Miniature servo driver

Abstract

The micro servo driver comprises an interface board, a control board, a power board, a heat conduction board and an aluminum substrate which are sequentially stacked from top to bottom, the interface board, the control board, the power board and the aluminum substrate are detachably connected through spacing columns, the heat conduction board is fixedly arranged above the aluminum substrate, the heat conduction board is detachably and electrically connected with the power board, and the power board is fixedly connected with the power board. A plurality of connectors are detachably arranged above the power board, the interface board is provided with a plurality of first through holes, the control board is provided with a plurality of second through holes, and after each connector sequentially penetrates through each first through hole and each second through hole from bottom to top, at least one part of each connector extends to the position above the interface board. According to the utility model, the hardware circuit function is reasonably arranged on each board, the spacer columns and the connectors with different heights are synchronously replaced after the spacer columns are disassembled and hardware or circuits are added on the corresponding boards, and the power input and output points are led to the top of the driver through the connectors, so that the compact volume design is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of servo drivers, in particular to a micro servo driver. Background Art

[0002] Servo drives are essential equipment in the field of industrial automation. Their main function is to control the motor so that the motor's speed, torque and other parameters meet user needs.

[0003] The common servo drives on the market are generally implemented by PCB stacking assembly. This method makes the entire servo drive consist of multiple plates, and the plates are fixedly connected. However, this structure has the following problems: First, since the connection between the plates is fixed by screws, when the circuit or hardware needs to be adjusted, all the screws must be removed to replace the corresponding components; second, since the height between adjacent plates is fixed, it is not conducive to the user's addition or customization of functional modules; third, for servo drives that require compact structure, due to the limitations of installation space and application conditions, the servo drive must have a very high volume-to-power ratio, that is, high power and small volume. High power means that the heat generated by the drive is also large. If this heat is not dissipated promptly and effectively, it will cause the temperature of the servo drive to rise sharply, affecting performance. Utility Model Content

[0004] To this end, the utility model provides a micro servo driver to solve the above problems in the prior art.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] According to a first aspect of the utility model, a micro servo driver includes an interface board, a control board, a power board, a heat conducting board, an aluminum substrate, a spacer column and a connector;

[0007] The interface board, control board, power board, heat conducting plate and aluminum substrate are stacked in sequence from top to bottom, wherein the interface board, control board, power board and aluminum substrate are detachably connected via the spacer, the heat conducting plate is fixedly arranged above the aluminum substrate, the heat conducting plate and the power board are detachably electrically connected, and the heat generated by the power board when doing work is conducted to the aluminum substrate via the heat conducting plate;

[0008] A plurality of connectors are detachably provided above the power board, a plurality of first through holes are provided on the interface board, and a plurality of second through holes are provided on the control board. Each of the connectors passes through each of the first through holes and the second through holes in sequence from bottom to top, and at least a portion of the connector extends to the top of the interface board.

[0009] Furthermore, the aluminum substrate is provided with a threaded pillar; the spacer column includes a first spacer column, a second spacer column and a screw, the bolt portion of the first spacer column passes through the threaded hole of the power board and is threadedly connected to the threaded pillar, the bolt portion of the second spacer column passes through the threaded hole of the control board and is threadedly connected to the screw hole portion of the first spacer column, and the screw passes through the threaded hole of the interface board and is threadedly connected to the screw hole portion of the second spacer column.

[0010] Furthermore, the first spacer column, the second spacer column and the screw are coaxially arranged.

[0011] Furthermore, the first spacer column and the second spacer column are both bolt pillars.

[0012] Furthermore, a power chip is provided below the power board, the bottom surface of the power chip is coupled with the top surface of the heat conducting plate, and the power chip is connected to the aluminum substrate via the heat conducting plate.

[0013] Furthermore, the power chip is a gallium nitride chip.

[0014] Furthermore, the interface board is provided with at least one signal connector.

[0015] Furthermore, the heat conducting plate is thermally conductive silicone grease.

[0016] The utility model has the following advantages: the utility model reasonably arranges the hardware circuit functions on each board. If hardware or circuits with different functions need to be added to each board, the spacer columns can be disassembled, and the hardware or circuits can be added to the corresponding plates. According to the different heights of the added hardware on each board, the spacer columns and connectors of different heights can be replaced synchronously, so that the volume of the interface board, control board, power board and aluminum substrate after stacking and assembly is minimized as much as possible, and the power input and output points are led to the top of the driver to achieve a compact volume design, effectively reduce the external dimensions of the driver, and further reduce the manufacturing cost of the driver. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0018] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0019] Figure 1 A three-dimensional diagram of a micro servo driver provided in some embodiments of the utility model.

