Laser processing device and laser de-bonding equipment

Abstract

The utility model is suitable for the technical field of laser processing, and provides a laser processing device and laser de-bonding equipment, the laser processing device comprises a base, a moving assembly, a carrying table, a distance measuring assembly and a laser emitting unit; the moving assembly, the distance measuring assembly and the laser emitting unit are arranged on the base; the carrying table is arranged at the output end of the moving assembly. The laser emitting unit is used for emitting laser beams. The moving assembly is used for driving the carrying table to move to the position under the distance measuring assembly and the laser emitting unit. According to the embodiment of the invention, the focus height of the laser emitting unit is adjusted according to the distance between the surface of the wafer and the distance measuring assembly, so that the de-bonding precision can be improved.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing device and a laser debonding equipment. Background Art

[0002] Integrated circuits are an important part of smart products, and wafers are the foundation of integrated circuit development. With the rapid development of integrated circuits, the market has put forward higher requirements on the processing quality of wafers.

[0003] In the semiconductor industry, during the wafer packaging process, due to the curing of the plastic packaging material and the different thermal expansion coefficients of different materials, the volume changes of different materials are different, causing the wafer to warp. The wafer warping will affect the processing accuracy of the laser debonding process, resulting in a decrease in the yield rate of wafer processing.

[0004] At present, wafers are generally fixed by using a wafer positioning jig to reduce the impact of wafer warpage on debonding accuracy. However, this method of fixing the wafer by a jig has limited improvement in the debonding accuracy of the wafer, resulting in a still low yield rate of wafer processing. Utility Model Content

[0005] The embodiments of the present application provide a laser processing device and a laser debonding device, which can improve the accuracy of wafer debonding.

[0006] In a first aspect, an embodiment of the present application provides a laser processing device, the laser processing device comprising:

[0007] Base;

[0008] A moving component, wherein the moving component is arranged on the base;

[0009] A carrier, the carrier being arranged at an output end of the moving component;

[0010] A distance measuring component, wherein the distance measuring component is arranged on the base;

[0011] A laser emitting unit, the laser emitting unit is disposed on the base, and the laser emitting unit is used to emit a laser beam;

[0012] The moving component is used to drive the carrier to move to the bottom of the distance measuring component and the laser emitting unit respectively.

[0013] In some possible implementations of the first aspect, the ranging component includes:

[0014] A mounting bracket, the mounting bracket is arranged on the base;

[0015] A laser emitting end, the laser emitting end is arranged on the mounting bracket, and the laser emitting end is used to emit a laser beam;

[0016] A laser receiving end, wherein the laser receiving end is arranged on the mounting bracket, and the laser receiving end is used to receive reflected light of the laser beam emitted by the laser emitting end.

[0017] In some possible implementations of the first aspect, the ranging component further includes:

[0018] a first adjustment unit, wherein the first adjustment unit is disposed on the mounting bracket;

[0019] A fixing member, the fixing member is connected to the first adjusting unit, and the first adjusting unit is used to adjust the height of the fixing member; the laser emitting end and the laser receiving end are both arranged on the fixing member.

[0020] In some possible implementations of the first aspect, the laser processing device further includes:

[0021] A power detection component is arranged at the output end of the moving component, and the moving component is used to drive the carrier and the power detection component to move synchronously.

[0022] In some possible implementations of the first aspect, the laser processing device further includes:

[0023] A light spot detection component is arranged at the output end of the moving component, and the moving component is used to drive the carrier and the light spot detection component to move synchronously.

[0024] In some possible implementations of the first aspect, the light spot detection component includes:

[0025] A mirror seat, the mirror seat being arranged at the output end of the moving component;

[0026] A reflector, wherein the reflector is disposed in the mirror seat;

[0027] A filter, wherein the filter is arranged in the lens holder;

[0028] An attenuation sheet, the attenuation sheet is arranged in the mirror seat;

[0029] An image acquisition unit, wherein the image acquisition unit is arranged on the lens base;

[0030] Wherein, the reflector, the filter, the attenuation plate and the image acquisition unit are arranged in sequence on the same optical path.

