Temperature control device for production and processing

Abstract

The utility model relates to a temperature control device for production and processing, which comprises an upper temperature control piece and / or a lower temperature control piece, an upper groove plate and an upper heat conducting plate of the upper temperature control piece are respectively provided with a sprue receding hole, and an upper temperature control runner bypassing the sprue receding holes is formed between a plurality of upper baffles of the upper groove plate and an upper temperature control groove. The upper heat conduction plate is provided with a plurality of first heat conduction needles extending into the upper temperature control flow channels, ejector pin receding holes are formed in a lower groove plate and the lower heat conduction plate of the lower temperature control piece, lower temperature control flow channels bypassing the ejector pin receding holes are formed between a plurality of lower baffles of the lower groove plate and lower temperature control grooves, and the lower heat conduction plate is provided with a plurality of second heat conduction needles extending into the lower temperature control flow channels. In the temperature control process, the upper baffle and the lower baffle can reduce the flow speed of a heat-conducting medium or a cooling medium, the first heat-conducting needle and the second heat-conducting needle are used for increasing the heat transfer area, the heat transfer area can be increased, energy loss is reduced, the temperature control efficiency is improved, disassembly, assembly and maintenance are convenient, and the device is suitable for air conditioner rear plate injection molding temperature control.

Description

Technical Field

[0001] The utility model belongs to the technical field of temperature control devices, and in particular relates to a temperature control device used for production and processing. Background Art

[0002] The air conditioner back plate is an important structure for supporting and installing the air conditioner body, or connecting internal devices and closing the air duct. The plastic air conditioner back plate has the advantages of light weight, high strength, corrosion resistance, etc. It is generally processed by injection molding, which involves controlling the temperature in the mold through a temperature control device. The temperature control device in the prior art generally adopts a heat channel set above and below the cavity or core, and uses an electric heating structure such as a heating rod or a heating plate in the heat channel to heat the heat-conducting medium to increase the temperature in the mold. In order to promote the cooling and solidification of the hot melt plastic in the injection molding tank, a cooling channel and a temperature sensor are also set. After the temperature is measured by the temperature sensor, the cooling medium in the cooling channel is used to reduce the mold temperature, thereby achieving the purpose of temperature control. Its main defects are: the contact area between the heat-conducting medium and the cooling medium and the cavity or core is small, and it is difficult to transfer heat quickly. At the same time, especially when the cooling channel is used for cooling, the heat-conducting medium is retained in the heat channel, and the electric heating structure still retains residual temperature, so that the cooling medium also exchanges heat with the heat-conducting medium or the electric heating structure during the cooling process of the injection molding tank, resulting in energy loss, large energy consumption, and slow temperature control speed. Secondly, it is not convenient to disassemble and maintain the heating channel or the cooling channel directly in the cavity or the core. Utility Model Content

[0003] The utility model aims to solve at least one of the above technical problems to a certain extent. The utility model provides a temperature control device for production and processing, which can increase the heat transfer area, reduce energy loss, improve temperature control efficiency, and facilitate disassembly and maintenance.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A temperature control device for production and processing, comprising an upper temperature control component and / or a lower temperature control component, the upper temperature control component comprising an upper groove plate and an upper heat conducting plate, the upper groove plate and the upper heat conducting plate are both provided with a gate clearance hole, the upper groove plate is provided with an upper temperature control groove, the upper temperature control groove is provided with a plurality of upper baffles, an upper temperature control flow channel bypassing the gate clearance hole is formed between the plurality of upper baffles and the upper temperature control groove, the two ends of the upper temperature control flow channel are respectively connected with a first inlet and a first outlet, and the upper heat conducting plate is provided with a plurality of first heat conducting needles extending into the upper temperature control flow channel;

[0006] The lower temperature control component includes a lower groove plate and a lower heat conducting plate, both of which are provided with ejector pin clearance holes, a lower temperature control groove is provided in the lower groove plate, a plurality of lower baffles are provided in the lower temperature control groove, a lower temperature control flow channel bypassing the ejector pin clearance hole is formed between the plurality of lower baffles and the lower temperature control groove, a second inlet and a second outlet are connected to the two ends of the lower temperature control flow channel respectively, and the lower heat conducting plate is provided with a plurality of second heat conducting pins extending into the lower temperature control flow channel.