[0020] Figure 2 A front view of a micro servo driver provided in some embodiments of the utility model.

[0021] Figure 3 A top view of a micro servo driver provided in some embodiments of the utility model.

[0022] Figure 4 A schematic diagram of a heat conducting plate of a micro servo drive provided in some embodiments of the utility model.

[0023] Figure 5 An exploded diagram of a micro servo driver provided in some embodiments of the utility model.

[0024] In the figure:

[0025] 10. Interface board, 101. First through hole, 102. Signal connector;

[0026] 20. control board, 201. second through hole;

[0027] 30. power board, 301. power chip, 302. connector;

[0028] 40. Heat conducting plate;

[0029] 50, aluminum substrate, 501, threaded support;

[0030] 60. Spacer column, 601. First spacer column, 602. Second spacer column, 603. Screw. DETAILED DESCRIPTION

[0031] The following is a specific embodiment of the present invention. People familiar with the technology can easily understand the other advantages and functions of the present invention from the contents disclosed in this specification. Obviously, the described embodiment is a part of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] Example 1

[0033] like Figures 1 to 5 As shown, a micro servo driver in the embodiment of the first aspect of the utility model, the detachable servo driver of the present invention comprises a housing and a PCB board, the PCB board is placed inside the housing, the PCB board is stacked and assembled from top to bottom by an interface board 10, a control board 20, a power board 30, a heat conducting plate 40 and an aluminum substrate 50, wherein the interface board 10, the control board 20, the power board 30 and the aluminum substrate 50 are adjacently spaced in sequence and supported and detachably connected by a plurality of spacer columns 60, the heat conducting plate 40 is fixedly arranged above the aluminum substrate 50, the heat conducting plate 40 and the power board 30 are detachably electrically connected, the heat generated by the power board 30 doing work is conducted to the aluminum substrate 50 through the heat conducting plate 40, and the aluminum substrate 50 is used to dissipate heat better, so as to avoid the power board 30 affecting its performance due to high power. At the same time, a plurality of threaded pillars 501 are arranged on the aluminum substrate 50, and the threaded pillars 501 and the aluminum substrate 50 are an integrally formed structure.

[0034] At the same time, a plurality of columnar connectors 302 are detachably provided above the power board 30, and the connectors 302 are used for the input and output of the power board 30; a plurality of first through holes 101 are provided on the interface board 10, and a plurality of second through holes 201 are provided on the control board 20, and each connector 302 passes through each first through hole 101 and the second through hole 201 from bottom to top in sequence, and at least a portion of the connector 302 extends to the top of the interface board 10. The connector 302 on the power board 30 leads the power input and output points to the top of the driver by passing through the first through hole 101 and the second through hole 201, thereby effectively reducing the external dimensions of the driver, and the through holes do not require additional insulation treatment.

[0035] The spacer column 60 includes a first spacer column 601, a second spacer column 602 and a screw 603. The bolt portion of the first spacer column 601 passes through the threaded hole of the power board 30 and is threadedly connected to the threaded support 501. The bolt portion of the second spacer column 602 passes through the threaded hole of the control board 20 and is threadedly connected to the screw hole portion of the first spacer column 601. The screw 603 passes through the threaded hole of the interface board 10 and is threadedly connected to the screw hole portion of the second spacer column 602.

[0036] When in use, the hardware circuit functions are reasonably arranged on each board. If hardware or circuits with different functions need to be added to each board, the spacer columns can be removed. After adding the hardware or circuits to the corresponding plates, the spacer columns and connectors of different heights can be replaced synchronously according to the different heights of the added hardware on each board. The volume of the interface board, control board, power board and aluminum substrate after stacking and assembly is as small as possible, and the power input and output points are led to the top of the driver to achieve a compact volume design, which effectively reduces the external dimensions of the driver. At the same time, the functional modules are reasonably split and arranged on different circuit boards, which can facilitate customer function customization and further reduce the manufacturing cost of the driver.

[0037] Optionally, the number of the multiple spacer columns 60 is preferably 4, and one end of the four spacer columns is threadedly connected to the threaded pillar 501 on the aluminum substrate 50 after passing through the interface board 10, the control board 20 and the power board 30 in sequence from top to bottom. The specific number of the spacer columns 60 can be increased or decreased according to actual needs.

