Fingerprint identification assembly and electronic equipment

Abstract

The utility model discloses a fingerprint identification assembly and electronic equipment, and belongs to the technical field of electronics. The fingerprint identification assembly is suitable for being installed below a screen and comprises a first chip, a second chip, a conductive part and a flexible circuit board. The first chip and the second chip are both located below a fingerprint identification area of the screen. Two sides of the conductive part are respectively bonded with the upper surface of the flexible circuit board, the lower surface of the first chip and / or the lower surface of the second chip, and the conductive part is used for realizing electrical connection between the first chip and / or the second chip and the flexible circuit board. By adopting the fingerprint identification assembly provided by the embodiment of the invention, the damage rate of the screen can be reduced.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to fingerprint recognition components and electronic devices. Background Art

[0002] With the rapid development of science and technology, mobile phones and other electronic devices are widely used in people's daily lives. When using mobile phones, users usually unlock them, such as by digital password unlocking, facial recognition unlocking, pattern unlocking or fingerprint recognition unlocking. Among them, fingerprint recognition unlocking has become one of the most frequently used unlocking methods because of its advantages such as convenience, high security and ability to protect user privacy. Among them, ultra-thin under-screen optical fingerprint recognition technology is very popular because it can reserve a large space inside the mobile phone to accommodate a larger capacity battery.

[0003] In the related art, the two chips in the ultra-thin under-screen optical fingerprint recognition component are electrically connected by wire bonding. However, since the top of the metal wire is higher than the upper surface of the chip, when the phone falls or the screen is pressed hard, the screen is easily hit by the metal wire, resulting in broken bright spots or damage. Utility Model Content

[0004] In view of this, an embodiment of the present application provides a fingerprint recognition component that can reduce the damage rate of the screen.

[0005] On the one hand, an embodiment of the present application provides a fingerprint recognition component, which is suitable for being installed under a screen, and includes a first chip, a second chip, a conductive member, and a flexible circuit board;

[0006] The first chip and the second chip are both located below the fingerprint recognition area of ​​the screen;

[0007] The two sides of the conductive member are respectively bonded to the upper surface of the flexible circuit board and the lower surface of the first chip and / or the lower surface of the second chip, wherein the conductive member is used to achieve electrical connection between the first chip and / or the second chip and the flexible circuit board.

[0008] Optionally, the first chip and the second chip are electrically connected;

[0009] The first chip is used to collect fingerprint image data, and the second chip is used to process the fingerprint image data.

[0010] Optionally, at least one first pad is provided on the lower surface of the first chip;

[0011] At least one second solder pad is disposed on the upper surface of the flexible circuit board, and the first solder pad corresponds to the second solder pad one by one;

[0012] The conductive member includes a first sub-conductive member, an upper surface of the first sub-conductive member is bonded to the first pad, and a lower surface of the first sub-conductive member is bonded to the second pad.

[0013] Optionally, at least one third pad is provided on the lower surface of the second chip;

[0014] At least one fourth pad is disposed on the upper surface of the flexible circuit board, and the third pad corresponds to the fourth pad one by one;

[0015] The conductive member further includes a second sub-conductive member, an upper surface of the second sub-conductive member is bonded to the third pad, and a lower surface of the second sub-conductive member is bonded to the fourth pad.

[0016] Optionally, the first sub-conductive member and the second sub-conductive member are anisotropic conductive adhesive films.

[0017] Optionally, a plurality of the first pads are arranged side by side at a first preset interval.

[0018] Optionally, a plurality of the third pads are arranged side by side at a second preset interval.

[0019] Optionally, at least one circuit is arranged on the flexible circuit board, and the circuit is used to conduct the first chip and the second chip.

[0020] Optionally, the fingerprint recognition component further includes a support member, an upper surface of the support member is connected to a lower surface of the flexible circuit board, and at least a portion of the support member is located below the first chip and the second chip.

