Chip bonding structure and bonding device
Through the coordination of multiple loading fixtures stacking and fixing components, precise docking and synchronous bonding of the chip are achieved, solving the problem of low bonding efficiency of small chips after the whole wafer is cut, improving bonding efficiency and reducing The occurrence of solder joint problems.
Patent Information
- Application Number
- CN202421023713.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-11
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-05-11
AI Technical Summary
In the existing chip bonding process, the bonding efficiency of the small chip after the whole wafer is cut is low, and problems such as solder joint cracking, offset and holes are prone to occur.
Multiple loading fixtures are laminated, with fixed areas and fixing components, and precise docking and synchronous bonding of the chip is achieved through vacuum pumps, air pipes, clamping mechanisms, deviation correction markings and heating coils, improving bonding efficiency.
The batch bonding of small-sized chips is realized, the bonding efficiency is improved, the occurrence of solder joint cracks and offsets is reduced, and the precise bonding and efficient soldering of the chip is ensured.
Smart Images
Figure CN222281943U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor bonding technology, and in particular to a chip bonding structure and a bonding device. Background Art
[0002] In the related technology, the mainstream method to improve the production capacity of chip bonding process is to bond the whole wafer and then cut it into chips of required size to improve the production capacity, but it is easy to cause problems such as solder joint cracking, offset and holes. The bonding efficiency of directly bonding the cut small chips is low. Utility Model Content
[0003] The purpose of the present application is to provide a chip bonding structure and a bonding device.
[0004] The technical solutions adopted in this application are as follows:
[0005] In a first aspect, an embodiment of the present application provides a chip bonding structure, including:
[0006] A plurality of loading jigs, wherein the plurality of loading jigs are stacked, and at least one side of the loading jig is provided with a plurality of fixing areas, and the fixing areas of two adjacent loading jigs are respectively used to place a first chip and a second chip;
[0007] A fixing component is used to fix the first chip and the second chip to the fixing area.
[0008] In one embodiment of the first aspect, the fixing assembly includes a vacuum pump and an air pipe, one end of the air pipe is connected to the vacuum pump, and one end of the air pipe away from the vacuum pump is respectively connected to the loading jig.
[0009] In one embodiment of the first aspect, each of the fixing areas is provided with a limiting groove, the sizes of the limiting grooves of two adjacent loading fixtures are respectively adapted to the first chip and the second chip, and the fixing component fixes the first chip or the second chip in the limiting groove.
[0010] In one embodiment of the first aspect, the fixing assembly includes a plurality of clamping mechanisms, each fixing area is provided with a clamping mechanism, the clamping mechanism is arranged on the outer side of the limiting groove, and the clamping mechanism is used to clamp the first chip or the second chip.
[0011] In one embodiment of the first aspect, the clamping mechanism includes at least one group of relatively arranged clamping blocks, one end of the clamping block is connected to an elastic member, and one end of the elastic member away from the clamping block is connected to the loading fixture.
[0012] In one embodiment of the first aspect, the loading jig includes a first surface and a second surface arranged opposite to each other, the first surface and the second surface are both provided with the fixing area, the first surface and the second surface are used to place the first chip and the second chip respectively, and in two adjacent loading jigs, the first surface of one loading jig is arranged adjacent to the second surface of the other loading jig.
[0013] In one embodiment of the first aspect, two opposite surfaces of each loading jig are respectively provided with a protrusion and a recess, and two adjacent loading jigs are connected and fixed by plugging and fitting the protrusion and the recess.
[0014] In one embodiment of the first aspect, a correction line is provided on one side of the loading jig, and the multiple correction lines of different loading jigs are located on the same straight line.
[0015] In one embodiment of the first aspect, a heating coil is disposed in the loading fixture, and the heating coil is connected to an external power source.
[0016] In a second aspect, an embodiment of the present application further provides a bonding device, including:
[0017] The chip bonding structure described in any of the above embodiments;
[0018] A pressure component and a support component are respectively abutted against two opposite sides of the chip bonding structure.
