Wave soldering device

Abstract

The utility model discloses a wave soldering device, which relates to the technical field of soldering equipment and comprises a transport device, the transport device comprises a conveyor belt, an element positioner and a motor, the motor is mounted on the left end face of the transport device, the conveyor belt is mounted on the inner side of the transport device, and the element positioner is mounted on the conveyor belt. A plurality of element positioners are mounted on the inner wall of the transportation device; according to the soldering flux spraying device, the laser sensor is arranged, the air pump is started, soldering flux is sprayed out through the nozzle, the soldering flux is sprayed to a part needing to be welded, the laser sensor can accurately identify the part needing to be sprayed with the soldering flux, identification is effective, production efficiency can be improved, the fan can be installed through the installation plate, and the production efficiency is improved. The fan is started to drive airflow to move, firstly, the air is filtered through the activated carbon filter screen, then the air is heated through the heating wire, and finally the air is brought to the circuit board to preheat and dry a part to be soldered, so that the processing quality of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of welding equipment, in particular to a wave soldering device. Background Art

[0002] Wave soldering has been around for nearly 70 years since it was invented in the 1950s. Because of its easy operation, high production efficiency, low cost and strong reliability, it is still widely used in the electronics field, especially in power supplies, home appliances, communications, automatic control, medical, military electronics and other fields.

[0003] The production of electronic components is inseparable from circuit boards. Multiple components are soldered on the circuit board substrate to form a circuit board. The soldering method was originally manual soldering. However, with the increase in soldered components, the soldering method has changed to wave soldering, which is more automated. Wave soldering is to insert plug-in components into a conveyor belt, spray flux, and then go through preheating, wave soldering, and cooling to complete the soldering of components.

[0004] There are various types of wave soldering machines on the market. However, in the actual use of wave soldering, it is found that there are still some defects that affect the efficiency and effect of wave soldering. One is that the components are inserted into the conveyor belt, and the insertion is unstable, so that the components cannot be stably fixed on the conveyor belt, and the components are easy to fall or tilt; the other is that the solder at the opening of the tin spraying port is easy to oxidize, resulting in serious solder waste. Utility Model Content

[0005] The purpose of the utility model is to provide a wave soldering device, which can solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wave soldering device, including a transport device, the transport device including a conveyor belt, a component locator and a motor, the left end face of the transport device is equipped with a motor, the inner side of the transport device is equipped with a conveyor belt, a plurality of component locators are installed on the inner wall of the transport device, and the lower end face of the transport device is fixedly provided with a supporting foot.

[0007] Preferably, a shell is fixedly provided on the upper end surface of the transport device, a mounting groove is provided on the upper end surface of the shell, and an observation window is provided on the front side of the shell.

[0008] Preferably, a flux tank is installed inside the mounting groove, and an air pump is installed on the lower end surface of the flux tank.

[0009] Preferably, the output end of the air pump is fixedly connected to a nozzle, and the inner lower end surface of the shell is fixedly provided with a laser sensor.

[0010] Preferably, a fixing frame is fixedly provided on the upper end surface of the shell, and an activated carbon filter is installed inside the fixing frame.

[0011] Preferably, a mounting plate is fixedly provided inside the fixing frame, a fan is fixedly provided on the lower end surface of the mounting plate, and a heating wire is installed inside the fixing frame.

[0012] Preferably, a tin melting pot is fixedly provided on the lower end surface of the shell, a wave soldering generator is installed inside the tin melting pot, and a tin spraying port is fixedly connected to the output end of the wave soldering generator.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model starts the air pump by setting a laser sensor, and the flux is sprayed out through the nozzle to spray the flux on the parts that need to be welded. The laser sensor can accurately identify the parts that need to be sprayed with flux, and the effective identification is conducive to improving production efficiency.

