, and also includes: a contact 104, a slide 107, a left clamping block 108, a right clamping block 109 and a driving structure 110, wherein the contact 104 is arranged at the bottom end of the cover plate 102, and the contact 104 is used to press the platinum sheet 105 onto the electrode 106 on the high-temperature strain sensor 1; the slide 107 is arranged at the upper end of the base plate 101, and the slide 107 is arranged along the width direction of the high-temperature strain sensor 1 The configuration is as follows: the left clamping block 108 is slidably connected in the slide groove 107, and the left clamping block 108 abuts against the left side wall of the high-temperature strain sensor 1; the right clamping block 109 is slidably connected in the slide groove 107, and the right clamping block 109 abuts against the right side wall of the high-temperature strain sensor 1; the driving structure 110 is connected to the left clamping block 108 and the right clamping block 109, and is used to drive the left clamping block 108 and the right clamping block 109 to clamp the high-temperature strain sensor 1 when the contact 104 presses the platinum sheet 105 onto the electrode 106 on the high-temperature strain sensor 1.

[0031] The working principle of the above embodiment is briefly described:

[0032] When the lead structure is in use, the contact area between the platinum sheet and the electrode of the high-temperature strain sensor is large. After being pressed and fixed with a ceramic clamp, that is, the cover plate and the bottom plate, the resistance drift is stable and the connection is reliable. The high-temperature strain sensor can be reused many times by mechanically clamping the cover plate and the bottom plate, which greatly reduces the cost without causing damage to the strain electrode, and realizes a stable electrical connection between the electrode on the high-temperature strain sensor and the platinum sheet connected to the lead. The electrode 106 end of the high-temperature strain sensor 1 is placed between the left clamping block 108 and the right clamping block 109 on the bottom plate 101, and then the platinum sheet 105 on the lead is pressed onto the electrode 106 of the high-temperature strain sensor 1. At this time, the cover plate 102 is covered on the high-temperature strain sensor 1, and the contact 104 on the cover plate 102 is pressed on the platinum sheet 105. Then, the cover plate 102 is connected to the base plate 101 by using the connector 103. The connector 103 applies a downward extrusion force to the cover plate 102, thereby driving the contact 104 to press the platinum sheet 105 onto the electrode 106 of the high-temperature strain sensor 1. During this process, the driving mechanism drives the left clamping mechanism to move along the slide slot 107 toward the right clamping block 109, and at the same time, drives the right clamping block 109 to move along the slide slot 107 toward the left clamping block 108, thereby driving the left clamping block 108 and the right clamping block 109 to approach each other, until the left clamping block 108 abuts against the left side wall of the high temperature strain sensor 1, and the right clamping block 109 abuts against the right side wall of the high temperature strain sensor 1, and the left clamping block 108 and the right clamping block 109 are used to apply clamping force to the high temperature strain sensor 1 to limit the shaking of the high temperature strain sensor 1 along its width direction, thereby ensuring that the platinum sheet 105 is stably electrically connected to the high temperature strain sensor 1. The high temperature strain sensor is pressed and fixed on the equal strength cantilever beam with high temperature glue, and the upper and lower alumina clamping plates are separated. The contact under the upper clamping plate corresponds to the electrode position of the strain sensor. The ceramic screw passes through the threaded holes on both sides of the upper and lower clamping plates, and the screws are rotated to tighten the upper and lower clamping plates to complete the connection between the platinum sheet and the strain sensor electrode. Clamps and screws form a fixed bracket around the strain sensor and the cantilever beam

[0033] The lead structure of the high-temperature thin film high-temperature strain sensor without slurry sintering of the utility model can apply a clamping force to the high-temperature strain sensor 1 to limit the shaking of the high-temperature strain sensor 1 along its width direction, ensure the stable electrical connection between the platinum sheet 105 and the high-temperature strain sensor 1, and improve the power-on stability of the high-temperature strain sensor 1. After the measurement is completed, there will be no problem of residual lumps on the electrodes of the high-temperature strain sensor 1, so that the high-temperature strain sensor 1 can be reused many times.

