Etching equipment
By using eccentric inclined rotation platform and angle adjustment components in the etching equipment, the problem of etching unevenness caused by water film in traditional spraying equipment is solved, and uniform spraying of etching liquid and safety and stability of substrate are achieved, and the board is adapted to different thicknesses of plates etching requirements.
Patent Information
- Application Number
- CN202420963437.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-05-07
AI Technical Summary
During the PCB etching process, traditional spray treatment equipment causes the treatment liquid to form a water film due to gravity, which hinders the contact between the liquid and the material, causing uneven etching, and the vibration mechanism is prone to damage the substrate.
An etching device was designed, using an eccentric inclined rotation platform and an angle adjustment component. The rotating platform is driven by a servo motor to make the etching liquid flow eccentrically from the top of the substrate to the bottom. The adaptability of plates of different thicknesses is achieved by combining slide rods and positioning screws. Etching ensures uniform etching and prevents substrate vibration.
The uniform spraying of etching liquid is achieved, the etching accuracy and safety is improved, and the circuit boards of different thicknesses is adapted to avoid substrate damage.
Smart Images
Figure CN222283604U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to an etching device. Background Art
[0002] The etching process of PCB is an important part that affects the quality of PCB. As the quality requirements of PCB continue to increase, the precision requirements for PCB etching are also getting higher and higher. At present, some PCB etching is processed by spray processing equipment. Traditional spray processing equipment usually sprays the processing liquid downward to chemically react or clean the horizontally moving material. However, due to the effect of gravity, the processing liquid is prone to form a layer of water film on the horizontally moving substrate, which prevents the new processing liquid from contacting the material and causes a "pool effect" on the upper surface, so that the sprayed liquid cannot be sprayed directly onto the horizontally moving substrate, resulting in uneven etching.
[0003] For example, in the Chinese utility model with the announcement number CN205406497U and the name of an etching device, a vibration mechanism is arranged on the workbench to vibrate the etching substrate on the workbench so that the etching liquid can be evenly sprayed onto the etching substrate. However, the vibration mechanism can easily damage the etching substrate at the clamping position. Therefore, in order to etch more safely and evenly, an etching device is now needed. Utility Model Content
[0004] The purpose of the utility model is to provide an etching device with a simple structure and reasonable design in order to solve the above problems.
[0005] The utility model achieves the above-mentioned purpose through the following technical solutions:
[0006] An etching device comprises an etching box, wherein a rotating platform is rotatably arranged inside the etching box, a driving assembly for driving the rotating platform to rotate is arranged at the bottom of the etching box, an eccentric rotating shaft is arranged at an eccentric position on the upper side of the rotating platform, an inclined etching platform is connected to the upper side of the eccentric rotating shaft, an angle adjustment assembly for adjusting the inclination angle of the etching platform is arranged on the upper side of the rotating platform, and a plurality of positioning assemblies for fixing a substrate to be etched on the etching platform are arranged on the edge of the etching platform.
[0007] As a further optimization scheme of the utility model, the angle adjustment assembly includes a rotating shaft arranged on the upper side of the rotating platform and a slide cylinder arranged on the rotating shaft, the upper end sliding sleeve of the slide cylinder is provided with a sliding rod rotatably connected to the lower side of the etching platform, a positioning groove is opened on one side of the slide cylinder, and a positioning screw passing through the positioning groove is threadedly connected on one side of the slide rod.
[0008] As a further optimization scheme of the utility model, the positioning assembly includes a pressure rod that slides through the edge of the etching platform and a cam pressure plate fixedly arranged at one end of the pressure rod and located on the upper side of the etching platform, one end of the pressure rod is fixedly provided with a push plate located on the lower side of the etching platform, and one end of the pressure rod is sleeved with a spring located between the lower side of the etching platform and the push plate.
[0009] As a further optimization solution of the utility model, the driving assembly includes a servo motor fixedly arranged at the bottom of the etching box and a protective tube sleeved on the outside of the servo motor, and the output end of the servo motor is connected to the center of the rotating platform through a flat key.
[0010] As a further optimization solution of the utility model, an etching nozzle and an etching liquid feed pipe connected to the etching nozzle are arranged on the top of the etching box.
[0011] As a further optimization solution of the utility model, a guide groove is provided on the lower surface of the rotating platform, and a plurality of support rods movably connected to the inner side of the guide groove are fixedly provided on the bottom of the etching box.
