Large-current chip connecting device

Abstract

The utility model discloses a large-current chip connecting device, which comprises a base (101), a plurality of groups of first terminals (301) and a plurality of groups of second terminals (201), the base (101) is provided with a plurality of groups of pin holes; the plurality of groups of first terminals (301) and the plurality of groups of second terminals (201) are arranged in the plurality of groups of pin holes in a one-to-one penetrating manner and extend out of the top and the bottom of the base (101) respectively; the first terminals (301) and the second terminals (201) are annularly arranged on the base (101) and are alternated with each other. According to the large-current chip connecting device disclosed by the utility model, annular multi-layer centralized distribution is adopted, so that first, PCB wiring is facilitated, and second, the current-carrying capability and the power are improved; and thirdly, the heat dissipation area can be increased while the large current is met, and the service life is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip connection, in particular to a high-current chip connection device. Background Art

[0002] With the development of global intelligent AI computing power, the demand for chip power is getting higher and higher. The existing chip terminal structure is single. Due to the limitation of CPU space structure, the terminal cross-section is usually small and the current carrying capacity is poor, which cannot meet the requirements of high power and high current. Utility Model Content

[0003] The utility model aims to provide a high-current chip connection device.

[0004] The utility model provides a high-current chip connection device, comprising a base (101), a plurality of groups of first terminals (301) and a plurality of groups of second terminals (201); the base (101) is provided with a plurality of groups of pin holes; the plurality of groups of first terminals (301) and the plurality of groups of second terminals (201) are inserted into the plurality of groups of pin holes one by one and extend from the top and the bottom of the base (101) respectively; the first terminals (301) and the second terminals (201) are arranged in a ring shape on the base (101) and alternate with each other.

[0005] Preferably, the number of rows of terminals in each ring area of ​​the first terminal (301) and the second terminal (201) is 5. Those skilled in the art will appreciate that 5 rows constitute 1 ring area, which can ensure the passage of large current and improve the heat dissipation effect.

[0006] Preferably, the first terminal (301) comprises a first column (3013); the first column (3013) is fixed to the base (101) after being inserted into the pin hole.

[0007] Preferably, the first terminal (301) further comprises a second column (3012) and a spring; the top of the first column (3013) is provided with a first slot hole matching the outer diameter of the second column (3012); the spring is fixed to the bottom of the first slot hole; the bottom of the second column (3012) is connected to the spring after being inserted into the first slot hole, and the top of the second column (3012) extends out of the top of the base (101).

[0008] Preferably, the first terminal (301) further comprises a third column (3014); the third column (3014) is fixed to the bottom of the first column (3013); and the bottom of the third column (3014) is arc-shaped.

[0009] Preferably, the first terminal (301) further comprises a first solder ball (3011); a first arc-shaped groove (3015) is provided at the top of the second column (3012); and the first solder ball (3011) is fixed in the first arc-shaped groove (3015).

[0010] Preferably, the second terminal (201) comprises a clamping portion (2012), a PCB connecting portion (2013) and a chip connecting portion (2011); the PCB connecting portion (2013) and the chip connecting portion (2011) are respectively located at the top and the bottom of the clamping portion (2012); the clamping portion (2012), the PCB connecting portion (2013) and the chip connecting portion (2011) are all sheet-shaped; the second terminal (201) is an integrally formed structure; the clamping portion (2012) is arranged in the pin hole and fixed to the base (101); the PCB connecting portion (2013) and the chip connecting portion (2011) extend from the bottom and the top of the base (101) respectively.

[0011] Preferably, the second terminal (201) further comprises a second solder ball (2014); a second arc-shaped groove (2015) is provided on the top of the chip connecting portion (2011); and the second solder ball (2014) is fixed at the second arc-shaped groove (2015).

[0012] The high-current chip connection device provided by the utility model has a first terminal (301) for electrically connecting to a power source, and a second terminal (201) for connecting to a signal. The second terminal (201) connected to the signal and the first terminal (301) connected to the power source are both distributed in a ring-shaped multi-layer centralized manner. Firstly, it is convenient for PCB wiring, secondly, the current carrying capacity is increased and the power is improved; thirdly, while meeting the high current, the heat dissipation area can be increased, thereby improving the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a top view of the high current chip connection device described in the utility model;

[0014] Figure 2 This is a bottom view of the high current chip connection device of the utility model;

[0015] Figure 3 for Figure 1 A magnified schematic diagram of the structure in the middle;

[0016] Figure 4 for Figure 3 A magnified schematic diagram of structure B in the middle;

[0017] Figure 5 This is a left view of the high current chip connection device of the utility model;

[0018] Figure 6 for Figure 5 A magnified schematic diagram of the C structure;

[0019] Figure 7 A schematic diagram of the structure in which the second terminal provided by the embodiment of the utility model is assembled with the chip and the PCB board respectively;

[0020] Figure 8 A schematic diagram of the structure in which the first terminal provided in the embodiment of the utility model is assembled with the chip and the PCB board respectively. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figure 1-Figure 8 As shown, the high-current chip connection device provided in this embodiment includes a base 101, multiple groups of first terminals 301 and multiple groups of second terminals 201; the base 101 is provided with multiple groups of pin holes; multiple groups of the first terminals 301 and multiple groups of the second terminals 201 are inserted into the multiple groups of the pin holes one by one and extend from the top and bottom of the base 101 respectively; the first terminals 301 and the second terminals 201 are arranged in a ring shape on the base 101 and alternate with each other. Those skilled in the art can understand that the base is made of plastic material; the first terminal 301 is used to electrically connect to the power supply, and the second terminal 201 is used to connect to the signal. The second terminal 201 connected to the signal and the first terminal 301 connected to the power supply are both distributed in a ring-shaped multi-layer centralized manner, which is first convenient for PCB wiring, second to increase the current carrying capacity and improve the power; third to meet the large current while also increasing the heat dissipation area and improving its service life.

