Gas spraying assembly and thin film deposition device

Abstract

The utility model relates to the technical field of thin film deposition, and discloses a gas spraying assembly and a thin film deposition device. The gas spraying assembly comprises a cover plate, a spraying plate and positioning columns, the cover plate is provided with a gas inlet and at least one through hole penetrating through the two sides of the cover plate, the spraying plate and the cover plate are connected in a sealed mode, a cavity communicated with the gas inlet is reserved between the spraying plate and the cover plate, the spraying plate is provided with a plurality of spraying holes communicated with the cavity, and the positioning columns correspond to the through holes one to one. The positioning column is provided with a supporting portion used for supporting the cover plate, the supporting portion is arranged between the connecting end and the mounting end, one end of the supporting portion extends to the connecting end, and the area of the axial cross section of the connecting end of the positioning column is smaller than that of the axial cross section of the supporting portion of the positioning column. And the bonding strength between the cover plate and the spraying plate is ensured, and the performance and the service life of the gas spraying assembly are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of thin film deposition, in particular to a gas spraying component and a thin film deposition device. Background Art

[0002] Thin film deposition is an important part of wafer processing and manufacturing, which forms a thin film on the surface of the wafer through thin film deposition equipment. Chemical vapor thin film deposition equipment is one of them. It places the wafer in the reaction chamber, and the reaction gas enters the reaction chamber through the gas distribution plate, and uses a radio frequency device to plasmatize the reaction gas. The heating plate in the reaction chamber provides the temperature required for the wafer reaction, so that a thin film is deposited on the wafer.

[0003] In the prior art, the gas shower head in the thin film deposition device is a key component. The function of the gas shower head is to spray the gas evenly on the surface of the wafer to ensure that the gas film is evenly deposited on the surface. Positioning posts are arranged on the shower plate to tightly combine the shower plate with the cover plate. However, since multiple positioning posts are arranged on the shower plate, the layout of the spray holes on the shower plate may be disturbed, thereby affecting the uniformity of thin film deposition on the wafer surface. Utility Model Content

[0004] In view of this, the utility model provides a gas spray assembly and a thin film deposition device to solve the problem that the positioning column affects the layout of the spray holes on the spray plate, thereby affecting the uniformity of thin film deposition on the wafer surface.

[0005] In a first aspect, the utility model provides a gas spray assembly, comprising:

[0006] A cover plate, having an air inlet hole and at least one through hole penetrating two sides of the cover plate;

[0007] A spray plate is sealed and connected to the cover plate, and a cavity communicating with the air inlet hole is left therebetween, and a plurality of spray holes communicating with the cavity are formed on the spray plate;

[0008] A positioning column, at least one of which is arranged in a one-to-one correspondence with the through holes, the positioning column having a connecting end and a mounting end, the connecting end being arranged on the spray plate, the mounting end being welded in the through hole, the positioning column being provided with a supporting portion for supporting the cover plate, the supporting portion being arranged between the connecting end and the mounting end and extending at one end to the connecting end, the area of ​​the axial cross-section of the connecting end of the positioning column being smaller than the area of ​​the axial cross-section of the supporting portion of the positioning column.

[0009] Beneficial effects: In this gas spray assembly, the cover plate is arranged on the spray plate, the connection end of the positioning column is arranged on the spray plate, and a through hole corresponding to the positioning column is opened on the cover plate, so that the installation end of the positioning column is inserted into the corresponding through hole, thereby realizing the precise positioning of the spray plate and the cover plate, simplifying the assembly process, improving the assembly efficiency and precision, and avoiding the process error caused by misalignment. By arranging a support part on the positioning column, the support part supports the cover plate, thereby avoiding the deformation problem caused by the uneven force of the cover plate after welding. Since one end of the support part extends to the connection end, and the area of ​​the axial cross-section of the connection end of the positioning column is smaller than the area of ​​the axial cross-section of the support part of the positioning column, not only the strength of the positioning column itself is guaranteed, but also the occupied area of ​​the connection end of the positioning column on the spray plate is reduced, thereby increasing the number of spray holes around the positioning column, so that the gas flow rate in the area around the positioning column is consistent with the gas flow rate in other areas, effectively improving the uniformity of thin film deposition on the wafer surface, and ensuring the bonding strength between the cover plate and the spray plate, improving the performance and service life of the gas spray assembly.

