Circuit board assembly and electronic equipment

Abstract

The embodiment of the utility model provides a circuit board assembly and electronic equipment. The electromagnetic shielding piece is arranged on the mainboard, the detection module is used as an independent module and can be arranged on the electromagnetic shielding piece, the mainboard, the electromagnetic shielding piece and the detection module are stacked and assembled to form a circuit board assembly, the circuit board assembly is assembled on the middle frame, and the bottom shell is installed on the middle frame. And the detection module and the mainboard are conductively connected to realize signal transmission. No safety gap is reserved between the electromagnetic shielding piece and the detection module, and no support with a certain thickness is arranged on the bottom shell. According to the electronic equipment, miniaturization can be achieved, the thickness of the whole electronic equipment is small, and the thickness of the whole electronic equipment can be reduced by 0.15 mm or above. In the production process or under the condition of falling and extrusion in a user use scene, the detection module, the electromagnetic shielding piece and the mainboard synchronously slightly deform, and the failure or damage caused by collision of the detection module is reduced. The electronic equipment is easy to assemble, and the assembling process is simple.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of circuit board assemblies, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] Electronic devices such as watches or bracelets usually include a middle frame, a bottom case, a main board, and a detection module. The detection module (e.g., photoplethysmography, PPG) is installed on the bottom case, and the main board is installed on the middle frame. With the development of electronic technology, users have higher and higher requirements on the appearance and performance of electronic devices. How to achieve the miniaturization of electronic devices is a problem that needs to be solved urgently. Utility Model Content

[0003] The embodiments of the present application provide a circuit board assembly and an electronic device, which realize the miniaturization of an electronic device having a detection module.

[0004] The embodiment of the present application adopts the following technical solution:

[0005] In a first aspect, an embodiment of the present application provides a circuit board assembly, comprising: a mainboard, an electromagnetic shielding component, and a detection module. The mainboard has a first surface and a second surface facing each other. The electromagnetic shielding component has a third surface and a fourth surface facing each other, the electromagnetic shielding component is arranged on the first surface of the mainboard, and the third surface of the electromagnetic shielding component and the first surface of the mainboard are arranged facing each other. The detection module comprises a substrate and a detection unit, the substrate has a fifth surface and a sixth surface facing each other, the fifth surface of the substrate is fixed to the fourth surface of the electromagnetic shielding component, the detection unit is installed on the sixth surface of the substrate, and the substrate and the mainboard are conductively connected.

[0006] In the circuit board assembly provided in the embodiment of the present application, the electromagnetic shielding component is arranged on the main board, the detection module can be arranged on the electromagnetic shielding component as an independent module, the detection module and the main board are conductively connected, and the main board, the electromagnetic shielding component and the detection module are stacked and assembled to form a circuit board assembly. When the circuit board assembly is applied to an electronic device as an integral component, it can be directly assembled on the middle frame of the electronic device, and no safety gap may be reserved between the electromagnetic shielding component and the detection module, and no bracket with a certain thickness may be provided on the bottom shell. The circuit board assembly of this embodiment can be miniaturized, with a small overall thickness, and can achieve a thinning of the entire machine by more than 0.15 mm. In the event of falling or squeezing during the production process or in the user's use scenario, the detection module, the electromagnetic shielding component and the main board are synchronously slightly deformed to reduce failure or damage caused by collision of the detection module.

[0007] In an optional implementation, the fifth surface of the substrate and the fourth surface of the electromagnetic shielding component can be connected by colloid bonding, welding, riveting, snap connection or fasteners (such as screws), which can conveniently achieve reliable connection between the substrate and the electromagnetic shielding component.

[0008] In an optional implementation, when the substrate and the electromagnetic shielding component are connected by colloid, the colloid can be double-sided tape. The double-sided tape is set on the substrate or the electromagnetic shielding component, and then the substrate and the electromagnetic shielding component are bonded together by the double-sided tape. The double-sided tape is a colloid layer set between the substrate and the electromagnetic shielding component.

[0009] In an optional implementation, when the substrate and the electromagnetic shielding component are connected by colloid, the colloid can be dispensing glue. Liquid glue is set on the substrate or the electromagnetic shielding component, and the substrate and the electromagnetic shielding component are pressed together. After the liquid glue is cured, the connection between the substrate and the electromagnetic shielding component can be achieved.

[0010] In an optional implementation, when the substrate and the electromagnetic shielding component are connected by snap-fit ​​connection, the substrate has a snap position, and the electromagnetic shielding component has a snap, and the snap is placed on the snap position to fix the substrate on the electromagnetic shielding component.

[0011] In an optional implementation, a first electronic component is provided on the first surface of the mainboard, and the electromagnetic shielding component covers the first electronic component. The electromagnetic shielding component includes a plate-like portion and a flange portion, the flange portion is connected to the edge of the plate-like portion, the flange portion is fixed to the first surface of the mainboard, the end surface of the plate-like portion facing the mainboard forms a third surface, and the end surface of the plate-like portion facing away from the mainboard forms a fourth surface. The plate-like portion is used to achieve electromagnetic shielding of the first electronic component and also serves as a supporting portion of the substrate in the detection module. The flange portion can be connected to the first surface of the mainboard to fix the electromagnetic shielding component on the mainboard.

[0012] In an optional implementation, the substrate may have a first flexible extension section, and the first flexible extension section is conductively connected to the main board. The main board, the electromagnetic shielding component and the detection module are assembled to form an overall structure of the circuit board assembly, and a first flexible extension section with a shorter length and a smaller area is configured between the main board and the substrate, which can realize the conductive connection between the main board and the detection module, and the cost is low.

[0013] In an optional implementation, the connection position between the first flexible extension section and the main board is located on the first surface of the main board and is arranged close to the edge of the electromagnetic shielding member. The conductive connection between the main board and the substrate is achieved through the first flexible extension section, which can make the length of the first flexible extension section shorter and the area smaller, effectively reducing the cost.

[0014] In an optional implementation, the substrate has one or more second flexible extension segments, and the second electronic components are respectively disposed on the one or more second flexible extension segments.

[0015] A second electronic component with a predetermined function can be installed on the second flexible extension segment, and the second electronic component can be adjusted to a predetermined position by adjusting the position and posture of the second flexible extension segment. The substrate can be configured with multiple second flexible extension segments as needed, and second electronic components with different functions can be configured to achieve different functional expansions.

[0016] In an optional implementation, the substrate includes a flexible circuit board and a reinforcement sheet, the flexible circuit board and the reinforcement sheet are stacked and connected, the first flexible extension section is formed on the flexible circuit board, the reinforcement sheet is not arranged on the first flexible extension section, the detection unit is arranged in the area of ​​the flexible circuit board corresponding to the reinforcement sheet, and the reinforcement sheet is fixed on the fourth surface of the electromagnetic shielding component.