[0031] In some possible implementations of the first aspect, the laser processing device further includes:

[0032] A second adjusting unit, wherein the second adjusting unit is arranged at an output end of the moving component, the light spot detection component is arranged at an output end of the second adjusting unit, and the second adjusting unit is used to adjust the height of the light spot detection component.

[0033] In some possible implementations of the first aspect, the moving component includes:

[0034] A first motion unit, wherein the first motion unit is disposed on the base;

[0035] a second motion unit, the second motion unit being disposed at an output end of the first motion unit, and the first motion unit being used to drive the second motion unit to move along a first direction;

[0036] A third motion unit, the third motion unit is arranged at the output end of the second motion unit, and the second motion unit is used to drive the third motion unit to move along the second direction; the stage is arranged at the output end of the third motion unit, and the third motion unit is used to drive the stage to move along the height direction;

[0037] The first direction, the second direction and the height direction are perpendicular to each other.

[0038] In some possible implementations of the first aspect, the laser processing device further includes:

[0039] A support seat, wherein the support seat is arranged on the base, and the distance measuring component and the laser emitting unit are both arranged on the support seat.

[0040] In a second aspect, an embodiment of the present application provides a laser debonding device, which includes a laser processing device as described in any one of the above technical solutions.

[0041] In the laser processing device and laser debonding equipment provided by the embodiments of the present application, a moving component, a distance measuring component and a laser emitting unit are all arranged on a base; a carrier is arranged at the output end of the moving component, and the carrier is used to place a wafer; after the wafer is positioned on the carrier, the moving component is used to drive the carrier to move to directly below the distance measuring component, and the distance measuring component is used to measure the distance between the wafer surface and the distance measuring component; then the moving component drives the carrier to directly below the laser emitting unit, so as to adjust the focal height of the laser beam emitted by the laser emitting unit according to the distance between the wafer surface and the distance measuring component, so as to debond the wafer on the carrier by the laser beam emitted by the laser emitting unit; since the focal height of the laser emitting unit is adjusted according to the distance between the wafer surface and the distance measuring component, the accuracy of debonding can be improved; and the influence on the accuracy of wafer debonding caused by the inconsistent focusing height of the laser beam emitted by the laser emitting unit on the wafer due to wafer warping is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0043] Figure 1 This is a schematic structural diagram of an embodiment of the laser processing device of the present application;

[0044] Figure 2 This is a schematic structural diagram of another embodiment of the laser processing device of the present application;

[0045] Figure 3 This is a schematic structural diagram of another embodiment of the laser processing device of the present application;

[0046] Figure 4 for Figure 3 Schematic diagram of the structure of the light spot detection component.

[0047] Description of Figure Numbers:

[0048] 1. Base; 2. Moving assembly; 21. First moving unit; 22. Second moving unit; 23. Third moving unit; 3. Carrier; 4. Distance measuring assembly; 41. Mounting bracket; 42. Fixing piece; 5. Laser emitting unit; 6. Power detecting assembly; 7. Spot detecting assembly; 71. Mirror holder; 72. Reflector; 73. Filter; 74. Attenuation plate; 75. Image acquisition unit; 8. Second adjusting unit; 9. Support seat.

[0049] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0051] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0052] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0053] It should be understood that the term “and / or” used in the specification and appended claims of this application refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0054] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0055] The embodiments of the present application provide a laser processing device and a laser debonding device, which are used to solve the technical problem of low precision of wafer debonding.

[0056] In the embodiments of the present application, Figure 1As shown, the laser processing device includes a base 1, a moving component 2, a carrier 3, a distance measuring component 4 and a laser emitting unit 5. The moving component 2, the distance measuring component 4 and the laser emitting unit 5 are all arranged on the base 1. The carrier 3 is arranged at the output end of the moving component 2, and the laser emitting unit 5 is used to emit a laser beam.

[0057] The moving component 2 is used to drive the carrier 3 to move to the bottom of the distance measuring component 4 and the laser emitting unit 5 respectively.