[0012] The beneficial effects of the utility model are:
[0013] 1. In the utility model, the etching platform is eccentrically tilted and arranged on the upper side of the rotating platform, so that when the etching platform rotates, the etching substrate on the upper side of the etching platform can rotate eccentrically above the rotating platform, and the etching liquid sprayed by the etching nozzle can flow eccentrically from the top of the etching substrate to the bottom, so that the etching liquid etches the etching substrate evenly, and the etching substrate does not vibrate, so the etching substrate can be etched more safely.
[0014] 2. In the utility model, by sliding the slide rod, one end of the slide rod slides out of the slide tube, and then fixed by a positioning screw, the etching platform can be tilted and fixed at a certain angle, so that the etching equipment can etch according to circuit boards of different thicknesses, thereby improving the adaptability of the etching equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a first overall structural schematic diagram of the utility model;
[0016] Figure 2 It is a second overall structural schematic diagram of the utility model;
[0017] Figure 3 This utility model Figure 1 Enlarged view of point A in the middle;
[0018] Figure 4 This utility model Figure 1 Enlarged view of point B in the middle.
[0019] In the figure: 1. Etching box; 2. Rotating platform; 3. Servo motor; 4. Protective tube; 5. Support rod; 6. Etching liquid feed pipe; 7. Etching platform; 8. Etching nozzle; 9. Angle adjustment assembly; 901. Slide; 902. Slide rod; 903. Positioning groove; 904. Positioning screw; 905. Rotating shaft; 10. Positioning assembly; 1001. Cam pressure plate; 1002. Spring; 1003. Pressure rod; 1004. Push plate; 11. Eccentric rotating shaft; 12. Guide groove. DETAILED DESCRIPTION
[0020] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.
[0021] Example
[0022] like Figure 1 , Figure 2 , Figure 3 As shown, an etching device comprises an etching box 1, an etching nozzle 8 and an etching liquid feed pipe 6 connected to the etching nozzle 8 are arranged on the top of the etching box 1, the other end of the etching liquid feed pipe 6 is connected to a pump body and an etching liquid box (not shown in the figure), a rotating platform 2 is rotatably arranged inside the etching box 1, a servo motor 3 is fixedly arranged at the bottom of the etching box 1, and a protective cylinder 4 is sleeved on the outside of the servo motor 3, the output end of the servo motor 3 is connected to the center of the rotating platform 2 through a flat key, and an eccentric rotating shaft 11 is arranged at an eccentric position on the upper side of the rotating platform 2. The upper side of the eccentric rotating shaft 11 is connected to an inclined etching platform 7. When in use, the etching platform 7 is eccentrically inclined on the upper side of the rotating platform 2, so that the etching substrate (not shown in the figure) on the upper side of the etching platform 7 can rotate eccentrically above the rotating platform 2 when the etching platform 7 rotates. The etching liquid sprayed by the etching nozzle 8 can flow eccentrically from the top of the etching substrate to the bottom, so that the etching liquid etches the etching substrate evenly, and the etching substrate does not vibrate, so the etching substrate can be etched more safely.
[0023] like Figure 1 , Figure 3As shown, an angle adjustment component 9 for adjusting the tilt angle of the etching platform 7 is provided on the upper side of the rotating platform 2. The angle adjustment component 9 includes a rotating shaft 905 provided on the upper side of the rotating platform 2 and a slide 901 provided on the rotating shaft 905. The upper end of the slide 901 is slidably sleeved with a slide bar 902 that is rotatably connected to the lower side of the etching platform 7. A positioning groove 903 is provided on one side of the slide 901. A positioning screw 904 that passes through the positioning groove 903 is threadedly connected on one side of the slide 902. When in use, by sliding the slide 902, one end of the slide 902 slides out of the slide 901, and then is fixed by the positioning screw 904, the etching platform 7 can be tilted and fixed at a certain angle, so that the etching equipment can perform etching according to circuit boards of different thicknesses, thereby improving the adaptability of the etching equipment.
[0024] like Figure 2 As shown, a guide groove 12 is provided on the lower surface of the rotating platform 2, and a plurality of support rods 5 movably connected to the inner side of the guide groove 12 are fixedly provided at the bottom of the etching box 1. When in use, when the rotating platform 2 rotates, the guide groove 12 on the lower side of the rotating platform 2 rotates at the upper end of the support rod 5, so that the rotating platform 2 rotates more stably, and the rotating platform 2 is prevented from vibrating and damaging the etching substrate.
