Subminiature surface-mounted connector

Abstract

The utility model relates to a subminiature surface-mounted connector, which comprises an inner conductor, an insulating medium and an outer conductor, a through hole is arranged at the center of the outer conductor, the insulating medium is matched in the through hole, the inner conductor is fixed in the insulating medium, the inner conductor, the insulating medium and the outer conductor are sintered into a whole at high temperature, and two ends of the inner conductor extend out of the insulating medium. The lower end of the inner conductor is provided with a welding end, and the diameter of the welding end is larger than that of other parts of the inner conductor. A welding ring is arranged at the bottom of the outer conductor, the welding end of the inner conductor is located at the center of the welding ring, and a plurality of positioning columns are arranged at the bottom of the welding ring and are symmetrically distributed about the center of the welding ring. After the scheme is adopted, the contact area between the welding end of the inner conductor and the printed board bonding pad can be effectively improved, and meanwhile, accurate positioning of the connector and the printed board bonding pad is realized.

Description

Technical Field

[0001] The utility model relates to an ultra-small surface-mount connector. Background Art

[0002] In the electronics manufacturing industry, reflow soldering, as an automated production process, has greatly improved soldering efficiency and soldering quality stability. Reflow soldering technology is widely used in large-scale, high-density electronic component assembly and connection.

[0003] With the miniaturization of electronic components, the coaxial surface mount connectors used in reflow soldering are getting smaller and smaller. At present, due to the small soldering area and the position deviation between the pads, the reflow soldering between the tiny contacts of the ultra-small surface mount connector and the small pads of the high-density printed circuit board has insufficient retention force on the printed circuit board, which poses a major risk of solder joints loosening or even falling off during the plug-in and unplugging process of the product. In this context, it is urgent to solve the reflow soldering problem of ultra-small surface mount connectors. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide an ultra-small surface mount connector, which can effectively increase the contact area between the inner conductor welding end and the printed circuit board pad, and at the same time realize the precise positioning of the connector and the printed circuit board pad.

[0005] In order to solve the above technical problems, the technical solutions provided by the utility model are as follows:

[0006] A subminiature surface mount connector comprises: an inner conductor, an insulating medium and an outer conductor, wherein a through hole is provided at the center of the outer conductor, the insulating medium is fitted in the through hole, the inner conductor is fixed in the insulating medium, the inner conductor, the insulating medium and the outer conductor are sintered into one piece at high temperature, both ends of the inner conductor extend out of the insulating medium, a welding end is provided at the lower end of the inner conductor, and the diameter of the welding end is larger than the diameter of other parts of the inner conductor; a welding ring is provided at the bottom of the outer conductor, the welding end of the inner conductor is located at the center of the welding ring, a positioning column is provided at the bottom of the welding ring, a plurality of the positioning columns are provided, and the plurality of the positioning columns are symmetrically distributed around the center of the welding ring.

[0007] Preferably, a groove is provided on the bottom surface of the welding ring, the width of the groove is greater than the diameter of the welding end, and the groove passes through the center of the welding ring.

[0008] Preferably, the bottom surface of the welding end is flush with the bottom surface of the welding ring or is within 0.05 mm of the bottom surface of the welding ring.

[0009] Preferably, an annular groove is provided on the outer side surface of the outer conductor, the annular groove extends along the circumference of the outer conductor, and an upper edge of the annular groove is provided with a chamfer.

[0010] Preferably, the side surface of the outer conductor is gold-plated, and the bottom surface of the welding end, the bottom surface of the welding ring and the positioning column are tin-plated after gold-plating.

[0011] Preferably, the upper end of the through hole is a standard SMP-J type interface.

[0012] Preferably, the inner hole diameter of the welding ring is smaller than the diameter of the through hole.

[0013] The beneficial effects of the utility model are as follows: since the lower end of the inner conductor is provided with a welding end, the diameter of the welding end is larger than the diameter of other parts of the inner conductor, thereby effectively increasing the contact area between the welding end of the inner conductor and the pad of the printed circuit board; at the same time, since the bottom of the outer conductor is provided with a welding ring, the bottom of the welding ring is provided with a positioning column, the surface mount connector can be welded in the printed circuit board through the welding ring to achieve a vertical surface mount connection with the printed circuit board, and the positioning column is used to be installed in a matching printed circuit board circular hole to achieve accurate positioning of the connector and the pad of the printed circuit board, thereby avoiding a reduction in the effective welding area due to position deviation between the inner conductor, the outer conductor and the pad of the printed circuit board in the connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments:

[0015] Figure 1 A cross-sectional view of an embodiment of the ultra-small surface mount connector of the utility model;

[0016] Figure 2 It is a schematic diagram of the bottom structure of an embodiment of the ultra-small surface mount connector of the utility model.