[0034] On the basis of the above embodiment, in order to improve the stability of the left clamping block 108 and the right clamping block 109 clamping the high temperature strain sensor 1, the stability of the power-on of the high temperature strain sensor 1 is further improved.

[0035] like Figure 1 , Figure 2 and Figure 4 As shown, the driving structure 110 includes a left wedge block 201 and a right wedge block 202, and the left wedge block 201 and the right wedge block 202 are both connected to the bottom end of the cover plate 102, and the left clamping block 108 and the right clamping block 109 are both provided with wedge surfaces, and the left wedge block 201 abuts against the wedge surface on the left clamping block 108, and the left wedge block 201 is used to apply a thrust to the left clamping block 108 toward the right clamping block 109, and the right wedge block 202 abuts against the wedge surface on the right clamping block 109, and the right wedge block 202 is used to apply a thrust to the right clamping block 109 toward the left clamping block 108.

[0036] When the connecting member 103 drives the cover plate 102 to move toward the bottom plate 101, the cover plate 102 drives the left wedge block 201 to move toward the left clamping block 108, and drives the right wedge block 202 to move toward the right clamping block 109, until the left wedge block 201 abuts against the wedge surface on the left clamping block 108, thereby applying a thrust to the left clamping block 108 toward the right clamping block 109, and the right wedge block 202 abuts against the wedge surface on the right clamping block 109, thereby applying a thrust to the right clamping block 109. A thrust is applied toward the left clamping block 108, thereby driving the left clamping block 108 and the right clamping block 109 closer to each other to clamp the high-temperature strain sensor 1 therebetween. Driven by the left wedge block 201 or the right wedge block 202, a stable extrusion force can be applied to the left clamping block 108 or the right clamping block 109, thereby improving the stability of the left clamping block 108 and the right clamping block 109 clamping the high-temperature strain sensor 1, thereby further improving the stability of the high-temperature strain sensor 1 when powered on.

[0037] As a preferred solution, Figure 2 and Figure 4 As shown, a groove 301 is provided on the bottom plate 101, and an elastic sheet 302 is provided in the groove. One end of the elastic sheet 302 abuts against the left clamping block 108, and the other end of the elastic sheet 302 abuts against the right clamping block 109. The elastic sheet 302 is used to apply an elastic force to move the left clamping block 108 and the right clamping block 109 away from each other. By providing the elastic sheet 302, under normal conditions, under the action of the elastic force of the elastic sheet 302, the left clamping block 108 and the right clamping block 109 move away from each other, so that it is convenient for the user to clamp the high temperature strain sensor 1 between the left clamping block 108 and the right clamping block 109, thereby improving the convenience of the operation of the entire lead structure.

[0038] As a preferred solution, Figure 1 , Figure 2 and Figure 4As shown, under the extrusion of the left wedge block 201 and the right wedge block 202, the middle part of the elastic sheet 302 can protrude from the groove 301 and abut against the lower end surface of the high temperature strain sensor 1. Under the extrusion of the left wedge block 201 and the right wedge block 202, the middle part of the elastic sheet 302 can protrude from the groove and abut against the lower end surface of the high temperature strain sensor 1, and then the elastic sheet 302 is used to apply an upward extrusion force to the lower end surface of the high temperature strain sensor 1, and the elastic sheet 302 has a certain elasticity, so it can further improve the stability of the clamping of the high temperature strain sensor 1, thereby further improving the stability of the high temperature strain sensor 1 when it is powered on.

