H-bridge module control circuit

By using ARM processor and acquisition module in the H-bridge module control circuit, the voltage and temperature signals are directly collected and processed, the problem of high cost of AD sampling chips is solved, which reduces the overall cost and improves the computing power and fault processing capabilities.

CN222281091UActive Publication Date: 2024-12-31WUHAN JINPAN INTELLIGENT TECH CO LTD +1
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Patent Information

Application Number
CN202421660812.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-15
Publication Date
2024-12-31
Estimated Expiration
2034-07-15

AI Technical Summary

Technical Problem

In the H-bridge module control circuit of high-voltage cascade SVG, the cost of AD sampling chip is high, resulting in an increase in overall cost.

Method used

Using ARM processor, voltage sampling module and IGBT temperature acquisition module, through the AD port and SPI communication of the ARM processor, voltage and temperature signals are directly collected and transmitted, replacing the AD sampling chip, reducing the cost of the H-bridge module control circuit.

Benefits of technology

The acquisition and processing of voltage signals and temperature signals is completed through the ARM processor, which avoids the use of AD sampling chips, reduces the cost of the H-bridge module control circuit, and improves the computing power and fault processing capabilities.

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Abstract

The utility model discloses an H-bridge module control circuit, and relates to the technical field of H-bridge module control. A voltage signal collected by a voltage sampling module is input into an ARM processor through an AD port of the ARM processor for AD conversion; a temperature signal output by the IGBT temperature acquisition module can be directly input into the ARM processor for decoding; the ARM processor transmits the processed voltage signal and temperature signal to the complex programmable logic device through SPI communication, so that the acquisition of the voltage signal and the temperature signal can be completed through the ARM processor, an AD sampling chip is not needed, the cost of the ARM processor is low, and the cost of the H-bridge module control circuit is reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of H-bridge module control, in particular to an H-bridge module control circuit. Background Art

[0002] High-voltage cascade SVG (static var generator) uses turn-off power electronic devices (IGBT) to form a self-commutated H-bridge circuit, which is connected in parallel to the power grid through a reactor. By properly adjusting the amplitude and phase of the output voltage on the AC side of the bridge circuit or directly controlling its AC side current, it can quickly absorb or emit the required reactive power, thereby achieving the purpose of rapid dynamic reactive adjustment.

[0003] At present, the H-bridge module of the high-voltage cascade SVG is controlled by a single-chip CPLD (complex programmable logic device) to realize functions such as optical fiber communication conversion and SPI control sampling. The external temperature and voltage signals are sampled by an AD sampling chip and then transmitted to the CPLD. The cost of the AD sampling chip is high, which leads to the high cost of the H-bridge module control circuit. Utility Model Content

[0004] The utility model solves the technical problem of how to reduce the cost of the H-bridge module control circuit by providing an H-bridge module control circuit.

[0005] The utility model provides the following technical solutions:

[0006] An H-bridge module control circuit includes a complex programmable logic device, an ARM processor, a voltage sampling module and an IGBT temperature acquisition module;

[0007] The output end of the voltage sampling module is connected to the AD port of the ARM processor;

[0008] The output end of the IGBT temperature acquisition module is connected to the ARM processor;

[0009] The complex programmable logic device is connected to the ARM processor via SPI communication.

[0010] Optionally, the voltage sampling module includes a first resistor, a second resistor and a capacitor;

[0011] The input end of the voltage sampling module is grounded via a first resistor and connected to the AD port of the ARM processor via a second resistor. The common end of the second resistor and the AD port of the ARM processor is grounded via a capacitor.

[0012] Optionally, the model of the ARM processor is STM32 series.

[0013] Optionally, the voltage sampling module has 6 outputs, and the output ends of the 6 voltage sampling modules are respectively connected to pin 10, pin 11, pin 12, pin 13, pin 14, and pin 15 of the ARM processor in a one-to-one correspondence.

[0014] Optionally, the output ends of the four IGBT temperature acquisition modules are connected to pins 42, 43, 45 and 46 of the ARM processor respectively and in a one-to-one correspondence.

