Fixture for wafer test

Abstract

The utility model relates to a fixture for wafer testing. The fixture comprises: a suction cup having a suction surface; the insulating heat-conducting disc is positioned on one side of the sucking disc back to the sucking surface; the temperature control disc is located on the side, opposite to the sucker, of the insulating heat conduction disc, and the temperature control disc, the insulating heat conduction disc and the sucker are sequentially connected in a heat conduction mode; and the insulating connecting piece penetrates through the insulating heat conduction disc to fix the sucking disc and the temperature control disc. The fixture can prevent the temperature control disc from being punctured by the voltage borne by the sucker.

Description

Technical Field

[0001] The present disclosure relates to the technical field of chip detection, and in particular to a fixture for wafer testing. Background Art

[0002] The chip structures on the wafer need to be inspected after manufacturing.

[0003] Current testing often applies high voltage to the wafer. At the same time, in order to obtain the performance data of the wafer under different working environments, the wafer needs to be heated or cooled. In order to test the wafer, a specific fixture is needed to clamp the wafer. In addition to ensuring the stable positioning and firm clamping of the wafer, the fixture also needs to control the temperature of the wafer, so the fixture often has various components built in.

[0004] However, under the action of high voltage, the card may be broken down, thus causing risks. Utility Model Content

[0005] Based on this, it is necessary to provide a fixture for wafer testing in order to address the safety issues of the fixture itself in a high voltage testing environment.

[0006] The disclosed embodiment provides a fixture for wafer testing, which includes: a suction cup having a suction surface; an insulating heat-conducting disc located on the side of the suction cup facing away from the suction surface; a temperature control disc located on the side of the insulating heat-conducting disc facing away from the suction cup, wherein the temperature control disc, the insulating heat-conducting disc and the suction cup are thermally connected in sequence; and an insulating connector that passes through the insulating heat-conducting disc to fix the suction cup and the temperature control disc.

[0007] The fixture provided in the embodiment of the present disclosure can use a suction cup to absorb wafers for wafer testing, and can perform tests under different temperature environments; by providing an insulating heat conductive plate and an insulating connector, while ensuring that each layer of the structure is firmly connected, it prevents the voltage borne by the suction cup from breaking through to the temperature control plate.

[0008] In some embodiments, the insulating connector includes an insulating sleeve and a connector, the connector is inserted into the insulating sleeve, the insulating sleeve includes a sleeve body and a flange connected to one end of the sleeve body, the connector includes a first connecting part and a second connecting part, the second connecting part is located at the end of the flange facing away from the sleeve body, the second connecting part is against the flange, and the first connecting part protrudes from the other end of the sleeve body; one of the suction cup and the temperature control plate is connected to the first connecting part, and the other is fastened by the flange.

[0009] Such an arrangement makes it easy to manufacture the connector and can also ensure connection strength and insulation capability.

[0010] Exemplarily, the flange is located on the side of the temperature control disk facing away from the insulating heat conductive disk and abuts against the temperature control disk, and the sleeve passes through the temperature control disk; the connecting piece is passed through the insulating sleeve and passes through the temperature control disk and the insulating heat conductive disk, the first connecting part of the connecting piece is connected to the suction cup and there is a distance between the first connecting part and the suction surface, the second connecting part of the connecting piece is located at one end of the flange facing away from the sleeve, and the second connecting part abuts against the flange.

[0011] Such an arrangement can ensure that the suction cup has a compact structure and reliable use function; in addition, it is also convenient for assembling and disassembling the fixture.

[0012] In some embodiments, the first connecting part is a screw rod, the second connecting part is a nut, and the screw rod is threadedly connected to the suction cup.

[0013] With such arrangement, the second connection part facilitates the operation of the first connection part and can ensure the effect of abutting the flange; the insulating connection piece is easy to install and can ensure the connection strength between the suction cup and the temperature control plate.

[0014] In some embodiments, the insulating heat-conducting disk is a ceramic disk, and a dimension of the insulating heat-conducting disk along the stacking direction is 4 mm to 6 mm.

[0015] Such an arrangement can not only ensure that the temperature control disc can effectively control the temperature of the suction cup, but also protect the temperature control disc from the risk of voltage at the suction cup.

[0016] In some embodiments, the insulation sleeve has a temperature resistance range of -60°C to 200°C.

[0017] With such configuration, the chuck can be used for low temperature testing, normal temperature testing and high temperature testing of wafers.

[0018] In some embodiments, the insulating sleeve is a Teflon insulating sleeve or a polyetheretherketone insulating sleeve.

