Printed circuit board (PCB) capable of reducing scratch of fine circuit
By using a composite ceramic abrasive protective layer on the PCB board, the problem of thin lines being susceptible to scratches is solved, the protection effect is improved, and the stable recording of control process information is ensured.
Patent Information
- Application Number
- CN202323610586.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2033-12-28
AI Technical Summary
The existing PCB board has poor protection effect when used, and thin lines are easily scratched, which affects the recording of control process information.
A composite structure including a PCB substrate, a reinforcement layer, a lead oxide ceramic layer and an elastic outer layer is adopted to form a composite ceramic abrasive protective layer to reduce fine line scratches and improve protective effect.
Through the composite ceramic abrasive protective layer, the risk of scratching on thin lines is significantly reduced, the protection effect of PCB boards is improved, and the control process information is better recorded.
Smart Images

Figure CN222283552U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of PCB circuit protection, in particular to a PCB board capable of reducing scratches on fine circuits. Background Art
[0002] PCB, the Chinese name for printed circuit board, is also called printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing technology, it is called a printed circuit board. PCB records all the information required by the operating system to describe the current status of the process and control the operation of the process.
[0003] PCB is an important electronic component, but the current PCB has poor protection effect when used. The fine lines of PCB are easily scratched, which in turn affects the recorded information of the PCB control process. Therefore, we propose a PCB board that can reduce fine line scratches to solve the above problem. Utility Model Content
[0004] The utility model aims to provide a PCB board capable of reducing scratches on fine circuits, so as to solve the problems raised in the above-mentioned background technology.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A PCB board capable of reducing scratches on fine circuits comprises a PCB board body, a circuit chip is fixedly embedded on the upper surface of the PCB board body, and the PCB board body comprises a PCB substrate, a reinforcement layer, a lead oxide ceramic layer and an elastic outer layer.
[0007] In a further embodiment, the upper surface of the PCB substrate is fixedly connected to the bottom surface of the reinforcement layer, and the upper surface of the reinforcement layer is fixedly connected to the bottom surface of the lead oxide ceramic layer.
[0008] In a further embodiment, the upper surface of the lead oxide ceramic layer is fixedly connected to the bottom surface of the elastic outer layer, and the reinforcement layer is an open mesh material.
[0009] In a further embodiment, a thermally conductive silicone layer is fixedly connected to the bottom surface of the PCB substrate, and a plastic bottom plate is fixedly connected to the bottom surface of the thermally conductive silicone layer.
[0010] In a further embodiment, two groups of connection holes are provided on the outer surface of the PCB body, and two positioning notches are provided on the outer surface of the PCB body.
[0011] In a further embodiment, a plurality of heat dissipation holes are provided on the bottom surface of the PCB body.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] The composite elastic ceramic abrasive can form a composite ceramic abrasive protective layer on the surface of the PCB substrate by providing a reinforcing layer and a lead oxide ceramic layer, and cooperating with the elastic outer layer. The composite elastic ceramic abrasive has a certain elasticity, which will reduce the scratches on the fine lines of the PCB board. The PCB board can have a ceramic abrasive protection structure, improve the protection effect of the PCB board during application, solve the problem that the fine lines of the PCB board are easily scratched, and enable the PCB board to better record the control process information. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 A schematic diagram of the three-dimensional structure of a front view of a PCB board that can reduce scratches on fine lines.
[0015] Figure 2 A schematic diagram of the three-dimensional structure of a bottom view of a PCB board that can reduce scratches on fine lines.
[0016] Figure 3 A cross-sectional view of the front view of a PCB board that can reduce scratches on fine lines.
[0017] In the figure: 1. PCB body; 101. PCB substrate; 102. reinforcement layer; 103. lead oxide ceramic layer; 104. elastic outer layer; 105. thermal conductive silicone layer; 106. plastic bottom plate; 2. circuit chip; 3. connection hole; 4. positioning notch; 5. heat dissipation vent. DETAILED DESCRIPTION
[0018] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.
