Wafer reaction device for epitaxy

Abstract

The wafer reaction device for epitaxy comprises an upper shell and a lower shell, the lower shell comprises a reaction part and an extension part, the reaction part and the upper shell are connected and define a reaction cavity, the extension part extends from the reaction part to the direction back to the upper shell, and the wafer reaction device further comprises a supporting mechanism, a horizontal moving mechanism and an adjusting mechanism, the supporting mechanism extends from the reaction cavity to the first sealing cavity, and the supporting mechanism is arranged at one end of the reaction cavity and used for bearing a wafer; the horizontal moving mechanism is arranged at the other end of the supporting mechanism, and the horizontal moving mechanism is used for driving the supporting mechanism to shift in at least two directions of the horizontal plane; the adjusting mechanism is arranged at the end, back to the supporting mechanism, of the horizontal moving mechanism and used for adjusting the angle between the horizontal moving mechanism and the horizontal plane. Through the arrangement of the embodiment of the invention, the wafer reaction device for epitaxy, which can adjust the central positions of the wafer and the reaction cavity and can improve the quality of the wafer, is provided.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a wafer reaction device for epitaxy. Background Art

[0002] The wafer reaction device for epitaxial growth is a deposition device widely used in semiconductor processing equipment, and its coating process is usually carried out in a vacuum environment.

[0003] In the related art, a wafer is usually placed at the center of a reaction chamber of an epitaxial wafer reaction device for deposition, so that the wafer can achieve the best deposition effect.

[0004] However, during the deposition process, as the oxide layer is deposited on the surface of the wafer, the wafer may shift relative to the center of the reaction chamber. When the position of the wafer shifts, the deposition position of the wafer cannot be adjusted to realign the wafer to the center of the reaction chamber, thereby affecting the deposition effect of the wafer. Utility Model Content

[0005] An embodiment of the present application provides a wafer reaction device for epitaxial growth to solve a technical problem in the related art that during the deposition process, as the oxide layer is deposited on the surface of the wafer, the position of the wafer may be shifted relative to the center of the reaction chamber. When the position of the wafer is shifted, the deposition position of the wafer cannot be adjusted to readjust the wafer to the center of the reaction chamber, thereby affecting the deposition effect of the wafer.

[0006] The embodiment of the present application provides a wafer reaction device for epitaxy, comprising an upper shell and a lower shell connected to each other, the lower shell comprising a reaction portion and an extension portion, the reaction portion and the upper shell are connected and enclosed to form a reaction chamber, the extension portion extends from the reaction portion in a direction away from the upper shell, and the extension portion forms a first sealed chamber connected to the reaction chamber, and the wafer reaction device further comprises:

[0007] A support mechanism, which is disposed in the reaction chamber and extends from the reaction chamber toward the first sealed chamber, and is disposed at one end of the reaction chamber for supporting the wafer;

[0008] A horizontal moving mechanism, which is disposed at the other end of the supporting mechanism and is used to drive the supporting mechanism to shift in at least two directions on the horizontal plane to adjust the position of the wafer on the horizontal plane;

[0009] The adjusting mechanism is arranged at one end of the horizontal moving mechanism facing away from the supporting mechanism, and is used to adjust the angle between the horizontal moving mechanism and the horizontal plane, so as to adjust the angle between the wafer and the horizontal plane.

[0010] In a feasible implementation, the horizontal movement mechanism includes at least a first movement mechanism and a second movement mechanism;

[0011] One side of the second moving mechanism is arranged on the moving side of the first moving mechanism, and the other side of the second moving mechanism is connected to the other end of the supporting mechanism through a magnetic fluid sealing assembly;

[0012] The first moving mechanism is used to drive the second moving mechanism to move along the first horizontal direction, so as to drive the supporting mechanism to move along the first horizontal direction; the second moving mechanism is used to drive the supporting mechanism to move along the second horizontal direction;

[0013] The first horizontal direction and the second horizontal direction are arranged perpendicular to each other on a horizontal plane.

[0014] In a feasible implementation, the first moving mechanism includes a fixed component and a first moving component, one side of the first moving component is slidably disposed on the fixed component, and the fixed component is connected to the lifting end of the lifting mechanism;

[0015] The second moving mechanism includes a second moving component, which is slidably arranged on the other side of the first moving component, and the sliding direction of the first moving component and the sliding direction of the second moving component are arranged perpendicular to each other.

[0016] In a feasible implementation, the fixed assembly includes a fixed plate, the fixed plate is provided with a first track, and the first movable assembly includes a first movable plate, a first fixed member, a first connecting member and a first adjustment structure;

[0017] A first sliding block adapted to the first track is disposed on one side of the first moving plate, and a second track is disposed on the other side of the first moving plate;

[0018] The first fixing member is fixed to the fixing plate, the first connecting member is fixed to the first movable plate, and the first adjustment structure passes through the first fixing member and is rotatably connected to the first connecting member to drive the first movable plate to move along the first horizontal direction;

[0019] The second moving assembly includes a second moving plate, a second fixing member, a second connecting member and a second adjustment structure; the second moving plate is provided with a second sliding block adapted to the second track, the second fixing member is fixed to the first moving plate, the second connecting member is fixed to the second moving plate, and the second adjustment structure is rotatably connected to the second connecting member through the second fixing member to drive the second moving plate to move along the second horizontal direction;

[0020] The second movable plate forms an active cavity coaxially arranged with the first sealing cavity. The other end of the supporting mechanism penetrates into the active cavity and is connected to the output end of the magnetic fluid sealing component. The other side of the second movable plate is sealed and fixedly connected to the outer wall of the output end of the magnetic fluid sealing component. The input end of the magnetic fluid sealing component is connected to the rotating mechanism so that the rotating mechanism drives the supporting mechanism to rotate via the magnetic fluid sealing component.

[0021] In a feasible implementation, the first adjustment structure includes a first rotating telescopic member, a first bearing and a first transmission member;

[0022] The first rotating telescopic member passes through the first fixed member and one end of the first transmission member and is rotatably connected, the other end of the first transmission member is rotatably connected to the first connecting member through the first bearing, and the side wall of the first connecting member is connected to the first movable plate;

[0023] The second adjustment structure includes a second rotating telescopic member, a second bearing and a second transmission member; the second rotating telescopic member passes through the second fixed member and is connected to one end of the second transmission member, and the other end of the second transmission member is rotatably connected through the second bearing and the second connecting member; the side wall of the second connecting member is connected to the second movable plate.