[0025] like Figure 1 , Figure 4 As shown, the edge of the etching platform 7 is provided with a plurality of positioning components 10 for fixing the substrate to be etched on the etching platform 7, the positioning component 10 includes a pressure rod 1003 which slides through the edge of the etching platform 7 and a cam pressure plate 1001 which is fixedly arranged at one end of the pressure rod 1003 and located on the upper side of the etching platform 7, one end of the pressure rod 1003 is fixedly provided with a push plate 1004 which is located on the lower side of the etching platform 7, and one end of the pressure rod 1003 is sleeved with a spring 1002 which is located between the lower side of the etching platform 7 and the push plate 1004. When in use, first place the etching substrate on the upper side of the etching platform 7, then rotate and press the push plate 1004 to make the cam pressure plate 1001 contact with the etching substrate, and then release the push plate 1004, and the elastic force of the spring 1002 can drive the push plate 1004 to pull the pressure rod 1003 to slide, so that the cam pressure plate 1001 at the other end of the pressure plate 1003 presses the etching substrate to the upper side of the etching platform 7, thereby improving the positioning efficiency.
[0026] It should be noted that, when using the etching device, the etching substrate is first placed on the upper side of the etching platform 7, and then the push plate 1004 is rotated and pressed, so that the cam pressure plate 1001 can contact the etching substrate, and then the push plate 1004 is released, and the elastic force of the spring 1002 can drive the push plate 1004 to slide the pressure rod 1003, so that the cam pressure plate 1001 at the other end of the pressure plate 1003 presses the etching substrate against the upper side of the etching platform 7, and then the sliding rod 902 is slid to make the sliding rod 902 move. One end of 902 slides out of the slide 901 and is then fixed by the positioning screw 904, so that the etching platform 7 can be tilted and fixed at a certain angle. Finally, the rotating platform 2 is driven to rotate by the servo motor 3, and then the etching platform 7 is driven to rotate. At the same time, the etching liquid is sprayed down through the etching nozzle 8, so that the etching liquid can flow eccentrically from the top of the etching substrate to the bottom, so that the etching liquid etches the etching substrate evenly, and the etching substrate does not vibrate, so the etching substrate can be etched more safely.
[0027] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model.
Claims
1. An etching device, comprising an etching box (1), characterized in that: A rotating platform (2) is rotatably arranged inside the etching box (1), a driving assembly for driving the rotating platform (2) to rotate is arranged at the bottom of the etching box (1), an eccentric rotating shaft (11) is arranged at an eccentric position on the upper side of the rotating platform (2), an inclined etching platform (7) is connected to the upper side of the eccentric rotating shaft (11), an angle adjustment assembly (9) for adjusting the inclination angle of the etching platform (7) is arranged on the upper side of the rotating platform (2), and a plurality of positioning assemblies (10) for fixing a substrate to be etched on the etching platform (7) are arranged at the edge of the etching platform (7).
2. An etching device according to claim 1, characterized in that: The angle adjustment assembly (9) comprises a rotating shaft (905) arranged on the upper side of the rotating platform (2) and a slide cylinder (901) arranged on the rotating shaft (905); the upper end sliding sleeve of the slide cylinder (901) is provided with a slide rod (902) rotatably connected to the lower side of the etching platform (7); a positioning groove (903) is provided on one side of the slide cylinder (901); and a positioning screw (904) passing through the positioning groove (903) is threadedly connected on one side of the slide rod (902).
3. An etching device according to claim 1, characterized in that: The positioning assembly (10) comprises a pressure rod (1003) which slides through the edge of the etching platform (7) and a cam pressure plate (1001) which is fixedly arranged at one end of the pressure rod (1003) and located on the upper side of the etching platform (7); a push plate (1004) which is located on the lower side of the etching platform (7) is fixedly arranged at one end of the pressure rod (1003); and a spring (1002) which is located between the lower side of the etching platform (7) and the push plate (1004) is sleeved at one end of the pressure rod (1003).
4. An etching device according to claim 1, characterized in that: The driving assembly comprises a servo motor (3) fixedly arranged at the bottom of the etching box (1) and a protective tube (4) sleeved on the outside of the servo motor (3); the output end of the servo motor (3) is connected to the center of the rotating platform (2) via a flat key.
5. The etching device according to claim 1, characterized in that: The top of the etching box (1) is provided with an etching nozzle (8) and an etching liquid feed pipe (6) connected to the etching nozzle (8).
6. An etching device according to claim 1, characterized in that: A guide groove (12) is provided on the lower surface of the rotating platform (2), and a plurality of support rods (5) movably connected to the inner side of the guide groove (12) are fixedly arranged on the bottom of the etching box (1).