[0007] Furthermore, a first sleeve is provided in the upper temperature control tank, and a second sleeve is provided on the upper heat conducting plate. The first sleeve and the second sleeve are coaxial with the gate clearance hole, and a first sealing ring is provided between the first sleeve and the second sleeve.

[0008] Furthermore, a first sealing groove is provided between the edge of the upper temperature control groove and the upper heat conducting plate, and a second sealing ring is provided in the first sealing groove.

[0009] Furthermore, the plurality of upper baffles include a first baffle, a second baffle and a third baffle, the end of the first baffle close to the first inlet is connected to the upper slot plate, the second baffle is connected to the first sleeve, the second baffle includes a first horizontal portion and a first inclined portion, both ends of the first horizontal portion are spaced apart from the inner wall of the upper temperature control slot, the first inclined portion is located between the first baffle and the second baffle, the third baffle is close to the second outlet, and one end of the third baffle is connected to the upper slot plate.

[0010] Furthermore, the upper heat conducting plate is provided with an upper positioning groove which cooperates with the outer parts of the plurality of upper baffles.

[0011] Furthermore, a third sleeve is provided in the lower temperature control tank, a fourth sleeve is provided in the lower heat conducting plate, the third sleeve and the fourth sleeve are coaxial with the ejector pin clearance hole, and a third sealing ring is provided between the third sleeve and the fourth sleeve.

[0012] Furthermore, a second sealing groove is provided between the edge of the lower temperature control groove and the lower heat conduction plate, and a fourth sealing ring is provided in the second sealing groove.

[0013] Furthermore, the plurality of lower baffles include a fourth baffle, a fifth baffle and a sixth baffle, the end of the fourth baffle close to the second inlet is connected to the lower slot plate, the fourth baffle is connected to the third sleeve, the fourth baffle includes a second horizontal portion, a vertical portion and a second inclined portion connected at one end, the other end of the second horizontal portion is spaced apart from the inner wall of the lower temperature control slot, the vertical portion is staggered with the sixth baffle, and the second inclined portion is located between the fourth baffle and the second outlet.

[0014] Furthermore, the lower heat conducting plate is provided with a lower positioning groove which cooperates with the outer parts of the plurality of lower baffles.

[0015] Furthermore, temperature sensors are provided below and above the upper heat conducting plate.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] (1) During the temperature control process, an upper temperature control flow channel bypassing the gate clearance hole is formed between the plurality of upper baffles and the upper temperature control groove, and a lower temperature control flow channel bypassing the ejector clearance hole is formed between the plurality of lower baffles and the lower temperature control groove. This can reduce the flow rate of the heat transfer medium or the cooling medium, and then the heat transfer medium flows through the plurality of first heat transfer needles and the second heat transfer needles, thereby increasing the heat transfer area, allowing the upper heat transfer plate and the lower heat transfer plate to quickly transfer heat to the core and the groove, thereby solving the problem that the existing heat transfer medium or the cooling medium has a small contact area with the cavity or the core, resulting in difficulty in quickly transferring heat.

[0018] (2) The heat loss problem caused by medium retention can be solved by draining the heat transfer medium or cooling medium from the upper temperature control channel or the lower temperature control channel and then introducing another medium, thereby reducing energy loss and improving temperature control efficiency.

[0019] (3) The problem of inconvenience in disassembly and maintenance can be solved by disassembling the upper slot plate, the upper heat conduction plate and the heat transfer part, such as the core, and disassembling the lower slot plate, the lower heat conduction plate and the heat transfer part, such as the slot, and using the upper temperature control part and the lower temperature control part independently or simultaneously as needed. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 It is an application schematic diagram of an implementation mode of the utility model;

[0022] Figure 2 yes Figure 1 Exploded view from front and bottom;

[0023] Figure 3 yes Figure 1 Exploded view from behind;

[0024] Figure 4 yes Figure 1 Rear top view of

[0025] Figure 5 yes Figure 4 AA direction cross-sectional view;

[0026] Figure 6 This is a top view of the structure of the upper temperature control component of one embodiment of the utility model;

[0027] Figure 7 It is a top view of the structure of the lower temperature control component of one embodiment of the utility model.