[0024] In a feasible implementation, the adjustment mechanism includes an adjustment plate and an adjustment screw sleeve;

[0025] The adjusting plate is arranged on the side of the horizontal moving mechanism facing away from the supporting mechanism, and a plurality of adjusting screw sleeves are arranged around the adjusting plate. The plurality of adjusting screw sleeves pass through the adjusting plate and abut against the horizontal moving mechanism, and the adjusting screw sleeves are rotatably connected to the adjusting plate. The angle between the adjusting plate and the horizontal moving mechanism is adjusted by adjusting the adjusting screw sleeves to adjust the angle between the horizontal moving mechanism and the horizontal direction.

[0026] In a feasible implementation, the adjustment mechanism also includes a fixing bolt and a fixing nut. The fixing bolt passes through the adjusting screw sleeve and is rotatably connected to the horizontal moving mechanism. The adjusting screw sleeve abuts against the bottom of the fixed plate. The fixing nut is sleeved on the outer wall of the adjusting screw sleeve and abuts against the bottom of the adjusting plate.

[0027] In a feasible implementation, the wafer reaction device also includes a lifting mechanism, the lifting end of the lifting mechanism is arranged on the horizontal moving mechanism, and the lifting end of the lifting mechanism is used to drive the supporting mechanism to lift and lower in the vertical direction to adjust the position of the wafer in the vertical direction.

[0028] In a feasible implementation, the wafer reaction device includes a sealing mechanism, a flexible connection mechanism and a bearing mechanism;

[0029] The sealing mechanism is sealed and connected to the outer side wall of the extension part, the flexible connection mechanism is sleeved on the outer side wall of the support mechanism, one end of the flexible connection mechanism is connected to the sealing mechanism, and the other end of the flexible connection mechanism is connected to the second movable plate;

[0030] The flexible connection mechanism is equipped with a bearing mechanism, and both ends of the bearing mechanism are connected to the reaction part;

[0031] A second sealing cavity communicated with the first sealing cavity is formed between the flexible connection mechanism and the sealing mechanism.

[0032] In a feasible implementation, the flexible connection mechanism includes a first flange, a first elastic member, a second flange, a second elastic member and a third flange which are sequentially and integrally arranged;

[0033] The bearing mechanism comprises a first bearing plate and a second bearing plate;

[0034] The first flange is connected to the sealing mechanism, the second flange is installed with a first bearing plate, both ends of the first bearing plate are connected to the second bearing plate, and one end of the second bearing plate away from the first bearing plate is connected to the reaction part;

[0035] The third flange is connected to the horizontal moving mechanism.

[0036] In a feasible implementation, the sealing mechanism includes a fixing block, a sealing ring and a cooling assembly;

[0037] The end of the extension part facing away from the reaction part forms a sealing head, and the sealing head comprises a first extension part, a protruding part and a second extension part connected in sequence; the inner diameter of the sealing head gradually decreases from the protruding part to the first extension part and the second extension part respectively;

[0038] The fixing block is clamped on the outer side wall of the first extension portion, and the cooling assembly is clamped on the outer side wall of the second extension portion, wherein the incident angle of the outer side wall of the second extension portion is greater than the incident angle of the inner side wall of the cooling assembly;

[0039] One end of the cooling assembly facing away from the fixed block is connected to the first elastic member through a first flange;

[0040] A plurality of sealing rings are arranged between the cooling assembly and the sealing head, and the cooling assembly is used for cooling the sealing rings.

[0041] In a feasible implementation, the cooling assembly includes a cooling block, a liquid inlet pipe, a liquid outlet pipe and an air extraction pipe;

[0042] The cooling block is clamped on the outer side wall of the second extension portion, a cooling channel is arranged in the cooling block, and the cooling channel and the sealing ring are arranged correspondingly;

[0043] The liquid inlet pipe is connected to the liquid inlet end of the cooling channel, and the liquid outlet pipe is connected to the liquid outlet end of the cooling channel;

[0044] The air extraction pipe is connected between the cooling block and the sealing head to detect whether there is a seal between the cooling block and the sealing head, wherein the air extraction pipe is not connected with the liquid inlet pipe and the liquid outlet pipe.

[0045] The embodiment of the present application provides a wafer reaction device for epitaxy. In the embodiment of the present application, by arranging a horizontal moving mechanism at the other end of the supporting mechanism, when the wafer located at one end of the supporting mechanism is offset in the horizontal plane from the center of the reaction chamber during the deposition process, the supporting mechanism can be driven by the horizontal moving mechanism to be offset in the horizontal plane, thereby adjusting the position of the wafer between the horizontal plane and the center of the reaction chamber. In the embodiment of the present application, by arranging an adjustment mechanism at one end of the horizontal moving mechanism facing away from the supporting mechanism, when the angle between the wafer and the center of the reaction chamber is offset, the angle between the horizontal moving mechanism and the horizontal direction can be adjusted by the adjustment mechanism, thereby adjusting the angle between the wafer and the reaction chamber, so that the wafer is always located in the center of the reaction chamber, improving the wafer quality. Through the arrangement of the embodiment of the present application, a wafer reaction device for epitaxy is provided that can adjust the position of the wafer and the center of the reaction chamber and can improve the wafer quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present application and do not constitute an improper limitation on the present invention. In the drawings:

[0047] Figure 1 It is a structural schematic diagram of an epitaxial wafer reaction device provided in one embodiment of the present application;

[0048] Figure 2 yes Figure 1 Structural cross-sectional view of

[0049] Figure 3 yes Figure 2 A partial enlarged schematic diagram of

[0050] Figure 4 yes Figure 1 Schematic diagram of the assembly structure of the horizontal moving mechanism and the adjusting mechanism;

[0051] Figure 5 yes Figure 4 A schematic diagram of the structure of the first moving mechanism;

[0052] Figure 6 yes Figure 5 Structural section of Figure 1 ;

[0053] Figure 7 yes Figure 5 Structural section of Figure 2 ;

[0054] Figure 8 yes Figure 1 Structural diagram of the lifting mechanism;

[0055] Fig. 9 yes Figure 1 Schematic diagram of the structure of the cooling component.