[0019] With such arrangement, the insulating sleeve has good insulation performance and good temperature resistance, and in addition, the connection strength of the connector can be ensured.

[0020] In some embodiments, the insulating connector includes a enclosure surrounding the flange, and the second connecting portion is embedded in the enclosure.

[0021] With such an arrangement, the second connecting portion can be surrounded by a barrier to improve the pressure resistance of the fixture.

[0022] In some embodiments, a fixture for wafer testing is characterized in that it also includes a heating plate, which is attached to the side of the temperature control disk facing away from the insulating heat conductive disk; the insulating connector passes through the heating plate, the temperature control disk and the insulating heat conductive disk in sequence and is connected to the suction cup.

[0023] With this arrangement, the temperature control plate can be used to achieve a low suction cup temperature, and the heating plate can be used to achieve a high suction cup temperature. After the wafer is tested, the temperature control plate or the heating plate can be used to restore the wafer to a basic normal temperature.

[0024] In some embodiments, the temperature control disk has a flow channel for the circulation of a heat-conducting medium and a fixed hole for avoiding the flow channel, and the flow channel is connected to the outer periphery of the temperature control disk; one end of the insulating connector is a flange, the insulating connector is passed through the fixed hole, and the flange abuts against a portion of the temperature control disk at the edge of the fixed hole.

[0025] Such an arrangement can flexibly realize temperature control of the suction cup through the temperature control plate.

[0026] In some embodiments, the suction cup has a plurality of air flow channel areas which are sequentially arranged from the inside to the outside, each air flow channel area is connected to the suction surface through a plurality of air holes, and each air flow channel area is respectively connected to the outer periphery of the suction cup.

[0027] With such an arrangement, the fixture can adsorb wafers of different sizes and ensure stable and uniform adsorption.

[0028] In some embodiments, the fixture for wafer testing is characterized in that it also includes a temperature sensor, the temperature sensor is located on the side of the temperature control disk facing away from the insulating heat conductive disk, and the temperature sensor is located in the center of the temperature control disk.

[0029] With such an arrangement, the temperature sensor can be used to control the temperature in real time and accurately.

[0030] In some embodiments, a fixture for wafer testing is characterized in that it further includes an insulating pressure block, a temperature sensor is inserted through the insulating pressure block, and the temperature sensor is connected to a temperature control disk through the insulating pressure block.

[0031] With such an arrangement, the insulating pressing block can be used to prevent the temperature sensor from being broken down during a high voltage test. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic exploded view of a fixture provided for an embodiment of the present disclosure;

[0033] Figure 2 A schematic diagram of the structure of a fixture provided in an embodiment of the present disclosure;

[0034] Figure 3 A schematic top view of a fixture provided for an embodiment of the present disclosure;

[0035] Figure 4 A schematic front view of a fixture provided in accordance with an embodiment of the present disclosure;

[0036] Figure 5 for Figure 4 A cross-sectional schematic diagram of

[0037] Figure 6 for Figure 5 The enlarged view of point A in the middle;

[0038] Figure 7 A schematic diagram of the structure of a suction cup in a fixture provided in an embodiment of the present disclosure.

[0039] Description of reference numerals: 1, suction cup; 101, suction surface; 102, air flow channel; 11, first air flow channel area; 12, second air flow channel area; 13, third air flow channel area; 14, fourth air flow channel area; 111, air hole; 112, air flow channel opening; 2, insulating heat conducting plate; 21, through hole; 3, temperature control plate; 31, temperature control plate body; 32, flow channel cover plate; 33, fixing hole; 310, flow channel; 311, flow channel opening;

[0040] 4. Insulating sleeve; 41. Sleeve body; 42. Flange; 5. Connector; 501. First connecting part; 502. Second connecting part; 503. Connecting rod; 50. First connecting bolt; 51. Second connecting bolt; 52. Connecting block; 6. Heating plate; 7. Insulating plate; 8. Insulating connector; 90. Insulating pressing block; 9. Temperature sensor;

[0041] 100. Fixture; 200. T-axis upper plate. DETAILED DESCRIPTION

[0042] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present disclosure more obvious and understandable, the specific implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the embodiments of the present disclosure. However, the embodiments of the present disclosure can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the embodiments of the present disclosure, so the embodiments of the present disclosure are not limited by the specific examples of the embodiments disclosed below.

[0043] In the description of the embodiments of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "perpendicular", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present disclosure.