[0021] On the other hand, an embodiment of the present application further provides an electronic device, the electronic device comprising a cover plate, a screen, a support assembly, a middle frame, and a fingerprint recognition assembly as described in any one of the above embodiments of the present application, wherein the fingerprint recognition assembly is suitable for being installed below the screen;

[0022] The lower surface of the glass cover plate is connected to the upper surface of the screen, and the screen includes a fingerprint recognition area;

[0023] The upper surface of the support assembly is connected to the lower surface of the screen, and the support assembly has a light-transmitting hole, and the light-transmitting hole is located below the fingerprint recognition area;

[0024] The middle frame includes a bottom wall, an upper surface of the bottom wall is provided with a mounting groove, the mounting groove is located below the fingerprint recognition area, and the first chip and the second chip are both located in the mounting groove.

[0025] Optionally, there is a first preset distance between the upper surface of the first chip and the upper surface of the second chip and the lower surface of the screen respectively.

[0026] Optionally, the first preset distance is not less than 0.2 mm and not more than 0.3 mm.

[0027] The fingerprint recognition component provided in the embodiment of the present application is suitable for installation under the screen, and the fingerprint recognition component includes a first chip, a second chip, a conductive member and a flexible circuit board. The first chip and the second chip are both located below the fingerprint recognition area of ​​the screen, so that when the user's finger presses the fingerprint recognition area of ​​the screen, the first chip and the second chip cooperate with each other to perform fingerprint recognition. The two sides of the conductor are respectively bonded to the upper surface of the flexible circuit board and the lower surface of the first chip and / or the lower surface of the second chip. Since the present application realizes electrical connection between the first chip and / or the second chip and the flexible circuit board through a conductive member, when the electronic device falls or the screen is subjected to a large pressure and other external factors cause the screen to deform, it can reduce the situation in the related art where the screen collides with the metal wire and causes broken bright spots and other undesirable phenomena. In other words, the method of using a conductive member to conduct any chip and the flexible circuit board can reduce the damage rate of the screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is an exploded diagram between a fingerprint recognition component and a part of the structure in the electronic device provided in an embodiment of the present application;

[0030] Figure 2 is a cross-sectional schematic diagram of a fingerprint recognition component provided in an embodiment of the present application;

[0031] Figure 3 is a cross-sectional schematic diagram of the location of a first chip in a fingerprint recognition component provided in an embodiment of the present application;

[0032] Figure 4 is a cross-sectional schematic diagram of the location of a second chip in a fingerprint recognition component provided in an embodiment of the present application;

[0033] Figure 5 It is a cross-sectional schematic diagram of a fingerprint recognition component provided in an embodiment of the present application after being assembled in an electronic device.

[0034] The various symbols in the accompanying drawings are:

[0035] A1, fingerprint recognition component;

[0036] 100, screen; 110, cover plate; 120, support assembly; 130, middle frame; 121, light transmission hole; 131, bottom wall; 132, mounting groove;

[0037] 210, first chip; 220, second chip; 211, first pad; 221, third pad;

[0038] 300, conductive element; 310, first sub-conductive element; 320, second sub-conductive element;

[0039] 400, flexible circuit board; 410, second pad; 420, fourth pad;

[0040] 500. Support parts.

[0041] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0043] Unless otherwise defined, all technical terms used in the embodiments of the present application have the same meanings as commonly understood by those skilled in the art.

[0044] In order to make the technical solutions and advantages of the present application more clear, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0045] like Figure 1 As shown, the embodiment of the present application provides a fingerprint recognition component, which is suitable for being installed under the screen 100, and includes a first chip 210, a second chip 220, a conductive member 300 and a flexible circuit board 400. The first chip 210 and the second chip 220 are both located under the fingerprint recognition area of ​​the screen 100, so that when the user's finger presses the fingerprint recognition area of ​​the screen 100, the first chip 210 and the second chip 220 cooperate with each other to perform fingerprint recognition.