[0010] When the wafer is undergoing thin film deposition, the gas enters the cavity through the air inlet hole, and then is evenly sprayed on the wafer surface through the spray holes of the spray plate to ensure that the gas film is evenly deposited on the wafer surface.

[0011] In an optional embodiment, an outer surface of the support portion is provided with an inclined surface, and the area of ​​the axial cross-section of the support portion gradually increases from the connecting end to the mounting end.

[0012] Beneficial effect: By setting an inclined surface on the outer surface of the support part, it helps to evenly distribute the stress borne by the support part and reduce local stress concentration. As the axial cross-sectional area gradually increases, the structural strength of the support part is enhanced, so that the positioning column can withstand a larger load and avoid breakage or deformation of the positioning column.

[0013] In an optional embodiment, the support portion is in a truncated cone shape.

[0014] Beneficial effects: The truncated cone-shaped support portion has a gradually increasing cross-section in the axial direction, which can increase the bearing capacity of the support portion, so that the support portion can withstand greater forces without deformation. At the same time, the truncated cone-shaped support portion is easy to produce and manufacture.

[0015] In an optional embodiment, a gap is left between the outer surface of the positioning column and the inner wall of the through hole to form a welding groove, and the welding groove is suitable for accommodating solder.

[0016] Beneficial effect: A gap is provided between the outer surface of the positioning column and the inner wall of the through hole to form a welding groove. When the operator welds the positioning column and the through hole, the solder can be filled into the welding groove, thereby fully welding the outer surface of the positioning column and the inner wall of the through hole, increasing the welding surface, thereby enhancing the welding strength, improving the quality and reliability of the connection between the cover plate and the spray plate, and avoiding the problem of breakage at the welding point between the positioning column and the through hole due to insufficient solder.

[0017] In an optional embodiment, a first fillet is provided between the outer surface of the positioning post and the supporting portion.

[0018] Beneficial effect: By providing a first fillet between the outer surface of the positioning column and the support portion, when the mounting end of the positioning column is installed in the through hole, the first fillet abuts against the bottom of the through hole, thereby sealing the bottom of the through hole, which can effectively prevent the solder in the welding groove from falling from the through hole into the cavity.

[0019] In an optional embodiment, the through hole includes an assembly section and a mounting section, the positioning column is disposed in the assembly section, and the aperture of the mounting section is larger than the aperture of the assembly section.

[0020] Beneficial effect: The aperture of the installation section of the through hole is set larger than the aperture of the assembly section. When welding the locating column, the locating column is installed in the assembly section to provide sufficient welding space to facilitate welding operations on the installation end or outer surface of the locating column.

[0021] In an optional implementation, the mounting end is disposed between the assembly section and the mounting section.

[0022] Beneficial effect: The mounting end is set between the assembly section and the mounting section. When the positioning column is welded and fixed, the end face of the mounting end of the positioning column can be welded together with the stepped surface formed between the assembly section and the mounting section, further ensuring that the positioning column is firmly welded in the through hole.

[0023] In an optional embodiment, a second fillet is provided at a connection between the connection end of the positioning column and the shower plate.

[0024] Beneficial effect: a second fillet is provided at the connection between the connection end of the positioning column and the spray plate, and a transition is performed through the second fillet to prevent stress concentration at the connection end of the positioning column from causing deformation of the positioning column, thereby extending the service life of the positioning column and the spray plate.

[0025] In an optional embodiment, a plurality of positioning posts are provided, and the plurality of positioning posts and the spray plate are integrally formed.

[0026] Beneficial effects: Multiple positioning columns are set on the spray plate, which can provide uniform support points for the cover plate, ensure the stability of the entire cover plate and the spray plate during installation and operation, and reduce deformation or displacement caused by uneven force. By integrating the positioning column with the spray plate, it can be ensured that there is no joint gap between the positioning column and the spray plate, and the structure is continuous without weaknesses, which greatly enhances the overall mechanical strength and torsion resistance, is suitable for withstanding harsh working conditions such as high temperature and vibration, and prolongs the service life of the spray structure.

[0027] In a second aspect, the utility model further provides a thin film deposition device, comprising:

[0028] Chamber;

[0029] A gas spray assembly, wherein the spray plate is arranged in the chamber.