[0056] Description of reference numerals:

[0057] 100-support mechanism; 200-wafer; 300-first moving mechanism; 400-second moving mechanism; 500-lifting mechanism; 600-adjusting mechanism; 700-flexible connection mechanism; 800-carrying mechanism; 900-sealing mechanism;

[0058] 110-first connecting section; 120-second connecting section; 130-third connecting section;

[0059] 310-fixed component; 311-fixed plate; 312-first track; 320-first moving component; 321-first moving plate; 321a-second track; 321b-first slider; 322-first fixed member; 323-first connecting member; 324-first adjustment structure; 324a-first rotating telescopic member; 324b-first bearing; 324c-first transmission member;

[0060] 410-second moving assembly; 411-second moving plate; 411a-second slider; 411b-movable cavity; 412-second fixing member; 413-second connecting member; 414-second adjustment structure; 414a-second rotating telescopic member; 414b-second transmission member;

[0061] 510-guide rail base; 511-lifting guide rail; 511a-upper limit photoelectric sensor; 511b-zero position photoelectric sensor; 511c-lower limit photoelectric sensor; 520-lifting block;

[0062] 610-adjusting plate; 620-fixing bolt; 630-adjusting screw sleeve; 640-fixing nut;

[0063] 710 - first flange; 720 - first elastic member; 730 - second flange; 740 - second elastic member; 750 - third flange; 700a - second sealing chamber;

[0064] 810 - first bearing plate; 820 - second bearing plate; 830 - third bearing;

[0065] 910-fixed block; 920-sealing ring; 930-cooling assembly; 931-cooling block; 932-liquid inlet pipe; 933-liquid outlet pipe; 934-air extraction pipe;

[0066] 10-upper shell; 10a-reaction chamber; 20-lower shell; 20a-first sealed chamber; 21-reaction part; 22-extension part; 22b-sealing head;

[0067] 30-magnetic fluid sealing assembly; 40-rotating mechanism. DETAILED DESCRIPTION

[0068] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work should fall within the scope of protection of the present application.

[0069] The wafer reaction device for epitaxial growth is a deposition device widely used in semiconductor processing equipment, and its coating process is usually carried out in a vacuum environment.

[0070] In the related art, a wafer is usually placed at the center of a reaction chamber of an epitaxial wafer reaction device for deposition, so that the wafer can achieve the best deposition effect.

[0071] However, during the deposition process, as the oxide layer is deposited on the surface of the wafer, the wafer may shift relative to the center of the reaction chamber. When the position of the wafer shifts, the deposition position of the wafer cannot be adjusted to realign the wafer to the center of the reaction chamber, thereby affecting the deposition effect of the wafer.

[0072] An embodiment of the present application provides a wafer reaction device for epitaxial growth to solve a technical problem in the related art that during the deposition process, as the oxide layer is deposited on the surface of the wafer, the position of the wafer may be shifted relative to the center of the reaction chamber. When the position of the wafer is shifted, the deposition position of the wafer cannot be adjusted to readjust the wafer to the center of the reaction chamber, thereby affecting the deposition effect of the wafer.

[0073] Figure 1 It is a structural schematic diagram of an epitaxial wafer reaction device provided in one embodiment of the present application; Figure 2 yes Figure 1 Structural cross-sectional view of Figure 3 yes Figure 2 A partial enlarged schematic diagram of .

[0074] Reference Figures 1 to 3The embodiment of the present application provides an epitaxial wafer reaction device, comprising an upper shell 10 and a lower shell 20 connected to each other, wherein the lower shell 20 comprises a reaction portion 21 and an extension portion 22, wherein the reaction portion 21 is connected to the upper shell 10 and encloses a reaction chamber 10a, wherein the extension portion 22 extends from the reaction portion 21 in a direction away from the upper shell 10, and the extension portion 22 forms a first sealed chamber 20a in communication with the reaction chamber 10a, and the wafer reaction device further comprises:

[0075] A support mechanism 100, wherein the support mechanism 100 is disposed in the reaction chamber 10a and extends from the reaction chamber 10a toward the first sealed chamber 20a, and the support mechanism 100 is disposed at one end of the reaction chamber 10a for supporting the wafer 200;

[0076] A horizontal moving mechanism, which is disposed at the other end of the supporting mechanism 100 and is used to drive the supporting mechanism 100 to shift in at least two directions on a horizontal plane to adjust the position of the wafer 200 on the horizontal plane;

[0077] The adjusting mechanism 600 is disposed at one end of the horizontal moving mechanism facing away from the supporting mechanism 100 , and is used to adjust the angle between the horizontal moving mechanism and the horizontal plane, so as to adjust the angle between the wafer 200 and the horizontal plane.

[0078] Exemplarily, the support mechanism 100 includes a support column and a carrier, one end of the support column is connected to the carrier, the other end of the support column extends to the horizontal moving mechanism, the carrier is arranged in the reaction chamber 10a, and the carrier is used to carry the wafer 200. For example, the support mechanism 100 is provided with one end of the carrier as a support handle, and the end of the support column facing away from the carrier is provided with a support claw, and the support claw is used to connect with other mechanisms. In specific implementation, a robot is usually used to place the wafer 200 on the carrier, and the wafer 200 is located in the center of the reaction chamber 10a.

[0079] Exemplarily, the horizontal movement mechanism can drive the support mechanism 100 to shift along a first direction and a second direction on a horizontal plane, wherein the angle between the first direction and the second direction can be 90°, 180°, 60°, etc.

[0080] Of course, the horizontal movement mechanism can also drive the support mechanism 100 to deviate along the first direction, the second direction, and the third direction on the horizontal plane.

[0081] In the specific implementation, a manipulator is used to place the wafer 200 at one end of the support mechanism 100, and the initial position of the wafer 200 is located at the center of the reaction chamber 10a, and then deposition is performed. During the deposition process, as the oxide layer on the surface of the wafer 200 is deposited, the position of the wafer 200 and the center of the reaction chamber 10a is offset. When the wafer 200 is offset relative to the center of the reaction chamber 10a on the horizontal plane, the support mechanism 100 can be driven to move on the horizontal plane by the horizontal moving mechanism to adjust the position of the wafer 200 on the horizontal plane. When the angle between the wafer 200 and the center of the reaction chamber 10a is offset, the angle between the horizontal moving mechanism and the horizontal direction can be adjusted by the adjustment mechanism 600, so that the angle between the wafer 200 and the reaction chamber 10a can be adjusted so that the wafer 200 is always located at the center of the reaction chamber 10a.

[0082] From the above description, it can be seen that this solution achieves the following technical effects:

[0083] The embodiment of the present application provides a wafer reaction device for epitaxy. In the embodiment of the present application, by arranging a horizontal moving mechanism at the other end of the supporting mechanism 100, when the wafer 200 located at one end of the supporting mechanism 100 is offset from the center of the reaction chamber 10a in the horizontal plane during the deposition process, the supporting mechanism 100 can be driven by the horizontal moving mechanism to offset in the horizontal plane, thereby adjusting the position of the wafer 200 between the horizontal plane and the center of the reaction chamber 10a. In the embodiment of the present application, in the embodiment of the present application, by arranging an adjustment mechanism 600 at one end of the horizontal moving mechanism facing away from the supporting mechanism 100, when the angle between the wafer 200 and the center of the reaction chamber 10a is offset, the angle between the horizontal moving mechanism and the horizontal direction can be adjusted by the adjustment mechanism 600, thereby adjusting the angle between the wafer 200 and the reaction chamber 10a, so that the wafer 200 is always located at the center of the reaction chamber 10a, thereby improving the quality of the wafer 200. Through the configuration of the embodiment of the present application, a wafer reaction device for epitaxial growth is provided, which can adjust the center position of the wafer 200 and the reaction chamber 10a and improve the quality of the wafer 200.