[0044] In the embodiments of the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0045] In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. Exemplarily, the first airflow channel area may also be referred to as the second airflow channel area, and the second airflow channel area may also be referred to as the first airflow channel area. In the description of the embodiments of the present disclosure, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0046] In the embodiments of the present disclosure, unless otherwise clearly specified and limited, the terms "connected", "connected", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a flexible connection, or a rigid connection along at least one direction; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or directly connected with the presence of an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly limited. The terms "installed", "set", "fixed", etc. can be broadly understood as connection. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0047] As used herein, the terms "layer" and "region" refer to a portion of a material including an area having a certain thickness. A layer can extend horizontally, vertically and / or along a tapered surface. A layer can be an area of ​​a uniform or non-uniform continuous structure, and its thickness perpendicular to the extension direction may not be greater than the thickness of the continuous structure. A layer can include multiple layers. The shapes of various areas and layers in the drawings and their relative sizes and positional relationships are only exemplary, and may actually deviate due to manufacturing tolerances or technical limitations, and the design can be adjusted according to actual needs.

[0048] See also Figure 1 , Figure 1The fixture 100 provided in the embodiment of the present disclosure includes a suction cup 1 , an insulating heat-conducting cup 2 , a temperature-controlling cup 3 and an insulating connector 8 .

[0049] The suction cup 1 has a suction surface 101. The suction surface 101 also serves as the main working surface of the fixture 100. In order to test the wafer, the wafer needs to be stably positioned. The wafer can be attached to the suction surface 101 and firmly adsorbed by the suction cup 1. For example, the suction cup 1 can be provided with a plurality of air holes 111 ( Figure 3 ), the gas near the suction surface 101 is sucked away through the air holes 111, and then the wafer can be adsorbed by air pressure.

[0050] The suction cup 1, the insulating heat-conducting cup 2 and the temperature-controlling cup 3 can be arranged in sequence along the Z-axis direction. The insulating heat-conducting cup 2 is located on the side of the suction cup 1 that faces away from the suction surface 101; and the temperature-controlling cup 3 is located on the side of the insulating heat-conducting cup 2 that faces away from the suction cup 1. For example, when in use, the suction cup 1 can be located on the upper side, and the insulating heat-conducting cup 2 and the temperature-controlling cup 3 can be located on the lower side of the suction cup 1 in sequence.

[0051] The temperature control plate 3, the insulating heat conductive plate 2 and the suction cup 1 are thermally connected in sequence, and then the temperature change achieved by the temperature control plate 3 can be transferred to the suction cup 1 through the insulating heat conductive plate 2, and the suction cup 1 changes the temperature of the wafer thereon.

[0052] The insulating connector 8 passes through the insulating heat-conducting plate 2 to fix the suction cup 1 and the temperature control plate 3. In some embodiments, the insulating connector 8 may protrude from the suction cup 1 or the temperature control plate 3; in other embodiments, the insulating connector 8 may sink into the suction cup 1 or the temperature control plate 3. Exemplarily, the insulating connector 8 may be surface-insulated or integrally insulated. The insulating connector 8 ensures that the connection structure between the suction cup 1 and the temperature control plate 3 is an insulating structure.

[0053] The fixture 100 provided in the embodiment of the present disclosure is used for wafer testing, specifically for high-voltage testing. The fixture 100 can not only ensure that the wafer is under a suitable temperature environment to withstand high voltage, but also ensure the safety of the test, thereby preventing the voltage borne by the suction cup 1 from breaking through the temperature control plate.

[0054] In some embodiments, the flatness of the suction surface 101 is within 20 μm.

[0055] Combination Figure 2 and Figure 4 As shown, Figure 2 1 shows the application state of the fixture in the embodiment of the present disclosure. In some embodiments, the wafer testing system includes a test machine and a fixture 100, the test machine includes a T-axis upper plate 200, and the fixture 100 can be fixed to the T-axis upper plate 200. Exemplarily, the total thickness of the fixture 100 after assembly, that is, the dimension along the Z-axis direction, can be 24.5 mm.

[0056] refer to Figure 3 In some embodiments, the suction cup 1 has a plurality of airflow channel areas arranged in sequence from the inside to the outside, which can be used to absorb wafers of different sizes. Exemplarily, the suction cup 1 has a first airflow channel area 11, a second airflow channel area 12, a third airflow channel area 13 and a fourth airflow channel area 14 from the outside to the inside. Each airflow channel area is connected to the suction surface 101 through a plurality of air holes 111. The size of the airflow channel area can be designed according to the adaptability of the wafer size, for example, for absorbing 8-inch or 12-inch wafers. At least one airflow channel area can be used to absorb a wafer, for example, the third airflow channel area 13 and the fourth airflow channel area 14 can be used to absorb an 8-inch wafer; for example, all the airflow channel areas can be used to absorb a 12-inch wafer.