[0015] 2. The utility model sets a mounting plate, and the mounting plate can be used to install the fan. Starting the fan can drive the airflow to move. First, the air is filtered through an activated carbon filter, and then heated by a heating wire. Finally, the air is brought to the circuit board to preheat and dry the parts to be soldered, thereby improving the processing quality of the device. The wave soldering generator is started to process the circuit board, and the width of the tin spraying port is 210 mm, which is smaller than the existing tin spraying port, thereby reducing the amount of tin and oxidation, reducing costs, reducing the amount of oxidation, and reducing the amount of tin used. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the overall cross-sectional structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the exploded three-dimensional structure of the fixing frame of the utility model;

[0019] Figure 4 The utility model is a three-dimensional structural schematic diagram of a tin melting can.

[0020] In the figure: 1. Transport device; 2. Shell; 3. Conveyor belt; 4. Component locator; 5. Observation window; 6. Mounting slot; 7. Flux tank; 8. Air pump; 9. Laser sensor; 10. Nozzle; 11. Motor; 12. Fixing bracket; 13. Activated carbon filter; 14. Mounting plate; 15. Fan; 16. Heating wire; 17. Tin melting tank; 18. Wave soldering generator; 19. Tin spray nozzle; 20. Support foot. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Example 1

[0023] See also Figure 1 A wave soldering device shown in the figure includes a transport device 1, which includes a conveyor belt 3, a component locator 4 and a motor 11. The motor 11 is installed on the left end face of the transport device 1, the conveyor belt 3 is installed on the inner side of the transport device 1, a plurality of component locators 4 are installed on the inner wall of the transport device 1, and a supporting foot 20 is fixedly provided on the lower end face of the transport device 1.

[0024] See also Figure 2 In the figure, a shell 2 is fixedly provided on the upper end surface of the transport device 1, a mounting groove 6 is provided on the upper end surface of the shell 2, and an observation window 5 is provided on the front side of the shell 2.

[0025] In this embodiment, the transport device 1 can transport the circuit board into the wave soldering machine, and the user can observe the internal operation of the device through the observation window 5.

[0026] Working principle: First, the circuit board can be sent into the wave soldering machine through the transportation device 1, and the circuit board can be limited by the component locator 4. The user can observe the internal operation of the device through the observation window 5. The flux tank 7 is installed inside the installation groove 6. When the flux tank 7 is damaged, it is convenient to replace it. Start the air pump 8 to spray the flux on the part of the circuit board that needs to be welded. Start the air pump 8, and the flux is sprayed through the nozzle 10 to spray the flux on the part that needs to be welded. The laser sensor 9 can accurately identify the part that needs to be sprayed with flux. Effective identification is conducive to improving production efficiency. The fixing frame 12 supports the activated carbon filter 13, the heating wire 16 and the mounting plate 14, which further improves The stability of the device is improved, and the activated carbon filter 13 can filter dust, particles, etc. in the air to prevent dust, particles, etc. from entering the inside of the device and causing damage to parts. The mounting plate 14 can install the fan 15. Starting the fan 15 can drive the airflow to move. First, the air is filtered through the activated carbon filter 13, and then the air is heated by the heating wire 16. Finally, it is brought to the circuit board to preheat and dry the part to be soldered, thereby improving the processing quality of the device. The wave soldering generator 18 is started to process the circuit board, and the width of the tin spraying port 19 is 210 mm, which is smaller than the existing tin spraying port 19, reducing the amount of tin and reducing oxidation, reducing costs, reducing oxidation, and reducing the amount of tin.

[0027] Example 2

[0028] See also Figure 2 This embodiment further explains Example 1. In the figure, a flux tank 7 is installed inside the mounting groove 6, and an air pump 8 is installed on the lower end surface of the flux tank 7.

[0029] In this embodiment, a soldering flux tank 7 is installed inside the installation groove 6, so that the soldering flux tank 7 can be easily replaced when damaged. The air pump 8 can be started to spray the soldering flux on the part of the circuit board that needs to be welded.