[0017] The flexible circuit board is used as a carrier for installing the detection unit, the first flexible extension section is used as a flexible extension part for connecting the substrate and the main board, and the reinforcing sheet can increase the structural strength. The reinforcing sheet is fixed on the electromagnetic shielding component to achieve reliable fixing of the detection module on the electromagnetic shielding component.

[0018] In an optional implementation, the substrate includes a first rigid board and a first flexible board, the first rigid board and the first flexible board are conductively connected, the first flexible board serves as a first flexible extension segment, the detection unit is disposed on the first rigid board, and the first rigid board is fixed on the fourth surface of the electromagnetic shielding component.

[0019] The first rigid board is used as a carrier for mounting the detection unit, and the first flexible board is used as a flexible extension part for connecting the first rigid board and the main board. The first rigid board is fixed on the electromagnetic shielding component to realize reliable fixing of the detection module on the electromagnetic shielding component.

[0020] In an optional implementation, the substrate is a rigid-flexible board, which includes a first rigid part and a first flexible part, the first rigid part and the first flexible part are conductively connected, the first flexible part serves as a first flexible extension segment, the detection unit is provided on the first rigid part, and the first rigid part is fixed on the fourth surface of the electromagnetic shielding component.

[0021] The first rigid part and the first flexible part are an integrated structure, the first rigid part is used as a carrier for installing the detection unit, and the first flexible part is used as a flexible extension part for connecting the first rigid part and the mainboard. The first rigid part is fixed on the electromagnetic shielding component to realize reliable fixing of the detection module on the electromagnetic shielding component.

[0022] In an optional implementation, the substrate and the mainboard are electrically connected via a connector, the connector comprising a first connecting portion and a second connecting portion for plugging and matching, the first connecting portion being arranged on the substrate, and the second connecting portion being arranged on the mainboard. The substrate and the mainboard are connected by a connector, which is easy to assemble and realizes an electrically conductive connection between the two.

[0023] In an optional implementation, the connector may be a board-to-board connector, a zero insertion force connector, or other types of connectors.

[0024] In an optional implementation, when the substrate has a first flexible extension section, the first connecting portion can be provided on the first flexible extension section. After the substrate is fixed to the electromagnetic shielding component, the first connecting portion and the second connecting portion can be plugged into each other by adjusting the position of the first flexible extension section, so that the assembly is convenient and reliable.

[0025] In an optional implementation, when the substrate does not have a first flexible extension section, the first connecting portion can be provided on a side of the substrate facing the mainboard, and the second connecting portion can be provided on a side of the mainboard facing the substrate. By plugging the first connecting portion and the second connecting portion into each other, a conductive connection between the substrate and the mainboard can be achieved.

[0026] In an optional implementation, the substrate and the mainboard are electrically connected by welding, the substrate has a first pad, the mainboard has a second pad, and the first pad and the second pad are welded. The substrate and the mainboard are connected by pads, which is easy to assemble and realizes the conductive connection between the two.

[0027] In an optional implementation, the detection unit may include at least one of an optical plethysmography sensor, an electrocardiogram sensor, and a temperature sensor. In other words, the detection unit may be configured with one or more functions as required. Different detection units may monitor different physiological parameters of the user.

[0028] In an optional implementation, when the detection unit includes an optical plethysmography sensor, the optical plethysmography sensor includes one or more light emitting diodes and one or more photodiodes, the light emitting surface of the light emitting diode is arranged to face away from the mainboard, and the light receiving surface of the photodiode is arranged to face away from the mainboard.

[0029] In an optional implementation, a light shielding member is provided between the light emitting diode and the photodiode to prevent the light of the light emitting diode from directly irradiating the photodiode, so that the photodiode receives the light signal reflected by the human body, thereby improving the detection accuracy.

[0030] In an optional implementation, the shading member may be made of foam or other materials. The shading member may be set in a rectangular, circular or other shape and arranged around the light emitting diode. The area of ​​the shading member may be set as required. The shading member may be fixed on the substrate by bonding or other methods.

[0031] In an optional implementation, the inner wall of the bottom shell may have partition ribs. When the bottom shell is fixed to the middle frame, the partition ribs are pressed against the shading member to achieve a shading effect between the light-emitting diode and the photodiode.

[0032] In an optional implementation, two photodiodes, two photodiodes and a frame-shaped shading member are provided on the substrate, the photodiodes and the photodiodes are arranged alternately in a predetermined direction, and the shading member is arranged between two adjacent photodiodes and around one photodiode.

[0033] In an optional implementation, a first lens is provided in front of the light emitting surface of the light emitting diode, and a second lens is provided in front of the light receiving surface of the photodiode. The light emitting diode and the first lens are combined to enable the light generated by the light emitting diode to be better emitted. The photodiode and the second lens are combined to enable the external light to be better received by the photodiode.

[0034] In an optional implementation, a battery is fixed on the second surface of the mainboard, and the battery and the mainboard are conductively connected. The battery can be used to power the mainboard, the detection module and other devices. The volume and capacity of the battery can be increased, and the maximum working time of the whole machine can be increased. The battery can be set in the middle frame.

[0035] In a second aspect, an embodiment of the present application provides an electronic device, comprising the above-mentioned circuit board assembly, a bottom shell and a middle frame, the bottom shell and the middle frame are connected, the circuit board assembly comprises a main board, an electromagnetic shielding component and a detection module, the main board has a first surface and a second surface opposite to each other, the main board is arranged on the middle frame, the first surface of the main board and the bottom shell are arranged facing each other, the electromagnetic shielding component is arranged on the first surface of the main board, the detection module is arranged on the electromagnetic shielding component, the detection module and the main board are conductively connected, and the detection module is arranged close to the bottom shell.

[0036] In the electronic device provided in the embodiment of the present application, the electromagnetic shielding component is arranged on the mainboard, the detection module can be arranged on the electromagnetic shielding component as an independent module, the mainboard, the electromagnetic shielding component and the detection module are stacked and assembled to form a circuit board assembly, the circuit board assembly is assembled on the middle frame, and the bottom shell is installed on the middle frame. The detection module and the mainboard are conductively connected to realize signal transmission. No safety gap may be reserved between the electromagnetic shielding component and the detection module, and a bracket with a certain thickness may not be provided on the bottom shell. The electronic device of this embodiment can be miniaturized, the thickness of the whole machine is small, and the whole machine can be thinned by more than 0.15mm. In the case of falling or squeezing during the production process or user use scenarios, the detection module, the electromagnetic shielding component and the mainboard are synchronously slightly deformed to reduce the failure or damage caused by the collision of the detection module. The electronic device of this embodiment is easy to assemble, and the assembly process is simple. There is no need to use the hot melt column of the bottom shell to fix the detection module, and there is no need to stick a wheat pull sheet on the outer surface of the hot melt column.