[0058] In this embodiment, the wafer is placed on the stage 3. The laser emitting unit 5 is used to emit a laser beam so as to debond the wafer on the stage 3.

[0059] like Figure 1 As shown, the first direction is parallel to the X-axis, the second direction is parallel to the Y-axis, and the height direction is parallel to the Z-axis.

[0060] The moving component 2, the distance measuring component 4 and the laser emitting unit 5 of the embodiment of the present application are all arranged on the base 1; the stage 3 is arranged at the output end of the moving component 2, and the stage 3 is used to place the wafer; after the wafer is positioned on the stage 3, the moving component 2 is used to drive the stage 3 to move to the bottom of the distance measuring component 4, and the distance measuring component 4 is used to measure the distance between the wafer surface and the distance measuring component 4; then the moving component 2 drives the stage 3 to the bottom of the laser emitting unit 5, so as to adjust the focal height of the laser beam emitted by the laser emitting unit 5 according to the distance between the wafer surface and the distance measuring component 4, so as to debond the wafer on the stage 3 by the laser beam emitted by the laser emitting unit 5; since the focal height of the laser emitting unit 5 is adjusted according to the distance between the wafer surface and the distance measuring component 4, the accuracy of debonding can be improved; and the influence on the accuracy of wafer debonding when the height of the laser beam emitted by the laser emitting unit 5 on the wafer is inconsistent due to wafer warping is reduced.

[0061] In one embodiment, if Figure 1 As shown, the distance measuring component 4 includes a mounting bracket 41, a laser emitting end and a laser receiving end, and the mounting bracket 41 is arranged on the base 1. The laser emitting end and the laser receiving end are both arranged on the mounting bracket 41, the laser emitting end is used to emit a laser beam, and the laser receiving end is used to receive the reflected light of the laser beam emitted by the laser emitting end.

[0062] After the moving component 2 drives the carrier 3 to the bottom of the laser emitting end and the laser receiving end, the laser emitting end is used to emit a laser beam toward the wafer on the carrier 3. After the laser beam emitted by the laser emitting end is reflected on the wafer, it is received by the laser receiving end. Then, according to the time from the laser emitting end emitting the laser beam to the laser receiving end receiving the reflected laser beam, the distance from the wafer surface to the laser emitting end is calculated, thereby determining the degree of warping of the wafer. Then, according to the degree of warping of the wafer, the focal height of the laser beam emitted by the laser emitting unit 5 is adjusted to improve the debonding accuracy of the wafer.

[0063] In this embodiment, a "X"-shaped track, a "M"-shaped track, etc. can be selected on the wafer according to actual needs to detect the distance from the wafer surface to the laser emitting end under the track, thereby facilitating the evaluation of the degree of wafer warping.

[0064] In one embodiment, if Figure 1 As shown, the distance measuring assembly 4 further includes a first adjustment unit and a fixing member 42, wherein the first adjustment unit is disposed on the mounting bracket 41. The fixing member 42 is connected to the first adjustment unit, and the first adjustment unit is used to adjust the height of the fixing member 42. The laser emitting end and the laser receiving end are both disposed on the fixing member 42.

[0065] The first adjusting unit is used to adjust the height of the fixing member 42, and the laser emitting end and the laser receiving end are both arranged on the fixing member 42, so the first adjusting member can adjust the height of the laser emitting end and the laser receiving end through the fixing member 42 to measure the distance of the surface of the wafer.

[0066] In one embodiment, if Figure 1 and Figure 2 As shown, the laser processing device further includes a power detection component 6, which is disposed at the output end of the moving component 2. The moving component 2 is used to drive the stage 3 and the power detection component 6 to move synchronously. After the wafer is positioned on the stage 3, the moving component 2 is used to drive the power detection component 6 to move to just below the laser emitting unit 5, so as to measure the power of the laser beam emitted by the laser emitting unit 5 through the power detection component 6.

[0067] In this embodiment, if the power of the laser beam emitted by the laser emitting unit 5 is too large, the product layer of the wafer will be damaged during the wafer debonding process. If the power of the laser beam emitted by the laser emitting unit 5 is too small, it will not be able to react with the laser response layer.

