Fragment suction cup assembly

The fragment suction cup assembly with symmetrically arranged sensors and suction cups enhances wafer inspection by detecting breakage in silicon wafers, addressing the lack of detection in existing methods.

CN222292963UActive Publication Date: 2025-01-03SHENGDA SEMICON EQUIP (JIANGSU) CO LTD
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Patent Information

Application Number
CN202421069807.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-16
Publication Date
2025-01-03
Estimated Expiration
2034-05-16

AI Technical Summary

Technical Problem

Existing silicon wafer adsorption methods lack the ability to detect whether transported wafers are broken.

Method used

A fragment suction cup assembly with multiple proximity sensors and vacuum suction cups arranged symmetrically around a disc to individually inspect the upper, middle, and lower areas of a silicon wafer, monitoring sensor and cup data for breakage detection.

Benefits of technology

Enhances detection capabilities to determine wafer integrity by providing individual inspection of wafer areas, improving functionality and effectiveness.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222292963U_ABST
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Abstract

The utility model discloses a fragment suction cup assembly which comprises a disc, a first detection part and two second detection parts, and the two second detection parts are symmetrically arranged on the upper side and the lower side of the first detection part. According to the suction cup assembly, the upper area, the middle area and the lower area of the silicon wafer are independently detected through the first detection part and the two second detection parts, data of the proximity sensors and the suction cups are monitored so as to determine whether the silicon wafer is broken or not, and therefore the functions are richer, and the effect is better.
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Description

Technical Field

[0001] The present application relates to the field of silicon wafer transmission technology, and in particular to a broken wafer suction cup assembly. Background Art

[0002] Existing silicon wafer adsorption is usually performed by a suction cup, but the function is relatively simple and it is unable to detect whether the transported silicon wafer is broken. Utility Model Content

[0003] The utility model aims to provide a fragment suction cup assembly to overcome the deficiencies in the prior art.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] The embodiment of the present application discloses a fragment suction cup assembly, which is characterized by comprising a circular disc, a first detection part and two second detection parts, the two second detection parts are symmetrically arranged on the upper and lower sides of the first detection part, the first detection part comprises two first proximity sensors and two first vacuum suction cups, the two first proximity sensors are symmetrically fixed on the circular disc, the two first vacuum suction cups are symmetrically arranged on the left and right sides of the two first proximity sensors and are fixedly connected to the circular disc, the second detection part comprises three second vacuum suction cups and a second proximity sensor, the second proximity sensor is fixed on the circular disc, two of the second vacuum suction cups are symmetrically arranged on the left and right sides of the second proximity sensor and are fixedly connected to the circular disc, and the other second vacuum suction cup is fixedly arranged on the circular disc on the side of the second proximity sensor away from the center of the circular disc.

[0006] Preferably, in the above-mentioned fragment suction cup assembly, the two first vacuum suction cups of the first detection part and the six second vacuum suction cups of the two second detection parts are arranged on the same circumference and coaxially with the disc.

[0007] Preferably, in the above-mentioned fragment suction cup assembly, two first vacuum suction cups of the first detection part and six second vacuum suction cups of the two second detection parts are arranged.

[0008] Preferably, in the above-mentioned fragment suction cup assembly, the two first proximity sensors of the first detection part and the two second proximity sensors of the two second detection parts are arranged on the same circumference and coaxially with the disc.

[0009] Preferably, in the above-mentioned fragment suction cup assembly, two first proximity sensors of the first detection part and two second proximity sensors of the two second detection parts are arranged.

[0010] Compared with the prior art, the advantages of the utility model are:

[0011] The upper, middle and lower areas of the silicon wafer are individually inspected by the first inspection unit and the two second inspection units, and the data of the respective proximity sensors and suction cups are monitored to determine whether the wafer is broken, thereby providing more functions and better effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, it is easy to obtain other drawings based on these drawings without creative work.

[0013] Figure 1 The figure is a front view of a fragment suction cup assembly in a specific embodiment of the utility model;

[0014] Figure 2 Shown is a stereoscopic view of a fragment suction cup assembly in a specific embodiment of the utility model. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the utility model to describe the technical solutions in the embodiments of the utility model in detail. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0016] Ginseng Figure 1~2 As shown, the fragment suction cup assembly in this embodiment includes a disc 1, a first detection part 2 and two second detection parts 3, the two second detection parts 3 are symmetrically arranged on the upper and lower sides of the first detection part 2, the first detection part 2 includes two first proximity sensors 201 and two first vacuum suction cups 202, the two first proximity sensors 201 are symmetrically fixed on the disc 1, the two first vacuum suction cups 202 are symmetrically arranged on the left and right sides of the two first proximity sensors 201 and are fixedly connected to the disc 1, the second detection part 3 includes three second vacuum suction cups 301 and second proximity sensors 302, the second proximity sensors 302 are fixed on the disc 1, wherein the two second vacuum suction cups 301 are symmetrically arranged on the left and right sides of the second proximity sensors 302 and are fixedly connected to the disc 1, and the other second vacuum suction cup 301 is fixedly arranged on the disc 1 on the side of the second proximity sensor 302 away from the center of the disc 1.

[0017] Furthermore, the two first vacuum suction cups 202 of the first detection part 2 and the six second vacuum suction cups 301 of the two second detection parts 3 are arranged on the same circumference and coaxially with the disk 1 .

[0018] Furthermore, the two first vacuum chucks 202 of the first detection part 2 and the six second vacuum chucks 301 of the two second detection parts 3 are arranged.

[0019] Furthermore, the two first proximity sensors 201 of the first detection unit 2 and the two second proximity sensors 302 of the two second detection units 3 are arranged on the same circumference and coaxially with the disk 1 .

[0020] Furthermore, the two first proximity sensors 201 of the first detection unit 2 and the two second proximity sensors 302 of the two second detection units 3 are arranged.

[0021] In this technical solution, the upper, middle and lower areas of the silicon wafer are individually detected by the first detection unit and the two second detection units, and the data of each proximity sensor and suction cup are monitored to determine whether the wafer is broken, thereby providing more functions and better effects.

[0022] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0023] The above is only a specific implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A fragment suction cup assembly, characterized in that: It includes a disc, a first detection part and two second detection parts, the two second detection parts are symmetrically arranged on the upper and lower sides of the first detection part, the first detection part includes two first proximity sensors and two first vacuum suction cups, the two first proximity sensors are symmetrically fixed on the disc, the two first vacuum suction cups are symmetrically arranged on the left and right sides of the two first proximity sensors and are fixedly connected to the disc, the second detection part includes three second vacuum suction cups and a second proximity sensor, the second proximity sensor is fixed on the disc, two of the second vacuum suction cups are symmetrically arranged on the left and right sides of the second proximity sensor and are fixedly connected to the disc, and the other second vacuum suction cup is fixedly arranged on the disc on the side of the second proximity sensor away from the center of the disc.

2. The fragment suction cup assembly according to claim 1, characterized in that: The two first vacuum suction cups of the first detection part and the six second vacuum suction cups of the two second detection parts are arranged on the same circumference and coaxially with the disk.

3. The fragment suction cup assembly according to claim 2, characterized in that: The two first vacuum suction cups of the first detection part and the six second vacuum suction cups of the two second detection parts are arranged.

4. The fragment suction cup assembly according to claim 1, characterized in that: The two first proximity sensors of the first detection unit and the two second proximity sensors of the two second detection units are arranged on the same circumference and coaxially with the disk.

5. The fragment suction cup assembly according to claim 4, characterized in that: The two first proximity sensors of the first detection unit and the two second proximity sensors of the second detection units are arranged between each other.