Computer built-in function daughter board

Abstract

The utility model relates to the technical field of computers, and particularly discloses a computer built-in function daughter board which comprises an installation board. The data slot is mounted at the top end of the mounting plate; the base plate is arranged outside the mounting plate; the heat dissipation mechanism is arranged at the top end of the mounting plate, and the heat dissipation mechanism comprises a heat dissipation device, a heat dissipation groove and a heat conduction copper pipe; according to the utility model, through the arrangement of the fixing plate, the limiting insertion rod, the limiting insertion buckle and the telescopic spring, when the control chip is installed, the fixing plate is fixed outside the installation plate through the limiting insertion buckle, so that convenient installation and disassembly operation can be realized, and meanwhile, through the elastic telescopic design between the limiting insertion rod and the telescopic spring, the control chip can be conveniently installed and disassembled. According to the computer fixing plate, a certain degree of elastic protection function can be provided for the fixing plate, and when a computer is collided by external force, impact force can be effectively absorbed and relieved, and the fixing plate is protected against damage.

Description

Technical Field

[0001] The utility model belongs to the technical field of computers, and in particular relates to a built-in functional daughter board of a computer. Background Art

[0002] Computer built-in function daughter boards usually refer to some functional modules integrated on the motherboard to provide specific functions or expand the functions of the computer. They are boards used to expand the functions of the computer or provide specific functions.

[0003] Existing computer built-in function daughter boards often have poor heat dissipation effects and are unable to effectively dissipate heat from the chip, causing the chip to overheat when running for a long time, affecting the performance and stability of the computer. In addition, since the computer built-in function daughter boards are usually fixed on the motherboard, they cannot be effectively protected after installation, which makes the chips and components on the computer built-in function daughter boards vulnerable to external forces, such as breakage, collision, etc. Utility Model Content

[0004] The utility model aims to provide a computer built-in functional daughter board to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A computer built-in functional daughter board, comprising:

[0007] Mounting plate;

[0008] A data slot, the data slot being mounted on the top of the mounting plate;

[0009] A base plate, the base plate being arranged outside the mounting plate;

[0010] The heat dissipation mechanism is arranged at the top of the mounting plate, and the heat dissipation mechanism includes a radiator, a heat dissipation groove and a heat-conducting copper tube. The radiator is fixedly connected to the top of the mounting plate, a heat dissipation groove is arranged on the outside of the radiator, a heat-conducting copper tube is fixedly connected to the top of the radiator, and a heat-conducting plate is fixedly connected to the outside of one side of the heat-conducting copper tube.

[0011] Preferably, one side of the heat-conducting copper tube is externally fixedly connected to the top of the base plate, and two heat dissipation grooves are arranged outside the radiator.

[0012] Preferably, a mounting mechanism is installed on the top of the mounting plate.

[0013] Preferably, the mounting mechanism includes a fixing plate, a limiting rod and a limiting buckle, the fixing plate is arranged on the outside of the mounting plate, the limiting rod is inserted into the inside of the fixing plate, the bottom end of the limiting rod is fixedly connected to the limiting buckle, the outside of the limiting rod is sleeved with a telescopic spring, and the top end of the fixing plate is fixedly connected to the control chip.

[0014] Preferably, the limit buckle is inserted into the interior of the mounting plate, the fixing plate is elastically telescopically connected to the telescopic spring, the control chip is fixedly connected to the top of the fixing plate, and the limit rod is slidably connected inside the fixing plate.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] (1) The utility model provides a fixing plate, a limiting plug rod, a limiting buckle and a telescopic spring, so that when the control chip is being installed, the fixing plate can be fixed to the outside of the installation plate by using the limiting buckle, so that convenient installation and disassembly operations can be achieved. At the same time, the elastic telescopic design between the limiting plug rod and the telescopic spring can provide a certain degree of elastic protection function for the fixing plate. When the computer is hit by external force, the impact force can be effectively absorbed and reduced, thereby protecting the fixing plate from damage.

[0017] (2) The utility model provides a heat sink, a heat sink, a heat-conducting copper tube and a heat-conducting plate, so that when the heat dissipation operation of the control chip and the substrate is performed, first, the heat of the control chip and the substrate can be transferred to the outside of the heat sink by providing the heat-conducting copper tube. The design of the heat-conducting copper tube can effectively transfer the heat from the inside to the outside, thereby achieving the heat dissipation effect. Then, the rotation of the heat sink can help the heat-conducting copper tube to perform the cooling operation. The rotation of the heat sink can increase the air circulation and accelerate the heat dissipation, thereby effectively reducing the temperature of the control chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0019] Figure 2 For this utility model Figure 1 The overall structural diagram of the heat dissipation mechanism;

[0020] Figure 3 For this utility model Figure 1 Schematic diagram of the overall structure of the installation mechanism.