[0084] In some examples, the horizontal movement mechanism includes at least a first movement mechanism 300 and a second movement mechanism 400;

[0085] One side of the second moving mechanism 400 is disposed on the moving side of the first moving mechanism 300 , and the other side of the second moving mechanism 400 is connected to the other end of the supporting mechanism 100 through the magnetic fluid sealing assembly 30 ;

[0086] The first moving mechanism 300 is used to drive the second moving mechanism 400 to move along the first horizontal direction, so as to drive the supporting mechanism 100 to move along the first horizontal direction; the second moving mechanism 400 is used to drive the supporting mechanism 100 to move along the second horizontal direction;

[0087] The first horizontal direction and the second horizontal direction are arranged perpendicular to each other on a horizontal plane.

[0088] For example, the horizontal moving mechanism includes a first moving mechanism 300, a second moving mechanism 400 and a third moving mechanism, one side of the third moving mechanism is arranged on the moving side of the second moving mechanism 400, and the other side of the third moving mechanism is arranged on the other end of the supporting mechanism 100; the connection side of the second moving mechanism 400 is arranged on the moving side of the first moving mechanism 300; the first moving mechanism 300 is used to drive the second moving mechanism 400 and the third moving mechanism to move along the first horizontal direction, so as to drive the supporting mechanism 100 to move along the first horizontal direction through the second moving mechanism 400 and the third moving mechanism; the second moving mechanism 400 is used to drive the third moving mechanism to move along the second horizontal direction, so as to drive the supporting mechanism 100 to move along the second horizontal direction through the third moving mechanism; the third moving mechanism is used to drive the supporting mechanism 100 to move along the third horizontal direction. For another example, the first horizontal direction, the second horizontal direction and the third horizontal direction are evenly distributed at 120° on the horizontal plane.

[0089] In the embodiment of the present application, by setting one side of the second moving mechanism 400 on the moving side of the first moving mechanism 300, and setting the other side of the second moving mechanism 400 on the other end of the support mechanism 100, the first moving mechanism 300 can drive the second moving mechanism 400 to move along the first horizontal direction, and then drive the support mechanism 100 to move along the first horizontal direction through the second moving mechanism 400 to adjust the relative position of the wafer 200 and the reaction chamber 10a on the horizontal plane along the first horizontal direction. In the embodiment of the present application, the second moving mechanism 400 drives the support mechanism 100 to move along the second horizontal direction, and can adjust the relative position of the wafer 200 and the reaction chamber 10a on the horizontal plane along the second horizontal direction. In the embodiment of the present application, by setting the first moving mechanism 300 and the second moving mechanism 400, the position of the wafer 200 can be adjusted along the first horizontal direction or the second horizontal direction, so that the wafer 200 is always located at the center of the reaction chamber 10a, thereby improving the quality of the wafer 200. Through the configuration of the embodiment of the present application, a wafer reaction device for epitaxial growth is provided, which can adjust the center position of the wafer 200 and the reaction chamber 10a and improve the quality of the wafer 200.

[0090] Figure 4 yes Figure 1 Schematic diagram of the assembly structure of the horizontal moving mechanism and the adjustment mechanism.

[0091] In some other examples, see Figure 4 The first moving mechanism 300 includes a fixed component 310 and a first moving component 320, and one side of the first moving component 320 is slidably disposed on the fixed component 310;

[0092] The second moving mechanism 400 includes a second moving assembly 410 , which is slidably disposed on the other side of the first moving assembly 320 , and the sliding direction of the first moving assembly 320 and the sliding direction of the second moving assembly 410 are perpendicular to each other.

[0093] Exemplarily, a first screw can be set on the surface of the fixed component 310 along a first horizontal direction, and the first movable component 320 is set on the first screw and is provided with a first threaded hole that is mutually adapted to the first screw so that the first movable component 320 can reciprocate along the extension direction of the first screw.

[0094] Similarly, a second lead screw is arranged on the other side of the first moving component 320 along a second horizontal direction, and the second moving component 410 is arranged on the second lead screw and is provided with a second threaded hole which is mutually adapted with the second lead screw so that the second moving component 410 can reciprocate along the extension direction of the second lead screw.

[0095] Figure 5 yes Figure 4 A schematic diagram of the structure of the first moving mechanism; Figure 6 yes Figure 5 Structural section of Figure 1 .

[0096] In some other implementations, refer to Figure 5 and Figure 6 The fixed assembly 310 includes a fixed plate 311, the fixed plate 311 is provided with a first track 312, and the first movable assembly 320 includes a first movable plate 321, a first fixing member 322, a first connecting member 323 and a first adjustment structure 324;

[0097] A first slider 321b adapted to the first track 312 is disposed on one side of the first moving plate 321, and a second track 321a is disposed on the other side of the first moving plate 321;

[0098] The first fixing member 322 is fixed to the fixing plate 311, the first connecting member 323 is fixed to the first movable plate 321, the second connecting member 413 is fixed to the second movable plate 411, and the first adjustment structure 324 passes through the first fixing member 322 and is rotatably connected to the first connecting member 323 to drive the first movable plate 321 to move along the first horizontal direction;

[0099] The second moving assembly 410 includes a second moving plate 411, a second fixing member 412, a second connecting member 413 and a second adjusting structure 414; the second moving plate 411 is provided with a second slider 411a adapted to the second track 321a, the second fixing member 412 is fixed to the first moving plate 321, and the second adjusting structure 414 is rotatably connected to the second connecting member 413 through the second fixing member 412 to drive the second moving plate 411 to move along the second horizontal direction;

[0100] The second movable plate 411 forms an active cavity 411b coaxially arranged with the first sealed cavity 20a, the other end of the support mechanism 100 penetrates into the active cavity 411b and is connected to the output end of the magnetic fluid sealing assembly 30, the other side of the second movable plate 411 is sealed and fixedly connected to the outer wall of the output end of the magnetic fluid sealing assembly 30, and the input end of the magnetic fluid sealing assembly 30 is connected to the rotating mechanism 40, so that the rotating mechanism 40 drives the support mechanism 100 to rotate via the magnetic fluid sealing assembly 30.

[0101] For example, the rotating mechanism 40 may be a rotating motor.