[0037] In an optional implementation, the electronic device is a watch, bracelet or other wearable device, the bottom shell is mounted on the middle frame, and the middle frame can be connected to a watch strap or wristband for easy wearing and use by the user. When the user wears the wearable device, the detection module is arranged close to the bottom shell, and the detection module faces the user's skin, and the detection module can detect information such as the user's physiological indicators.

[0038] In an optional implementation, the mainboard and the middle frame may be connected by fasteners (such as screws), snaps, rivets, adhesives, and other different connection methods, and the mainboard and the middle frame may be assembled as a circuit board assembly on the middle frame.

[0039] In an optional implementation, the mainboard has multiple vias and the middle frame has multiple threaded holes. The vias of the mainboard and the threaded holes of the middle frame are aligned, and fasteners are passed through the vias and threadedly connected to the threaded holes, so that the circuit board assembly can be reliably fixed on the middle frame.

[0040] In an optional implementation, the mainboard has a latching position, and the middle frame has a buckle. By placing the buckle on the latching position, the circuit board assembly can be reliably fixed on the middle frame.

[0041] In an optional implementation, the middle frame and the bottom shell may be connected by means of colloid bonding, snap fastening, or the like to achieve reliable connection between the middle frame and the bottom shell.

[0042] In an optional implementation, a screen assembly is further included, the screen assembly is arranged on the middle frame, the screen assembly is conductively connected to the mainboard, and the second surface of the mainboard and the screen assembly are arranged facing each other. The screen assembly is used to output light to display images, text and other information. The screen assembly and the bottom shell can be respectively arranged at opposite ends of the middle frame, the screen assembly displays information to the user, and the detection module close to the bottom shell detects the user.

[0043] In an optional implementation, the screen assembly may have a touch layer, and the touch layer is conductively connected to the main board. The touch layer is used to detect touch operations acting on or near it. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A cross-sectional view of an electronic device of the related art;

[0045] Figure 2 for Figure 1 A local enlarged view of point A;

[0046] Figure 3 It is a schematic diagram of the assembly of the detection module and the bottom shell in the related art;

[0047] Figure 4 for Figure 3 A three-dimensional structural diagram of the detection module;

[0048] Figure 5 A cross-sectional view of another electronic device of the related art;

[0049] Figure 6 A three-dimensional exploded view of an electronic device provided in an embodiment of the present application;

[0050] Figure 7 for Figure 6 An assembly diagram of a partial structure in an electronic device;

[0051] Figure 8 for Figure 6 A three-dimensional assembly drawing of a circuit board assembly in an electronic device;

[0052] Fig. 9 for Figure 8 A front view of a circuit board assembly;

[0053] Fig.10 of Fig. 9 a side view of a circuit board assembly;

[0054] Fig.11 for Figure 8 A cross-sectional view of the circuit board assembly along line BB;

[0055] Fig.12 for Fig. 9 A schematic diagram of the structure of a detection module in a circuit board assembly;

[0056] Fig.13 A schematic diagram of the structure of a detection module in a circuit board assembly provided in another embodiment of the present application;

[0057] Fig.14 A schematic diagram of the structure of a detection module in a circuit board assembly provided in another embodiment of the present application;

[0058] Fig.15 A cross-sectional view of an electronic device provided in an embodiment of the present application;

[0059] Fig.16 for Fig.15 A partial enlarged view of point C.

[0060] Description of reference numerals:

[0061] 10-electronic device; 11-middle frame; 12-bottom shell; 13-mainboard; 13a-electronic component; 14-electromagnetic shielding member; 15-detection module; 15a-substrate; 15b-flexible printed circuit board; 16-battery; 17-gap; 18-hot melt column;

[0062] 20-electronic device; 21-middle frame; 22-bottom shell; 23-main board; 24-sub-board; 25-detection module; 25a-substrate; 25b-flexible printed circuit board; 26-battery; 27-bracket; 28-gap; 29-flexible circuit board;

[0063] 100-circuit board assembly;

[0064] 110 - main board; 110a - first surface; 110b - second surface; 111 - via hole; 112 - first electronic component;

[0065] 120-electromagnetic shielding member; 120a-third surface; 120b-fourth surface; 121-plate-shaped portion; 122-flanged portion; 123-edge;

[0066] 130-detection module; 131-substrate; 131a-fifth surface; 131b-sixth surface; 131c-flexible circuit board; 131d-reinforcement sheet; 131e-first rigid board; 131f-first flexible board; 131g-connector; 131h-first rigid part; 131i-first flexible part; 1311-first flexible extension; 1311a-connection position; 1312-second flexible extension; 132-detection unit; 1321-light emitting diode; 1322-photodiode; 1323-shading member; 1324-first lens; 1325-second lens; 133-predetermined device;

[0067] 140 - colloid; 150 - second electronic component; 160 - connector; 161 - first connecting portion; 162 - second connecting portion; 170 - battery;

[0068] 200- bottom shell; 201- partition rib; 300- middle frame; 301- fastener; 400- screen assembly; 1000- electronic device. DETAILED DESCRIPTION

[0069] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation mode. On the contrary, the purpose of combining the implementation mode as an application introduction is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0070] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0071] It should be understood that in the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0072] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0073] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0074] See also Figure 1 , Figure 2, an electronic device 10 in the related art, the electronic device 10 may include a middle frame 11, a bottom shell 12, a mainboard 13, an electromagnetic shielding component 14, a detection module 15 and a battery 16, the detection module 15 is mounted on the bottom shell 12, the mainboard 13 is mounted on the middle frame 11, the battery 16 is assembled on the top surface of the mainboard 13, the bottom surface of the mainboard 13 can be installed with electronic components 13a such as communication chips, and the electromagnetic shielding component 14 is arranged on the bottom surface of the mainboard 13 and covers the outside of the electronic components 13a. The bottom surface of the mainboard 13 and the bottom shell 12 are arranged facing each other, and the bottom shell 12 is mounted on the middle frame 11. A safety gap 17 greater than or equal to 0.15 mm (mm) needs to be reserved between the electromagnetic shielding component 14 and the substrate 15a in the detection module 15 to reduce the instantaneous micro-deformation of the detection module 15 caused by falling or squeezing during the production process or user use scenarios, and the failure or damage caused by the collision of the detection module 15. The above-mentioned safety gap 17 will increase the thickness of the entire electronic device 10 ( Figure 1 , Figure 2 Dimensions in the left and right directions).

[0075] Combination Figure 3 When the detection module 15 is installed on the bottom shell 12, the substrate 15a of the detection module 15 needs to be passed through the hot melt column 18 of the bottom shell 12, and the substrate 15a is fixed to the bottom shell 12 by hot riveting, so that the detection module 15 is fixed to the bottom shell 12. A wheat pull sheet can be attached to the outer surface of the hot melt column 18 to overcome the problem of wire drawing and roughness on the outer surface of the hot melt column 18. These will make the manufacturing process complicated.