[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] See also Figure 1-3 In the utility model, a PCB board capable of reducing scratches on fine circuits comprises a PCB body 1, a circuit chip 2 is fixedly embedded on the upper surface of the PCB body 1, and the PCB body 1 comprises a PCB substrate 101, a reinforcement layer 102, a lead oxide ceramic layer 103 and an elastic outer layer 104.
[0021] The upper surface of the PCB substrate 101 is fixedly connected to the bottom surface of the reinforcement layer 102, the upper surface of the reinforcement layer 102 is fixedly connected to the bottom surface of the lead oxide ceramic layer 103, the upper surface of the lead oxide ceramic layer 103 is fixedly connected to the bottom surface of the elastic outer layer 104, and the reinforcement layer 102 is an open mesh material. Through the connection between the reinforcement layer 102, the lead oxide ceramic layer 103 and the elastic outer layer 104, the PCB substrate 101 will be better protected and the scratches on its fine circuits will be reduced.
[0022] A thermally conductive silicone layer 105 is fixedly connected to the bottom surface of the PCB substrate 101, and a plastic bottom plate 106 is fixedly connected to the bottom surface of the thermally conductive silicone layer 105. Two groups of connecting holes 3 are provided on the outer surface of the PCB body 1, and two positioning notches 4 are provided on the outer surface of the PCB body 1. A plurality of heat dissipation holes 5 are provided on the bottom surface of the PCB body 1. The heat of the PCB substrate 101 can be dissipated through the thermally conductive silicone layer 105 and the heat dissipation holes 5. The plastic bottom plate 106 can be used to provide wear-resistant protection for the bottom surface of the PCB substrate 101. The connecting holes 3 and the positioning notches 4 can be used to position and fix the PCB body 1 during connection.
[0023] The working principle of the utility model is: firstly, the PCB body 1 is produced and processed. During the processing of the PCB body 1, it is necessary to sequentially bond the reinforcing layer 102, the lead oxide ceramic layer 103 and the elastic outer layer 104 on the top of the PCB substrate 101, and then fix the thermal conductive silicone layer 105 and the plastic bottom plate 106 on the bottom surface of the PCB substrate 101. Then, the lead oxide ceramic layer 103 and the elastic outer layer 104 can be used to protect the fine circuits of the PCB substrate 101, which will reduce scratches on the fine circuits.
[0024] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
[0025] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A PCB board capable of reducing scratches on fine lines, characterized in that: The invention comprises a PCB body (1), wherein a circuit chip (2) is fixedly embedded on the upper surface of the PCB body (1), and the PCB body (1) comprises a PCB substrate (101), a reinforcement layer (102), a lead oxide ceramic layer (103) and an elastic outer layer (104).
2. A PCB board capable of reducing fine line scratches according to claim 1, characterized in that: The upper surface of the PCB substrate (101) is fixedly connected to the bottom surface of the reinforcement layer (102), and the upper surface of the reinforcement layer (102) is fixedly connected to the bottom surface of the lead oxide ceramic layer (103).
3. A PCB board capable of reducing fine line scratches according to claim 2, characterized in that: The upper surface of the lead oxide ceramic layer (103) is fixedly connected to the bottom surface of the elastic outer layer (104), and the reinforcing layer (102) is an open mesh material.
4. A PCB board capable of reducing fine line scratches according to claim 1, characterized in that: A heat-conducting silicone layer (105) is fixedly connected to the bottom surface of the PCB substrate (101), and a plastic bottom plate (106) is fixedly connected to the bottom surface of the heat-conducting silicone layer (105).
5. A PCB board capable of reducing fine line scratches according to claim 1, characterized in that: The outer surface of the PCB body (1) is provided with two groups of connection holes (3), and the outer surface of the PCB body (1) is provided with two positioning notches (4).
6. A PCB board capable of reducing fine line scratches according to claim 1, characterized in that: The bottom surface of the PCB body (1) is provided with a plurality of groups of heat dissipation holes (5).