[0028] Markings in the figure: upper temperature control member 1, upper groove plate 11, upper temperature control groove 111, upper baffle 112, upper temperature control flow channel 113, first inlet 114, first outlet 115, first sleeve 116, first sealing groove 117, first baffle 118, second baffle 119, first horizontal portion 1191, first inclined portion 1192, third baffle 120;

[0029] Upper heat conducting plate 12, first heat conducting needle 121, second sleeve 122, upper positioning groove 123;

[0030] Gate clearance hole 13, first sealing ring 14, second sealing ring 15;

[0031] Lower temperature control member 2, lower groove plate 21, lower temperature control groove 211, lower baffle 212, lower temperature control flow channel 213, second inlet 214, second outlet 215, third sleeve 216, second sealing groove 218, fourth baffle 219, fifth baffle 220, second horizontal portion 2201, vertical portion 2202, second inclined portion 2203, sixth baffle 217;

[0032] Lower heat conducting plate 22, second heat conducting pin 221, fourth sleeve 222, lower positioning groove 223;

[0033] Ejector pin clearance hole 23, third sealing ring 24, fourth sealing ring 25;

[0034] Core 3, groove 4, temperature sensor 5, arrow indicates flow direction. DETAILED DESCRIPTION

[0035] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0036] In the description of the present utility model, it should be understood that the terms "upper", "lower", "axial", "radial", "vertical", "horizontal" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, "multiple" and "several" mean two or more, unless otherwise clearly and specifically defined.

[0037] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In view of the problem that the temperature control device in the prior art has poor temperature control efficiency due to small heat transfer area and medium retention, such as Figure 1-7 As shown, it is a preferred embodiment of a temperature control device for production and processing described in the utility model, the temperature control device for production and processing comprises an upper temperature control part 1 and / or a lower temperature control part 2, the upper temperature control part 1 comprises an upper groove plate 11 and an upper heat conducting plate 12, the upper groove plate 11 and the upper heat conducting plate 12 are both provided with a gate clearance hole 13, an upper temperature control groove 111 is provided in the upper groove plate 11, a plurality of upper baffles 112 are provided in the upper temperature control groove 111, an upper temperature control flow channel 113 bypassing the gate clearance hole 13 is formed between the plurality of upper baffles 112 and the upper temperature control groove 111, the first inlet 114 and the first outlet 115 are connected to the two ends of the upper temperature control flow channel 113 respectively, and the upper heat conducting plate 12 is provided with a plurality of first heat conducting needles 121 extending into the upper temperature control flow channel 113;

[0039] The lower temperature control component 2 includes a lower groove plate 21 and a lower heat conducting plate 22, both of which are provided with an ejector pin clearance hole 23. A lower temperature control groove 211 is provided in the lower groove plate 21, and a plurality of lower baffles 212 are provided in the lower temperature control groove 211. A lower temperature control flow channel 213 bypassing the ejector pin clearance hole 23 is formed between the plurality of lower baffles 212 and the lower temperature control groove 211. The two ends of the lower temperature control flow channel 213 are respectively connected to a second inlet 214 and a second outlet 215, and the lower heat conducting plate 22 is provided with a plurality of second heat conducting pins 221 extending into the lower temperature control flow channel 213.

[0040] like Figure 1 As shown, if the upper temperature control component 1 and the lower temperature control component 2 are used at the same time, the upper temperature control component 1 can be installed above the core 3, the upper heat conducting plate 12 is in contact with the upper surface of the core 3, the upper groove plate 11, the upper heat conducting plate 12 and the core 3 can be connected by bolts, and the lower temperature control component 2 is installed below the groove 4, the lower heat conducting plate 22 is in contact with the groove 4, and the lower groove plate 21, the lower heat conducting plate 22 and the groove 4 can be connected by bolts; as shown in 5, the gate clearance hole 13 can be used to install the gate sleeve, and the ejector clearance hole 23 can be installed with an ejector that can be lifted and moved, so that when the groove 4 and the core 3 are molded together, the plastic melt can pass through the gate sleeve and be injected between the groove 4 and the core 3 for injection molding.

[0041] For example, in the processing of the plastic air conditioner back plate, a heat conducting medium or a cooling medium can be introduced into the first inlet 114 or the second inlet 214 channel during the process, and the upper temperature control component 1 is used to control the temperature of the core 3, and the lower temperature control component 2 is used to control the temperature of the groove 4. For example, during injection molding, a heat conducting medium is used to keep the groove 4 and the core 3 heated up to ensure the fluidity of the plastic melt, and the ejector pin is sunk into the ejector pin clearance hole 23. After injection molding, a cooling medium is used to keep the groove 4 and the core 3 cooled to promote solidification molding, and the ejector pin moves upward to eject the molded plastic air conditioner back plate out of the groove 4 for demolding.