[0102] In the embodiment of the present application, the first fixing member 322 is fixed to the fixing plate 311, the first connecting member 323 is fixed to the first movable plate 321, and the first adjustment structure 324 is rotatably connected through the first fixing member 322 and the first connecting member 323, so that the first movable plate 321 can be driven to reciprocate along the first horizontal direction through the first connecting member 323 by rotating the first adjustment mechanism. In the embodiment of the present application, the second fixing member 412 is fixed to the first movable plate 321, and the second adjustment structure 414 is rotatably connected through the second fixing member 412 and the first connecting member 323, so that the second movable plate 411 can be driven to reciprocate along the second horizontal direction through the second connecting member 413 by rotating the second adjustment structure 414.

[0103] Exemplarily, the first adjustment structure 324 includes a first rotating telescopic member 324a, a first bearing 324b and a first transmission member 324c;

[0104] The first rotating telescopic member 324a passes through the first fixed member 322 and is rotatably connected to one end of the first transmission member 324c. The other end of the first transmission member 324c is rotatably connected to the first connecting member 323 through the first bearing 324b. The side wall of the first connecting member 323 is connected to the first movable plate 321.

[0105] The second adjustment structure 414 includes a second rotating telescopic member 414a, a second bearing and a second transmission member 414b; the second rotating telescopic member 414a passes through the second fixed member 412 and is connected to one end of the second transmission member 414b, and the other end of the second transmission member 414b is rotatably connected through the second bearing and the second connecting member 413; the side wall of the second connecting member 413 is connected to the second movable plate 411.

[0106] For example, a first handle is provided at one end of the first rotating telescopic member 324a facing away from the first bearing 324b, and the staff can rotate the first rotating telescopic member 324a by rotating the first handle. Similarly, a second handle is provided at one end of the second rotating telescopic member 414a facing away from the second bearing, and the staff can rotate the second rotating telescopic member 414a by rotating the second handle.

[0107] For another example, the side wall of the first rotating telescopic member 324a is provided with a scale, and when the first rotating telescopic member 324a is rotated, the scale of the side wall of the first rotating telescopic member 324a will change according to the number of rotations of the first rotating telescopic member 324a, thereby displaying the moving distance of the first movable plate 321, so as to accurately adjust the offset distance of the support mechanism 100 along the first horizontal direction. Similarly, the side wall of the second rotating telescopic member 414a is also provided with a scale, and the scale of the side wall of the second rotating telescopic member 414a will change according to the number of rotations of the second rotating telescopic member 414a, thereby displaying the moving distance of the second movable plate 411, so as to accurately adjust the offset distance of the support mechanism 100 along the second horizontal direction.

[0108] Exemplarily, both the first rotating telescopic member 324a and the second rotating telescopic member 414a may adopt a micrometer screw.

[0109] In the embodiment of the present application, through the mutual cooperation of the first rotating telescopic member 324a, the first transmission member 324c and the first bearing 324b, the first movable plate 321 can be moved along the first horizontal direction by rotating the first rotating telescopic member 324a, and through the mutual cooperation of the second rotating telescopic member 414a, the second transmission member 414b and the second bearing, the second movable plate 411 can be moved along the second horizontal direction by rotating the second rotating telescopic member 414a.

[0110] In another implementation, the adjustment mechanism 600 includes an adjustment plate 610 and an adjustment screw sleeve 630;

[0111] The adjustment plate 610 is arranged on the side of the horizontal moving mechanism facing away from the supporting mechanism 100, and a plurality of adjusting screw sleeves 630 are arranged around the adjustment plate 610. The plurality of adjusting screw sleeves 630 pass through the adjustment plate 610 and abut against the horizontal moving mechanism, and the adjusting screw sleeves 630 and the adjustment plate 610 are rotatably connected. The angle between the adjustment plate 610 and the horizontal moving mechanism is adjusted by adjusting the fixed adjusting screw sleeves 630 to adjust the angle between the horizontal moving mechanism and the horizontal direction.

[0112] Exemplarily, a plurality of adjusting screw sleeves 630 sequentially pass through the adjusting plate 610 and abut against the fixed plate 311 in the horizontal moving mechanism, and the angle between the adjusting plate 610 and the fixed plate 311 is adjusted by adjusting the adjusting screw sleeves 630, that is, the angle between the horizontal moving mechanism and the horizontal direction is adjusted.

[0113] Exemplarily, four adjusting screw sleeves 630 may be evenly arranged around the adjusting plate 610 .

[0114] In the embodiment of the present application, by setting the adjustment plate 610 and the adjustment screw sleeve 630, when the wafer 200 is offset from the center of the reaction chamber 10a on the horizontal plane, the height of the adjustment plate 610 and the horizontal moving mechanism at that position can be adjusted by adjusting the relative height of the adjustment screw sleeve 630, thereby adjusting the angle between the horizontal moving mechanism and the horizontal plane, and then adjusting the angle between the wafer 200 located at one end of the support mechanism 100 and the center of the reaction chamber 10a, so that the wafer 200 is always in the center position of the reaction chamber 10a.

[0115] Figure 7 yes Figure 5 Structural section of Figure 2 .

[0116] Reference Figure 7 In some examples, the adjustment mechanism 600 also includes a fixing bolt 620 and a fixing nut 640. The fixing bolt 620 passes through the adjusting screw sleeve 630 and is rotatably connected to the horizontal moving mechanism. The adjusting screw sleeve 630 rests against the bottom of the fixing plate 311. The fixing nut 640 is sleeved on the outer wall of the adjusting screw sleeve 630 and rests against the bottom of the adjusting plate 610.

[0117] In specific implementation, when it is necessary to adjust the angle between the horizontal moving mechanism and the horizontal direction, the fixing nut 640 can be loosened and then removed. After removing the fixing bolt 620 and adjusting the height of the adjusting screw sleeve 630 supported on the fixed plate 311, the fixing bolt 620 is passed through the adjusting screw sleeve 630 and fixed to the fixed plate 311. Then, the fixing nut 640 is sleeved on the outer wall of the adjusting screw sleeve 630 and rests against the bottom of the adjusting plate 610.

[0118] The embodiment of the present application can position the adjusting screw sleeve 630 by setting the fixing bolt 620, avoid displacement of the adjusting screw sleeve 630, and ensure the position of the wafer. The embodiment of the present application can fix the adjusting screw sleeve 630 by setting the fixing nut 630, so that the position of the wafer remains stable.

[0119] In some examples, the wafer reaction device also includes a lifting mechanism 500, the lifting end of the lifting mechanism 500 is arranged on the adjusting mechanism 600, and the lifting end of the lifting mechanism 500 is used to drive the supporting mechanism 100 to lift and lower in the vertical direction to adjust the position of the wafer 200 in the vertical direction.

