Wafer transmission mechanism

Abstract

The utility model provides a wafer transmission mechanism, which relates to the technical field of semiconductors and comprises a support, a top plate and a bottom plate are sequentially mounted on the support from top to bottom, a wafer supporting plate is arranged above the bottom plate, a wafer body is placed on the wafer supporting plate, a protective box body is mounted on the outer side of the support, and the protective box body is connected with the top plate and the bottom plate. A forward and reverse rotation motor is arranged in the protection box body, and the output end of the forward and reverse rotation motor is connected with a lead screw. According to the utility model, the positive and negative rotation motor drives the screw rod to rotate, the screw rod drives the moving block to carry out translational motion, and the moving block is limited by the limiting groove and can only move left and right along the direction of the screw rod, so that the vacuum negative pressure machine can accurately move to the wafer supporting plate and firmly adsorb the wafer body, and then the wafer body is driven to be conveyed backwards. And meanwhile, the water pump and the wafer body operate at the same time, the multiple nozzles spray the cleaning agent to clean the wafer body, and therefore simultaneous cleaning of the wafer body is achieved in the conveying process.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a mechanism for transmitting wafers. Background Art

[0002] Wafer, also known as silicon wafer, is a silicon chip used in the manufacture of silicon semiconductor integrated circuits. It is the basic raw material for manufacturing semiconductor components. Because of its round shape, it is called a wafer. Various circuit component structures can be processed on silicon wafers to become IC products with specific electrical functions.

[0003] After searching, a wafer transfer device disclosed in the existing patent announcement number CN106449510B includes a wafer clamping assembly; a vertical moving assembly, which is configured to drive the wafer clamping assembly to move vertically; and a horizontal moving assembly, which is configured to drive the vertical moving assembly to move horizontally.

[0004] However, in actual use of the invention, the wafers need to be transferred to the rear and cleaned and packaged, but the device cannot clean the wafers simultaneously during the transfer process, resulting in a too long wafer packaging time and reduced transfer efficiency. Utility Model Content

[0005] The technical solution of the utility model is aimed at the existing technology that solves too single technical problems, and provides a solution that is significantly different from the existing technology. In order to overcome the above defects of the existing technology, the utility model provides a new solution to solve the problems raised in the above background technology.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a mechanism for transmitting wafers, comprising a bracket, wherein the bracket is equipped with a top plate and a bottom plate from top to bottom, a wafer support plate is provided above the bottom plate, a wafer body is placed on the wafer support plate, a protective box is installed on the outside of the bracket, a forward and reverse motor is provided inside the protective box, the output end of the forward and reverse motor is connected to a screw rod, a moving block is threadedly connected to the screw rod, a first connecting rod and a second connecting rod are respectively connected on both sides of the moving block, the second connecting rod is connected to an outer water pump, a plurality of nozzles are provided on the side of the water pump close to the wafer body, a protective box is also provided under the top plate, the output end inside the protective box is connected to a vacuum negative pressure machine, and a suction cup is provided at the bottom output end of the vacuum negative pressure machine.

[0007] Optionally, limiting grooves are provided on both sides of the protection box body near the first connecting rod and the second connecting rod, and the first connecting rod and the second connecting rod are slidably connected inside each of the two limiting grooves.

[0008] Optionally, the first connecting rod is designed to be U-shaped, and a gas injector is connected to the end thereof, and an output end of the gas injector is close to the nozzle.

[0009] Optionally, a bearing is provided inside the protective box, and a screw rod is rotatably connected inside the bearing.

[0010] Optionally, a forward and reverse motor, a lead screw, and a second connecting rod are also provided inside the protective box below the top plate.

[0011] Optionally, the output direction of the nozzle and the gas injector is perpendicular to the suction direction of the suction cup.

[0012] Optionally, the output points of the nozzle and the gas injector are the same.

[0013] Optionally, rubber blocks are installed at the bottom of the four support rods of the bracket.

[0014] Compared with the prior art, the advantages and positive effects of the utility model are:

[0015] In the utility model, the screw is driven to rotate by the forward and reverse motors, and the screw drives the moving block to perform translational motion. The moving block is limited by the limit groove and can only move left and right along the direction of the screw. This system enables the vacuum negative pressure machine to be accurately moved to the wafer support plate and firmly adsorb the wafer body. Subsequently, the wafer body is driven to be transported backward, and the water pump and the wafer body are running at the same time, and multiple nozzles spray cleaning agent to clean the wafer body, thereby achieving simultaneous cleaning of the wafer body during the transmission process, without the need for additional cleaning steps, and improving the transmission efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A three-dimensional diagram of a wafer transmission mechanism provided by the utility model;

[0017] Figure 2 The utility model provides a wafer transmission mechanism Figure 1 Enlarged view of part A;

[0018] Figure 3 A schematic diagram of the outer structure of a protective box of a wafer transmission mechanism provided by the utility model;

[0019] Figure 4 The utility model is a schematic diagram of the cross-sectional structure of the interior of a protective box of a wafer transmission mechanism.