[0076] Combination Figure 3 , Figure 4 , the detection module 15 is mounted on the bottom shell 12, and the substrate 15a has a redundant flexible printed circuit (FPC) 15b. Before the bottom shell 12 is mounted on the middle frame 11, the FPC 15b of the detection module 15 needs to be connected to the main board 13 through a connector to achieve the conductive connection between the main board 13 and the detection module 15. The FPC 15b of the detection module 15 should be designed in combination with the gap between the electromagnetic shielding member 14 and the bottom shell 12 and a certain path, so that the length and area of ​​the FPC 15b are longer and the cost is higher.

[0077] See also Figure 5 Another electronic device 20 in the related art may include a middle frame 21, a bottom shell 22, a main board 23, a sub-board 24, a detection module 25, a battery 26 and a bracket 27. The detection module 25 is mounted on the bottom shell 22. The thickness of the bracket 27 is about 0.6 mm. The bracket 27 is mounted on the bottom shell 22 and is located above the detection module 25 ( Figure 5The battery 26 is mounted on the bracket 27, and the main board 23 and the sub-board 24 are mounted on the side of the battery 26, that is, beside the battery 26 in a direction perpendicular to the thickness direction ( Figure 5 The thickness direction of the battery in the figure is the left-right direction). A safety gap 28 of 0.15 mm or more needs to be reserved between the bracket 27 and the substrate 25a in the detection module 25 to reduce the instantaneous micro-deformation of the detection module 25 caused by falling or squeezing during the production process or user use scenario, and the failure or damage caused by the collision of the detection module 25. The above-mentioned safety gap 28 and the thickness of the bracket 27 will increase the thickness of the electronic device 20 ( Figure 5 Dimensions in the left and right directions).

[0078] The main board 23 and the auxiliary board 24 are arranged on the side of the battery 26, which makes the volume and capacity of the battery 26 small, affecting the maximum working time of the whole machine. The main board 23 and the auxiliary board 24 need to be connected through a flexible circuit board 29, which makes the manufacturing process complicated.

[0079] The detection module 25 is mounted on the bottom shell 22, and the substrate 25a has a redundant flexible printed circuit board 25b. Before the bottom shell 22 is mounted on the middle frame 21, the FPC 25b of the detection module 25 needs to be connected to the mainboard 23 through a connector to achieve the conductive connection between the mainboard 23 and the detection module 25. The FPC 25b of the detection module 25 should be designed in combination with the gaps and a certain path of multiple devices. The FPC 25b should extend along the bottom, side and top of the battery 26, so that the length of the FPC 25b is longer, the area is larger, and the cost is higher.

[0080] See also Figures 6 to 8 An embodiment of the present application provides an electronic device 1000, including a circuit board assembly 100, a bottom shell 200 and a middle frame 300, the bottom shell 200 and the middle frame 300 are connected, the circuit board assembly 100 includes a mainboard 110, an electromagnetic shielding component 120 and a detection module 130, the mainboard 110 has a first surface 110a and a second surface 110b opposite to each other, the mainboard 110 is arranged on the middle frame 300, the first surface 110a of the mainboard 110 and the bottom shell 200 are arranged facing each other, the electromagnetic shielding component 120 is arranged on the first surface 110a of the mainboard 110, the detection module 130 is arranged on the electromagnetic shielding component 120, the detection module 130 and the mainboard 110 are conductively connected, and the detection module 130 is arranged close to the bottom shell 200.

[0081] The electronic device 1000 may be any device having a detection module 130, such as a watch, a bracelet or other wearable device. The bottom shell 200 may be disposed on one side of the middle frame 300, and the bottom shell 200 and the middle frame 300 both serve as the housing portion of the electronic device 1000. The middle frame 300 may include structures such as a circuit board assembly 100 and a battery 170.

[0082] The mainboard 110 may be provided with electronic components such as a processor and a communication chip. The electromagnetic shielding member 120 may cover some of the electronic components on the mainboard 110 to achieve electromagnetic shielding between these electronic components. The electromagnetic shielding member 120 may support the detection module 130. The detection module 130 and the mainboard 110 are conductively connected to achieve signal transmission.

[0083] For example, the electronic device 1000 is a watch, a bracelet or other wearable device, and the bottom shell 200 is mounted on the middle frame 300, and the middle frame 300 can be connected to a watch strap or a wristband for easy wearing and use by the user. When the user wears the wearable device, the detection module 130 is arranged close to the bottom shell 200, and the detection module 130 faces the user's skin, and the detection module 130 can detect information such as the user's physiological indicators.

[0084] In the electronic device 1000 provided in the embodiment of the present application, the electromagnetic shielding member 120 is arranged on the mainboard 110, the detection module 130 can be arranged on the electromagnetic shielding member 120 as an independent module, the mainboard 110, the electromagnetic shielding member 120 and the detection module 130 are stacked and assembled to form a circuit board assembly 100, the circuit board assembly 100 is assembled on the middle frame 300, and the bottom shell 200 is installed on the middle frame 300. The detection module 130 and the mainboard 110 are conductively connected to realize signal transmission. There may be no safety gap reserved between the electromagnetic shielding member 120 and the detection module 130, and a bracket with a certain thickness may not be provided on the bottom shell 200. The electronic device 1000 of this embodiment can be miniaturized, the thickness of the whole machine is small, and the whole machine can be thinned by more than 0.15mm. In the case of falling or squeezing during the production process or the user's use scenario, the detection module 130, the electromagnetic shielding member 120 and the mainboard 110 are synchronously slightly deformed to reduce the failure or damage caused by the collision of the detection module 130. The electronic device 1000 of this embodiment is easy to assemble, and the assembly process is simple. There is no need to use the hot melt column of the bottom shell to fix the detection module, and there is no need to stick a mylar sheet on the outer surface of the hot melt column.

[0085] When assembling the main board 110 of the circuit board assembly 100 to the middle frame 300, refer to Figures 6 to 8 Different connection methods such as fasteners 301 (such as screws), snaps, riveting, bonding, etc. can be used between the mainboard 110 and the middle frame 300 to assemble the circuit board assembly 100 as a whole on the middle frame 300.

[0086] For example, see Figure 7 , Figure 8 The mainboard 110 has a plurality of through holes 111, and the middle frame 300 has a plurality of threaded holes (not shown). The through holes 111 of the mainboard 110 and the threaded holes of the middle frame 300 are aligned, and the fasteners 301 are passed through the through holes 111 and threadedly connected to the threaded holes, so that the circuit board assembly 100 can be reliably fixed on the middle frame 300.

[0087] Exemplarily, the mainboard 110 has a latching position (not shown), and the middle frame 300 has a buckle (not shown). By placing the buckle on the latching position, the circuit board assembly 100 can be reliably fixed on the middle frame 300 .