[0120] Exemplarily, the lifting end of the lifting mechanism 500 is disposed on the adjustment plate 610 .

[0121] For example, the lifting mechanism 500 may be configured as a driving motor.

[0122] The embodiment of the present application sets the lifting end of the lifting mechanism 500 on the adjusting mechanism 600, so that the adjusting mechanism 600 can drive the horizontal moving mechanism to move back and forth in the vertical direction, thereby driving the supporting mechanism 100 to move back and forth in the vertical direction to adjust the vertical position of the wafer 200.

[0123] In some other implementations, the wafer reaction device includes a sealing mechanism 900, a flexible connection mechanism 700, and a carrying mechanism 800;

[0124] The sealing mechanism 900 is sealed and connected to the outer wall of the extension portion 22, the flexible connection mechanism 700 is sleeved on the outer wall of the support mechanism 100, and one end of the flexible connection mechanism 700 is connected to the sealing mechanism 900, and the other end of the flexible connection mechanism 700 is connected to the second movable plate 411;

[0125] The flexible connection mechanism 700 is equipped with a bearing mechanism 800, and both ends of the bearing mechanism 800 are connected to the reaction part 21;

[0126] A second sealed cavity 700 a communicating with the first sealed cavity 20 a is formed between the flexible connection mechanism 700 and the sealing mechanism 900 .

[0127] The embodiment of the present application connects one end of the flexible connection mechanism 700 to the sealing mechanism 900, connects the other end of the flexible connection mechanism 700 to the second movable plate 411, and forms a second sealed cavity 700a that is connected to the first sealed cavity 20a between the flexible connection mechanism 700 and the bearing mechanism 800, thereby sealing the reaction cavity 10a and the first sealed cavity 20a. The embodiment of the present application can provide a certain support for the sealing mechanism 900 through the setting of the bearing mechanism 800.

[0128] Exemplarily, the flexible connection mechanism 700 includes a first flange 710, a first elastic member 720, a second flange 730, a second elastic member 740 and a third flange 750 which are integrally arranged in sequence;

[0129] The carrying mechanism 800 includes a first carrying plate 810 and a second carrying plate 820;

[0130] The first flange 710 is connected to the sealing mechanism 900 . The second flange 730 is installed with a first carrier plate 810 . Both ends of the first carrier plate 810 are connected to the second carrier plate 820 . One end of the second carrier plate 820 away from the first carrier plate 810 is connected to the reaction unit 21 .

[0131] For example, the first elastic member 720 and the second elastic member 740 may both be configured as elastic bellows.

[0132] For another example, the other end of the second elastic member 740 is connected to the second moving plate 411 in the horizontal moving mechanism through the third flange 750 .

[0133] In a specific implementation, during the movement process, the fixed end of the lifting mechanism 500 is fixed to the first supporting plate 810, and the first supporting plate 810 is fixed to the outer wall of the first elastic member 720 through the first flange 710. When the lifting end of the lifting mechanism 500 drives the support mechanism 100 to move in a vertical direction toward the wafer 200 via the horizontal moving mechanism, the lifting end drives the support mechanism 100 to move upward via the horizontal moving mechanism, and the first elastic member 720 contracts; when the lifting end of the lifting mechanism 500 drives the support mechanism 100 to move in a vertical direction away from the wafer 200 via the horizontal moving mechanism, the lifting end drives the support mechanism 100 to move downward via the horizontal moving mechanism, and the first elastic member 720 expands downward.

[0134] Figure 8 yes Figure 1 Schematic diagram of the structure of the lifting mechanism.

[0135] For example, refer to Figure 8 The lifting mechanism 500 can be set as a linear lifting module. For example, the linear module includes a guide rail base 510 and a lifting block 520. A lifting rail 511 is formed on the guide rail base 510. The lifting block 520 and the lifting rail 511 are adapted to each other. The guide rail base 510 is fixed to the support plate 810, and the lifting block 520 is connected to the horizontal moving mechanism.

[0136] Furthermore, an upper limit photoelectric sensor 511a, a zero position photoelectric sensor 511b, and a lower limit photoelectric sensor 511c are provided along the extension direction of the lifting guide rail 511. The upper limit photoelectric sensor 511a is used to detect whether the lifting block 520 has reached the upper limit position of the lifting guide rail 511, the lower limit photoelectric sensor 511c is used to detect whether the lifting block 520 has reached the lower limit position of the lifting guide rail 511, and the zero position photoelectric sensor 511b is used to detect whether the lifting block 520 has reached the initial position of the lifting guide rail 511.

[0137] For example, limit blocks are provided at the upper end of the lifting guide rail 511 and the lower end of the lifting guide rail 511 to prevent the lifting block 520 from moving to an extreme position and causing damage to the linear lifting module, thereby protecting the linear lifting module.

[0138] Exemplarily, the second elastic member 720 may be configured as a second bellows.

[0139] In the embodiment of the present application, the first elastic member 720 is provided, and since the first elastic member 720 has a certain flexibility, the sealing mechanism 900 and the supporting mechanism 100 can be connected by the first elastic member 720, thereby providing a certain protection for the sealing mechanism 900. In the embodiment of the present application, the second elastic member 740 is provided, and the supporting mechanism 100 can be lifted and lowered by the second elastic member 740.

[0140] Fig. 9 yes Figure 1 Schematic diagram of the structure of the cooling component.

[0141] For example, refer to Fig. 9 , the sealing mechanism 900 includes a fixing block 910, a sealing ring 920 and a cooling assembly 930;

[0142] The end of the extension part 22 facing away from the reaction part 21 forms a sealing head 22b, and the sealing head 22b includes a first extension part, a protruding part, and a second extension part connected in sequence; the inner diameter of the sealing head 22b gradually decreases from the protruding part to the first extension part and the second extension part respectively;

[0143] The fixing block 910 is clamped on the outer side wall of the first extension part, and the cooling assembly 930 is clamped on the outer side wall of the second extension part, wherein the incident angle of the outer side wall of the second extension part is greater than the incident angle of the inner side wall of the cooling assembly;

[0144] One end of the cooling assembly 930 facing away from the fixing block 910 is connected to the first elastic member 720 via the first flange 710;

[0145] A plurality of sealing rings 920 are disposed between the cooling assembly 930 and the sealing head 22 b , and the cooling assembly 930 is used to cool the sealing rings 920 .

[0146] Exemplarily, the sealing ring 920 can be made of materials such as rubber and silicone.