[0019] Compared with the related art, the beneficial effects of the present application are as follows: the present application provides a chip bonding structure and a bonding device, which can be used for batch bonding of chips. The chip bonding structure includes multiple loading jigs and fixing components. The multiple loading jigs are stacked, and each loading jig is provided with multiple fixing areas. Under the action of the fixing components, the fixing areas of two adjacent loading jigs are respectively fixed to the first chip and the second chip. In this way, multiple first chips and second chips can be placed on each loading jig, so that during bonding, the first chip and the second chip on the two adjacent loading jigs are fitted one by one, and the chips are bonded synchronously, so as to realize batch bonding of small-size chips and improve bonding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0021] Figure 1 A schematic diagram of the structure of a chip bonding structure in some embodiments of the present application is shown;
[0022] Figure 2 The structure of the loading fixture in some embodiments of the present application is shown Figure 1 ;
[0023] Figure 3 The structure of the loading fixture in some embodiments of the present application is shown Figure 2 ;
[0024] Figure 4 The structure of the loading fixture in some embodiments of the present application is shown Figure 3 ;
[0025] Figure 5 A schematic diagram of the structure of a fixing assembly in some embodiments of the present application is shown;
[0026] Figure 6 A schematic diagram of the structure of a bonding device in some embodiments of the present application is shown;
[0027] Figure 7 The stacking structure of the loading fixture in some embodiments of the present application is shown Figure 1 ;
[0028] Figure 8 The stacking structure of the loading fixture in some embodiments of the present application is shown Figure 2 .
[0029] Description of main component symbols:
[0030] 1000-bonding device;
[0031] 100-chip bonding structure; 110-loading fixture; 111-fixing area; 112-limiting groove; 113-first surface; 114-second surface; 115-convex part; 116-concave part; 117-correction marking line; 120-fixing component; 121-vacuum pump; 122-air pipe; 130-heating coil; 140-connecting wire;
[0032] 200-pressure assembly; 300-support assembly; 400-power supply. DETAILED DESCRIPTION
[0033] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0036] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0037] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0038] The general structure of a Micro-LED display screen is that the IC (Integrated Circuit) driver chip at the bottom and the Micro-LED array chip at the top are welded together through flip-chip technology. In related technologies, in order to improve chip bonding capacity, the whole wafer is often bonded and then cut to obtain a Micro-LED display screen of the required size, but this is prone to problems such as solder joint cracking, offset and holes.
[0039] For ease of understanding, in this application, Micro-LED array chip refers to an independent chip formed by cutting from a Micro-LED wafer according to the design size. Each Micro-LED array chip includes multiple single LEDs (die) distributed in an array to form a pixel unit to achieve higher brightness and wider color gamut coverage.
[0040] The embodiment of the present application provides a chip bonding structure 100, which can be used in semiconductor bonding process, specifically for batch bonding of Micro-LED array chips. The chip bonding structure 100 provided in the present application can realize batch bonding of small-sized chips and improve bonding efficiency.
[0041] like Figure 1 As shown, the chip bonding structure 100 includes a plurality of loading jigs 110 and a fixing assembly 120. The plurality of loading jigs 110 are stacked, and at least one side of the loading jig 110 is provided with a plurality of fixing areas 111, and the fixing areas 111 of two adjacent loading jigs 110 are respectively used to place the first chip and the second chip. The fixing assembly 120 is used to fix the first chip and the second chip to the fixing area 111.
[0042] For ease of understanding, the first chip in the present application may be a Micro-LED array chip, and the second chip may be a driver chip.
[0043] Exemplarily, the "multiple" in the present application refers to a natural number greater than one. The number of loading fixtures 110 can be two, three, four, five, six, eight, ten, etc., and the number of fixed areas 111 can be twenty, thirty, fifty, eighty, one hundred, etc., and the specific selection can be made according to actual needs.