[0039] As a preferred solution, Figure 2 and Figure 4 As shown, the upper end surface of the middle part of the elastic sheet 302 is provided with an anti-skid groove 4 along the length direction of the slide groove 107. By providing the anti-skid groove 4, when the middle part of the elastic sheet 302 protrudes from the groove and abuts against the lower end surface of the high-temperature strain sensor 1, the anti-skid groove 4 can prevent the high-temperature strain gauge from moving along the width direction of the slide groove 107, that is, the width direction of the bottom plate 101 and the cover plate 102, thereby further improving the clamping stability of the high-temperature strain sensor 1 and ensuring the stability of the high-temperature strain sensor 1 when it is powered on.

[0040] As a preferred solution, Figure 2 and Figure 4 As shown, the bottom ends of the left clamping block 108 and the right clamping block 109 are both provided with a dovetail tenon 5, the slide groove 107 is a dovetail groove, and the left clamping block 108 and the right clamping block 109 are both slidably connected to the slide groove 107 through the dovetail tenon 5 thereon. By providing the dovetail tenon 5, the left clamping block 108 and the right clamping block 109 slide in the slide groove 107 through the dovetail tenon 5 connected thereto, which can prevent the left clamping block 108 and the right clamping block 109 from falling out of the slide groove 107, thereby ensuring the normal operation of the entire lead structure.

[0041] As a preferred solution, Figure 1 , Figure 2 and Figure 4 As shown, the left clamping block 108 is provided with a rubber layer 6 on one end face close to the right clamping block 109, and the right clamping block 109 is provided with a rubber layer 6 on one end face close to the left clamping block 108. The left clamping block 108 and the right clamping block 109 are both in contact with the side wall of the high temperature strain sensor 1 through the rubber layer 6 thereon. By providing the rubber layer 6, a certain buffering effect can be played when the left clamping block 108 and the right clamping block 109 clamp the high temperature strain sensor 1, thereby preventing the left clamping block 108 and the right clamping block 109 from clamping the high temperature strain sensor 1.

[0042] As a preferred solution, Figure 1-Figure 4As shown, the connector 103 includes a bolt 701 and a nut sleeve 702. The cover plate 102 and the bottom plate 101 are both provided with threaded holes. The bolt 701 passes through the threaded holes on the cover plate 102 and the bottom plate 101 and is connected to the nut sleeve 702. The use of the bolt 701 and the nut sleeve 702 as the connector 103 can facilitate the disassembly and assembly of the cover plate 102 and the bottom plate 101, thereby facilitating the disassembly and assembly of the entire lead structure, thereby facilitating the use of the entire lead structure.

[0043] As a preferred solution, Figure 1 As shown, the left wedge block 201 and the cover plate 102, as well as the right wedge block 202 and the cover plate 102, are all detachably connected. By arranging the left wedge block 201 and the right wedge block 202 and the cover plate 102 to be detachably connected, the disassembly and installation of the left wedge block 201 and the right wedge block 202 can be facilitated, thereby facilitating the maintenance of the entire lead structure.

[0044] As a preferred solution, Figure 1 As shown, the left wedge block 201 and the right wedge block 202 are both provided with a wear-resistant coating. By providing the wear-resistant coating, the wear resistance of the left wedge block 201 and the right wedge block 202 can be improved, thereby improving the service life of the entire lead structure.

[0045] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-temperature thin film high-temperature strain sensor lead structure without slurry sintering, comprising a base plate (101), a cover plate (102) and a connector (103), characterized in that: Also includes: A contact (104) is arranged at the bottom end of the cover plate (102), and the contact (104) is used to press the platinum sheet (105) onto the electrode (106) on the high-temperature strain sensor (1); A slide groove (107) is arranged at the upper end of the bottom plate (101), and the slide groove (107) is arranged along the width direction of the high temperature strain sensor (1); A left clamping block (108) is slidably connected in the slide groove (107), and the left clamping block (108) abuts against the left side wall of the high temperature strain sensor (1); A right clamping block (109) is slidably connected in the slide groove (107), and the right clamping block (109) abuts against the right side wall of the high-temperature strain sensor (1); The driving structure (110) is connected to the left clamping block (108) and the right clamping block (109) and is used to drive the left clamping block (108) and the right clamping block (109) to clamp the high-temperature strain sensor (1) when the contact (104) presses the platinum sheet (105) onto the electrode (106) on the high-temperature strain sensor (1).