[0030] Beneficial effects: This thin film deposition device sets the spray plate in the chamber, and evenly sprays gas on the wafer surface through the spray holes of the spray plate to perform thin film deposition. Since one end of the support portion extends to the connection end, and the area of ​​the axial cross section of the connection end of the positioning column is smaller than the area of ​​the axial cross section of the support portion of the positioning column, it not only ensures the strength of the positioning column itself, but also reduces the area occupied by the connection end of the positioning column on the spray plate, thereby increasing the number of spray holes around the positioning column, so that the gas flow rate in the area around the positioning column is consistent with the gas flow rate in other areas, effectively improving the uniformity of thin film deposition on the wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 A cross-sectional view of a gas spray assembly according to an embodiment of the utility model;

[0033] Figure 2 for Figure 1 A is a partial enlarged schematic diagram of the middle part.

[0034] Description of reference numerals:

[0035] 1. Cover plate; 101. Air inlet; 102. Through hole; 1021. Assembly section; 1022. Installation section; 2. Spray plate; 201. Spray hole; 3. Cavity; 4. Positioning column; 401. Connection end; 402. Installation end; 403. Support part; 4031. Inclined surface; 404. First fillet; 405. Second fillet; 5. Welding groove. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0037] In the related art, the gas shower head in the thin film deposition device is a key component. The function of the gas shower head is to spray the gas evenly on the surface of the wafer to ensure that the gas film is evenly deposited on the surface. Positioning posts are set on the shower plate to make the shower plate and the cover plate tightly combined. However, since multiple positioning posts are arranged on the shower plate, the layout of the spray holes on the shower plate may be disturbed, thereby affecting the uniformity of thin film deposition on the wafer surface.

[0038] In order to solve the above technical problems, the following Figure 1 to Figure 2 , describing an embodiment of the utility model.

[0039] According to an embodiment of the present utility model, on the one hand, as Figure 1 and Figure 2 As shown, a gas spray assembly is provided, including a cover plate 1, a spray plate 2 and a positioning column 4.

[0040] Specifically, Figure 1 As shown, the cover plate 1 is provided with an air inlet hole 101 and a through hole 102 . At least one through hole 102 is provided, and the through hole 102 runs through two opposite sides of the cover plate 1 .

[0041] Specifically, Figure 1 As shown, the spray plate 2 is sealed and connected to the cover plate 1, and a cavity 3 is left between the spray plate 2 and the cover plate 1, and the cavity 3 is connected to the air inlet 101. The spray plate 2 is provided with a plurality of spray holes 201 connected to the cavity 3.

[0042] Specifically, combined Figure 1 and Figure 2As shown, at least one positioning column 4 is provided, and the positioning column 4 is arranged in a one-to-one correspondence with the through hole 102. The positioning column 4 has a connecting end 401 and a mounting end 402. The connecting end 401 is arranged on the spray plate 2, and the mounting end 402 is welded in the through hole 102. The positioning column 4 is provided with a supporting portion 403, and the supporting portion 403 is used to support the cover plate 1. The supporting portion 403 is arranged between the connecting end 401 and the mounting end 402, and one end of the supporting portion 403 extends to the connecting end 401. The area of ​​the axial cross section of the connecting end 401 of the positioning column 4 is smaller than the area of ​​the axial cross section of the supporting portion 403 of the positioning column 4.

[0043] In this gas spray assembly, the cover plate 1 is placed on the spray plate 2, the connection end 401 of the positioning column 4 is placed on the spray plate 2, and the cover plate 1 is provided with through holes 102 corresponding to the positioning columns 4, so that the mounting end 402 of the positioning column 4 is inserted into the corresponding through hole 102, thereby achieving accurate positioning of the spray plate 2 and the cover plate 1, simplifying the assembly process, improving assembly efficiency and accuracy, and avoiding process errors caused by misalignment. By arranging a support portion 403 on the positioning column 4, the support portion 403 supports the cover plate 1, thereby avoiding deformation of the cover plate 1 due to uneven force after welding. Since one end of the support portion 403 extends to the connecting end 401, and the area of ​​the axial cross-section of the connecting end 401 of the positioning column 4 is smaller than the area of ​​the axial cross-section of the supporting portion 403 of the positioning column 4, not only the self-strength of the positioning column 4 is ensured, but also the occupied area of ​​the connecting end 401 of the positioning column 4 on the spray plate 2 is reduced, thereby increasing the number of spray holes 201 around the positioning column 4, so that the gas flow rate in the surrounding area of ​​the positioning column 4 is consistent with the gas flow rate in other areas, effectively improving the uniformity of thin film deposition on the wafer surface, and ensuring the bonding strength between the cover plate 1 and the spray plate 2, thereby improving the performance and service life of the gas spray assembly.