[0044] Combined Figure 2 As shown, in this embodiment, the loading jig 110 can be a rectangular box structure, and at least one of its upper and lower end faces is provided with a fixing area 111. Under the action of the fixing component 120, the first chip and the second chip are fixed to different loading jigs 110 respectively. The two adjacent loading jigs 110 arranged in a stacked manner are respectively placed with the first chip and the second chip in a one-to-one correspondence. By bonding the upper and lower loading jigs 110, which are respectively equipped with the first chip and the second chip, the solder joints of each first chip are bonded to the pads of a second chip. For example, the side of the loading jig 110 located in the lower layer with the first chip facing upward, and the side of the loading jig 110 located in the upper layer with the second chip facing downward, so that the first chip is bonded to the second chip. Of course, the upper and lower positions of the first chip and the second chip can be interchanged, which will not be elaborated here. By stacking a plurality of loading jigs 110, batch bonding of small-sized chips can be performed simultaneously under the fixation of the bonding pressure component 200.
[0045] In one embodiment, only one side of each loading jig 110 is provided with a fixing area 111 , and then every two loading jigs 110 cooperate with each other and are stacked in sequence.
[0046] In another embodiment, two opposite sides of each loading fixture 110 are provided with fixing areas 111 , so that two adjacent loading fixtures 110 form a bonding fit, further improving the bonding capacity.
[0047] like Figure 1 As shown, in some embodiments, the fixing assembly 120 includes a vacuum pump 121 and an air pipe 122 , one end of the air pipe 122 is connected to the vacuum pump 121 , and one end of the air pipe 122 away from the vacuum pump 121 is respectively connected to the loading fixture 110 .
[0048] Exemplarily, the first chip and the second chip are fixed on the loading jig 110 by vacuum adsorption, and each fixing area 111 of the loading jig 110 can be provided with an air hole, and connected to the air pipe 122 through the air hole. When the vacuum pump 121 is operating, the air hole evacuates the fixing area 111, so that the chip is adsorbed on the fixing area 111.
[0049] Combination Figure 3 and Figure 4 As shown, in some embodiments, each fixing area 111 is provided with a limiting groove 112 , and the sizes of the limiting grooves 112 of two adjacent loading fixtures 110 are respectively adapted to the first chip and the second chip, and the fixing component 120 fixes the first chip or the second chip in the limiting groove 112 .
[0050] Exemplarily, the limiting groove 112 can be a rectangular groove adapted to the chip, and accordingly, the size of the limiting groove 112 for placing the first chip is equal to or slightly larger than the outer frame size of the first chip, and the size of the limiting groove 112 for placing the second chip is equal to or slightly larger than the outer frame size of the second chip. Through the setting of the limiting groove 112, the chip is placed in the limiting groove 112 for preliminary positioning, and at the same time forms a double fixed fit with the fixing component 120.
[0051] In some embodiments, the fixing assembly 120 includes a plurality of clamping mechanisms. Each fixing area 111 is provided with a clamping mechanism. The clamping mechanism is disposed outside the limiting groove. The clamping mechanism is used to clamp the first chip or the second chip.
[0052] Exemplarily, the fixing assembly 120 may also be a mechanical clamping mechanism, such as a pneumatic clamp, etc. After the chip is placed in the limiting groove 112, it may be fixed again by the clamping mechanism.
[0053] In other embodiments, the clamping mechanism may be directly disposed in the fixing area 111 without the need for preliminary limitation by the limiting groove 112 .
[0054] like Figure 5 As shown, in some embodiments, the clamping mechanism includes at least one set of relatively arranged clamping blocks, one end of the clamping block is connected to an elastic member, and the end of the elastic member away from the clamping block is connected to the loading fixture 110.
[0055] Exemplarily, the elastic member may be a coil spring, a gas spring or a spring sheet, etc. In this embodiment, the elastic sheet may be a coil spring.
[0056] The end of the elastic member away from the clamping block can be connected to the inner wall of the limiting groove 112, so that after the chip is placed in the limiting groove 112, the two clamping blocks arranged opposite to each other respectively abut against the sides of the chip under the resetting action of the elastic sheet to clamp and fix the chip. The part of the clamping block in contact with the chip can be made of a material with low hardness such as polypropylene or polytetrafluoroethylene to reduce the risk of clamping the chip and have a certain anti-slip performance.