[0015] Optionally, the model of the complex programmable logic device is EPM1270 series.

[0016] Optionally, pin 25, pin 26, pin 27 and pin 28 of the ARM processor are respectively connected to pin 72, pin 71, pin 70 and pin 69 of the complex programmable logic device in a one-to-one correspondence.

[0017] The technical solution provided by the utility model has at least the following technical effects or advantages:

[0018] The voltage signal collected by the voltage sampling module of the utility model is input into the ARM processor through the AD port of the ARM processor for AD conversion; the temperature signal output by the IGBT temperature collection module can be directly input into the ARM processor for decoding; the ARM processor transmits the processed voltage signal and temperature signal to the complex programmable logic device through SPI communication, so that the collection of voltage signal and temperature signal can be completed by the ARM processor, and no AD sampling chip is required. The cost of the ARM processor is low, which reduces the cost of the H-bridge module control circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 This is a structural block diagram of the H-bridge module control circuit in the embodiment of the utility model;

[0021] Figure 2 This is a circuit diagram of a voltage sampling module in an embodiment of the utility model;

[0022] Figure 3 A circuit diagram of an ARM processor in an embodiment of the present utility model;

[0023] Figure 4The circuit diagram of the complex programmable logic device in the embodiment of the utility model is shown in FIG. DETAILED DESCRIPTION

[0024] The embodiment of the utility model solves the technical problem of how to reduce the cost of the H-bridge module control circuit by providing an H-bridge module control circuit.

[0025] In order to better understand the technical solution of the present invention, the technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0026] like Figure 1 As shown, the H-bridge module control circuit of the embodiment of the utility model includes a complex programmable logic device, an ARM processor, a voltage sampling module and an IGBT temperature acquisition module; the output end of the voltage sampling module is connected to the AD port of the ARM processor; the output end of the IGBT temperature acquisition module is connected to the ARM processor; the complex programmable logic device and the ARM processor are connected via SPI communication.

[0027] Among them, the voltage sampling module can collect the output voltage and DC bus voltage of the 15V DC voltage source; the voltage sampling module can have multiple channels to collect the 15V power supply voltage and DC bus voltage of each unit respectively; the IGBT temperature acquisition module is used to collect the temperature of each IGBT in the H-bridge module.

[0028] In the embodiment of the utility model, the voltage signal collected by the voltage sampling module is input into the ARM processor through the AD port of the ARM processor for AD conversion; the temperature signal output by the IGBT temperature acquisition module can be directly input into the ARM processor for decoding; the ARM processor transmits the processed voltage signal and temperature signal to the complex programmable logic device through SPI communication, so that the voltage signal and temperature signal can be collected by the ARM processor without the need for an AD sampling chip. The cost of the ARM processor is low, which reduces the cost of the H-bridge module control circuit.

[0029] Take the STM32 series ARM processor and the EPM1270 series complex programmable logic device as examples. Figure 2 and Figure 3 As shown, the voltage sampling module has 6 channels, and the output ends of the 6-channel voltage sampling modules are connected to the 10th pin, the 11th pin, the 12th pin, the 13th pin, the 14th pin, and the 15th pin of the ARM processor respectively. The output ends of the 4-channel IGBT temperature acquisition module are connected to the 42nd pin, the 43rd pin, the 45th pin, and the 46th pin of the ARM processor respectively. Figure 3 and Figure 4As shown, pins 25, 26, 27 and 28 of the ARM processor are connected to pins 72, 71, 70 and 69 of the complex programmable logic device in a one-to-one correspondence. The voltage sampling module may include a first resistor, a second resistor and a capacitor; the input end of the voltage sampling module is also connected to the ground through the first resistor and to the AD port of the ARM processor through the second resistor, and the common end of the second resistor and the AD port of the ARM processor is grounded through the capacitor.