[0088] When assembling the middle frame 300 and the bottom case 200, refer to Figure 5 The middle frame 300 and the bottom shell 200 may be connected by means of colloid bonding, snap fastening, etc., to achieve reliable connection between the middle frame 300 and the bottom shell 200.

[0089] In order to enable the electronic device 1000 to have a display function, in some embodiments, refer to Figure 6 , further comprising a screen assembly 400, the screen assembly 400 is disposed on the middle frame 300, the screen assembly 400 and the mainboard 110 are conductively connected, and the second surface 110b of the mainboard 110 and the screen assembly 400 are disposed facing each other.

[0090] The conductive connection between the screen assembly 400 and the mainboard 110 realizes signal transmission. The screen assembly 400 is used to output light to display images, text and other information, such as the user's physiological indicators detected by the detection module 130. The screen assembly 400 and the bottom shell 200 can be respectively arranged at opposite ends of the middle frame 300, and the screen assembly 400 displays information to the user, and the detection module 130 close to the bottom shell 200 detects the user.

[0091] Among them, the screen component 400 can be an organic light emitting diode (OLED) screen, an active-matrix organic light emitting diode or an active-matrix organic light emitting diode (AMOLED) screen, a mini light emitting diode (Mini LED) screen, a micro light emitting diode (Micro LED) screen, a micro organic light emitting diode (Micro OLED) screen, a quantum dot light emitting diode (QLED) screen, etc.

[0092] In order to enable the electronic device 1000 to have a touch function, in some embodiments, the screen assembly 400 may have a touch layer (not shown), and the touch layer and the main board 110 are conductively connected. The touch layer is used to detect touch operations acting on or near it. The touch layer can pass the detected touch operation to the processor to determine the type of touch event. Visual output related to the touch operation is provided through the screen assembly 400. The touch layer can be a conventional capacitive touch sensor or other types of touch sensors.

[0093] See also Figures 8 to 11 The embodiment of the present application provides a circuit board assembly 100, comprising: a mainboard 110, an electromagnetic shielding component 120 and a detection module 130. The mainboard 110 has a first surface 110a and a second surface 110b opposite to each other. The electromagnetic shielding component 120 has a third surface 120a and a fourth surface 120b opposite to each other. The electromagnetic shielding component 120 is arranged on the first surface 110a of the mainboard 110, and the third surface 120a of the electromagnetic shielding component 120 and the first surface 110a of the mainboard 110 are arranged facing each other. The detection module 130 includes a substrate 131 and a detection unit 132. The substrate 131 has a fifth surface 131a and a sixth surface 131b opposite to each other. The fifth surface 131a of the substrate 131 is fixed to the fourth surface 120b of the electromagnetic shielding component 120, and the detection unit 132 is installed on the sixth surface 131b of the substrate 131. The substrate 131 and the mainboard 110 are electrically connected.

[0094] Electronic components may be disposed on both the first surface 110a and the second surface 110b of the mainboard 110. The substrate 131 in the detection module 130 may be used as a carrier of the detection unit 132 or other predetermined devices 133. The detection unit 132 is a hardware structure and may have different forms of expression.

[0095] Exemplarily, when the detection module 130 is an optical plethysmography module, the detection unit 132 may include a light emitting diode 1321 and a photodiode 1322. Alternatively, when the detection module 130 is an electrocardiogram module, the detection unit 132 is an electrocardiogram sensor. Alternatively, when the detection module 130 is a temperature detection module, the detection unit 132 is a temperature sensor.

[0096] The fifth surface 131a of the substrate 131 is fixed to the fourth surface 120b of the electromagnetic shielding element 120, which means that the fifth surface 131a of the substrate 131 and the fourth surface 120b of the electromagnetic shielding element 120 are mechanically connected face to face without a gap therebetween.

[0097] In the circuit board assembly 100 provided in the embodiment of the present application, the electromagnetic shielding member 120 is arranged on the mainboard 110, the detection module 130 can be arranged on the electromagnetic shielding member 120 as an independent module, the detection module 130 and the mainboard 110 are conductively connected, and the mainboard 110, the electromagnetic shielding member 120 and the detection module 130 are stacked and assembled to form the circuit board assembly 100. When the circuit board assembly 100 is applied to the electronic device 1000 as an integral component, it can be directly assembled on the middle frame 300 of the electronic device 1000, and no safety gap may be reserved between the electromagnetic shielding member 120 and the detection module 130, and a bracket with a certain thickness may not be provided on the bottom shell 200. The circuit board assembly 100 of this embodiment can be miniaturized, with a small overall thickness, and can achieve a thinning of the whole machine by more than 0.15 mm. In the case of falling or squeezing during the production process or the user's use scenario, the detection module 130, the electromagnetic shielding member 120 and the mainboard 110 are synchronously slightly deformed to reduce the failure or damage caused by the collision of the detection module 130.

[0098] When realizing the connection between the substrate 131 and the electromagnetic shielding member 120, refer to Fig.10 , Fig.11 The fifth surface 131a of the substrate 131 and the fourth surface 120b of the electromagnetic shielding element 120 can be connected by bonding, welding, riveting, snap connection or fasteners (such as screws) with colloid 140. The above mechanical connection method can easily achieve reliable connection between the substrate 131 and the electromagnetic shielding element 120.

[0099] Exemplarily, when the substrate 131 and the electromagnetic shielding component 120 are connected by the colloid 140, the colloid 140 may be a double-sided tape, which is set on the substrate 131 or the electromagnetic shielding component 120, and then the substrate 131 and the electromagnetic shielding component 120 are bonded to each other by the double-sided tape. The double-sided tape is a colloid layer set between the substrate 131 and the electromagnetic shielding component 120.

[0100] Exemplarily, when the substrate 131 and the electromagnetic shielding component 120 are connected by the colloid 140, the colloid 140 can be dispensing glue. Liquid glue is set on the substrate 131 or the electromagnetic shielding component 120. After the substrate 131 and the electromagnetic shielding component 120 are pressed together and the liquid glue is cured, the connection between the substrate 131 and the electromagnetic shielding component 120 can be achieved.

[0101] Exemplarily, when the substrate 131 and the electromagnetic shielding component 120 are connected by snap-fit ​​connection, the substrate 131 has a snap position, and the electromagnetic shielding component 120 has a snap, and the snap is fastened to the snap position to fix the substrate 131 on the electromagnetic shielding component 120.

[0102] When setting the electromagnetic shielding member 120, refer to Fig.11, a first electronic component 112 is disposed on the first surface 110a of the mainboard 110, and an electromagnetic shielding member 120 covers the first electronic component 112. The electromagnetic shielding member 120 includes a plate-like portion 121 and a flange portion 122, the flange portion 122 is connected to the edge of the plate-like portion 121, the flange portion 122 is fixed to the first surface 110a of the mainboard 110, the end surface of the plate-like portion 121 facing the mainboard 110 forms a third surface 120a, and the end surface of the plate-like portion 121 facing away from the mainboard 110 forms a fourth surface 120b.

