Silicon wafer edge defect detection device and silicon wafer sorting machine

Abstract

The utility model relates to the field of detection equipment, in particular to a silicon wafer edge defect detection device and a silicon wafer sorting machine. The silicon wafer edge defect detection device comprises an edge detection light source, a chamfer detection light source and a detection camera; the edge detection light source is opposite to a side edge of the silicon wafer, so that light emitted by the edge detection light source is reflected by the side edge to enter a lens of the detection camera; and the chamfering detection light source is opposite to the chamfering edge of the silicon wafer, so that light emitted by the chamfering detection light source is reflected by the chamfering edge to enter a lens of the detection camera. According to the silicon wafer edge defect detection device provided by the invention, the detection coverage range is more comprehensive, and the missing detection risk of silicon wafer edge breakage can be eliminated; the light path of the detection light source is directly irradiated on the silicon wafer and does not need to be adjusted through optical elements such as prisms and light path limiting elements, adjustment is more convenient, and the collision risk in the silicon wafer detection process is effectively reduced.

Description

Technical Field

[0001] The present application relates to the field of detection equipment, and in particular to a silicon wafer edge defect detection device and a silicon wafer sorting machine. Background Art

[0002] As the raw material of solar cells, silicon wafers are widely used in the production of solar cells, circuit boards and other products. In the production process of silicon wafers, silicon wafer sorting machines, as the terminal equipment for quality control, detect and grade the silicon wafers in terms of size, edge collapse, silicon drop, dirt, hidden cracks, holes and resistivity to ensure the quality of solar cells, circuit boards and other products made from silicon wafers.

[0003] The edge detection mechanism set up in the silicon wafer sorting machine is used to detect defects such as chipping and silicon falling on the side edges of the silicon wafer. The silicon wafers used in the solar energy field are square or rectangular in shape, and the four corners are blunted at 45 degrees. The existing edge detection mechanism uses a light source to illuminate the silicon wafer, and reflects the light to the side edges and chamfers of the silicon wafer to be detected through the reflection of the prism, and then enters the camera through the optical path limiting element. This detection device can improve the imaging effect of the camera. However, since the silicon wafer needs to pass through the limiting element during detection, there is a possibility of collision, and the optical path needs to be reflected by the prism, there is also the problem of difficulty in debugging. Utility Model Content

[0004] The purpose of the present application is to provide a silicon wafer edge defect detection device and a silicon wafer sorting machine, so that the detection can fully cover the side edges, chamfered edges, and the transition part between the side edges and chamfered edges of the silicon wafer, and the optical path is easy to debug and can reduce the risk of collision with the silicon wafer.

[0005] The present application provides a silicon wafer edge defect detection device, including an edge detection light source, a chamfer detection light source and a detection camera;

[0006] The edge detection light source is opposite to the side edge of the silicon wafer, so that the light emitted by the edge detection light source is reflected by the side edge and enters the lens of the detection camera;

[0007] The chamfer detection light source is opposite to the chamfered edge of the silicon wafer, so that the light emitted by the chamfer detection light source is reflected by the chamfered edge and enters the lens of the detection camera.

[0008] In the above technical solution, further, the lens center of the detection camera is located below the side edge, and the edge detection light source is located directly above the detection camera;

[0009] Or the lens center of the detection camera is located above the side edge, and the edge detection light source is located directly below the detection camera.

[0010] In the above technical solution, further, the chamfer detection light source includes a front chamfer detection light source and / or a rear chamfer detection light source;

[0011] The front chamfer detection light source is located on a side of the detection camera close to the advancing direction of the silicon wafer, and the front chamfer detection light source is located below the silicon wafer;

[0012] The back chamfer detection light source is located on a side of the detection camera close to the silicon wafer in a backward direction, and the back chamfer detection light source is located below the silicon wafer.

[0013] In the above technical solution, further, it also includes a bracket;

[0014] The edge detection light source and the chamfer detection light source are movably mounted on the bracket so that the positions and light incident angles of the edge detection light source and the chamfer detection light source are adjustable.