[0147] In the embodiment of the present application, the sealing head 22b is configured to include a first extension portion, a protruding portion, and a second extension portion connected in sequence; the inner diameter of the sealing head 22b gradually decreases from the protruding portion to the first extension portion and the second extension portion, respectively, and a plurality of sealing rings 920 are provided between the cooling component 930 and the sealing head 22b, which can not only seal the cooling component 930 and the sealing ring 920, but also cool the sealing ring 920 through the cooling component 930. Furthermore, in the embodiment of the present application, by setting the incident angle of the outer wall of the second extension portion to be greater than the incident angle of the inner wall of the cooling component, the sealing surface of the sealing ring 920 located above can be greater than the sealing surface of the sealing ring 920 located below, so as to improve the sealing effect of the sealing ring 920 on the cooling component 930 and the sealing head 22b.

[0148] Exemplarily, the cooling assembly 930 includes a cooling block 931, a liquid inlet pipe 932, a liquid outlet pipe 933, and an air extraction pipe 934;

[0149] The cooling block 931 is clamped on the outer wall of the second extension portion, and a cooling channel is provided in the cooling block 931, and the cooling channel and the sealing ring 920 are provided correspondingly;

[0150] The liquid inlet pipe 932 is connected to the liquid inlet end of the cooling channel, and the liquid outlet pipe 933 is connected to the liquid outlet end of the cooling channel;

[0151] The air extraction pipe 934 is connected between the cooling block 931 and the sealing head 22 b to detect whether the cooling block 931 and the sealing head 22 b are sealed, wherein the air extraction pipe 934 is not connected to the liquid inlet pipe 932 and the liquid outlet pipe 933 .

[0152] Exemplarily, liquids such as water and oil may flow in the liquid inlet pipe 932 and the liquid outlet pipe 933 .

[0153] Illustratively, in the embodiment of the present application, a second elastic member 720 is connected to the sealing head 22b, and the sealing head 22b usually adopts a glass ball head. The setting of the second elastic member 720 can provide a deformation space for the installation of the glass ball head to prevent the generation of lateral stress.

[0154] Since the wafer 200 needs to be heated during the deposition process, the sealing ring 920 is easily heated during the heating process. Therefore, by setting the liquid inlet pipe 932 and the liquid outlet pipe 933, the coolant can be circulated in the cooling block 931, thereby cooling the sealing ring 920.

[0155] The embodiment of the present application can extract the air between the cooling block 931 and the sealing head 22b before the reaction by setting the exhaust pipe 934, so as to ensure the purity of the reaction carrier in the first sealed cavity 20a. And the embodiment of the present application can detect whether there is air between the cooling block 931 and the sealing head 22b in real time by setting the exhaust pipe 934, so as to further ensure the purity of the reaction carrier in the first sealed cavity 20a.

[0156] It is easy to understand that those skilled in the art can combine, split, reorganize, etc. the embodiments of the present application to obtain other embodiments based on the several embodiments provided in the present application, and these embodiments do not exceed the protection scope of the present application.

[0157] The above specific implementation methods further explain in detail the purpose, technical solutions and beneficial effects of the embodiments of the present application. It should be understood that the above are only specific implementation methods of the embodiments of the present application and are not used to limit the protection scope of the embodiments of the present application. Any modifications, equivalent substitutions, improvements, etc. made on the basis of the technical solutions of the embodiments of the present application should be included in the protection scope of the embodiments of the present application.

Claims

1. A wafer reaction device for epitaxial growth, comprising an upper shell (10) and a lower shell (20) connected to each other, the lower shell (20) comprising a reaction part (21) and an extension part (22), the reaction part (21) and the upper shell (10) are connected and enclosed to form a reaction chamber (10a), the extension part (22) extends from the reaction part (21) in a direction away from the upper shell (10), and the extension part (22) forms a first sealed chamber (20a) connected to the reaction chamber (10a), characterized in that: The wafer reaction device also includes: A support mechanism (100), the support mechanism (100) being arranged in a reaction chamber (10a) and extending from the reaction chamber (10a) toward the first sealed chamber (20a), the support mechanism (100) being arranged at one end of the reaction chamber (10a) for supporting a wafer (200); a horizontal moving mechanism, the horizontal moving mechanism being arranged at the other end of the supporting mechanism (100), the horizontal moving mechanism being used to drive the supporting mechanism (100) to shift in at least two directions on a horizontal plane, so as to adjust the position of the wafer (200) on the horizontal plane; An adjusting mechanism (600) is arranged at one end of the horizontal moving mechanism facing away from the supporting mechanism (100), and the adjusting mechanism (600) is used to adjust the angle between the horizontal moving mechanism and the horizontal plane, so as to adjust the angle between the wafer (200) and the horizontal plane.

2. The epitaxial wafer reaction device according to claim 1, characterized in that: The horizontal moving mechanism at least comprises a first moving mechanism (300) and a second moving mechanism (400); One side of the second moving mechanism (400) is arranged on the moving side of the first moving mechanism (300), and the other side of the second moving mechanism (400) is connected to the other end of the supporting mechanism (100) through a magnetic fluid sealing component (30); The first moving mechanism (300) is used to drive the second moving mechanism (400) to move along a first horizontal direction, so as to drive the supporting mechanism (100) to move along the first horizontal direction; the second moving mechanism (400) is used to drive the supporting mechanism (100) to move along a second horizontal direction; The first horizontal direction and the second horizontal direction are arranged perpendicular to each other on a horizontal plane.

3. The epitaxial wafer reaction device according to claim 2, characterized in that: The first moving mechanism (300) comprises a fixed component (310) and a first moving component (320), and one side of the first moving component (320) is slidably disposed on the fixed component (310); The second moving mechanism (400) comprises a second moving component (410), and the second moving component (410) is slidably arranged on the other side of the first moving component (320), and the sliding direction of the first moving component (320) and the sliding direction of the second moving component (410) are arranged perpendicular to each other.

4. The epitaxial wafer reaction device according to claim 3, characterized in that: The fixed assembly (310) comprises a fixed plate (311), the fixed plate (311) is provided with a first track (312), and the first movable assembly (320) comprises a first movable plate (321), a first fixing member (322), a first connecting member (323) and a first adjustment structure (324); A first sliding block (321b) adapted to the first track (312) is disposed on one side of the first movable plate (321), and a second track (321a) is disposed on the other side of the first movable plate (321); The first fixing member (322) is fixed to the fixing plate (311), the first connecting member (323) is fixed to the first movable plate (321), and the first adjustment structure (324) passes through the first fixing member (322) and is rotatably connected to the first connecting member (323) to drive the first movable plate (321) to move along a first horizontal direction; The second moving assembly (410) comprises a second moving plate (411), a second fixing member (412), a second connecting member (413) and a second adjustment structure (414); the second moving plate (411) is provided with a second sliding block (411a) adapted to the second track (321a); ​​the second fixing member (412) is fixed to the first moving plate (321); the second connecting member (413) is fixed to the second moving plate (411); the second adjustment structure (414) passes through the second fixing member (412) and is rotatably connected to the second connecting member (413) to drive the second moving plate (411) to move along a second horizontal direction; The second movable plate (411) forms an active cavity (411b) coaxially arranged with the first sealed cavity (20a); the other end of the support mechanism (100) penetrates into the active cavity (411b) and is connected to the output end of the magnetic fluid sealing component (30); the other side of the second movable plate (411) is sealed and fixedly connected to the outer wall of the output end of the magnetic fluid sealing component (30); the input end of the magnetic fluid sealing component (30) is connected to the rotating mechanism (40) so that the rotating mechanism (40) drives the support mechanism (100) to rotate via the magnetic fluid sealing component (30).

