Semiconductor heating plate

Abstract

The utility model relates to the technical field of semiconductor heating, and particularly discloses a semiconductor heating plate, which comprises a shell, a mounting groove is formed in the shell, a heating plate is mounted in the mounting groove, and a plurality of groups of anti-static fixing blocks are fixedly connected in the mounting groove. Clamping grooves matched with the heating disc are formed in the upper end faces of the multiple sets of anti-static fixing blocks, multiple sets of anti-static guide columns distributed with the anti-static fixing blocks at intervals are installed in the installation groove, the heating disc can be supported through the multiple sets of anti-static fixing blocks, and meanwhile the heating disc is located in the clamping grooves; the heating disc can be limited and fixed through the anti-static guide columns, the heating disc can be installed and positioned through the anti-static guide columns, the heating disc is stably installed in the shell, the heating disc can be limited, and the effect that the heating disc is stably installed is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor heating, in particular to a semiconductor heating plate. Background Art

[0002] In the semiconductor manufacturing process, a heating plate in the semiconductor manufacturing equipment is needed to soft-bake the wafer after the coating process, and to heat the wafer by inputting heated gas into the chamber.

[0003] At present, the semiconductor heating plate is directly placed inside the shell during installation, and there is no structure to limit and fix the heating plate, which leads to unstable installation of the heating plate. The heating plate is prone to displacement after long-term use, affecting the uniformity of heating. Therefore, it is necessary to propose a semiconductor heating plate to solve the above-mentioned problems. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor heating plate, which has the characteristics of positioning the heating plate for installation and then limiting the heating plate, so as to achieve the effect of stable installation of the heating plate, and secondly can increase the heating area, thereby improving the heating effect of subsequent use.

[0005] To achieve the above object, the utility model provides the following technical solutions: a semiconductor heating plate, comprising a shell, a mounting groove is provided inside the shell, a heating plate is installed inside the mounting groove, a plurality of groups of anti-static fixing blocks are fixedly connected inside the mounting groove, a plurality of groups of anti-static fixing blocks are provided with slots matching the heating plate on the upper end surfaces, and a plurality of groups of anti-static guide columns spaced apart from the anti-static fixing blocks are installed inside the mounting groove;

[0006] The upper end surface of the shell is installed with a cover located in the installation groove, the upper end surface of the cover is installed with a connection plate, and the outer side of the connection plate is fixedly connected with an extension portion extending to the outside of the cover.

[0007] In order to ensure that the heat of the heating plate is transferred to the connecting plate, as a preferred semiconductor heating plate of the utility model, a heat conducting plate is installed between the sealing cover and the connecting plate.

[0008] In order to insulate the lower end surface of the extension part, as a preferred semiconductor heating plate of the present invention, a heat insulation pad is installed on the lower end surface of the extension part, and a handle is fixedly connected to the lower end surface of the heat insulation pad.

[0009] In order to limit and fix the heating plate, as a preferred semiconductor heating plate of the present invention, multiple groups of anti-static fixing blocks and anti-static guide columns are arranged in a line.

[0010] In order to energize the heating disk, as a preferred semiconductor heating disk of the present invention, the front end surface of the shell is provided with a wiring port.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0012] The utility model firstly supports the heating plate through multiple groups of anti-static fixing blocks, and at the same time makes the heating plate located in the card slot, thereby realizing the limiting fixation of the heating plate, and the installation positioning of the heating plate can be realized through multiple groups of anti-static guide columns, so that the heating plate can be stably installed in the shell, thereby realizing the limiting fixation of the heating plate, and achieving the effect of stable installation of the heating plate, secondly, the heating plate can be sealed and installed in the shell by the sealing cover, and the heating area can be increased by arranging the connecting plate, thereby improving the heating effect of subsequent use, and the extension part is convenient for hand-held disassembly of the sealing cover and the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is the overall structure diagram of the utility model;

[0014] Figure 2 This is a bottom view of the connection plate and the cover of the utility model;

[0015] Figure 3 This is a diagram of the internal structure of the housing of the utility model;

[0016] Figure 4 This is a structural diagram of the connection disk of the utility model.

[0017] In the figure: 1. Shell; 101. Mounting slot; 2. Antistatic fixing block; 201. Card slot; 202. Antistatic guide column; 3. Cover; 301. Heat conduction plate; 4. Connection plate; 401. Handle; 402. Heat insulation pad. DETAILED DESCRIPTION

[0018] See also Figures 1 to 4 A semiconductor heating plate comprises a shell 1, a mounting groove 101 is provided inside the shell 1, a heating plate is installed inside the mounting groove 101, a plurality of groups of antistatic fixing blocks 2 are fixedly connected inside the mounting groove 101, a plurality of groups of antistatic fixing blocks 2 are provided with slots 201 matching the heating plate on the upper end surfaces, and a plurality of groups of antistatic guide columns 202 spaced apart from the antistatic fixing blocks 2 are installed inside the mounting groove 101;

[0019] The upper end surface of the housing 1 is mounted with a cover 3 located in the mounting groove 101 , the upper end surface of the cover 3 is mounted with a connection plate 4 , and the outer side of the connection plate 4 is fixedly connected with an extension portion extending to the outside of the cover 3 .