[0015] In the above technical solution, further, the bracket includes a first mounting component and a second mounting component;

[0016] The first mounting assembly includes a first mounting member and a first adjusting rod; the edge detection light source is mounted on the first adjusting rod; the first mounting member is provided with a first guide rail, the guiding direction of the first guide rail is a first direction, and the first direction is perpendicular to the surface of the side edge; the first adjusting rod is mounted on the first guide rail and can rotate relative to the first mounting member;

[0017] The second mounting assembly includes a second mounting member and a second adjusting rod; the chamfer detection light source is mounted on the second adjusting rod; the second mounting member is provided with a second guide rail, the guiding direction of the second guide rail is a second direction, and the second direction is the conveying direction of the silicon wafer; the second adjusting rod is mounted on the second guide rail and can rotate relative to the second mounting member; the second adjusting rod is provided with a third guide rail, and the guiding direction of the third guide rail is the first direction.

[0018] In the above technical solution, further, the bracket also includes a bracket body and an adjustment component;

[0019] The first mounting member and the second mounting member are connected to the bracket body;

[0020] The detection camera is installed on the bracket body through the adjustment component so that the detection camera can be raised and lowered relative to the bracket body.

[0021] The present application also provides a silicon wafer sorting machine, comprising the silicon wafer edge defect detection device described in the above scheme.

[0022] In the above technical solution, further, it also includes a conveying mechanism;

[0023] The conveying mechanism is used to transport silicon wafers. The silicon wafer edge defect detection devices are arranged on both sides of the conveying mechanism to detect the side edges and chamfered edges on both sides of the silicon wafer.

[0024] In the above technical solution, further, a distance adjustment mechanism is included, the distance adjustment mechanism includes a mounting seat, a driving assembly and a guide rail assembly, the driving assembly and the guide rail assembly are installed on the mounting seat, and the guiding direction of the guide rail assembly is perpendicular to the transportation direction of the silicon wafer;

[0025] The guide rail assembly includes a slide rail and two sliders slidably mounted on the slide rail. The driving assembly is connected to the two sliders to drive the two sliders to move closer or farther away. The two silicon wafer edge defect detection devices are respectively mounted on the two sliders.

[0026] In the above technical solution, further, the guide rail assembly includes a driving device, a transmission belt and a connecting member;

[0027] The driving device is mounted on the mounting seat, and the output shaft of the driving device is connected to the driving wheel of the transmission belt, and the driven wheel of the transmission belt is mounted on the mounting seat;

[0028] The belt of the transmission belt comprises two connecting parts with opposite movement directions, both connecting parts are equipped with the connecting piece, and the two connecting pieces are respectively connected to the two sliders;

[0029] The connecting piece is provided with an adjusting hole, and the sliding block is provided with an adjusting handle, which passes through the adjusting hole and can reciprocate along the length direction of the adjusting hole.

[0030] Compared with the prior art, the beneficial effects of this application are:

[0031] The silicon wafer edge defect detection device provided in the present application has a more comprehensive detection coverage and can eliminate the risk of missed detection of silicon wafer edge collapse; the light path of the detection light source directly hits the silicon wafer, and there is no need to adjust the light path through optical elements such as prisms and light path limiting elements. The adjustment is more convenient and effectively reduces the collision risk during the silicon wafer detection process.

[0032] The present application also provides a silicon wafer sorting machine, including the silicon wafer edge defect detection device described in the above solution. Based on the above analysis, it can be seen that the silicon wafer sorting machine also has the above beneficial effects, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 A schematic diagram of the structure of the silicon wafer edge defect detection device provided in this application;

[0035] Figure 2 A schematic diagram of the first optical path of the silicon wafer edge defect detection device provided in this application;

[0036] Figure 3 A schematic diagram of the second optical path of the silicon wafer edge defect detection device provided in this application;

[0037] Figure 4 A schematic diagram of the third optical path of the silicon wafer edge defect detection device provided in this application;

[0038] Figure 5 A schematic diagram of the structure of the silicon wafer sorting machine provided in this application;

[0039] Figure 6 This is a schematic diagram of the structure of the distance adjustment mechanism provided in this application.