5. The epitaxial wafer reaction device according to claim 4, characterized in that: The first adjustment structure (324) comprises a first rotating telescopic member (324a), a first bearing (324b) and a first transmission member (324c); The first rotating telescopic member (324a) passes through the first fixing member (322) and one end of the first transmission member (324c) to be rotatably connected, the other end of the first transmission member (324c) is rotatably connected to the first connecting member (323) via the first bearing (324b), and the side wall of the first connecting member (323) is connected to the first movable plate (321); The second adjustment structure (414) includes a second rotatable telescopic member (414a), a second bearing and a second transmission member (414b); the second rotatable telescopic member (414a) passes through the second fixed member (412) and is connected to one end of the second transmission member (414b), and the other end of the second transmission member (414b) is rotatably connected to the second connecting member (413) through the second bearing; the side wall of the second connecting member (413) is connected to the second movable plate (411).

6. The epitaxial wafer reaction device according to claim 1, characterized in that: The adjustment mechanism (600) comprises an adjustment plate (610) and an adjustment screw sleeve (630); The adjusting plate (610) is arranged on a side of the horizontal moving mechanism facing away from the supporting mechanism (100), and a plurality of adjusting screw sleeves (630) are arranged around the adjusting plate (610). The plurality of adjusting screw sleeves (630) pass through the adjusting plate (610) and abut against the horizontal moving mechanism, and the adjusting screw sleeves (630) and the adjusting plate (610) are rotatably connected. The angle between the adjusting plate (610) and the horizontal moving mechanism is adjusted by adjusting the adjusting screw sleeves (630), so as to adjust the angle between the horizontal moving mechanism and the horizontal direction.

7. The epitaxial wafer reaction device according to claim 6, characterized in that: The adjustment mechanism (600) further comprises a fixing bolt (620) and a fixing nut (640); the fixing bolt (620) passes through the adjusting screw sleeve (630) and is rotationally connected to the horizontal moving mechanism; the adjusting screw sleeve (630) abuts against the bottom of the fixing plate (311); and the fixing nut (640) is sleeved on the outer side wall of the adjusting screw sleeve (630) and abuts against the bottom of the adjusting plate (610).

8. The epitaxial wafer reaction device according to any one of claims 1 to 7, characterized in that: The wafer reaction device further comprises a lifting mechanism (500), wherein a lifting end of the lifting mechanism (500) is arranged on the horizontal moving mechanism, and the lifting end of the lifting mechanism (500) is used to drive the supporting mechanism (100) to lift and lower in the vertical direction so as to adjust the position of the wafer (200) in the vertical direction.

9. The epitaxial wafer reaction device according to claim 8, characterized in that: The wafer reaction device comprises a sealing mechanism (900), a flexible connection mechanism (700) and a bearing mechanism (800); The sealing mechanism (900) is sealingly connected to the outer wall of the extension portion (22); the flexible connection mechanism (700) is sleeved on the outer wall of the support mechanism (100); one end of the flexible connection mechanism (700) is connected to the sealing mechanism (900); and the other end of the flexible connection mechanism (700) is connected to the second movable plate (411); The flexible connection mechanism (700) is equipped with the support mechanism (800), and both ends of the support mechanism (800) are connected to the reaction part (21); A second sealing cavity (700a) communicating with the first sealing cavity (20a) is formed between the flexible connection mechanism (700) and the sealing mechanism (900).

10. The epitaxial wafer reaction device according to claim 9, characterized in that: The flexible connection mechanism (700) comprises a first flange (710), a first elastic member (720), a second flange (730), a second elastic member (740) and a third flange (750) which are integrally arranged in sequence; The bearing mechanism (800) comprises a first bearing plate (810) and a second bearing plate (820); The first flange (710) is connected to the sealing mechanism (900), the second flange (730) is mounted with the first carrier plate (810), both ends of the first carrier plate (810) are connected to the second carrier plate (820), and one end of the second carrier plate (820) away from the first carrier plate (810) is connected to the reaction part (21); The third flange (750) is connected to the horizontal movement mechanism.

11. The epitaxial wafer reaction device according to claim 10, characterized in that: The sealing mechanism (900) comprises a fixing block (910), a sealing ring (920) and a cooling assembly (930); An end of the extension portion (22) facing away from the reaction portion (21) forms a sealing head (22b), and the sealing head (22b) comprises a first extension portion, a protruding portion, and a second extension portion which are connected in sequence; the inner diameter of the sealing head (22b) gradually decreases from the protruding portion to the first extension portion and the second extension portion respectively; The fixing block (910) is clamped on the outer side wall of the first extension portion, and the cooling assembly (930) is clamped on the outer side wall of the second extension portion, wherein the incident angle of the outer side wall of the second extension portion is greater than the incident angle of the inner side wall of the cooling assembly (930); One end of the cooling assembly (930) facing away from the fixing block (910) is connected to the first elastic member (720) via the first flange (710); A plurality of sealing rings (920) are arranged between the cooling component (930) and the sealing head (22b), and the cooling component (930) is used to cool the sealing rings (920).

12. The epitaxial wafer reaction device according to claim 11, characterized in that: The cooling assembly (930) comprises a cooling block (931), a liquid inlet pipe (932), a liquid outlet pipe (933) and an air extraction pipe (934); The cooling block (931) is clamped on the outer wall of the second extension portion, a cooling channel is provided in the cooling block (931), and the cooling channel and the sealing ring (920) are provided correspondingly; The liquid inlet pipe (932) is connected to the liquid inlet end of the cooling channel, and the liquid outlet pipe (933) is connected to the liquid outlet end of the cooling channel; The exhaust pipe (934) is connected to a plurality of sealing rings between the cooling block (931) and the sealing head (22b) for detecting whether the cooling block (931) and the sealing head (22b) are sealed, wherein the exhaust pipe (934) is not connected to the liquid inlet pipe (932) and the liquid outlet pipe (933).

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