[0044] When the wafer is undergoing thin film deposition, the gas enters the cavity 3 through the gas inlet 101 and is then evenly sprayed on the wafer surface through the spray holes 201 of the spray plate 2 to ensure that the gas film is evenly deposited on the wafer surface.

[0045] Specifically, the air inlet hole 101 can be arranged in the middle area of ​​the cover plate 1, or in other areas of the cover plate 1. In the embodiment of the present application, the position of the air inlet hole 101 on the cover plate 1 is not specifically limited.

[0046] Specifically, the spray plate 2 and the cover plate 1 are sealed and connected by welding. In the embodiment of the present application, the welding method of the spray plate 2 and the cover plate 1 is not specifically limited.

[0047] Specifically, the connection end 401 of the positioning column 4 can be fixedly connected to the spray plate 2, or the connection end 401 of the positioning column 4 can be detachably connected to the spray plate 2. In the embodiment of the present application, no specific limitation is imposed on the connection method between the positioning column 4 and the spray plate 2.

[0048] Specifically, one or more through holes 102 may be provided, and one or more positioning posts 4 may be provided corresponding to the through holes 102 . In the embodiment of the present application, the number of through holes 102 and positioning posts 4 is not specifically limited.

[0049] Specifically, the support portion 403 may be configured to be in the shape of a stepped shaft or in the shape of a truncated cone. In the embodiment of the present application, the shape of the support portion 403 is not specifically limited.

[0050] In one embodiment, Figure 2 As shown, an outer surface of the support portion 403 is provided with an inclined surface 4031 , and the area of ​​the axial cross section of the support portion 403 gradually increases from the connecting end 401 to the mounting end 402 .

[0051] By providing an inclined surface 4031 on the outer surface of the support portion 403, it helps to evenly distribute the stress borne by the support portion 403 and reduce local stress concentration. As the axial cross-sectional area gradually increases, the structural strength of the support portion 403 is enhanced, so that the positioning column 4 can withstand a larger load and avoid breakage or deformation of the positioning column 4.

[0052] Specifically, an inclined surface 4031 is provided on the outer surface of the support portion 403 to facilitate machining the support portion 403 on the positioning column 4. For example, the support portion 403 of the positioning column 4 can be machined by milling or turning.

[0053] Specifically, the inclination angle of the inclined surface 4031 relative to the axis of the positioning column 4 can be set according to usage requirements. In the embodiment of the present application, the inclination angle of the inclined surface 4031 is not specifically limited.

[0054] In one embodiment, Figure 2 As shown, the support portion 403 is configured in a truncated cone shape.

[0055] The truncated cone-shaped support portion 403 has a gradually increasing cross-section in the axial direction, which can increase the bearing capacity of the support portion 403, so that the support portion 403 can withstand a greater force without deformation. At the same time, the truncated cone-shaped support portion 403 is easy to produce and manufacture.

[0056] Specifically, the height of the truncated cone-shaped support portion 403 and the sizes of the end surfaces at both ends can be adaptively designed according to usage requirements. In the embodiment of the present application, no specific restrictions are imposed on the size of the truncated cone-shaped support portion 403.

[0057] In one embodiment, Figure 2 As shown, a gap is left between the outer surface of the positioning column 4 and the inner wall of the through hole 102 to form a welding groove 5, and the welding groove 5 is suitable for accommodating solder.

[0058] A gap is provided between the outer surface of the positioning column 4 and the inner wall of the through hole 102 to form a welding groove 5. When the operator is welding the positioning column 4 and the through hole 102, the solder can be filled into the welding groove 5, thereby fully welding the outer surface of the positioning column 4 and the inner wall of the through hole 102, increasing the welding surface, thereby enhancing the welding strength, improving the quality and reliability of the connection between the cover plate 1 and the spray plate 2, and avoiding the problem of fracture at the welding point between the positioning column 4 and the through hole 102 due to insufficient solder.