[0046] The two sides of the conductive member 300 are respectively bonded to the upper surface of the flexible circuit board 400 and the lower surface of the first chip 210 and / or the lower surface of the second chip 220, wherein the conductive member 300 is used to electrically connect the first chip 210 and / or the second chip 220 to the flexible circuit board 400. It should be noted that, Figure 1 The portion indicated by A1 is a schematic diagram of the structure of the fingerprint recognition component provided in the embodiment of the present application. The screen 100 in the embodiment of the present application may be an OLED (Organic Light-Emitting Diode, organic laser display) screen, and the fingerprint recognition component adopts the principle of ultra-thin under-screen optical fingerprint recognition technology to implement the fingerprint recognition process. The top and bottom of the electronic device generally include two electrically connected printed circuit boards, respectively. The flexible circuit board 400 is generally electrically connected to the printed circuit board at the bottom of the electronic device. The fingerprint recognition result of the fingerprint recognition component can be transmitted to the processor on the printed circuit board at the top of the electronic device through the flexible circuit board 400 and the printed circuit board at the bottom of the electronic device. The processor responds to the fingerprint recognition result as an unlockable result, and then the electronic device can be unlocked. It can be understood that, in combination Figure 5 As shown, when the user's finger presses within the fingerprint recognition area in the embodiment of the present application, the electronic device can achieve fingerprint recognition unlocking.

[0047] It should be noted that, since the embodiment of the present application realizes electrical connection between the first chip 210 and / or the second chip 220 and the flexible circuit board 400 through the conductive member 300, when the electronic device falls or the screen 100 is subjected to a large pressure and other external factors cause the screen 100 to deform, it can reduce the undesirable phenomenon such as the screen colliding with the metal wire and causing broken bright spots in the related art. In other words, the use of the conductive member 300 to conduct the first chip 210 and the flexible circuit board 400, and / or the second chip 220 and the head-shaped circuit board 400 can reduce the damage rate of the screen, extend the service life of the screen 100, and improve the user experience. In addition, the use of the conductive member 300 to achieve the connection between the chip and the flexible circuit board 400 can also reduce the manufacturing cost of the fingerprint recognition component.

[0048] The following is combined with Figures 1 to 5 The structure and function of each component of the fingerprint recognition component provided in the embodiment of the present application are described in more detail.

[0049] like Figure 2As shown, in some embodiments, the first chip 210 and the second chip 220 are electrically connected. The first chip 210 is used to collect fingerprint image data, and the second chip 220 is used to process fingerprint image data. Since the first chip 210 and the second chip 220 are electrically connected, the first chip 210 can send the collected fingerprint image data to the second chip 220. Generally, the second chip 220 generates an unlock signal by comparing the fingerprint image data sent by the first chip 210 with the target fingerprint image information, and sends the unlock signal to the processor on the printed circuit board at the top of the electronic device through the flexible circuit board 400 and the printed circuit board at the bottom of the electronic device. In response to receiving the unlock signal, the processor can unlock the terminal.

[0050] like Figure 3 As shown, in some embodiments, at least one first pad 211 is provided on the lower surface of the first chip 210. At least one second pad 410 is provided on the upper surface of the flexible circuit board 400, and the first pad 211 corresponds to the second pad 410 one by one. The conductive member 300 includes a first sub-conductive member 310, the upper surface of the first sub-conductive member 310 is bonded to the first pad 211, and the lower surface of the first sub-conductive member 310 is bonded to the second pad 410. In other words, the first pad 211 and the second pad 410 can be connected through the first sub-conductive member 310, that is, the first chip 210 and the flexible circuit board 400 are connected, so that the first chip 210 and the flexible circuit board 400 are electrically connected. Since the first chip 210 does not need to be connected to the flexible circuit board 400 by a metal wire, the undesirable phenomenon of the collision between the metal wire and the screen 100 and the generation of broken bright spots can be reduced, thereby reducing the damage rate of the screen 100 and extending the service life of the screen 100.