[0057] Exemplarily, the air holes 111 of the suction surface 101 are densely distributed, which helps to make the suction force on the wafer uniform, thereby helping to avoid the wafer being damaged by suction cracking.

[0058] refer to Figure 1 , Figure 5 and Figure 6 In some embodiments, the insulating connector 8 includes an insulating sleeve 4 and a connector 5. The insulating sleeve 4 includes a sleeve body 41 and a flange 42 connected to one end of the sleeve body 41, and the outer diameter of the flange 42 is larger than the outer diameter of the sleeve body 41. The connector 5 is inserted into the insulating sleeve 4. The connector 5 includes a first connecting portion 501 and a second connecting portion 502. The first connecting portion 501 and the second connecting portion 502 can be an integrated structure or a structure assembled separately.

[0059] For the insulating connector 8, the second connecting portion 502 is located at one end of the flange 42 facing away from the sleeve 41, the second connecting portion 502 abuts against the flange 42, and the first connecting portion 501 protrudes from the other end of the sleeve 41. In some embodiments, one of the suction cup 1 and the temperature control disc 3 is connected to the first connecting portion 501, and the other is fastened by the flange 42.

[0060] like Figure 5 As shown, in some embodiments, the flange 42 is located on the side of the temperature control disk 3 facing away from the insulating heat conductive disk 2 and abuts against the temperature control disk 3. The sleeve 41 passes through the temperature control disk 3; the sleeve 41 can also be inserted into the insulating heat conductive disk 2. The connector 5 is inserted into the insulating sleeve 4, specifically, the connector 5 passes through the temperature control disk 3 and the insulating heat conductive disk 2. Exemplarily, the thickness of the portion of the temperature control disk 3 at the sleeve 41 can be thinner than other portions.

[0061] The first connection part 501 of the connection member 5 is connected to the suction cup 1 and there is a distance between the first connection part 501 and the suction surface 101, which ensures that the suction surface 101 is complete and flat. The second connection part 502 of the connection member 5 is located at the end of the flange 42 facing away from the sleeve 41, and the second connection part 502 abuts against the flange 42. The second connection part 502 presses the temperature control disk 3 and the insulating heat conductive disk 2 against the suction cup 1 by pressing the flange 42.

[0062] In other embodiments, the first connection portion 501 of the connection member 5 may be connected to the temperature control plate 3, and the flange 42 abuts against the suction cup 1. The connection member 5 may be disposed at the periphery of the air flow channel region.

[0063] Exemplarily, the first connecting part 501 is a screw rod, and the second connecting part 502 is a nut, and the nut and the screw rod can be fixedly connected to form an integrated structure. The suction cup 1 can be provided with an internal thread. The screw rod is threadedly connected to the suction cup 1. Exemplarily, the second connecting part 502 is a nut threadedly connected to the screw rod. The connecting member 5 can be firmly and detachably connected to the suction cup 1.

[0064] For example, the first connection part 501 and the second connection part 502 can be directly connected together; the first connection part 501 is a full-length screw. Figure 6 As shown, the connecting member 5 further includes a connecting rod 503 , and the first connecting portion 501 and the second connecting portion 502 are connected by the connecting rod 503 .

[0065] Exemplarily, the insulating sleeve 4 is a Teflon insulating sleeve or a polyetheretherketone insulating sleeve. The insulating sleeve 4 can achieve insulation and can be installed smoothly. Exemplarily, the insulating heat-conducting plate 2 is a ceramic plate.

[0066] In other embodiments, the entire material of the insulating connector 8 is insulating material.

[0067] refer to Figure 5 and Figure 6 In some embodiments, the fixture 100 also includes a heating plate 6. The heating plate 6 is attached to the side of the temperature control disk 3 facing away from the insulating heat conductive disk 2. The insulating connector 8 passes through the heating plate 6, the temperature control disk 3 and the insulating heat conductive disk 2 in sequence and is connected to the suction cup 1. With this arrangement, the temperature control disk 3 can be used to achieve low temperatures, and the heating plate 6 can be used to achieve high temperatures. The temperature control disk 3 is closer to the suction cup 1 than the heating plate 6, which helps to ensure the cooling ability of the fixture 100. The fixture 100 provided in the embodiment of the present disclosure can achieve a temperature environment of -55°C to 150°C for three-temperature wafer testing. The temperature uniformity on the surface of the suction cup 1 can be maintained within ±1°C.