[0023] Furthermore, the number of rows of terminals in each ring area of ​​the first terminal 301 and the second terminal 201 is 5. Those skilled in the art can understand that 5 rows constitute 1 ring area, which can ensure the passage of large current and improve the heat dissipation effect.

[0024] Furthermore, the first terminal 301 includes a first column 3013 ; the first column 3013 is inserted into the pin hole and fixed to the base 101 .

[0025] Further, the first terminal 301 further includes a second column 3012 and a spring (not shown in the figure); the top of the first column 3013 is provided with a first slot hole (not shown in the figure) matching the outer diameter of the second column 3012; the spring is fixed at the bottom of the first slot hole; the bottom of the second column 3012 is connected to the spring after being inserted into the first slot hole, and the top of the second column 3012 extends out of the top of the base 101. Those skilled in the art can understand that the second column 3012 and the first column 3013 are slidably connected, so that when contacting the chip 401, it can play a buffering role to prevent the first terminal 301 from being damaged.

[0026] Furthermore, the first terminal 301 further includes a third column 3014; the third column 3014 is fixed to the bottom of the first column 3013; the bottom of the third column 3014 is arc-shaped. Those skilled in the art can understand that the third column 3014 is used to connect with the PCB board 501, and its arc-shaped bottom can fit with the arc-shaped groove of the PCB board 501.

[0027] Furthermore, the first terminal 301 further includes a first solder ball 3011; the top of the second column 3012 is provided with a first arc groove 3015; the first solder ball 3011 is fixed in the first arc groove 3015. Those skilled in the art can understand that the first solder ball 3011 is used to connect with the chip 401.

[0028] Furthermore, the second terminal 201 includes a clamping portion 2012, a PCB connecting portion 2013 and a chip connecting portion 2011; the PCB connecting portion 2013 and the chip connecting portion 2011 are respectively located at the top and bottom of the clamping portion 2012; the clamping portion 2012, the PCB connecting portion 2013 and the chip connecting portion 2011 are all sheet-shaped; the second terminal 201 is an integrally formed structure; the clamping portion 2012 is arranged in the pin hole and fixed to the base 101; the PCB connecting portion 2013 and the chip connecting portion 2011 extend from the bottom and top of the base 101 respectively.

[0029] Furthermore, the second terminal 201 further includes a second solder ball 2014; a second arc-shaped groove 2015 is provided on the top of the chip connection portion 2011; and the second solder ball 2014 is fixed at the second arc-shaped groove 2015. Those skilled in the art can understand that the second terminal 201 is used for information signal connection and does not need to pass a large current, so the second terminal 201 is formed by traditional stamping, which has high assembly efficiency and low material cost.

[0030] Those skilled in the art will appreciate that the first terminal 301 and the second terminal 201 are designed using different processes, which not only meets the functional requirements of customers, but also reduces costs and meets market demand.

[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A high current chip connection device, characterized in that: The invention comprises a base (101), a plurality of groups of first terminals (301) and a plurality of groups of second terminals (201); the base (101) is provided with a plurality of groups of pin holes; the plurality of groups of first terminals (301) and the plurality of groups of second terminals (201) are inserted into the plurality of groups of pin holes one by one and extend from the top and the bottom of the base (101) respectively; the first terminals (301) and the second terminals (201) are arranged in a ring shape on the base (101) and alternate with each other.

2. The high current chip connection device according to claim 1, characterized in that: The number of rows of terminals in each ring area of ​​the first terminal (301) and the second terminal (201) is 5.

3. The high current chip connection device according to claim 2, characterized in that: The first terminal (301) comprises a first column (3013); after the first column (3013) is inserted into the pin hole, it is fixed to the base (101).

4. The high current chip connection device according to claim 3, characterized in that: The first terminal (301) further comprises a second column (3012) and a spring; the top of the first column (3013) is provided with a first slot hole matching the outer diameter of the second column (3012); the spring is fixed to the bottom of the first slot hole; the bottom of the second column (3012) is connected to the spring after being inserted into the first slot hole, and the top of the second column (3012) extends out of the top of the base (101).

5. The high current chip connection device according to claim 4, characterized in that: The first terminal (301) further comprises a third column (3014); the third column (3014) is fixed to the bottom of the first column (3013); the bottom of the third column (3014) is arc-shaped.

6. The high current chip connection device according to claim 5, characterized in that: The first terminal (301) further comprises a first solder ball (3011); a first arc-shaped groove (3015) is provided at the top of the second column (3012); and the first solder ball (3011) is fixed in the first arc-shaped groove (3015).

7. The high current chip connection device according to claim 6, characterized in that: The second terminal (201) comprises a clamping portion (2012), a PCB connecting portion (2013) and a chip connecting portion (2011); the PCB connecting portion (2013) and the chip connecting portion (2011) are respectively located at the top and the bottom of the clamping portion (2012); the clamping portion (2012), the PCB connecting portion (2013) and the chip connecting portion (2011) are all sheet-shaped; the second terminal (201) is an integrally formed structure; the clamping portion (2012) is arranged in the pin hole and fixed to the base (101); the PCB connecting portion (2013) and the chip connecting portion (2011) extend from the bottom and the top of the base (101) respectively.

8. The high current chip connection device according to claim 7, characterized in that: The second terminal (201) further comprises a second solder ball (2014); a second arc-shaped groove (2015) is provided on the top of the chip connecting portion (2011); and the second solder ball (2014) is fixed at the second arc-shaped groove (2015).

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