[0051] like Figure 4 As shown, in some embodiments, at least one third pad 221 is provided on the lower surface of the second chip 220. At least one fourth pad 420 is provided on the upper surface of the flexible circuit board 400, and the third pad 221 corresponds to the fourth pad 420 one by one. The conductive member 300 also includes a second sub-conductive member 320, the upper surface of the second sub-conductive member 320 is bonded to the third pad 221, and the lower surface of the second sub-conductive member 320 is bonded to the fourth pad 420. In other words, the third pad 221 and the fourth pad 420 can be connected through the second sub-conductive member 320, that is, the second chip 220 and the flexible circuit board 400 are connected, so that the second chip 220 and the flexible circuit board 400 are electrically connected. Since the first chip 210 does not need to be connected to the flexible circuit board 400 by a metal wire, the undesirable phenomenon of the collision between the metal wire and the screen 100 and the generation of broken bright spots can be reduced, thereby reducing the damage rate of the screen 100 and extending the service life of the screen 100.

[0052] In some embodiments, the first sub-conductive member 310 and the second sub-conductive member 320 are anisotropic conductive films. It should be noted that the conductive principle of the anisotropic conductive film is to use conductive particles to connect the corresponding pads between the chip and the circuit board to make them conductive, while avoiding short circuits between two adjacent pads, thereby achieving the effect of conducting only in the direction perpendicular to the chip. It is understandable that since the anisotropic conductive film is generally very thin, the first sub-conductive member 310 and the second sub-conductive member 320 only occupy a small part of the stacking space. In this way, it can be ensured that the distance between the upper surface of the first chip 210 and the screen 100 and the distance between the upper surface of the second chip 220 and the screen 100 are between 0.2mm and 0.3mm, so that the first chip 210 and the second chip 220 can meet the requirements of fingerprint recognition accuracy and efficiency.

[0053] like Figure 3 As shown, in some embodiments, a plurality of first pads 211 are arranged side by side at a first preset interval. It is understandable that the second pads 410 corresponding to the first pads 211 are also arranged side by side at the first preset interval. It should be noted that arranging the first pads 211 and the second pads 410 at the first preset interval can not only align the first pads 211 and the second pads 410 in a direction perpendicular to the screen 100 to ensure the conduction effect, but also reduce the manufacturing cost.

[0054] like Figure 4 As shown, in some embodiments, a plurality of third pads 221 are arranged side by side at a second preset interval. It is understandable that the fourth pads 420 corresponding to the third pads 221 are also arranged side by side at the second preset interval. It should be noted that arranging the third pads 221 and the fourth pads 420 at the second preset interval can not only align the third pads 221 and the fourth pads 420 in a direction perpendicular to the screen 100 to ensure the conduction effect, but also reduce the manufacturing cost.

[0055] In some embodiments, at least one circuit (not shown in the figure) is arranged on the flexible circuit board 400, and the circuit is used to conduct the first chip 210 and the second chip 220, so that signal transmission can be achieved between the first chip 210 and the second chip 220. For example, the second pad 410 and the fourth pad 420 can be connected through the circuit, thereby achieving electrical connection between the first chip 210 and the second chip 220.

[0056] like Figures 3 to 5As shown, in some embodiments, the fingerprint recognition component further includes a support member 500, the upper surface of the support member 500 is connected to the lower surface of the flexible circuit board 400, and at least a portion of the support member 500 is located below the first chip 210 and the second chip 220. It should be noted that the upper surface of the support member 500 and the lower surface of the flexible circuit board 400 can be connected by bonding, or can be abutted together, or can be fixed together by a fixing member. The support member 500 can be a steel plate, which can not only increase the strength of the flexible circuit board 400 and prevent the flexible circuit board 400 from deformation, but also play a certain supporting role for the first chip 210 and the second chip 220.