[0068] A plurality of bosses with a height of 7 mm can be provided on the side of the temperature control disk 3 facing away from the insulating heat conducting disk 2 , and the space formed by the temperature control disk 3 is used for mounting the heating plate 6 made of silicone material.

[0069] refer to Figure 1 and Figure 6 In some embodiments, the temperature control disk 3 has a flow channel 310 for the heat transfer medium to flow. Exemplarily, the temperature control disk 3 includes a temperature control disk body 31 and a flow channel cover plate 32. The temperature control disk body 31 opens a flow channel 310, and the cross-sectional size of the flow channel 310 can be 6mm*6mm. The thickness of the space above the flow channel 310 is, for example, 7.5mm, and the thickness below is, for example, 4mm. The flow channel cover plate 32 is covered on the flow channel 310, and the two can be welded and sealed.

[0070] refer to Figure 1 and Figure 4 The flow channel 310 has a flow channel opening 311 connected to the outside of the temperature control disk 3. The flow channel opening 311 is used to connect to the stainless steel straight-through connector, and then connected to the chiller through the stainless steel straight-through connector and the Teflon corrugated hose. The heat-conducting medium in the flow channel 310 of the fixture 100 can circulate to maintain the cooling capacity of the temperature control disk 3 and keep the temperature stable.

[0071] refer to Figure 1 and Figure 5 Exemplarily, the fixture 100 further includes a temperature sensor 9. The temperature sensor 9 may be, for example, an E5CC thermostat. The temperature of the fixture 100 can control the temperature fluctuation within ±0.3°C.

[0072] Exemplarily, the temperature sensor 9 is located on the side of the temperature control disk 3 facing away from the insulating heat conducting disk 2, and the temperature sensor 9 is located at the center of the temperature control disk 3. When the heating plate 6 is provided, the temperature sensor 9 may pass through the heating plate 6.

[0073] Exemplarily, the fixture 100 for wafer testing further includes an insulating pressing block 90. ​​The temperature sensor 9 is provided through the insulating pressing block 90, and the temperature sensor 9 is connected to the temperature control plate 3 through the insulating pressing block 90. ​​Such a configuration avoids the temperature sensor 9 from being directly connected to the suction cup 1, and avoids the temperature sensor 9 from being broken down. The insulating pressing block 90 can be a ceramic pressing block to ensure the sensitive response of the temperature sensor.

[0074] Exemplarily, the temperature control disk 3 has a fixing hole 33 that avoids the flow channel 310, and the fixing hole 33 penetrates the body of the temperature control disk 3 along the Z-axis direction. The flow channel 310 is connected to the outer periphery of the temperature control disk 3, and the double-start thread shape of the flow channel 310 in the XY plane can avoid the position of the fixing hole 33. One end of the insulating connector 8 is a flange 42, and the insulating connector 8 is inserted into the fixing hole 33, and abuts against a portion of the temperature control disk 3 at the edge of the fixing hole 33 through the flange 42.

[0075] In some embodiments, the fixture 100 further includes a temperature-isolating plate 7, which may be a ceramic plate. The temperature-isolating plate 7 is disposed below the temperature-controlling plate 3, for example, below the heating plate 6. The temperature-isolating plate 7 can isolate the temperature-controlling plate 3 and the heating plate 6 of the fixture 100 from the T-axis upper plate 200.

[0076] Exemplarily, a connection block 52 is provided under the temperature-isolating plate 7. The connection block 52 can support the avoidance space and can be used to connect with the T-axis upper plate 200. The connection block 52 is connected to the temperature-isolating plate 7 by using a first connection bolt 50.

[0077] Exemplarily, the temperature-isolating plate 7 is fixed to the temperature-controlling plate 3 by using the second connecting bolts 51 . The second connecting bolts 51 avoid the flow channel 310 .

[0078] refer to Figure 4 , Figure 6 and Figure 7 Each air flow channel area is connected to the outer periphery of the suction cup 1. Each air flow channel area can be provided with an air flow channel opening 112. The external air pump can extract the gas of the corresponding air flow channel area through the air flow channel opening 112.

[0079] Exemplarily, a plurality of air channels 102 may be provided in each air channel region, and the cross-sectional area of ​​each air channel 102 is larger than the cross-sectional area of ​​the air holes 111. The air channels 102 are connected to the densely distributed air holes 111. The air channel openings 112 are connected to the air holes 111 through the air channels 102, which helps to balance the suction of the air holes 111.