[0042] During the temperature control process, an upper temperature control flow channel 113 bypassing the gate clearance hole 13 is formed between the plurality of upper baffles 112 and the upper temperature control groove 111, and a lower temperature control flow channel 213 bypassing the ejector clearance hole 23 is formed between the plurality of lower baffles 212 and the lower temperature control groove 211. This can reduce the flow rate of the heat-conducting medium or the cooling medium, and then the heat-conducting medium flows through the plurality of first heat-conducting needles 121 and the second heat-conducting needles 221 to increase the heat transfer area, so that the upper heat-conducting plate 12 and the lower heat-conducting plate 22 can quickly transfer heat to the core 3 and the groove 4, thereby solving the problem of difficulty in rapid heat transfer due to the small contact area between the existing heat-conducting medium or the cooling medium and the cavity or the core 3. At the same time, the heat loss problem caused by medium retention can be solved by draining the heat-conducting medium or the cooling medium from the upper temperature control flow channel 113 or the lower temperature control flow channel 213, for example, by introducing air for drainage, and then introducing another medium, thereby reducing energy loss and improving temperature control efficiency.

[0043] Furthermore, the upper temperature control tank 111 is provided with a first casing, the upper heat conducting plate 12 is provided with a second casing 122, the first casing and the second casing 122 are coaxial with the gate clearance hole 13, and a first sealing ring 14 is provided between the first casing and the second casing 122. Figure 5 As shown, the first sealing ring 14 can be used to increase the sealing performance at the gate clearance hole 13 to prevent the medium from flowing out.

[0044] Furthermore, a first sealing groove 117 is provided between the edge of the upper temperature control groove 111 and the upper heat conducting plate 12, and a second sealing ring 15 is provided in the first sealing groove 117. Figure 5 As shown, the second sealing ring 15 can be used to increase the sealing between the upper temperature control tank 111 and the upper heat conducting plate 12 to prevent the medium from flowing out.

[0045] Further, such as Figure 6 As shown, the plurality of upper baffles 112 include a first baffle 118, a second baffle 119 and a third baffle 120, the end of the first baffle 118 close to the first inlet 114 is connected to the upper tank plate 11, the second baffle 119 is connected to the first sleeve, the second baffle 119 includes a first horizontal portion 1191 and a first inclined portion 1192, both ends of the first horizontal portion 1191 are spaced from the inner wall of the upper temperature control tank 111, the first inclined portion 1192 is located between the first baffle 118 and the second baffle 119, the third baffle 120 is close to the second outlet 215, and one end of the third baffle 120 is connected to the upper tank plate 11.

[0046] For example, the gate giving way hole 13 has one, and the heat-conducting medium or cooling medium entering the upper temperature-control groove 111 from the first inlet 114 first moves along one side of the first baffle 118 and the inner wall of the upper temperature-control groove 111, and enters between one side of the first horizontal part 1191 and the other side of the first baffle 118 from the gap between the first baffle 118 and the first inclined portion 1192, and then moves from the gap between one end of the first horizontal part 1191 and the inner wall of the upper temperature-control groove 111 to the gap between the other side of the second horizontal part 2201 and the inner wall of the upper temperature-control groove 111, and then from the gap between the other end of the first horizontal part 1191 and the inner wall of the upper temperature-control groove 111 to the gap between the first horizontal part 1191 and the third baffle 120, and finally enters the second outlet 215 from the gap between the third baffle 120 and the first inclined portion 1192 and is discharged. The heat-conducting medium or cooling medium reduces its flow rate in the continuous deflection process, fully transfers heat with the first heat-conducting needle 121, and improves the heat transfer efficiency.

[0047] Furthermore, the upper heat conducting plate 12 is provided with upper positioning grooves 123 that cooperate with the outer parts of the upper baffles 112 , and the upper heat conducting plate 12 and the upper slot plate 11 can be quickly positioned and installed by plugging the positioning grooves with the upper baffles 112 .

[0048] Furthermore, the lower temperature control tank 211 is provided with a third sleeve 216, the lower heat conducting plate 22 is provided with a fourth sleeve 222, the third sleeve 216 and the fourth sleeve 222 are coaxial with the ejector hole 23, and a third sealing ring 24 is provided between the third sleeve 216 and the fourth sleeve 222. Figure 5 As shown, the third sealing ring 24 can be used to increase the sealing performance of the ejector pin clearance hole 23 to prevent the medium from flowing out.