[0068] In one embodiment, if Figure 1 and Figure 3As shown, the laser processing device further includes a spot detection component 7, which is disposed at the output end of the moving component 2, and the moving component 2 is used to drive the stage 3 and the spot detection component 7 to move synchronously. After positioning the wafer on the stage 3, the moving component 2 is used to drive the spot detection component 7 to move to just below the laser emitting unit 5, so as to measure the spot of the laser beam emitted by the laser emitting unit 5 through the spot detection component 7. Among them, the parameters measured for the spot of the laser beam emitted by the laser emitting unit 5 include the morphology, size and uniformity of the spot.

[0069] In this embodiment, the shape, size and uniformity of the spot of the laser beam emitted by the laser emitting unit 5 will affect the uniformity of the laser beam in debonding the wafer.

[0070] In one embodiment, if Figure 1 and Figure 4 As shown, the light spot detection component 7 includes a mirror base 71, a reflector 72, a filter 73, an attenuation plate 74 and an image acquisition unit 75, and the mirror base 71 is arranged at the output end of the moving component 2. The reflector 72, the filter 73 and the attenuation plate 74 are all arranged in the mirror base 71, and the image acquisition unit 75 is arranged in the mirror base 71. Among them, the reflector 72, the filter 73, the attenuation plate 74 and the image acquisition unit 75 are arranged in sequence on the same optical path.

[0071] The mirror holder 71 is used to install a reflector 72, a filter 73, an attenuation plate 74 and an image acquisition unit 75. The reflector 72 is used to change the direction of the optical path, the filter 73 is used to remove the light of non-detection wavelengths, and the attenuation plate 74 is used to attenuate the laser power so as to improve the detection accuracy of the spot parameters of the laser beam.

[0072] In this embodiment, the image acquisition unit 75 may be a camera.

[0073] In one embodiment, if Figure 1 and Figure 3 As shown, the laser processing device also includes a second adjusting unit 8, which is arranged at the output end of the moving component 2, and the spot detection component 7 is arranged at the output end of the second adjusting unit 8, and the second adjusting unit 8 is used to adjust the height of the spot detection component 7.

[0074] The moving assembly 2 is used to drive the stage 3 and the second adjusting unit 8 to move synchronously. The second adjusting unit 8 is used to adjust the height of the light spot detection assembly 7 so that the light spot detection assembly 7 can detect the light spot of the focus of the laser beam emitted by the laser emitting unit 5.

[0075] In one embodiment, if Figure 1As shown, the moving assembly 2 includes a first moving unit 21, a second moving unit 22 and a third moving unit 23. The first moving unit 21 is arranged on the base 1, the second moving unit 22 is arranged at the output end of the first moving unit 21, and the first moving unit 21 is used to drive the second moving unit 22 to move along the first direction. The third moving unit 23 is arranged at the output end of the second moving unit 22, and the second moving unit 22 is used to drive the third moving unit 23 to move along the second direction. The carrier 3 is arranged at the output end of the third moving unit 23, and the third moving unit 23 is used to drive the carrier 3 to move along the height direction. Among them, the first direction, the second direction and the height direction are perpendicular to each other.

[0076] The first moving unit 21, the second moving unit 22 and the third moving unit 23 can drive the stage 3 to move in the first direction, the second direction and the height direction, so as to drive the stage 3 to be directly below the distance measuring component 4 and the laser emitting unit 5 respectively. When the stage 3 is driven to be directly below the distance measuring component 4, the stage 3 can also be driven to move along a "cross" or "M" shaped path to improve the distance measuring component 4 to measure the distance between the wafer surface and the distance measuring component 4. When the stage 3 is driven to be directly below the laser emitting unit 5, the stage 3 can also be driven to move in the first direction and the second direction, so that the laser beam emitted by the laser emitting unit 5 debonds the wafer, and the focus of the laser beam emitted by the laser emitting unit 5 can be adjusted according to the distance between the wafer surface and the distance measuring component 4, so as to improve the uniformity of the wafer debonding.