[0040] In the figure: 101-edge detection light source; 102-chamfer detection light source; 103-detection camera; 104-silicon wafer; 105-side edge; 106-chamfer edge; 107-front chamfer detection light source; 108-rear chamfer detection light source; 109-bracket; 110-first mounting member; 111-first adjustment rod; 112-first guide rail; 113-support arm; 114-second mounting member; 115-second adjustment rod; 116-second guide rail; 117-third Guide rail; 118-bracket body; 119-adjusting block; 120-adjusting screw; 121-conveying mechanism; 122-distance adjustment mechanism; 123-mounting seat; 124-support block; 125-mounting plate; 126-connecting plate; 127-guide rail assembly; 128-slide rail; 129-slider; 130-motor; 131-driving wheel; 132-driven wheel; 133-belt; 134-connecting piece; 135-adjusting hole; 136-adjusting handle. DETAILED DESCRIPTION

[0041] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0042] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0043] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0044] Embodiment 1

[0045] See also Figures 1 to 6 As shown, the silicon wafer edge defect detection device provided by the present application includes an edge detection light source 101, a chamfer detection light source 102 and a detection camera 103. Specifically, the edge detection light source 101 and the chamfer detection light source 102 can be point light sources, and the detection camera 103 is a line scan camera.

[0046] In the specific detection process of the silicon wafer 104, when the silicon wafer 104 enters the lens shooting range of the detection camera 103, the edge detection light source 101 can be opposite to the side edge 105 of the silicon wafer 104, so that the light emitted by the edge detection light source 101 directly hits the side edge 105 of the silicon wafer 104, and the side edge 105 can reflect the light into the lens of the detection camera 103, so that the side edge 105 is imaged in the camera, so as to achieve defect detection of the side edge 105. Similarly, the chamfer detection light source 102 can also be opposite to the chamfered edge 106 of the silicon wafer 104, so that the light emitted by the chamfer detection light source 102 is reflected by the chamfered edge 106 and enters the lens of the detection camera 103, so that the chamfered edge 106 is imaged in the camera, so as to achieve defect detection of the chamfered edge 106. As the silicon wafer 104 moves, the detection range can cover the side edge 105, the chamfered edge 106, and the transition part between the side edge 105 and the chamfered edge 106.

[0047] The silicon wafer edge defect detection device provided in the present application has a more comprehensive detection coverage, which can eliminate the risk of missed detection of chipped edges of the silicon wafer 104; the light path of the detection light source directly hits the silicon wafer 104, and there is no need to adjust the light path through optical elements such as prisms and light path limiting elements. The adjustment is more convenient and effectively reduces the collision risk during the detection process of the silicon wafer 104.

[0048] In an optional scheme of this embodiment, the lens center of the detection camera 103 is located below the side edge 105, and the edge detection light source 101 is located directly above the detection camera 103; or the lens center of the detection camera 103 is located above the side edge 105, and the edge detection light source 101 is located directly below the detection camera 103.

[0049] In this embodiment, if Figures 1 to 3 As shown, when the silicon wafer 104 is placed horizontally, the side edge 105 of the silicon wafer 104 is in a vertical direction. The edge detection light source 101 is located obliquely above the side edge 105, the detection camera 103 is directly opposite to the side edge 105, and the lens center of the detection camera 103 is located at a position slightly below the side edge 105, so that the light emitted by the edge detection light source 101 into the side edge 105 can enter the lens shooting range of the detection camera 103 after being reflected by the side edge 105. When the silicon wafer 104 moves horizontally driven by the conveying mechanism 121, the entire side edge 105 of the silicon wafer 104 can enter the lighting range of the edge detection light source 101 and the lens shooting range of the detection camera 103, thereby realizing the defect detection of the side edge 105.

[0050] In an optional scheme of this embodiment, the chamfer detection light source 102 includes a front chamfer detection light source 107 and / or a rear chamfer detection light source 108; the front chamfer detection light source 107 is located on the side of the detection camera 103 close to the silicon wafer 104 in the forward direction, so as to be opposite to the front chamfer edge 106 of the silicon wafer 104; the rear chamfer detection light source 108 is located on the side of the detection camera 103 close to the silicon wafer 104 in the backward direction, so as to be opposite to the rear chamfer edge 106 of the silicon wafer 104.