[0059] Specifically, the welding groove 5 may be a circular ring groove, a square ring groove, etc. In the embodiment of the present application, the shape of the welding groove 5 is not specifically limited.

[0060] Exemplarily, the circumferential cross-sections of the through hole 102 and the positioning column 4 are both circular, the diameter of the through hole 102 is 10 mm, and the diameter of the outer surface of the positioning column 4 is 8 mm, then the welding groove 5 formed between the outer surface of the positioning column 4 and the inner wall of the through hole 102 is a circular ring groove.

[0061] In one embodiment, Figure 2 As shown, a first fillet 404 is provided between the outer surface of the positioning post 4 and the supporting portion 403 .

[0062] By providing a first rounded corner 404 between the outer surface of the positioning column 4 and the support portion 403, when the mounting end 402 of the positioning column 4 is installed in the through hole 102, the first rounded corner 404 abuts against the bottom of the through hole 102, thereby sealing the bottom of the through hole 102, which can effectively prevent the solder in the welding groove 5 from falling from the through hole 102 into the cavity 3.

[0063] In one embodiment, Figure 2 As shown, the through hole 102 includes an assembly section 1021 and a mounting section 1022 , the positioning column 4 is disposed in the assembly section 1021 , and the aperture of the mounting section 1022 is larger than that of the assembly section 1021 .

[0064] The aperture of the installation section 1022 of the through hole 102 is set larger than the aperture of the assembly section 1021. When welding the positioning column 4, the positioning column 4 is installed in the assembly section 1021 to provide sufficient welding space to facilitate welding operations on the installation end 402 or the outer surface of the positioning column 4.

[0065] In one embodiment, Figure 2 As shown, the mounting end 402 is disposed between the assembly section 1021 and the mounting section 1022 .

[0066] The mounting end 402 is set between the assembly section 1021 and the mounting section 1022. When the positioning column 4 is welded and fixed, the end face of the mounting end 402 of the positioning column 4 can be welded together with the stepped surface formed between the assembly section 1021 and the mounting section 1022, further ensuring that the positioning column 4 is firmly welded in the through hole 102.

[0067] In one embodiment, Figure 2 As shown, a second fillet 405 is provided at the connection between the connection end 401 of the positioning column 4 and the spray plate 2 .

[0068] A second fillet 405 is provided at the connection between the connection end 401 of the positioning post 4 and the spray plate 2 to prevent stress concentration at the connection end 401 of the positioning post 4 from causing deformation of the positioning post 4 and extend the service life of the positioning post 4 and the spray plate 2.

[0069] In one embodiment, a plurality of positioning posts 4 are provided, and the plurality of positioning posts 4 and the spray plate 2 are integrally formed.

[0070] A plurality of positioning posts 4 are arranged on the spray plate 2, which can provide uniform support points for the cover plate 1, ensure the stability of the entire cover plate 1 and the spray plate 2 during installation and operation, and reduce deformation or displacement caused by uneven force. By integrating the positioning posts 4 with the spray plate 2, it can be ensured that there is no joint gap between the positioning posts 4 and the spray plate 2, and the structure is continuous without weaknesses, which greatly enhances the overall mechanical strength and torsional resistance, is suitable for withstanding harsh working conditions such as high temperature and vibration, and prolongs the service life of the spray structure.

[0071] Specifically, when the shower plate 2 is processed, the positioning pillars 4 can be milled out from the shower plate 2 by milling.

[0072] The principle of the gas spray assembly in this embodiment is described as follows:

[0073] Align the through hole 102 on the cover plate 1 with the mounting end 402 of the positioning column 4 on the spray plate 2, and then cover the cover plate 1 on the spray plate 2, so that the positioning column 4 is inserted into the corresponding through hole 102, the outer surface of the positioning column 4 is in contact with the inner wall of the assembly section 1021 of the corresponding through hole 102, and the mounting end 402 of the positioning column 4 is located between the assembly section 1021 and the mounting section 1022 of the through hole 102. The support portion 403 supports the cover plate 1 to avoid deformation caused by uneven force on the cover plate 1 after welding.