[0077] In one embodiment, if Figure 1 As shown, the laser processing device further includes a support seat 9, which is disposed on the base 1, and the distance measuring component 4 and the laser emitting unit 5 are both disposed on the support seat 9. By providing the support seat 9, the distance measuring component 4 and the laser emitting unit 5 can be conveniently disposed.

[0078] In addition, an embodiment of the present application also provides a laser debonding device, which includes a laser processing device. The specific structure of the laser processing device refers to the above embodiment. Since the laser debonding device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments.

[0079] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the present application specification and drawings under the inventive concept of the present application, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A laser processing device, characterized in that: The laser processing device comprises: Base; A moving component, wherein the moving component is arranged on the base; A carrier, the carrier being arranged at an output end of the moving component; A distance measuring component, wherein the distance measuring component is arranged on the base; A laser emitting unit, the laser emitting unit is disposed on the base, and the laser emitting unit is used to emit a laser beam; The moving component is used to drive the carrier to move to the bottom of the distance measuring component and the laser emitting unit respectively.

2. The laser processing device according to claim 1, characterized in that: The ranging component comprises: A mounting bracket, the mounting bracket is arranged on the base; A laser emitting end, the laser emitting end is arranged on the mounting bracket, and the laser emitting end is used to emit a laser beam; A laser receiving end, wherein the laser receiving end is arranged on the mounting bracket, and the laser receiving end is used to receive reflected light of the laser beam emitted by the laser emitting end.

3. The laser processing device according to claim 2, characterized in that: The ranging component also includes: a first adjustment unit, wherein the first adjustment unit is disposed on the mounting bracket; A fixing member, the fixing member is connected to the first adjusting unit, and the first adjusting unit is used to adjust the height of the fixing member; the laser emitting end and the laser receiving end are both arranged on the fixing member.

4. The laser processing device according to claim 1, characterized in that: The laser processing device also includes: A power detection component is arranged at the output end of the moving component, and the moving component is used to drive the carrier and the power detection component to move synchronously.

5. The laser processing device according to claim 1, characterized in that: The laser processing device also includes: A light spot detection component is arranged at the output end of the moving component, and the moving component is used to drive the carrier and the light spot detection component to move synchronously.

6. The laser processing device according to claim 5, characterized in that: The light spot detection component comprises: A mirror seat, the mirror seat being arranged at the output end of the moving component; A reflector, wherein the reflector is disposed in the mirror seat; A filter, wherein the filter is arranged in the lens holder; An attenuation sheet, the attenuation sheet is arranged in the mirror seat; An image acquisition unit, wherein the image acquisition unit is arranged on the lens base; Wherein, the reflector, the filter, the attenuation plate and the image acquisition unit are arranged in sequence on the same optical path.

7. The laser processing device according to claim 5, characterized in that: The laser processing device also includes: A second adjusting unit, wherein the second adjusting unit is arranged at an output end of the moving component, the light spot detection component is arranged at an output end of the second adjusting unit, and the second adjusting unit is used to adjust the height of the light spot detection component.

8. The laser processing device according to claim 1, characterized in that: The mobile assembly comprises: A first motion unit, wherein the first motion unit is disposed on the base; a second motion unit, the second motion unit being disposed at an output end of the first motion unit, and the first motion unit being used to drive the second motion unit to move along a first direction; A third motion unit, the third motion unit is arranged at the output end of the second motion unit, and the second motion unit is used to drive the third motion unit to move along the second direction; the stage is arranged at the output end of the third motion unit, and the third motion unit is used to drive the stage to move along the height direction; The first direction, the second direction and the height direction are perpendicular to each other.

9. The laser processing device according to claim 1, characterized in that: The laser processing device also includes: A support seat, wherein the support seat is arranged on the base, and the distance measuring component and the laser emitting unit are both arranged on the support seat.

10. A laser debonding device, characterized in that: The laser debonding equipment comprises the laser processing device according to any one of claims 1 to 9.

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