[0051] In this embodiment, if Figure 1 , Figure 2 and Figure 4 As shown, when the silicon wafer 104 is placed horizontally, the chamfered edge 106 of the silicon wafer 104 is in a vertical direction. When the silicon wafer 104 is moved horizontally driven by the conveying mechanism 121, since the front chamfer detection light source 107 is located on the side of the detection camera 103 close to the advancing direction of the silicon wafer 104, the front chamfered edge 106 of the silicon wafer 104 can enter the irradiation range of the front chamfer detection light source 107, so that the light reflected by the front chamfered edge 106 enters the lens shooting range of the detection camera 103, so that the front chamfered edge 106 is imaged in the camera. Then, the side edge 105 of the silicon wafer 104 can enter the irradiation range of the edge detection light source 101, so that the light reflected by the side edge 105 enters the lens shooting range of the detection camera 103, so that the side edge 105 is imaged in the camera. Finally, since the back chamfer detection light source 108 is located on the side of the detection camera 103 close to the silicon wafer 104 in the backward direction, the back chamfer edge 106 of the silicon wafer 104 can enter the irradiation range of the back chamfer detection light source 108, so that the light reflected by the back chamfer edge 106 enters the lens shooting range of the detection camera 103, so that the back chamfer edge 106 is imaged in the camera. Through the above process, the detection of the side edge 105, the chamfer edge 106 and the transition part between the side edge 105 and the chamfer edge 106 of the silicon wafer 104 is completed.

[0052] Embodiment 2

[0053] The silicon wafer edge defect detection device in the second embodiment is an improvement on the above embodiment. The technical contents disclosed in the above embodiment will not be described repeatedly, and the contents disclosed in the above embodiment also belong to the contents disclosed in the second embodiment.

[0054] See also Figure 1As shown, in an optional solution of this embodiment, the silicon wafer edge defect detection device also includes a bracket 109; the edge detection light source 101 and the chamfer detection light source 102 are movably mounted on the bracket 109, so that the position of the edge detection light source 101 and the chamfer detection light source 102 and the light incident angle are adjustable. In this way, when detecting silicon wafers 104 of different sizes, the position of the edge detection light source 101 and the chamfer detection light source 102 and the light incident angle can be adjusted accordingly according to the actual position of the side edge 105 and the chamfer edge 106 of the silicon wafer 104, so as to achieve a better imaging effect, and the adjustment parameters are relatively few and convenient to adjust, which effectively avoids the collision problem existing in the detection of the silicon wafer 104.

[0055] In an optional solution of this embodiment, the bracket 109 includes a first mounting assembly, and the first mounting assembly is used to fix the edge detection light source 101. Specifically, the first mounting assembly includes a first mounting member 110 and a first adjustment rod 111; the edge detection light source 101 is mounted on the first adjustment rod 111; the first mounting member 110 is provided with a first guide rail 112, the guiding direction of the first guide rail 112 is a first direction, and the first direction is perpendicular to the surface of the side edge 105; the first adjustment rod 111 is mounted on the first guide rail 112 and can rotate relative to the first mounting member 110.

[0056] like Figure 1 As shown, the first mounting member 110 includes two arms 113 spaced apart, the arms 113 are provided with adjusting long holes to form the structure of the first guide rail 112, and the two ends of the first adjusting rod 111 are inserted into the adjusting long holes of the two arms 113, and the first adjusting rod 111 can rotate in the adjusting long holes. When adjusting the light emitting position of the edge detection light source 101, the first adjusting rod 111 can be driven to move along the adjusting long hole to adjust the position of the first adjusting rod 111 in the adjusting long hole, so as to be close to or away from the side edge 105 of the silicon wafer 104; when adjusting the light emitting angle of the edge detection light source 101, the angle of the first adjusting rod 111 can be rotated, and the adjustment operation is convenient and quick.