[0038] Optionally, the aluminum substrate 50 may be a copper substrate or other thermally conductive materials.

[0039] Optionally, the heat conducting plate 40 may be thermally conductive silicone grease, which further increases the thermal conductivity and thermal conductivity.

[0040] Optionally, the spacer column 60 is made of copper.

[0041] Optionally, the first spacer column 601, the second spacer column 602 and the screw 603 are coaxially arranged.

[0042] Optionally, a circuit board of other functional modules is added on the top of the interface board 10 , and the screw 603 can be replaced by the first spacer column 601 or the second spacer column 602 .

[0043] Optionally, the first spacer column 601 and the second spacer column 602 are both bolt pillars.

[0044] Example 2

[0045] like Figures 1 to 5 As shown, a micro servo driver includes all the contents of Example 2. In addition, a power chip 301 is provided below the power board 30, and the bottom surface of the power chip 301 is coupled with the top surface of the heat conducting plate 40 so that they have sufficient contact and strong heat conductivity. The heat conducting plate 40 is fixedly arranged above the aluminum substrate 50, and an aluminum substrate 50 is provided below the power chip 301 to facilitate heat dissipation of the driver.

[0046] Optionally, the power chip 301 is a gallium nitride chip. Compared with traditional MOSFET chips, gallium nitride chips have no reverse recovery of the body diode, thereby greatly reducing dead time and switching losses, thereby reducing the heat generation of the power board 30, improving power efficiency, and greatly improving power density.

[0047] Example 3

[0048] like Figures 1 to 5 As shown, a micro servo driver includes all the contents of Example 3. In addition, at least one signal connector 102 is provided on the interface board 10. The signal connector 102 is arranged on a side away from the control board 20. The signal connector 102 can be used to input and output control signals to the outside.

[0049] Although the utility model has been described in detail above with general descriptions and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements can be made to the utility model. Therefore, these modifications or improvements made without departing from the spirit of the utility model are within the scope of protection claimed by the utility model.

[0050] The terms such as "upper", "lower", "left", "right", "middle", etc. cited in this specification are only for the convenience of description and are not used to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships should be regarded as the scope of implementation of the present invention without substantially changing the technical content.

Claims

1. A micro servo driver, characterized in that: Including interface board, control board, power board, heat conducting board, aluminum substrate, spacer column and connector; The interface board, control board, power board, heat conducting plate and aluminum substrate are stacked in sequence from top to bottom, wherein the interface board, control board, power board and aluminum substrate are detachably connected via the spacer, the heat conducting plate is fixedly arranged above the aluminum substrate, the heat conducting plate and the power board are detachably electrically connected, and the heat generated by the power board when doing work is conducted to the aluminum substrate via the heat conducting plate; A plurality of connectors are detachably provided above the power board, a plurality of first through holes are provided on the interface board, and a plurality of second through holes are provided on the control board. Each of the connectors passes through each of the first through holes and the second through holes in sequence from bottom to top, and at least a portion of the connector extends to the top of the interface board.

2. A micro servo driver according to claim 1, characterized in that: The aluminum substrate is provided with a threaded pillar; the spacer column includes a first spacer column, a second spacer column and a screw, the bolt portion of the first spacer column passes through the threaded hole of the power board and is threadedly connected to the threaded pillar, the bolt portion of the second spacer column passes through the threaded hole of the control board and is threadedly connected to the screw hole portion of the first spacer column, and the screw passes through the threaded hole of the interface board and is threadedly connected to the screw hole portion of the second spacer column.

3. A micro servo driver according to claim 2, characterized in that: The first spacer column, the second spacer column and the screw are coaxially arranged.

4. A micro servo driver according to claim 2 or 3, characterized in that: The first spacer column and the second spacer column are both bolt pillars.

5. A micro servo driver according to claim 1, characterized in that: A power chip is arranged below the power board, the bottom surface of the power chip is coupled with the top surface of the heat conducting plate, and the power chip is connected with the aluminum substrate through the heat conducting plate.

6. A micro servo driver according to claim 5, characterized in that: The power chip is a gallium nitride chip.

7. A micro servo driver according to claim 1, characterized in that: The interface board is provided with at least one signal connector.

8. The micro servo driver according to claim 1, characterized in that: The heat conducting plate is thermally conductive silicone grease.

Images