[0080] The technical features of the embodiments disclosed above can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The above disclosed embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of patent protection of the utility model. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the scope of patent protection required by the utility model. Therefore, the scope of patent protection of the utility model shall be based on the attached claims.

Claims

1. A fixture for wafer testing, characterized in that: include: A suction cup (1) having a suction surface (101); An insulating heat-conducting plate (2) located on a side of the suction cup (1) facing away from the suction surface (101); A temperature control plate (3) is located on a side of the insulating heat-conducting plate (2) facing away from the suction cup (1), and the temperature control plate (3), the insulating heat-conducting plate (2) and the suction cup (1) are thermally connected in sequence; and An insulating connector (8) passes through the insulating heat-conducting plate (2) to fix the suction cup (1) and the temperature-control plate (3).

2. The fixture for wafer testing according to claim 1, characterized in that: The insulating connector (8) comprises an insulating sleeve (4) and a connector (5), wherein the connector (5) is inserted into the insulating sleeve (4), wherein the insulating sleeve (4) comprises a sleeve body (41) and a flange (42) connected to one end of the sleeve body (41), wherein the connector (5) comprises a first connecting portion (501) and a second connecting portion (502), wherein the second connecting portion (502) is located at an end of the flange (42) facing away from the sleeve body (41), wherein the second connecting portion (502) abuts against the flange (42), and wherein the first connecting portion (501) protrudes from the other end of the sleeve body (41); One of the suction cup (1) and the temperature control cup (3) is connected to the first connection portion (501), and the other is fastened by the flange (42).

3. The fixture for wafer testing according to claim 2, characterized in that: The flange (42) is located on a side of the temperature control disk (3) facing away from the insulating heat conducting disk (2) and abuts against the temperature control disk (3), and the sleeve (41) passes through the temperature control disk (3); The connecting member (5) passes through the temperature control plate (3) and the insulating heat-conducting plate (2); the first connecting portion (501) of the connecting member (5) is connected to the suction cup (1) and there is a distance between the first connecting portion (501) and the suction surface (101); the second connecting portion (502) of the connecting member (5) is located at an end of the flange (42) facing away from the sleeve (41), and the second connecting portion (502) abuts against the flange (42).

4. The fixture for wafer testing according to claim 2, characterized in that: The first connecting part (501) is a screw rod, the second connecting part (502) is a nut, and the screw rod is threadedly connected to the suction cup (1).

5. The fixture for wafer testing according to claim 2, characterized in that: The insulating sleeve (4) is a Teflon insulating sleeve or a polyetheretherketone insulating sleeve.

6. The fixture for wafer testing according to claim 1, characterized in that: It also includes a heating plate (6), wherein the heating plate (6) is attached to a side of the temperature control plate (3) facing away from the insulating heat-conducting plate (2); the insulating connecting piece (8) passes through the heating plate (6), the temperature control plate (3) and the insulating heat-conducting plate (2) in sequence and is connected to the suction cup (1).

7. The fixture for wafer testing according to claim 1, characterized in that: The temperature control disk (3) has a flow channel (310) for the circulation of a heat-conducting medium and a fixing hole (33) that avoids the flow channel (310), and the flow channel (310) is connected to the outer periphery of the temperature control disk (3); One end of the insulating connector (8) is a flange (42), and the insulating connector (8) is inserted into the fixing hole (33) and abuts against a portion of the temperature control disk (3) at the edge of the fixing hole (33) through the flange (42).

8. The fixture for wafer testing according to claim 1, characterized in that: The suction cup (1) has a plurality of air flow channel areas which are sequentially arranged from the inside to the outside, each of the air flow channel areas is connected to the suction surface (101) via a plurality of air holes (111), and each of the air flow channel areas is respectively connected to the outer periphery of the suction cup (1).

9. The fixture for wafer testing according to claim 1, characterized in that: It also comprises a temperature sensor (9), wherein the temperature sensor (9) is located on the side of the temperature control disk (3) facing away from the insulating heat conducting disk (2), and the temperature sensor (9) is located in the center of the temperature control disk (3).

10. The fixture for wafer testing according to claim 9, characterized in that: It also comprises an insulating pressing block (90), the temperature sensor (9) is inserted through the insulating pressing block (90), and the temperature sensor (9) is connected to the temperature control disk (3) through the insulating pressing block (90).

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