[0057] Combination Figure 3 and Figure 4 As shown, in some embodiments, the loading jig 110 includes a first surface 113 and a second surface 114 that are arranged opposite to each other, and the first surface 113 and the second surface 114 are both provided with a fixing area 111, and the first surface 113 and the second surface 114 are used to place the first chip and the second chip respectively. In two adjacent loading jigs 110, the first surface 113 of one loading jig 110 is arranged adjacent to the second surface 114 of the other loading jig 110.
[0058] Exemplarily, the first chip can be placed in the fixed area 111 of the first surface 113 of the loading jig 110, and the second chip can be placed in the fixed area 111 of the second surface 114 of the loading jig 110. During stacking and assembly, the first surface 113 of the loading jig 110 is placed upward, so that the second surface 114 of the upper loading jig 110 is close to the first surface 113 of the lower loading jig 110, so that the solder joints of the first chip are in contact with the solder pads of the second chip, and the first chip corresponds to the second chip one by one, so as to achieve batch welding.
[0059] Of course, in other embodiments, the first chip may be placed in the fixing area 111 of the second surface 114 of the loading jig 110 , and the second chip may be placed in the fixing area 111 of the first surface 113 of the loading jig 110 .
[0060] Combination Figure 3 and Figure 4 As shown, in some embodiments, two opposite surfaces of each loading jig 110 are respectively provided with a protrusion 115 and a recess 116 , and two adjacent loading jigs 110 are connected and fixed by plugging and fitting the protrusion 115 and the recess 116 .
[0061] Exemplarily, the first surface 113 of the loading jig 110 is provided with a raised portion 115, and the second surface 114 of the loading jig 110 is provided with a recessed portion 116. The recessed portion 116 of the upper loading jig 110 is plugged into the raised portion 115 of the lower loading jig 110 to achieve the splicing combination of the loading jigs 110 on the adjacent sides.
[0062] In this embodiment, the protrusion 115 may be a positioning pin, and the recessed portion 116 may be a positioning hole. The positioning pin is inserted into the positioning hole to achieve the splicing between the loading fixtures 110.
[0063] Of course, in other embodiments, the protrusion 115 may be disposed on the second surface 114 of the loading jig 110 , and the recess 116 may be disposed on the first surface 113 of the loading jig 110 .
[0064] Combination Figure 3 and Figure 4 As shown, in some embodiments, a correction line 117 is provided on one side of the loading jig 110 , and multiple correction lines 117 on different loading jigs 110 are located on the same straight line.
[0065] Exemplarily, the deflection correction mark 117 is set only on one side of the loading jig 110, so that the loading jigs 110 form a fixed splicing relationship. By detecting whether the deflection correction marks 117 of different loading jigs 110 are on the same straight line, the assembly alignment relationship between the loading jigs 110 is confirmed, so that the first chip and the second chip are accurately docked. The deflection correction mark 117 can be a deflection correction line or a linear groove, so that the alignment state of the deflection correction mark 117 can be accurately observed.
[0066] refer to Figure 2 As shown, in some embodiments, a heating coil 130 is disposed in the loading fixture 110 , and the heating coil 130 is connected to an external power source 400 .
[0067] For example, the heating coils 130 may be distributed around the loading jig 110, or located in the middle layer of the loading jig 110, and the heating coils 130 are connected to the external power source 400 through the connecting wires 140 to heat the first chip and the second chip on both sides at the same time. After the loading jig 110 is assembled, the heating coils 130 may be used for heating treatment to make the solder joints of the first chip and the second chip reach the bonding temperature, thereby realizing batch bonding.
[0068] like Figure 6 As shown, an embodiment of the present application further provides a bonding device 1000, which includes the chip bonding structure 100, the pressure assembly 200 and the support assembly 300 in any of the above embodiments, and the pressure assembly 200 and the support assembly 300 are respectively abutted against two opposite sides of the chip bonding structure 100.
[0069] For example, the pressure assembly 200 may be a thruster, and the support assembly 300 may be a work platform. After the device jig is assembled, the thruster applies downward pressure to fix the loading jig 110 on the work platform, and at the same time, the heating coil 130 is energized to heat the chip, melt the chip solder joints, and realize the welding of the first chip and the second chip.