[0057] Furthermore, the bracket 109 also includes a second mounting assembly, and the second mounting assembly is used to fix the chamfer detection light source 102. Specifically, the second mounting assembly includes a second mounting member 114 and a second adjustment rod 115; the chamfer detection light source 102 is mounted on the second adjustment rod 115; the second mounting member 114 is provided with a second guide rail 116, and the guiding direction of the second guide rail 116 is the second direction, and the second direction is the conveying direction of the silicon wafer 104; the second adjustment rod 115 is installed on the second guide rail 116 and can rotate relative to the second mounting member 114; the second adjustment rod 115 is provided with a third guide rail 117, and the guiding direction of the third guide rail 117 is the first direction.

[0058] like Figure 1As shown, the second mounting member 114 includes a mounting rod, and the length direction of the mounting rod is the conveying direction of the silicon wafer 104. The mounting rod is provided with an adjustment slot at one end in the forward direction (corresponding to the installation of the front chamfer detection light source 107) and at one end in the backward direction (corresponding to the installation of the rear chamfer detection light source 108) close to the silicon wafer 104 to form a second guide rail 116 structure, and the length direction of the adjustment slot is the conveying direction ( Figure 1 The second adjusting rod 115 is installed in the adjusting slot of the mounting rod, and the second adjusting rod 115 can rotate in the adjusting slot. At the same time, the second adjusting rod 115 is also provided with an adjusting slot (length direction is Figure 1 in the Y direction) to form the structure of the third guide rail 117.

[0059] Specifically, when adjusting the light emitting position of the chamfer detection light source 102, it can be adjusted in two directions: the second adjustment rod 115 can be driven to move along the adjustment slot of the mounting rod to adjust the position of the second adjustment rod 115 in the adjustment slot, so as to get closer to or farther away from the chamfer edge 106 of the silicon wafer 104 in the X direction; and the position of the chamfer detection light source 102 in the adjustment slot of the second adjustment rod 115 can be adjusted, so as to get closer to or farther away from the chamfer edge 106 of the silicon wafer 104 in the Y direction, and the position of the chamfer detection light source 102 can be adjusted according to the size of the silicon wafer 104 and the specific angle of the chamfer. When adjusting the light emitting angle of the chamfer detection light source 102, it is sufficient to rotate the angle of the second adjustment rod 115, and the adjustment operation is convenient and quick.

[0060] In an optional solution of this embodiment, the bracket 109 also includes a bracket body 118 and an adjustment component; the first mounting member 110 and the second mounting member 114 are connected to the bracket body 118; the detection camera 103 is installed on the bracket body 118 through the adjustment component so that the detection camera 103 can be raised and lowered relative to the bracket body 118.

[0061] In this embodiment, the bracket 109 further includes a bracket body 118 and an adjustment assembly. The bracket body 118 serves as a main supporting structure and can fix the first mounting member 110, the second mounting member 114 and the detection camera 103. The bracket 109 includes a bottom plate and a vertical plate. The second mounting member 114 is connected to the bottom plate. The vertical plate is mounted on the top surface of the bottom plate, and a connecting rod is provided on the top surface of the vertical plate. The two arms 113 of the first mounting member 110 are connected to the connecting rod. Specifically, the adjustment assembly includes an adjustment block 119 and an adjustment screw 120. The adjustment block 119 is connected to the detection camera 103, and the adjustment block 119 is suspended on the connecting rod by the adjustment screw 120. Rotating the adjustment screw 120 can change the depth of the adjustment screw 120 selected into the adjustment block 119, that is, change the height of the adjustment block 119, thereby adjusting the height of the detection camera 103, that is, making corresponding adaptive adjustments when detecting different silicon wafers 104.

[0062] Embodiment 3

[0063] Embodiment 3 of the present application provides a silicon wafer sorting machine, including the silicon wafer edge defect detection device of any of the above embodiments, and thus has all the beneficial technical effects of the silicon wafer edge defect detection device of any of the above embodiments, which will not be repeated here.

[0064] See also Figure 5 As shown, in an optional scheme of this embodiment, the silicon wafer sorting machine also includes a conveying mechanism 121; the conveying mechanism 121 is specifically a conveyor belt for transporting the silicon wafer 104, and silicon wafer edge defect detection devices are provided on both sides of the conveying mechanism 121 to detect the side edges 105 and chamfered edges 106 on both sides of the silicon wafer 104.