[0020] In the present embodiment: the heating plate is installed in the installation groove 101, and the heating plate can be supported by multiple sets of anti-static fixing blocks 2, and the heating plate is located in the card slot 201 at the same time, so as to achieve the limit fixation of the heating plate, and the installation positioning of the heating plate can be achieved by multiple sets of anti-static guide columns 202, so that the heating plate can be stably installed in the shell 1, and then the limit of the heating plate can be achieved, so as to achieve the effect of stable installation of the heating plate, and secondly, the heating plate can be sealed and installed in the shell 1 by the cover 3, and the heating area can be increased by setting the connecting plate 4, so as to improve the heating effect of subsequent use, and the extension part is convenient for hand-held disassembly of the cover 3 and the shell 1.

[0021] As a technical optimization solution of the present invention, a heat conducting plate 301 is installed between the sealing cover 3 and the connecting plate 4 .

[0022] In this embodiment, the heat from the heating plate can be transferred to the connecting plate 4 through the heat conducting plate 301 .

[0023] As a technical optimization solution of the present invention, a heat insulating pad 402 is installed on the lower end surface of the extension portion, and a handle 401 is fixedly connected to the lower end surface of the heat insulating pad 402 .

[0024] In this embodiment: the lower end surface of the extension portion can be insulated by the heat insulation pad 402 to prevent the heat of the heating plate from being transferred to the handle 401. The handle 401 facilitates the removal of the connecting plate 4 and the cover 3.

[0025] As a technical optimization solution of the present utility model, multiple groups of anti-static fixing blocks 2 and anti-static guide pillars 202 are arranged in a line.

[0026] In this embodiment, the heating plate can be fixed in position by arranging a plurality of anti-static fixing blocks 2 and anti-static guide pillars 202 in a straight line.

[0027] As a technical optimization solution of the present invention, a wiring port is provided on the front end surface of the housing 1 .

[0028] In this embodiment: the heating plate can be powered through the wiring port.

[0029] Working principle: first, install the heating plate in the installation groove 101, and support the heating plate through multiple sets of anti-static fixing blocks 2, and make the heating plate located in the card slot 201 at the same time, so as to achieve the limit fixation of the heating plate, and the installation positioning of the heating plate can be achieved through multiple sets of anti-static guide columns 202, so that the heating plate can be stably installed in the shell 1, so as to achieve the limit fixation of the heating plate, and achieve the effect of stable installation of the heating plate, and secondly, the heating plate can be sealed and installed in the shell 1 through the cover 3, and the heating area can be increased by setting the connecting plate 4, so as to improve the heating effect of subsequent use, and the extension part is convenient for hand-held disassembly of the cover 3 and the shell 1.

[0030] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor heating plate, comprising a housing (1), wherein a mounting groove (101) is provided inside the housing (1), and a heating plate is installed inside the mounting groove (101), characterized in that: A plurality of groups of antistatic fixing blocks (2) are fixedly connected inside the installation groove (101), and upper end surfaces of the plurality of groups of antistatic fixing blocks (2) are provided with a slot (201) matching the heating plate, and a plurality of groups of antistatic guide columns (202) are installed inside the installation groove (101) and are spaced apart from the antistatic fixing blocks (2); The upper end surface of the shell (1) is mounted with a cover (3) located in the mounting groove (101), the upper end surface of the cover (3) is mounted with a connection plate (4), and the outer side of the connection plate (4) is fixedly connected with an extension portion extending to the outside of the cover (3).

2. A semiconductor heating plate according to claim 1, characterized in that: A heat conducting plate (301) is installed between the sealing cover (3) and the connecting plate (4).

3. A semiconductor heating plate according to claim 1, characterized in that: A heat insulating pad (402) is installed on the lower end surface of the extension portion, and a handle (401) is fixedly connected to the lower end surface of the heat insulating pad (402).

4. A semiconductor heating plate according to claim 1, characterized in that: The plurality of groups of antistatic fixing blocks (2) and antistatic guide columns (202) are arranged in a line.

5. A semiconductor heating plate according to claim 1, characterized in that: The front end surface of the housing (1) is provided with a wiring port.

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