[0020] Legend:

[0021] 1. Bracket; 2. Top plate; 3. Bottom plate; 4. Wafer support plate; 5. Wafer body; 6. Protective box; 7. Limiting groove; 8. Water pump; 9. Nozzle; 10. Forward and reverse motor; 11. Screw rod; 12. Moving block; 13. First connecting rod; 14. Second connecting rod; 15. Bearing; 16. Gas injector; 17. Vacuum negative pressure machine; 18. Suction cup; 19. Rubber block. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Example

[0024] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the utility model provides a technical solution: a mechanism for transmitting wafers, comprising a bracket 1, the bracket 1 is equipped with a top plate 2 and a bottom plate 3 from top to bottom, a wafer support plate 4 is arranged above the bottom plate 3, a wafer body 5 is placed on the wafer support plate 4, a protective box 6 is installed on the outside of the bracket 1, a forward and reverse motor 10 is arranged inside the protective box 6, the output end of the forward and reverse motor 10 is connected to a screw rod 11, a moving block 12 is threadedly connected to the screw rod 11, a first connecting rod 13 and a second connecting rod 14 are respectively connected to the two sides of the moving block 12, the second connecting rod 14 is connected to the outer water pump 8, a plurality of nozzles 9 are arranged on the side of the water pump 8 close to the wafer body 5, a protective box 6 is also arranged below the top plate 2, the internal output end of the protective box 6 is connected to a vacuum negative pressure machine 17, a suction cup 18 is arranged at the bottom output end of the vacuum negative pressure machine 17, limiting grooves 7 are arranged on both sides of the protective box 6 close to the first connecting rod 13 and the second connecting rod 14, and the first connecting rod 13 and the second connecting rod 14 are respectively slidably connected inside the two limiting grooves 7.

[0025] In this embodiment, the screw rod 11 is driven to rotate by the forward and reverse motor 10, and the screw rod 11 drives the moving block 12 to perform translational movement. The moving block 12 is limited by the limit groove 7 and can only move left and right along the direction of the screw rod 11. This system enables the vacuum negative pressure machine 17 to be accurately moved to the wafer pallet 4 and firmly adsorb the wafer body 5. Subsequently, the wafer body 5 is driven to be transported backward, and the water pump 8 and the wafer body 5 are running at the same time. Multiple nozzles 9 spray cleaning agent to clean the wafer body 5, thereby achieving simultaneous cleaning of the wafer body 5 during the transmission process, without the need for additional cleaning steps, thereby improving the transmission efficiency.

[0026] The first connecting rod 13 is designed to be U-shaped, and a gas injector 16 is connected to the end thereof. The output end of the gas injector 16 is close to the nozzle 9 . A bearing 15 is provided inside the protective box 6 , and a screw rod 11 is rotatably connected inside the bearing 15 .

[0027] In this embodiment, the gas injector 16 can clean the cleaning agent, thereby reducing secondary pollution, and the bearing 15 plays a role in supporting and fixing the screw rod 11.

[0028] A forward and reverse motor 10, a screw rod 11, and a second connecting rod 14 are also provided inside the protective box 6 below the top plate 2. The output directions of the nozzle 9 and the gas injector 16 are perpendicular to the adsorption direction of the suction cup 18. The output points of the nozzle 9 and the gas injector 16 are the same. Rubber blocks 19 are installed at the bottom of the four support rods of the bracket 1.

[0029] In this embodiment, the rubber block 19 plays a role of shock absorption.

[0030] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A wafer transport mechanism, comprising a support (1), characterized in that: The support (1) is provided with a top plate (2) and a bottom plate (3) from top to bottom, a wafer support plate (4) is provided above the bottom plate (3), a wafer body (5) is placed on the wafer support plate (4), a protective box (6) is provided on the outside of the support (1), a forward and reverse motor (10) is provided inside the protective box (6), the output end of the forward and reverse motor (10) is connected to a screw rod (11), a moving block (12) is threadedly connected to the screw rod (11), the two sides of the moving block (12) are respectively connected to a first connecting rod (13) and a second connecting rod (14), the second connecting rod (14) is connected to an outer water pump (8), a side of the water pump (8) close to the wafer body (5) is provided with a plurality of nozzles (9), a protective box (6) is also provided below the top plate (2), the internal output end of the protective box (6) is connected to a vacuum negative pressure machine (17), and a suction cup (18) is provided at the bottom output end of the vacuum negative pressure machine (17).

2. A wafer transfer mechanism according to claim 1, characterized in that: Limiting grooves (7) are provided on both sides of the protection box body (6) near the first connecting rod (13) and the second connecting rod (14), and the first connecting rod (13) and the second connecting rod (14) are slidably connected inside the two limiting grooves (7).

3. The wafer transfer mechanism according to claim 1, characterized in that: The first connecting rod (13) is designed to be U-shaped, and a gas injector (16) is connected to the end thereof, wherein the output end of the gas injector (16) is close to the nozzle (9).

4. The wafer transfer mechanism according to claim 1, characterized in that: A bearing (15) is provided inside the protection box (6), and a screw rod (11) is rotatably connected inside the bearing (15).

5. The wafer transfer mechanism according to claim 1, characterized in that: A forward and reverse motor (10), a screw rod (11), and a second connecting rod (14) are also arranged inside the protective box (6) below the top plate (2).

6. The wafer transfer mechanism according to claim 3, characterized in that: The output directions of the nozzle (9) and the gas injector (16) are perpendicular to the adsorption direction of the suction cup (18).

7. The wafer transfer mechanism according to claim 3, characterized in that: The output points of the nozzle (9) and the gas injector (16) are the same.

8. The wafer transfer mechanism according to claim 1, characterized in that: Rubber blocks (19) are installed at the bottoms of the four support rods of the bracket (1).

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