[0049] Furthermore, a second sealing groove 218 is provided between the edge of the lower temperature control groove 211 and the lower heat conducting plate 22, and a fourth sealing ring 25 is provided in the second sealing groove 218. Figure 5 As shown, the sealing between the lower temperature control groove 211 and the lower heat conducting plate 22 can be increased by a fourth sealing ring 25 .

[0050] Further, such as Figure 7 As shown, the plurality of lower baffles 212 include a fourth baffle 219, a fifth baffle 220 and a sixth baffle 217, the end of the fourth baffle 219 close to the second inlet 214 is connected to the lower slot plate 21, the fourth baffle 219 is connected to the third sleeve 216, the fourth baffle 219 includes a second horizontal portion 2201, a vertical portion 2202 and a second inclined portion 2203 connected at one end, the other end of the second horizontal portion 2201 is spaced from the inner wall of the lower temperature control slot 211, the vertical portion 2202 and the sixth baffle 217 are staggered, and the second inclined portion 2203 is located between the fourth baffle 219 and the second outlet 215.

[0051] For example, there are two ejector pin holes 23. The heat-conducting medium or cooling medium entering the lower temperature-control groove 211 from the second inlet 214 first flows along one side of the fourth baffle 219 and the inner wall of the lower temperature-control groove 211, and flows through the gap between the fourth baffle 219 and the second inclined portion 2203 to enter between the other side of the fourth baffle 219 and one side of the second horizontal portion 2201, and then flows through the gap between the second horizontal portion 2201 and the inner wall of the lower temperature-control groove 211 to enter between the other side of the second horizontal portion 2201, and then deflects to bypass the sixth baffle 217 and the vertical portion 2202, and is discharged from the second outlet 215. In this way, the heat-conducting medium or cooling medium reduces its flow rate during the continuous deflection process, fully transfers heat to the second heat-conducting needle 221, and improves the heat transfer efficiency.

[0052] Furthermore, the lower heat conducting plate 22 is provided with a lower positioning groove 223 that cooperates with the outer parts of the lower baffles 212 , and can be plugged and matched with the lower baffles 212 through the lower positioning groove 223 to assist in the rapid positioning and installation of the lower heat conducting plate 22 and the lower slot plate 21 .

[0053] Furthermore, temperature sensors 5 are provided below and above the upper heat conducting plate 12. The temperature sensors 5 can be located between the upper heat conducting plate 12 and the core 3, and between the lower heat conducting plate 22 and the groove 4, to detect the temperature and thus control the inflow and outflow of the heat conducting medium or the cooling medium.

[0054] The application method of the above temperature control device includes:

[0055] like Figure 1 As shown, the upper temperature control component 1 is connected to the core 3, the lower temperature control component 2 is connected to the groove 4, the gate sleeve of the injection mold is installed in the gate clearance hole 13, and the ejector of the injection mold is installed in the ejector clearance hole 23.

[0056] like Figure 5 As shown, during injection molding, the groove 4 and the core 3 are molded together, the ejector pin sinks to the bottom of the groove 4, and heat-conducting medium is introduced into the first inlet 114 and the second inlet 214 respectively. The heat-conducting medium in the upper temperature control component 1 flows along the upper temperature control groove 111, exchanges heat with the first heat-conducting needle 121, so that the upper heat-conducting plate 12 is quickly heated up, and the heat is transferred to the core 3 to heat up. The heat-conducting medium in the lower temperature control component 2 flows along the lower temperature control groove 211, exchanges heat with the second heat-conducting needle 221, so that the lower heat-conducting plate 22 is quickly cooled down, and the heat is transferred to the groove 4 to heat up. The injection molding machine injects the plastic melt between the core 3 and the groove 4 through the gate sleeve, maintains the temperature of the groove 4 and the core 3, promotes the flow of the plastic melt, and fills the gap between the core 3 and the groove 4.

[0057] After injection molding, air is introduced into the first inlet 114 and the second inlet 214 respectively. After the heat transfer medium is emptied, cooling medium is introduced into the first inlet 114 and the second inlet 214 respectively. The cooling medium in the upper temperature control component 1 flows along the upper temperature control groove 111, exchanges heat with the first heat conduction needle 121, so that the upper heat conduction plate 12 is quickly cooled down, and is transferred to the core 3 for cooling. The cooling medium in the lower temperature control component 2 flows along the lower temperature control groove 211, exchanges heat with the second heat conduction needle 221, so that the lower heat conduction plate 22 is quickly cooled down, and is transferred to the groove 4 for cooling, thereby promoting the cooling and molding of the plastic melt between the core 3 and the groove 4; after the groove 4 and the core 3 are opened, the molded part is ejected out of the groove 4 by an ejector for rapid demolding.