[0021] In the figure: 1. mounting plate; 2. data slot; 3. base plate; 4. heat dissipation mechanism; 401. radiator; 402. heat dissipation slot; 403. heat-conducting copper tube; 404. heat-conducting plate; 5. mounting mechanism; 501. fixing plate; 502. limit rod; 503. limit buckle; 504. telescopic spring; 505. control chip. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Embodiment 1:

[0024] See also Figure 1-Figure 3 As shown, a computer built-in function daughter board includes:

[0025] Mounting plate 1;

[0026] Data slot 2, data slot 2 is installed on the top of the mounting plate 1;

[0027] A substrate 3, wherein the substrate 3 is arranged outside the mounting plate 1;

[0028] The heat dissipation mechanism 4 is arranged at the top of the mounting plate 1. The heat dissipation mechanism 4 includes a radiator 401, a heat dissipation groove 402 and a thermally conductive copper tube 403. The radiator 401 is fixedly connected to the top of the mounting plate 1. The heat dissipation groove 402 is arranged on the outside of the radiator 401. The top of the radiator 401 is fixedly connected to the thermally conductive copper tube 403. A heat conducting plate 404 is fixedly connected to the outside of the thermally conductive copper tube 403. One side of the thermally conductive copper tube 403 is fixedly connected to the top of the substrate 3. Two heat dissipation grooves 402 are arranged on the outside of the radiator 401.

[0029] Specifically, the heat conducting copper tube 403 can be cooled by the operation of the radiator 401 , so that the mounting mechanism 5 and the substrate 3 can be cooled quickly.

[0030] As can be seen from the above, when the control chip 505 is being installed, the fixing plate 501 can be installed outside the mounting plate 1 by means of the insertion and engagement of the limiting plug 503 inside the mounting plate 1. At this time, the fixing plate 501 can be elastically protected by means of the elastic expansion and contraction between the limiting plug rod 502 and the expansion spring 504, so that when the computer is hit by an external force, part of the impact force can be offset.

[0031] Embodiment 2:

[0032] refer to Figure 1 and Figure 3 As shown, a mounting mechanism 5 is installed at the top of the mounting plate 1, and the mounting mechanism 5 includes a fixed plate 501, a limit plug rod 502 and a limit buckle 503. The fixed plate 501 is arranged on the outside of the mounting plate 1, and a limit plug rod 502 is inserted inside the fixed plate 501. The bottom end of the limit plug rod 502 is fixedly connected to the limit buckle 503, and the outer sleeve of the limit plug rod 502 is provided with a telescopic spring 504. The top of the fixed plate 501 is fixedly connected to the control chip 505, and the limit buckle 503 is inserted inside the mounting plate 1. The fixed plate 501 is elastically telescopically connected to the telescopic spring 504, the control chip 505 is fixedly connected to the top of the fixed plate 501, and the limit plug rod 502 is slidably connected inside the fixed plate 501.

[0033] Specifically, the fixing plate 501 can be elastically extended and retracted through the elastic extension and retraction between the extension spring 504 and the limiting plug rod 502 , thereby performing a protective operation on the control chip 505 installed on the fixing plate 501 .

[0034] As can be seen from the above, when the heat dissipation operation of the control chip 505 and the substrate 3 is being performed, firstly, through the setting of the heat-conducting copper tube 403, the temperature of the control chip 505 and the substrate 3 can be transferred to the outside of the radiator 401, and then through the rotation of the radiator 401, the heat-conducting copper tube 403 can be cooled, thereby reducing the temperature of the control chip 505, and through the setting of the heat dissipation groove 402, the board can be cooled, thereby increasing the heat dissipation effect of the functional sub-board.

[0035] The standard parts used in this utility model can be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0036] In the description of the present utility model, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. The meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0037] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0039] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine the different embodiments or examples and the features of the different embodiments or examples described in this specification without contradiction.

[0040] In the drawings of the embodiments disclosed by the present invention, only the structures related to the embodiments disclosed by the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0041] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A computer built-in functional daughter board, characterized in that: include: Mounting plate (1); A data slot (2), wherein the data slot (2) is mounted on the top of the mounting plate (1); A base plate (3), wherein the base plate (3) is arranged outside the mounting plate (1); A heat dissipation mechanism (4), the heat dissipation mechanism (4) being arranged at the top of the mounting plate (1), the heat dissipation mechanism (4) comprising a heat sink (401), a heat dissipation groove (402) and a heat-conducting copper tube (403), the heat sink (401) being fixedly connected to the top of the mounting plate (1), the heat dissipation groove (402) being arranged outside the heat sink (401), the top of the heat sink (401) being fixedly connected to the heat-conducting copper tube (403), and one side of the heat-conducting copper tube (403) being fixedly connected to the outside to a heat-conducting plate (404).

2. A computer built-in functional daughterboard according to claim 1, characterized in that: One side of the heat-conducting copper tube (403) is externally fixedly connected to the top of the base plate (3), and two heat dissipation grooves (402) are arranged outside the radiator (401).

3. A computer built-in functional daughterboard according to claim 1, characterized in that: A mounting mechanism (5) is mounted on the top of the mounting plate (1).

4. A computer built-in functional daughterboard according to claim 3, characterized in that: The mounting mechanism (5) comprises a fixing plate (501), a limiting plug rod (502) and a limiting buckle (503); the fixing plate (501) is arranged outside the mounting plate (1); a limiting plug rod (502) is inserted inside the fixing plate (501); the bottom end of the limiting plug rod (502) is fixedly connected to the limiting buckle (503); a telescopic spring (504) is sleeved outside the limiting plug rod (502); and the top end of the fixing plate (501) is fixedly connected to a control chip (505).

5. A computer built-in functional daughterboard according to claim 4, characterized in that: The limit buckle (503) is inserted into the interior of the mounting plate (1), the fixed plate (501) is elastically and telescopically connected to the telescopic spring (504), the control chip (505) is fixedly connected to the top of the fixed plate (501), and the limit plug rod (502) is slidably connected inside the fixed plate (501).

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