[0065] In this embodiment, both sides of the conveying mechanism 121 are provided with silicon wafer edge defect detection devices to respectively capture images of the side edges 105 and chamfered edges 106 on the left and right sides of the silicon wafer 104. Each silicon wafer edge defect detection device is provided with three point light sources to form three light paths (shown by dotted lines in the figure), and the three light paths are staggered. When the silicon wafer 104 moves forward under the transportation of the conveying mechanism 121, the front chamfered edge 106, the side edge 105 and the rear chamfered edge 106 of the silicon wafer 104 can successively enter the irradiation range of each light source, so that each detection surface of the silicon wafer 104 can be imaged in the line scan camera.

[0066] See also Figure 5 and Figure 6 As shown, in an optional solution of this embodiment, the silicon wafer sorting machine also includes a distance adjustment mechanism 122, which can adjust the position of the silicon wafer edge defect detection device to keep the silicon wafer 104 centered, thereby automatically adjusting the distance when changing silicon wafers 104 of different sizes, which is more accurate and convenient than manual adjustment.

[0067] Specifically, the distance adjustment mechanism 122 includes a mounting seat 123, a driving assembly and a guide rail assembly 127. The driving assembly and the guide rail assembly 127 are mounted on the mounting seat 123, and the guide direction of the guide rail assembly 127 is perpendicular to the transportation direction of the silicon wafer 104. The mounting seat 123 includes a support block 124, a mounting plate 125 and a connecting plate 126. The support block 124 is used to support the guide rail assembly 127, the mounting plate 125 is used to fix the driving assembly, and the mounting plate 125 is connected to the guide rail assembly 127 through the connecting plate 126.

[0068] The guide rail assembly 127 includes a slide rail 128 and two sliders 129 slidably mounted on the slide rail 128. The driving assembly is connected to the two sliders 129 to drive the two sliders 129 to move closer or farther away. The two silicon wafer edge defect detection devices are respectively mounted on the two sliders 129. The guide rail assembly 127 can guide the movement of the silicon wafer edge defect detection device so that the silicon wafer edge defect detection device can reciprocate in a direction perpendicular to the transport direction of the silicon wafer 104, so that the position adjustment of the silicon wafer edge defect detection device is more accurate.

[0069] Furthermore, the guide rail assembly 127 includes a driving device, a transmission belt and a connecting piece 134. The driving device is specifically a motor 130 and is installed on the mounting seat 123. The output shaft of the motor 130 is connected to the driving wheel 131 of the transmission belt, and the driven wheel 132 of the transmission belt can be installed on the mounting seat 123 through a bearing. The driving wheel 131 and the driven wheel 132 of the transmission belt divide the belt 133 into two connecting parts with opposite movement directions. The two connecting parts are both installed with a connecting piece 134, and the two connecting pieces 134 are respectively connected to two sliders 129. When the motor 130 drives the transmission belt to run, the transmission belt can drive the two sliders 129 to move toward or away from each other to change the relative position of the two silicon wafer edge defect detection devices and the silicon wafer 104, so that the relative position of the two can be adjusted according to the size of the silicon wafer 104, thereby ensuring that the silicon wafer 104 is always centered.

[0070] Preferably, the connecting member 134 is provided with an adjustment hole 135, and the slider 129 is provided with an adjustment handle 136, which passes through the adjustment hole 135 and can reciprocate along the length direction of the adjustment hole 135 to adjust the position of the slider 129 on the slide rail 128. The setting of the adjustment handle 136 can realize manual adjustment of the position of the slider 129, further ensuring that the silicon wafer 104 is centered.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application. In addition, a person skilled in the art can understand that although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments means being within the scope of the present application and forming different embodiments.

Claims

1. A silicon wafer edge defect detection device, characterized in that: Including edge detection light source, chamfer detection light source and detection camera; The edge detection light source is opposite to the side edge of the silicon wafer, so that the light emitted by the edge detection light source is reflected by the side edge and enters the lens of the detection camera; The chamfer detection light source is opposite to the chamfered edge of the silicon wafer, so that the light emitted by the chamfer detection light source is reflected by the chamfered edge and enters the lens of the detection camera.