[0058] The above operation can be repeated for repeatable processing; the upper groove plate 11, the upper heat conduction plate 12 and the core 3, the lower groove plate 21, the lower heat conduction plate 22 and the groove 4 can be disassembled for maintenance, and the upper temperature control component 1 and the lower temperature control component 2 can be used independently or simultaneously as needed, thereby solving the existing problem of inconvenient disassembly and maintenance.

[0059] The series of detailed descriptions listed above are only specific descriptions of feasible embodiments of the present invention. They are not intended to limit the protection scope of the present invention. All equivalent embodiments or changes that do not deviate from the technical spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A temperature control device for production and processing, characterized in that: The invention comprises an upper temperature control component (1) and / or a lower temperature control component (2), wherein the upper temperature control component (1) comprises an upper groove plate (11) and an upper heat conducting plate (12), wherein the upper groove plate (11) and the upper heat conducting plate (12) are both provided with a gate clearance hole (13), wherein an upper temperature control groove (111) is provided in the upper groove plate (11), wherein a plurality of upper baffles (112) are provided in the upper temperature control groove (111), wherein an upper temperature control flow channel (113) bypassing the gate clearance hole (13) is formed between the plurality of upper baffles (112) and the upper temperature control groove (111), wherein two ends of the upper temperature control flow channel (113) are respectively connected with a first inlet (114) and a first outlet (115), and wherein the upper heat conducting plate (12) is provided with a plurality of first heat conducting needles (121) extending into the upper temperature control flow channel (113); The lower temperature control component (2) comprises a lower groove plate (21) and a lower heat conducting plate (22), the lower groove plate (21) and the lower heat conducting plate (22) are both provided with ejector pin clearance holes (23), a lower temperature control groove (211) is provided in the lower groove plate (21), a plurality of lower baffles (212) are provided in the lower temperature control groove (211), a lower temperature control flow channel (213) bypassing the ejector pin clearance hole (23) is formed between the plurality of lower baffles (212) and the lower temperature control groove (211), two ends of the lower temperature control flow channel (213) are respectively connected with a second inlet (214) and a second outlet (215), and the lower heat conducting plate (22) is provided with a plurality of second heat conducting pins (221) extending into the lower temperature control flow channel (213).

2. A temperature control device for production and processing according to claim 1, characterized in that: A first sleeve is provided in the upper temperature control tank (111), and a second sleeve (122) is provided on the upper heat conducting plate (12). The first sleeve and the second sleeve (122) are coaxial with the gate clearance hole (13), and a first sealing ring (14) is provided between the first sleeve and the second sleeve (122).

3. A temperature control device for production and processing according to claim 2, characterized in that: A first sealing groove (117) is provided between the edge of the upper temperature control groove (111) and the upper heat conducting plate (12), and a second sealing ring (15) is provided in the first sealing groove (117).

4. A temperature control device for production and processing according to claim 1, characterized in that: The upper heat conducting plate (12) is provided with an upper positioning groove (123) that cooperates with the outside of a plurality of upper baffles (112).

5. A temperature control device for production and processing according to claim 1, characterized in that: A third sleeve (216) is provided in the lower temperature control tank (211), a fourth sleeve (222) is provided in the lower heat conducting plate (22), the third sleeve (216) and the fourth sleeve (222) are coaxial with the ejector pin clearance hole (23), and a third sealing ring (24) is provided between the third sleeve (216) and the fourth sleeve (222).

6. A temperature control device for production and processing according to claim 5, characterized in that: A second sealing groove (218) is provided between the edge of the lower temperature control groove (211) and the lower heat conduction plate (22), and a fourth sealing ring (25) is provided in the second sealing groove (218).

7. A temperature control device for production and processing according to claim 1, characterized in that: The lower heat conducting plate (22) is provided with a lower positioning groove (223) that cooperates with the exterior of a plurality of lower baffles (212).

8. A temperature control device for production and processing according to any one of claims 1 to 7, characterized in that: Temperature sensors (5) are provided below the upper heat conducting plate (12) and above the upper heat conducting plate (12).

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