[0017] in:

[0018] 1. Inner conductor; 11. Welding end;

[0019] 2. Insulating medium;

[0020] 3. outer conductor; 31. through hole; 32. welding ring; 321. slot; 33. positioning column; 34. annular groove; 341. chamfer. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] In the description of the present invention, it is necessary to understand that the directions and positional relationships indicated by “up”, “down”, “left”, “right”, “front”, “back”, “vertical”, “bottom”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0023] like Figure 1 and Figure 2 As shown,

[0024] A super-small surface mount connector, comprising: an inner conductor 1, an insulating medium 2 and an outer conductor 3, wherein a through hole 31 is arranged at the center of the outer conductor 3, the upper end of the through hole 31 is a standard SMP-J type interface, the insulating medium 2 is fitted in the through hole 31, the inner conductor 1 is fixed in the insulating medium 2, the insulating medium 2 is a glass insulating medium, the inner conductor 1, the insulating medium 2 and the outer conductor 3 are sintered into one body at high temperature, both ends of the inner conductor 1 are extended out of the insulating medium 2, the lower end of the inner conductor 1 is provided with a welding end 11, the welding end 12 is provided with a welding end 13, and the welding end 14 is provided with a welding end 15. The diameter of the connecting end 11 is larger than the diameter of other parts of the inner conductor 1; a welding ring 32 is arranged at the bottom of the outer conductor 3, the welding end 11 of the inner conductor 1 is located at the center of the welding ring 32, the bottom surface of the welding end 11 is flush with the bottom surface of the welding ring 32 or is within 0.05 mm of the bottom surface of the welding ring 32, and a positioning column 33 is arranged at the bottom of the welding ring 32. There are multiple positioning columns 33, and the multiple positioning columns 33 are symmetrically distributed around the center of the welding ring 32. There can be 4 welding rings 32.

[0025] In this way, since the lower end of the inner conductor 1 is provided with a welding end 11, and the diameter of the welding end 11 is larger than the diameter of other parts of the inner conductor 1, the contact area between the inner conductor welding end 11 and the printed circuit board pad can be effectively increased; at the same time, since the bottom of the outer conductor 3 is provided with a welding ring 32, and the bottom of the welding ring 32 is provided with a positioning column 33, the surface mount connector can be welded in the printed circuit board through the welding ring 32 to achieve a vertical surface mount connection with the printed circuit board, and the positioning column 33 is used to be installed in a matching printed circuit board circular hole to achieve precise positioning of the connector and the printed circuit board pad, thereby avoiding a reduction in the effective welding area due to position deviation between the inner conductor 1, the outer conductor 3 and the printed circuit board pad in the connector.

[0026] In addition, a groove 321 is provided on the bottom surface of the welding ring 32 . The width of the groove 321 is greater than the diameter of the welding end 11 . The groove 321 passes through the center of the welding ring 32 .

[0027] In this way, the setting of the slot 321 can, on the one hand, eliminate the welding hot air accumulated between the outer conductor 3 and the printed circuit board, avoiding the influence of the accumulated upward hot air on the welding reliability; on the other hand, the slot can also avoid the continuous inner conductor microstrip line on the surface of the single-layer printed circuit board, avoiding conduction between the inner conductor 1 and the outer conductor 3.

[0028] In addition, an annular groove 34 is provided on the outer side surface of the outer conductor 3 . The annular groove 34 extends along the circumference of the outer conductor 3 . A chamfer 341 is provided on the upper edge of the annular groove 34 .

[0029] In this way, it is convenient for the robot arm of the reflow soldering equipment to grab the outer conductor 3 .

[0030] In addition, the side surface of the outer conductor 3 is gold-plated, and the bottom surface of the welding end 11, the bottom surface of the welding ring 32 and the positioning column 33 are tin-plated after gold plating.

[0031] In this way, the side of the outer conductor 3 is gold-plated to ensure conductivity and corrosion resistance; the bottom surface of the welding end 11, the bottom surface of the welding ring 32 and the positioning column 33 are tin-plated after gold plating, which enhances the solderability of the inner conductor 1 and the outer conductor 3, thereby improving welding reliability.

[0032] In addition, the inner diameter of the welding ring 32 is smaller than the diameter of the through hole 31 .

[0033] In this way, it is convenient to place the lower end of the insulating medium 2 against the welding ring 32 , thereby facilitating the positioning of the insulating medium 2 .

[0034] In short, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An ultra-small surface mount connector, characterized in that: include: An inner conductor, an insulating medium and an outer conductor, wherein a through hole is provided at the center of the outer conductor, the insulating medium is fitted in the through hole, the inner conductor is fixed in the insulating medium, the inner conductor, the insulating medium and the outer conductor are sintered into one body through high temperature, both ends of the inner conductor extend out of the insulating medium, a welding end is provided at the lower end of the inner conductor, and the diameter of the welding end is larger than the diameter of other parts of the inner conductor; a welding ring is provided at the bottom of the outer conductor, the welding end of the inner conductor is located at the center of the welding ring, a positioning column is provided at the bottom of the welding ring, a plurality of positioning columns are provided, and the plurality of positioning columns are symmetrically distributed around the center of the welding ring.

2. The ultra-small surface mount connector according to claim 1, characterized in that: The bottom surface of the welding ring is provided with a slot, the width of the slot is greater than the diameter of the welding end, and the slot passes through the center of the welding ring.

3. The ultra-small surface mount connector according to claim 1 or 2, characterized in that: The bottom surface of the welding end is flush with the bottom surface of the welding ring or is within 0.05 mm of the bottom surface of the welding ring.

4. The ultra-small surface mount connector according to claim 1 or 2, characterized in that: An annular groove is provided on the outer side surface of the outer conductor. The annular groove extends along the circumference of the outer conductor. The upper edge of the annular groove is provided with a chamfer.

5. The ultra-small surface mount connector according to claim 1 or 2, characterized in that: The side surface of the outer conductor is gold-plated, and the bottom surface of the welding end, the bottom surface of the welding ring and the positioning column are tin-plated after gold plating.

6. The ultra-small surface mount connector according to claim 1 or 2, characterized in that: The upper end of the through hole is a standard SMP-J type interface.

7. The ultra-small surface mount connector according to claim 1 or 2, characterized in that: The inner hole diameter of the welding ring is smaller than the diameter of the through hole.

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