[0103] The electromagnetic shielding component 120 can cover the first electronic component 112 on the mainboard 110 to achieve electromagnetic shielding of the first electronic component 112. The electromagnetic shielding component 120 can be made of metals such as iron and steel, and has a good electromagnetic shielding effect. The first electronic component 112 can be a communication chip, a processor, a memory or other device. The plate-like portion 121 and the flange portion 122 on the electromagnetic shielding component 120 can adopt an integrally formed structure, such as stamping. The plate-like portion 121 is used to achieve electromagnetic shielding of the first electronic component 112, and also serves as a supporting portion for the substrate 131 in the detection module 130. The flange portion 122 can be connected to the first surface 110a of the mainboard 110 to fix the electromagnetic shielding component 120 on the mainboard 110.

[0104] When realizing the conductive connection between the substrate 131 and the main board 110, in some embodiments, refer to Figure 8 , Fig. 9 , Fig.12 The substrate 131 may have a first flexible extension section 1311 , and the first flexible extension section 1311 and the main board 110 are conductively connected.

[0105] A first flexible extension section 1311 is disposed on the substrate 131. The first flexible extension section 1311 can be understood as a bendable flexible circuit board. The position and posture of the first flexible extension section 1311 can be conveniently adjusted to achieve conductive connection between the substrate 131 and the mainboard 110 to realize signal transmission. Figure 3 , Figure 4 The technical solution shown arranges the main board in the middle frame and the detection module in the bottom shell, and configures redundant FPCs to achieve conductive connection between the main board and the detection module. The main board 110, the electromagnetic shielding component 120 and the detection module 130 in this embodiment are assembled to form the overall structure of the circuit board assembly 100. A first flexible extension section 1311 with a shorter length and smaller area is arranged between the main board 110 and the substrate 131, so that the conductive connection between the main board 110 and the detection module 130 can be achieved at a lower cost.

[0106] When setting the connection position 1311a between the first flexible extension section 1311 and the main board 110, refer to Figure 8 , Fig. 9The connection position 1311a between the first flexible extension section 1311 and the main board 110 is located on the first surface 110a of the main board 110 and is arranged close to the edge 123 of the electromagnetic shielding member 120. In this way, the main board 110 and the substrate 131 are electrically connected through the first flexible extension section 1311, and the length of the first flexible extension section 1311 can be made shorter and the area smaller, which effectively reduces the cost.

[0107] For example, a first flexible extension section 1311 with a smaller area may be provided between the mainboard 110 and the detection module 130 of this embodiment to achieve a conductive connection between the mainboard 110 and the detection module 130. Figure 3 , Figure 4 In the technical solution shown, the mainboard is arranged in the middle frame and the detection module is arranged in the bottom shell, and the mainboard and the detection module are conductively connected through a redundant FPC. In this embodiment, the area of ​​the first flexible extension section 1311 is reduced by more than 50%.

[0108] In order to enable the circuit board assembly 100 to have certain functional expansion, in some embodiments, refer to Figure 8 , Fig. 9 , Fig.12 The substrate 131 has one or more second flexible extension sections 1312 , and a second electronic component 150 is respectively disposed on the one or more second flexible extension sections 1312 .

[0109] A second flexible extension section 1312 is configured on the substrate 131, and the second flexible extension section 1312 can be understood as a bendable flexible circuit board. A second electronic component 150 with a predetermined function can be installed on the second flexible extension section 1312, and the second electronic component 150 can be adjusted to a predetermined position by adjusting the position and posture of the second flexible extension section 1312. The second electronic component 150 is conductively connected through the second flexible extension section 1312, the first flexible extension section 1311 and the mainboard 110 to realize the drive control of the second electronic component 150. The second electronic component 150 can be a speaker, a vibration motor, etc. The substrate 131 can be configured with multiple second flexible extension sections 1312 as needed, and second electronic components 150 with different functions can be configured to achieve different functional expansions. The second electronic component 150 and the second flexible extension section 1312 can be welded by pads.

[0110] There are multiple optional implementations when manufacturing the substrate 131 , and three implementations are given as examples below.

[0111] The first implementation method of the substrate 131 is: Fig.11 , Fig.12The substrate 131 includes a flexible circuit board 131c and a reinforcing sheet 131d, the flexible circuit board 131c and the reinforcing sheet 131d are stacked and connected, the first flexible extension section 1311 is formed on the flexible circuit board 131c, the reinforcing sheet 131d is not arranged on the first flexible extension section 1311, the detection unit 132 is arranged in the area of ​​the flexible circuit board 131c corresponding to the reinforcing sheet 131d, and the reinforcing sheet 131d is fixed on the fourth surface 120b of the electromagnetic shielding component 120.

[0112] The reinforcing sheet 131d is not disposed on the first flexible extension section 1311, so that the first flexible extension section 1311 can be bent, which facilitates adjustment of the position and posture of the first flexible extension section 1311, and realizes conductive connection between the first flexible extension section 1311 and the main board 110. The area of ​​the flexible circuit board 131c corresponding to the reinforcing sheet 131d refers to the area on the flexible circuit board 131c connected to the reinforcing sheet 131d.

[0113] The substrate 131 is in the form of a flexible circuit board 131c and a reinforcing sheet 131d. The flexible circuit board 131c is used as a carrier for installing the detection unit 132. The first flexible extension section 1311 is used as a flexible extension part for connecting the substrate 131 and the main board 110. The reinforcing sheet 131d can increase the structural strength. The reinforcing sheet 131d is fixed on the electromagnetic shielding component 120 to achieve reliable fixing of the detection module 130 on the electromagnetic shielding component 120. The reinforcing sheet 131d can be a sheet made of iron or other metals. The reinforcing sheet 131d and the flexible circuit board 131c can be connected by means of colloid bonding or the like. The surface of the reinforcing sheet 131d away from the flexible circuit board 131c is used as the fifth surface 131a fixedly connected to the electromagnetic shielding component 120. The surface of the flexible circuit board 131c away from the reinforcing sheet 131d is used as the sixth surface 131b for installing the detection unit 132.

[0114] When the substrate 131 has a second flexible extension section 1312, the reinforcing sheet 131d is not provided on the second flexible extension section 1312, so that the second flexible extension section 1312 can be bent, which facilitates adjusting the position and posture of the second flexible extension section 1312 and adjusting the second electronic component 150 on the second flexible extension section 1312 to a predetermined position.

[0115] The second implementation method of the substrate 131 is: Fig.13 The substrate 131 includes a first rigid board 131e and a first flexible board 131f. The first rigid board 131e and the first flexible board 131f are conductively connected. The first flexible board 131f serves as a first flexible extension section 1311. The detection unit 132 is disposed on the first rigid board 131e. The first rigid board 131e is fixed on the fourth surface 120b of the electromagnetic shielding component 120.