[0030] like Figure 2 As shown, for the first voltage sampling module, the input end of the voltage sampling module is VIN1, the first resistor is resistor R12, the second resistor is resistor R4, the capacitor is C7, and the output end of the voltage sampling module is V1; for the second voltage sampling module, the input end of the voltage sampling module is VIN2, the first resistor is resistor R16, the second resistor is resistor R15, the capacitor is C9, and the output end of the voltage sampling module is V2; for the third voltage sampling module, the input end of the voltage sampling module is VIN3, the first resistor is resistor R18, the second resistor is resistor R17, the capacitor is C10, and the output end of the voltage sampling module is V3; The 4th voltage sampling module, the input end of the voltage sampling module is VIN4, the first resistor is resistor R13, the second resistor is resistor R11, the capacitor is C8, and the output end of the voltage sampling module is V4; for the 5th voltage sampling module, the input end of the voltage sampling module is VIN5, the first resistor is resistor R14, the second resistor is resistor R167, the capacitor is C128, and the output end of the voltage sampling module is V5; for the 6th voltage sampling module, the input end of the voltage sampling module is VIN6, the first resistor is resistor R175, the second resistor is resistor R174, the capacitor is C129, and the output end of the voltage sampling module is V6. The AD port of the ARM processor includes its pins 10, 11, 12, 13, 14, and 15.

[0031] The temperature signals output by the 4-channel IGBT temperature acquisition module are TMP1, TMP2, TMP3, and TMP4. The 25th, 26th, 27th, and 28th pins of the STM32 series chip and the 72nd, 71st, 70th, and 69th pins of the CPLD are connected by SPI communication. In addition, Figure 4 RD1 and RD2 are optical fiber receiving signals, and TD1 and TD2 are optical fiber sending signals. ARM processors and CPLDs also include some common peripheral circuits, such as debugging circuits, power supply circuits, etc., which are not described here.

[0032] In addition, since the ARM processor has certain computing power and excellent computing power in voltage data filtering and fault identification processing, the ARM processor can reduce the computing power consumption of the host computer main control module. The ARM processor can also quickly process key local fault signals, quickly seal the pipe and notify the main control of the fault when there is a fault, and the whole machine stops running: the module self-check function can be realized through the IO port control of the ARM processor and CPLD, and the module fault and fault point can be quickly determined.

[0033] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present invention.

[0034] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. An H-bridge module control circuit, characterized in that: Including complex programmable logic devices, ARM processors, voltage sampling modules and IGBT temperature acquisition modules; The output end of the voltage sampling module is connected to the AD port of the ARM processor; The output end of the IGBT temperature acquisition module is connected to the ARM processor; The complex programmable logic device is connected to the ARM processor via SPI communication.

2. The H-bridge module control circuit according to claim 1, characterized in that: The voltage sampling module includes a first resistor, a second resistor and a capacitor; The input end of the voltage sampling module is grounded via a first resistor and connected to the AD port of the ARM processor via a second resistor. The common end of the second resistor and the AD port of the ARM processor is grounded via a capacitor.

3. The H-bridge module control circuit according to claim 1, characterized in that: The model of the ARM processor is STM32 series.

4. The H-bridge module control circuit according to claim 3, characterized in that: The voltage sampling module has 6 outputs, and the output ends of the 6 outputs of the voltage sampling module are respectively connected to pins 10, 11, 12, 13, 14, and 15 of the ARM processor in a one-to-one correspondence.

5. The H-bridge module control circuit according to claim 3, characterized in that: The output ends of the 4 IGBT temperature acquisition modules are respectively connected to pins 42, 43, 45 and 46 of the ARM processor in a one-to-one correspondence.

6. The H-bridge module control circuit according to claim 3, characterized in that: The model of the complex programmable logic device is EPM1270 series.

7. The H-bridge module control circuit according to claim 6, characterized in that: Pin No. 25, Pin No. 26, Pin No. 27, and Pin No. 28 of the ARM processor are respectively connected to Pin No. 72, Pin No. 71, Pin No. 70, and Pin No. 69 of the complex programmable logic device in a one-to-one correspondence.