[0070] Combined Figure 7 and Figure 8 As shown, it should be noted that in the chip bonding structure 100 composed of a plurality of stacked loading jigs 110, the two loading jigs 110 located at the top and the bottom may be provided with a fixing area 111 only on one side. For example, the loading jig 110 located at the bottom layer of the chip bonding structure 100 is provided with a fixing area 111 on the upper side for placing the first chip or the second chip, and the bottom side is a planar structure, which abuts against the support component 300; the loading jig 110 located at the top layer of the chip bonding structure 100 is provided with a fixing area 111 on the lower side for placing the first chip or the second chip, and the top side is a planar structure, which abuts against the pressure component 200.
[0071] This embodiment has the chip bonding structure 100 in any of the above embodiments, and therefore has all the beneficial effects of the chip bonding structure 100 in any of the above embodiments.
[0072] In summary, the chip bonding structure 100 and bonding device 1000 provided by the present application can make the first chip and the second chip on two adjacent loading fixtures 110 correspond one to one during bonding, perform synchronous chip bonding, realize batch bonding of small-sized chips, and improve bonding efficiency. Through the positioning and splicing of the recessed portion 116 and the raised portion 115, and the positioning detection of the correction mark line 117, the precise assembly of the two adjacent loading fixtures 110 and the precise positioning of the first chip and the second chip can be achieved.
[0073] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.
[0074] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.
Claims
1. A chip bonding structure, characterized in that: include: A plurality of loading jigs, wherein the plurality of loading jigs are stacked, and at least one side of the loading jig is provided with a plurality of fixing areas, and the fixing areas of two adjacent loading jigs are respectively used to place a first chip and a second chip; A fixing component is used to fix the first chip and the second chip to the fixing area.
2. The chip bonding structure according to claim 1, characterized in that: The fixing assembly includes a vacuum pump and an air pipe, one end of the air pipe is connected to the vacuum pump, and one end of the air pipe away from the vacuum pump is respectively connected to the loading fixture.
3. The chip bonding structure according to claim 1, characterized in that: Each of the fixing areas is provided with a limiting groove, and the sizes of the limiting grooves of two adjacent loading fixtures are respectively adapted to the first chip and the second chip, and the fixing component fixes the first chip or the second chip in the limiting groove.
4. The chip bonding structure according to claim 3, characterized in that: The fixing assembly includes a plurality of clamping mechanisms, each of the fixing areas is provided with a clamping mechanism, the clamping mechanism is arranged on the outside of the limiting groove, and the clamping mechanism is used to clamp the first chip or the second chip.
5. The chip bonding structure according to claim 4, characterized in that: The clamping mechanism comprises at least one group of clamping blocks arranged opposite to each other, one end of the clamping block is connected to an elastic member, and one end of the elastic member away from the clamping block is connected to the loading fixture.
6. The chip bonding structure according to claim 1, characterized in that: The loading jig includes a first surface and a second surface that are arranged opposite to each other, the first surface and the second surface are both provided with the fixing area, the first surface and the second surface are used to place the first chip and the second chip respectively, and in two adjacent loading jigs, the first surface of one loading jig is arranged adjacent to the second surface of the other loading jig.
7. The chip bonding structure according to claim 1, characterized in that: Two opposite surfaces of each loading jig are respectively provided with a raised portion and a recessed portion, and two adjacent loading jigs are connected and fixed by plugging and fitting the raised portion and the recessed portion.
8. The chip bonding structure according to claim 1, characterized in that: A deviation correction line is provided on one side of the loading jig, and the plurality of deviation correction lines of different loading jigs are located on the same straight line.
9. The chip bonding structure according to claim 1, characterized in that: A heating coil is provided in the loading fixture, and the heating coil is connected to an external power source.
10. A bonding device, characterized in that: include: The chip bonding structure according to any one of claims 1 to 9; A pressure component and a support component are respectively abutted against two opposite sides of the chip bonding structure.