[0116] The substrate 131 is in the form of a first rigid board 131e and a first flexible board 131f. The first rigid board 131e serves as a carrier for installing the detection unit 132, and the first flexible board 131f serves as a flexible extension portion for connecting the first rigid board 131e and the main board 110. The first rigid board 131e and the first flexible board 131f can be conductively connected by means of a connector 131g, pad welding, etc. The first rigid board 131e is fixed on the electromagnetic shielding component 120 to achieve reliable fixing of the detection module 130 on the electromagnetic shielding component 120. The surface of the first rigid board 131e facing the electromagnetic shielding component 120 serves as the fifth surface 131a fixedly connected to the electromagnetic shielding component 120. The surface of the first rigid board 131e facing away from the electromagnetic shielding component 120 serves as the sixth surface 131b for installing the detection unit 132.

[0117] The third implementation method of the substrate 131 is: Fig.14 The substrate 131 is a rigid-flexible board, which includes a first rigid part 131h and a first flexible part 131i. The first rigid part 131h and the first flexible part 131i are conductively connected. The first flexible part 131i serves as a first flexible extension section 1311. The detection unit 132 is arranged on the first rigid part 131h, and the first rigid part 131h is fixed on the fourth surface 120b of the electromagnetic shielding component 120.

[0118] The substrate 131 is in the form of a rigid-flexible board, the first rigid part 131h and the first flexible part 131i are an integrated structure, the first rigid part 131h is used as a carrier for installing the detection unit 132, and the first flexible part 131i is used as a flexible extension part for connecting the first rigid part 131h and the main board 110. The first rigid part 131h is fixed on the electromagnetic shielding component 120 to achieve reliable fixing of the detection module 130 on the electromagnetic shielding component 120. The surface of the first rigid part 131h facing the electromagnetic shielding component 120 is used as the fifth surface 131a fixedly connected to the electromagnetic shielding component 120. The surface of the first rigid part 131h away from the electromagnetic shielding component 120 is used as the sixth surface 131b for installing the detection unit 132.

[0119] There are multiple optional implementations for the conductive connection between the substrate 131 and the main board 110 , and two implementations are given as examples below.

[0120] The first method for realizing the conductive connection between the substrate 131 and the main board 110: Figure 8 , Fig.11 The substrate 131 and the main board 110 are conductively connected via a connector 160 . The connector 160 includes a first connecting portion 161 and a second connecting portion 162 that are plug-fitted. The first connecting portion 161 is disposed on the substrate 131 , and the second connecting portion 162 is disposed on the main board 110 .

[0121] The substrate 131 and the main board 110 are connected by a connector 160, which is easy to assemble and realizes a conductive connection between the two. During assembly, the substrate 131 of the detection module 130 can be fixed on the electromagnetic shielding member 120, and the first connecting portion 161 can be plugged into the second connecting portion 162, so that the conductive connection between the substrate 131 and the main board 110 can be realized through the first connecting portion 161 and the second connecting portion 162.

[0122] The connector 160 may be a board-to-board (BTB) connector, a zero insertion force (ZIF) connector, or other types of connectors. The ZIF connector does not require additional insertion force during connection, and a stable connection can be achieved through a snap-fit ​​mechanism.

[0123] In the case where the substrate 131 has a first flexible extension 1311, see Fig.11 The first connection portion 161 can be disposed on the first flexible extension section 1311. After the substrate 131 is fixed to the electromagnetic shielding component 120, the first connection portion 161 and the second connection portion 162 can be plugged and matched by adjusting the position of the first flexible extension section 1311, so that the assembly is convenient and reliable.

[0124] In the case where the substrate 131 does not have the first flexible extension section 1311, the first connection portion 161 can be provided on the side of the substrate 131 facing the mainboard 110, and the second connection portion 162 can be provided on the side of the mainboard 110 facing the substrate 131. By plugging the first connection portion 161 and the second connection portion 162 into each other, a conductive connection between the substrate 131 and the mainboard 110 can be achieved.

[0125] The second method for realizing the conductive connection between the substrate 131 and the main board 110: the substrate 131 and the main board 110 are conductively connected by welding, the substrate 131 has a first soldering pad (not shown), the main board 110 has a second soldering pad (not shown), and the first soldering pad and the second soldering pad are welded.

[0126] The substrate 131 and the main board 110 are connected by a pad, which is easy to assemble and realizes a conductive connection between the two. During assembly, the substrate 131 of the detection module 130 can be fixed on the electromagnetic shielding member 120, and the first pad and the second pad are welded, so that the conductive connection between the substrate 131 and the main board 110 can be realized through the first pad and the second pad.

[0127] When setting the detection unit 132, the detection unit 132 may include at least one of an optical plethysmography sensor, an electrocardiogram sensor, and a temperature sensor. In other words, the detection unit 132 with one or more functions may be configured as needed. Different detection units 132 may monitor different physiological parameters of the user.

[0128] The optical plethysmography (PPG) sensor uses a photoelectric sensor to detect the intensity of reflected light after absorption by human blood and tissues, records the changes in blood vessel volume during the cardiac cycle, and calculates the heart rate and blood oxygen from the obtained pulse waveform.

[0129] Electrocardiogram (ECG) sensors use electrodes in contact with human skin to record the timing and strength of the electrical signals that cause the heart to beat.

[0130] Temperature sensors use temperature sensitive elements to measure temperature changes in the human body.

[0131] In the case where the detection unit 132 includes an optical plethysmographic sensor, see Figures 11 to 14 The optical plethysmography sensor includes one or more light emitting diodes 1321 (light emitting diode, LED) and one or more photoelectric diodes 1322 (photoelectric diode, PD). The light emitting surface of the light emitting diode 1321 is arranged to face away from the main board 110, and the light receiving surface of the photodiode 1322 is arranged to face away from the main board 110.

[0132] The light emitting diode 1321 is a semiconductor light emitting device that emits light. The photodiode 1322 is a semiconductor photodetector device that converts light into an electrical signal. The light emitting diode 1321 and the photodiode 1322 are arranged on the substrate 131 and are conductively connected to the substrate 131. When working, part of the light signal emitted by the light emitting diode 1321 to the human body is absorbed by the human blood and tissue, and part of the light signal is reflected and received by the photodiode 1322. The change of the blood vessel volume during the cardiac cycle is recorded based on the collected light signal, and the heart rate and blood oxygen are obtained from the obtained pulse waveform. The combination and layout of the light emitting diode 1321 and the photodiode 1322 can be determined based on the optical path design.

[0133] See also Fig.15 , Fig.16 In the case where the detection unit 132 of the detection module 130 is a PPG sensor, the circuit board assembly 100 having the mainboard 110, the electromagnetic shielding component 120 and the detection module 130 is directly arranged on the middle frame 300, and a predetermined spacing needs to be set between the mainboard 110 and the bottom shell 200 so that there is a predetermined distance between the PPG sensor and the bottom shell 200, so that the PPG sensor can work normally, that is, the light emitting diode 1321 in the PPG sensor sends a light signal to the human body, and the photodiode 1322 in the PPG sensor receives the light signal reflected by the human body, thereby realizing the optimized design of the optical path of the PPG sensor.