2. The lead structure of the high-temperature thin film high-temperature strain sensor without slurry sintering as claimed in claim 1, characterized in that: The driving structure (110) comprises a left wedge block (201) and a right wedge block (202), wherein the left wedge block (201) and the right wedge block (202) are both connected to the bottom end of the cover plate (102), and the left clamping block (108) and the right clamping block (109) are both provided with wedge surfaces, the left wedge block (201) abuts against the wedge surface on the left clamping block (108), and the left wedge block (201) is used to apply a thrust to the left clamping block (108) toward the right clamping block (109), and the right wedge block (202) abuts against the wedge surface on the right clamping block (109), and the right wedge block (202) is used to apply a thrust to the right clamping block (109) toward the left clamping block (108).

3. The lead structure of the high-temperature thin film high-temperature strain sensor without slurry sintering as claimed in claim 2, characterized in that: The bottom plate (101) is provided with a groove (301), and an elastic sheet (302) is provided in the groove. One end of the elastic sheet (302) abuts against the left clamping block (108), and the other end of the elastic sheet (302) abuts against the right clamping block (109). The elastic sheet (302) is used to apply an elastic force to the left clamping block (108) and the right clamping block (109) to move them away from each other.

4. The lead structure of the high-temperature thin film high-temperature strain sensor without slurry sintering as claimed in claim 3, characterized in that: Under the pressure of the left wedge-shaped block (201) and the right wedge-shaped block (202), the middle part of the elastic sheet (302) can protrude from the groove (301) and abut against the lower end surface of the high-temperature strain sensor (1).

5. The lead structure of the high-temperature thin film high-temperature strain sensor without slurry sintering as claimed in claim 4, characterized in that: The upper end surface of the middle portion of the elastic sheet (302) is provided with an anti-slip groove (4) along the length direction of the slide groove (107).

6. The lead structure of the high-temperature thin film high-temperature strain sensor without slurry sintering as claimed in claim 1, characterized in that: The bottom ends of the left clamping block (108) and the right clamping block (109) are both provided with dovetail tenons (5), and the slide groove (107) is a dovetail groove. The left clamping block (108) and the right clamping block (109) are both slidably connected to the slide groove (107) via the dovetail tenons (5) thereon.

7. The lead structure of the high-temperature thin film high-temperature strain sensor without slurry sintering as claimed in claim 1, characterized in that: The left clamping block (108) is provided with a rubber layer (6) on one end face close to the right clamping block (109), and the right clamping block (109) is provided with a rubber layer (6) on one end face close to the left clamping block (108). Both the left clamping block (108) and the right clamping block (109) are in contact with the side wall of the high-temperature strain sensor (1) via the rubber layer (6) thereon.

8. The lead structure of the high-temperature thin film high-temperature strain sensor without slurry sintering as claimed in claim 1, characterized in that: The connecting member (103) comprises a bolt (701) and a nut sleeve (702); threaded holes are provided on the cover plate (102) and the bottom plate (101); the bolt (701) passes through the threaded holes on the cover plate (102) and the bottom plate (101) and is connected to the nut sleeve (702).

9. The lead structure of the high-temperature thin film high-temperature strain sensor without slurry sintering as claimed in claim 2, characterized in that: The left wedge-shaped block (201) and the cover plate (102) as well as the right wedge-shaped block (202) and the cover plate (102) are both detachably connected.

10. The lead structure of the high-temperature thin film high-temperature strain sensor without slurry sintering as claimed in claim 2, characterized in that: The left wedge block (201) and the right wedge block (202) are both provided with a wear-resistant coating.

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