2. The silicon wafer edge defect detection device according to claim 1, characterized in that: The lens center of the detection camera is located below the side edge, and the edge detection light source is located directly above the detection camera; Or the lens center of the detection camera is located above the side edge, and the edge detection light source is located directly below the detection camera.

3. The silicon wafer edge defect detection device according to claim 1, characterized in that: The chamfer detection light source includes a front chamfer detection light source and / or a rear chamfer detection light source; The front chamfer detection light source is located on a side of the detection camera close to the advancing direction of the silicon wafer, and the front chamfer detection light source is located below the silicon wafer; The back chamfer detection light source is located on a side of the detection camera close to the silicon wafer in a backward direction, and the back chamfer detection light source is located below the silicon wafer.

4. The silicon wafer edge defect detection device according to claim 2, characterized in that: Also includes a stand; The edge detection light source and the chamfer detection light source are movably mounted on the bracket so that the positions and light incident angles of the edge detection light source and the chamfer detection light source are adjustable.

5. The silicon wafer edge defect detection device according to claim 4, characterized in that: The bracket includes a first mounting assembly and a second mounting assembly; The first mounting assembly includes a first mounting member and a first adjusting rod; the edge detection light source is mounted on the first adjusting rod; the first mounting member is provided with a first guide rail, the guiding direction of the first guide rail is a first direction, and the first direction is perpendicular to the surface of the side edge; the first adjusting rod is mounted on the first guide rail and can rotate relative to the first mounting member; The second mounting assembly includes a second mounting member and a second adjusting rod; the chamfer detection light source is mounted on the second adjusting rod; the second mounting member is provided with a second guide rail, the guiding direction of the second guide rail is a second direction, and the second direction is the conveying direction of the silicon wafer; the second adjusting rod is mounted on the second guide rail and can rotate relative to the second mounting member; the second adjusting rod is provided with a third guide rail, and the guiding direction of the third guide rail is the first direction.

6. The silicon wafer edge defect detection device according to claim 5, characterized in that: The bracket also includes a bracket body and an adjustment component; The first mounting member and the second mounting member are connected to the bracket body; The detection camera is installed on the bracket body through the adjustment component so that the detection camera can be raised and lowered relative to the bracket body.

7. A silicon wafer sorting machine, characterized in that: It comprises a silicon wafer edge defect detection device as described in any one of claims 1 to 6.

8. The silicon wafer sorting machine according to claim 7, characterized in that: Also includes a conveying mechanism; The conveying mechanism is used to transport silicon wafers. The silicon wafer edge defect detection devices are arranged on both sides of the conveying mechanism to detect the side edges and chamfered edges on both sides of the silicon wafer.

9. The silicon wafer sorting machine according to claim 8, characterized in that: It also includes a distance adjustment mechanism, which includes a mounting seat, a driving assembly and a guide rail assembly, wherein the driving assembly and the guide rail assembly are mounted on the mounting seat, and the guiding direction of the guide rail assembly is perpendicular to the transport direction of the silicon wafer; The guide rail assembly includes a slide rail and two sliders slidably mounted on the slide rail. The driving assembly is connected to the two sliders to drive the two sliders to move closer or farther away. The two silicon wafer edge defect detection devices are respectively mounted on the two sliders.

10. The silicon wafer sorting machine according to claim 9, characterized in that: The guide rail assembly includes a driving device, a transmission belt and a connecting piece; The driving device is mounted on the mounting seat, and the output shaft of the driving device is connected to the driving wheel of the transmission belt, and the driven wheel of the transmission belt is mounted on the mounting seat; The belt of the transmission belt comprises two connecting parts with opposite movement directions, both connecting parts are equipped with the connecting piece, and the two connecting pieces are respectively connected to the two sliders; The connecting piece is provided with an adjusting hole, and the sliding block is provided with an adjusting handle, which passes through the adjusting hole and can reciprocate along the length direction of the adjusting hole.

Images