[0134] In order to prevent the light from the LED 1321 from directly irradiating the photodiode 1322, in some embodiments, see Fig.12 A light shielding member 1323 is provided between the light emitting diode 1321 and the photodiode 1322. The light shielding member 1323 can prevent the light of the light emitting diode 1321 from directly irradiating the photodiode 1322, so that the photodiode 1322 receives the light signal reflected by the human body, thereby improving the detection accuracy.

[0135] The light shielding member 1323 may be made of foam or other materials. The light shielding member 1323 may be set to a rectangular, circular or other shape and may be set around the light emitting diode 1321. The area of ​​the light shielding member 1323 may be set as required. The light shielding member 1323 may be fixed to the substrate 131 by bonding or other methods.

[0136] When assembling the bottom case 200 and the middle frame 300, refer to Fig.15 , Fig.16 The inner wall of the bottom shell 200 may have a partition rib 201. When the bottom shell 200 is fixed to the middle frame 300, the partition rib 201 is pressed against the shading member 1323 to achieve a shading effect between the light-emitting diode 1321 and the photodiode 1322.

[0137] For example, see Fig.12 Two photodiodes 1322 , two photodiodes 1322 and a frame-shaped shading member 1323 are provided on the substrate 131 . The photodiodes 1322 and the photodiodes 1322 are arranged alternately in a predetermined direction. The shading member 1323 is arranged between two adjacent photodiodes 1322 and around one photodiode 1322 .

[0138] In order to achieve better light emission and light reception of the PPG sensor, in some embodiments, refer to Fig.15 , Fig.16 A first lens 1324 is provided in front of the light emitting surface of the light emitting diode 1321, and a second lens 1325 is provided in front of the light receiving surface of the photodiode 1322. The light emitting diode 1321 and the first lens 1324 are combined so that the light generated by the light emitting diode 1321 can be better emitted. The photodiode 1322 and the second lens 1325 are combined so that the external light can be better received by the photodiode 1322. In addition, some light emitting diodes 1321 and photodiodes 1322 are arranged adjacent to each other and can share the same lens.

[0139] In order to enable the circuit board assembly 100 to have power supply capability, in some embodiments, refer to Figure 6 , Figure 8 , Fig.10, a battery 170 is fixed to the second surface 110b of the mainboard 110, and the battery 170 is conductively connected to the mainboard 110. The battery 170 can be used to power the mainboard 110, the detection module 130 and other devices. The mainboard 110 is a whole board structure, and the battery 170 is arranged on the second surface 110b of the mainboard 110, so that the volume and capacity of the battery 170 can be increased, and the maximum working time of the whole machine is increased. The battery 170 can be arranged in the middle frame 300. The battery 170 can be fixed to the mainboard 110 by colloid or other means.

[0140] When it is necessary to confirm the circuit board assembly 100 and the electronic device 1000 of this embodiment, the device can be disassembled to see whether the detection module 130 is fixed on the electromagnetic shielding component 120. A tomographic image of the circuit board assembly 100 can also be obtained by electronic computed tomography (CT) to determine whether the detection module 130 is fixed on the electromagnetic shielding component 120.

[0141] Finally, it should be noted that the above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A circuit board assembly, characterized in that: include: Mainboard, electromagnetic shielding components and detection modules; The main board has a first surface and a second surface facing each other; The electromagnetic shielding component has a third surface and a fourth surface facing each other, the electromagnetic shielding component is arranged on the first surface of the main board, and the third surface of the electromagnetic shielding component and the first surface of the main board are arranged facing each other; The detection module includes a substrate and a detection unit. The substrate has a fifth surface and a sixth surface facing each other. The fifth surface of the substrate is fixed to the fourth surface of the electromagnetic shielding component. The detection unit is installed on the sixth surface of the substrate. The substrate and the main board are conductively connected.

2. The circuit board assembly according to claim 1, characterized in that: The fifth surface of the substrate and the fourth surface of the electromagnetic shielding component are connected by colloid bonding, welding, riveting, snap connection or fastener connection.

3. The circuit board assembly according to claim 1 or 2, characterized in that: A first electronic component is disposed on the first surface of the mainboard, and the electromagnetic shielding component covers the first electronic component; The electromagnetic shielding component includes a plate-like portion and a flange portion, the flange portion is connected to the edge of the plate-like portion, the flange portion is fixed to the first surface of the main board, the end surface of the plate-like portion facing the main board forms the third surface, and the end surface of the plate-like portion away from the main board forms the fourth surface.

4. The circuit board assembly according to any one of claims 1 to 3, characterized in that: The substrate has a first flexible extension section, and the first flexible extension section is conductively connected to the main board.

5. The circuit board assembly according to claim 4, characterized in that: The connection position between the first flexible extension section and the main board is located on the first surface of the main board and is arranged close to the edge of the electromagnetic shielding component.

6. The circuit board assembly according to claim 4 or 5, characterized in that: The substrate includes a flexible circuit board and a reinforcing sheet, the flexible circuit board and the reinforcing sheet are stacked and connected, the first flexible extension section is formed on the flexible circuit board, the reinforcing sheet is not arranged on the first flexible extension section, the detection unit is arranged in an area of ​​the flexible circuit board corresponding to the reinforcing sheet, and the reinforcing sheet is fixed on the fourth surface of the electromagnetic shielding component.

7. The circuit board assembly according to any one of claims 1 to 6, characterized in that: The substrate and the mainboard are electrically connected via a connector, the connector comprising a first connecting portion and a second connecting portion for plug-in matching, the first connecting portion being arranged on the substrate, and the second connecting portion being arranged on the mainboard; Alternatively, the substrate and the mainboard are conductively connected by welding, the substrate has a first welding pad, the mainboard has a second welding pad, and the first welding pad and the second welding pad are welded.

8. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The detection unit includes at least one of an optical plethysmography sensor, an electrocardiogram sensor, and a temperature sensor.

9. An electronic device, characterized in that: It includes a bottom shell, a middle frame and a circuit board assembly as described in any one of claims 1 to 8, the bottom shell and the middle frame are connected, the mainboard is arranged on the middle frame, the first surface of the mainboard and the bottom shell are arranged facing each other, and the detection module is arranged close to the bottom shell.

10. The electronic device according to claim 9, characterized in that: It also includes a screen assembly, which is arranged on the middle frame. The screen assembly and the mainboard are conductively connected, and the second surface of the mainboard and the screen assembly are arranged facing each other.

11. The electronic device according to claim 10, characterized in that: The electronic device includes a watch or a bracelet.

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