[0030] See also Figure 2 In the figure, the output end of the air pump 8 is fixedly connected to the nozzle 10, and the inner lower end surface of the shell 2 is fixedly provided with a laser sensor 9.

[0031] In this embodiment: the air pump 8 is started, the flux is sprayed out through the nozzle 10, and the flux is sprayed on the parts that need to be welded, and the laser sensor 9 can accurately identify the parts that need to be sprayed with flux, and the effective identification is conducive to improving production efficiency.

[0032] See also Figure 3 In the figure, a fixing frame 12 is fixedly provided on the upper end surface of the housing 2, and an activated carbon filter 13 is installed inside the fixing frame 12.

[0033] In this embodiment: the fixing frame 12 supports the activated carbon filter 13, the heating wire 16 and the mounting plate 14, further improving the stability of the device, and the activated carbon filter 13 can filter dust, particles, etc. in the air to prevent dust, particles, etc. from entering the interior of the device and causing damage to parts.

[0034] See also Figure 3 In the figure, a mounting plate 14 is fixedly arranged inside the fixing frame 12 , a fan 15 is fixedly arranged on the lower end surface of the mounting plate 14 , and a heating wire 16 is installed inside the fixing frame 12 .

[0035] In this embodiment: the mounting plate 14 can be used to install the fan 15. Starting the fan 15 can drive the airflow to move. First, the air is filtered through the activated carbon filter 13, and then the air is heated by the heating wire 16. Finally, it is brought to the circuit board to preheat and dry the part to be soldered, thereby improving the processing quality of the device.

[0036] See also Figure 4 In the figure, a molten tin tank 17 is fixedly provided on the lower end surface of the housing 2, a wave soldering generator 18 is installed inside the molten tin tank 17, and a tin spraying port 19 is fixedly connected to the output end of the wave soldering generator 18.

[0037] In this embodiment: the wave soldering generator 18 is started to process the circuit board, and the width of the tin spraying port 19 is 210 mm, which is smaller than the existing tin spraying port 19, reducing the amount of tin used and oxidation, reducing costs, reducing the amount of oxidation, and reducing the amount of tin used.

[0038] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include"-"comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process-method-article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process-method-article or device.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wave soldering device, comprising a transport device (1), characterized in that: The transport device (1) comprises a conveyor belt (3), a component positioner (4) and a motor (11); the motor (11) is installed on the left end face of the transport device (1); the conveyor belt (3) is installed on the inner side of the transport device (1); a plurality of component positioners (4) are installed on the inner wall of the transport device (1); and a support foot (20) is fixedly provided on the lower end face of the transport device (1).

2. A wave soldering device according to claim 1, characterized in that: A shell (2) is fixedly arranged on the upper end surface of the transport device (1), a mounting groove (6) is provided on the upper end surface of the shell (2), and an observation window (5) is provided on the front surface of the shell (2).

3. A wave soldering device according to claim 2, characterized in that: A soldering flux tank (7) is installed inside the installation groove (6), and an air pump (8) is installed on the lower end surface of the soldering flux tank (7).

4. A wave soldering device according to claim 3, characterized in that: The output end of the air pump (8) is fixedly connected to a nozzle (10), and the inner lower end surface of the housing (2) is fixedly provided with a laser sensor (9).

5. A wave soldering device according to claim 4, characterized in that: A fixing frame (12) is fixedly arranged on the upper end surface of the housing (2), and an activated carbon filter (13) is installed inside the fixing frame (12).

6. A wave soldering device according to claim 5, characterized in that: A mounting plate (14) is fixedly arranged inside the fixing frame (12), a fan (15) is fixedly arranged on the lower end surface of the mounting plate (14), and a heating wire (16) is installed inside the fixing frame (12).

7. A wave soldering device according to claim 5, characterized in that: A molten tin tank (17) is fixedly arranged on the lower end surface of the housing (2), a wave soldering generator (18) is installed inside the molten tin tank (17), and a tin spraying port (19) is fixedly connected to the output end of the wave soldering generator (18).

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