[0074] Since one end of the support portion 403 extends to the connecting end 401, the support portion 403 is in a truncated cone shape, which not only ensures the strength of the positioning column 4 itself, but also reduces the occupied area of ​​the connecting end 401 of the positioning column 4 on the spray plate 2, thereby increasing the number of spray holes 201 around the positioning column 4, so that the gas flow rate in the area around the positioning column 4 is consistent with the gas flow rate in other areas, effectively improving the uniformity of thin film deposition on the wafer surface, and ensuring the bonding strength between the cover plate 1 and the spray plate 2, thereby improving the performance and service life of the gas spray assembly.

[0075] According to an embodiment of the present invention, on the other hand, a thin film deposition device is provided, including a chamber and a gas spray assembly.

[0076] Specifically, the gas spray assembly is disposed in a chamber (not shown in the figure).

[0077] In this thin film deposition device, the spray plate 2 is arranged in the chamber, and the gas is uniformly sprayed on the surface of the wafer through the spray holes 201 of the spray plate 2 to perform thin film deposition. Since one end of the support portion 403 extends to the connection end 401, and the area of ​​the axial cross section of the connection end 401 of the positioning column 4 is smaller than the area of ​​the axial cross section of the support portion 403 of the positioning column 4, not only the strength of the positioning column 4 itself is ensured, but also the area occupied by the connection end 401 of the positioning column 4 on the spray plate 2 is reduced, thereby increasing the number of spray holes 201 around the positioning column 4, so that the gas flow rate in the area around the positioning column 4 is consistent with the gas flow rate in other areas, and effectively improving the uniformity of thin film deposition on the wafer surface.

[0078] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A gas spray assembly, characterized in that: include: A cover plate (1) having an air inlet hole (101) and at least one through hole (102) penetrating two sides of the cover plate (1); A spray plate (2) is sealed and connected to the cover plate (1) and a cavity (3) communicating with the air inlet hole (101) is left therebetween; the spray plate (2) is provided with a plurality of spray holes (201) communicating with the cavity (3); The positioning column (4) is provided with at least one positioning column (4) and is arranged in one-to-one correspondence with the through hole (102). The positioning column (4) has a connecting end (401) and a mounting end (402). The connecting end (401) is arranged on the spray plate (2), and the mounting end (402) is welded in the through hole (102). The positioning column (4) is provided with a supporting portion (403) for supporting the cover plate (1). The supporting portion (403) is arranged between the connecting end (401) and the mounting end (402) and one end extends to the connecting end (401). The area of ​​the axial cross section of the connecting end (401) of the positioning column (4) is smaller than the area of ​​the axial cross section of the supporting portion (403) of the positioning column (4).

2. The gas spray assembly according to claim 1, characterized in that: The outer surface of the support portion (403) is provided with an inclined surface (4031), and the area of ​​the axial cross section of the support portion (403) gradually increases from the connecting end (401) to the mounting end (402).

3. The gas spray assembly according to claim 2, characterized in that: The support portion (403) is in the shape of a truncated cone.

4. The gas spray assembly according to claim 2, characterized in that: A gap is left between the outer surface of the positioning column (4) and the inner wall of the through hole (102) to form a welding groove (5), and the welding groove (5) is suitable for accommodating solder.

5. The gas spray assembly according to claim 4, characterized in that: A first rounded corner (404) is provided between the outer surface of the positioning column (4) and the supporting portion (403).

6. The gas spray assembly according to any one of claims 1 to 5, characterized in that: The through hole (102) comprises an assembly section (1021) and a mounting section (1022); the positioning column (4) is arranged in the assembly section (1021); and the hole diameter of the mounting section (1022) is larger than the hole diameter of the assembly section (1021).

7. The gas spray assembly according to claim 6, characterized in that: The installation end (402) is arranged between the assembly section (1021) and the installation section (1022).

8. The gas spray assembly according to any one of claims 1 to 5, characterized in that: A second rounded corner (405) is provided at the connection point between the connection end (401) of the positioning column (4) and the spray plate (2).

9. The gas spray assembly according to any one of claims 1 to 5, characterized in that: A plurality of the positioning posts (4) are provided, and the plurality of positioning posts (4) and the spray plate (2) are integrally formed.

10. A thin film deposition device, characterized in that: include: Chamber; The gas spray assembly according to any one of claims 1 to 9, wherein the spray plate (2) is arranged in the chamber.

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