[0057] Combination Figures 1 to 5 As shown, on the other hand, the embodiment of the present application further provides an electronic device, the electronic device includes a cover plate 110, a screen 100, a support assembly 120, a middle frame 130 and a fingerprint recognition assembly as described in any one of the embodiments of the present application, and the fingerprint recognition assembly is suitable for being installed below the screen 100. It should be noted that the cover plate 110 can be a glass cover plate.

[0058] The lower surface of the cover plate 110 is connected to the upper surface of the screen 100, and the screen 100 includes a fingerprint recognition area. It should be noted that the electronic device in the embodiment of the present application can be a mobile phone, a computer, a tablet, a smart wearable product, an e-book, a vehicle and other electronic devices. The screen 100 can be an OLED (Organic Light-Emitting Diode, organic laser display) screen 100, and the fingerprint recognition component adopts the principle of ultra-thin under-screen optical fingerprint recognition technology to realize the fingerprint recognition process. The top and bottom of the electronic device generally include two electrically connected printed circuit boards respectively. The flexible circuit board 400 is generally electrically connected to the printed circuit board at the bottom of the electronic device. The fingerprint recognition result of the fingerprint recognition component can be transmitted to the processor on the printed circuit board at the top of the electronic device through the flexible circuit board 400 and the printed circuit board at the bottom of the electronic device. The processor responds to the fingerprint recognition result as an unlockable result, and the electronic device can be unlocked. Generally, the support component 120 can include stacked foam, metal plates and other components, wherein the foam can play a buffering role, and the metal plate can play a supporting and shielding function.

[0059] The upper surface of the support component 120 is connected to the lower surface of the screen 100, and the support component 120 has a light-transmitting hole 121, which is located below the fingerprint recognition area. It should be noted that by providing the light-transmitting hole 121, the light path used to realize the optical fingerprint recognition under the ultra-thin screen can pass through the light-transmitting hole 121 and propagate between the screen 100 and the fingerprint recognition component, thereby realizing the collection of fingerprint image data.

[0060] The middle frame 130 includes a bottom wall 131, and a mounting groove 132 is provided on the upper surface of the bottom wall 131. The mounting groove 132 is located below the fingerprint recognition area, and the first chip 210 and the second chip 220 are both located in the mounting groove 132. It can be understood that the mounting groove 132 is recessed in a direction away from the screen 100. By installing the first chip 210 and the second chip 220 in the mounting groove 132, the distance between the first chip 210 and the second chip 220 and the screen 100 can be increased to avoid occupying too much stacking space.

[0061] It is understandable that since the fingerprint recognition component can reduce the occurrence of bright spots on the screen 100, thereby reducing the damage rate of the screen 100 and extending the service life of the screen 100, it can reduce the probability and cost of users repairing electronic devices and improve the user experience.

[0062] In some embodiments, the upper surface of the first chip 210 and the upper surface of the second chip 220 are respectively at a first preset distance from the lower surface of the screen 100. In some embodiments, the first preset distance is not less than 0.2 mm and not more than 0.3 mm. In other words, the distance between the upper surface of the first chip 210 and the screen 100 and the distance between the second chip 220 and the screen 100 are both between 0.2 mm and 0.3 mm, so that the first chip 210 and the second chip 220 can meet the requirements of fingerprint recognition accuracy and efficiency.

[0063] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0064] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the present application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only.

[0065] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A fingerprint recognition component, characterized in that: The fingerprint recognition component is suitable for being installed below the screen (100), and comprises a first chip (210), a second chip (220), a conductive member (300) and a flexible circuit board (400); The first chip (210) and the second chip (220) are both located below the fingerprint recognition area of ​​the screen (100); The two sides of the conductive member (300) are respectively bonded to the upper surface of the flexible circuit board (400) and the lower surface of the first chip (210) and / or the lower surface of the second chip (220), wherein the conductive member (300) is used to achieve electrical connection between the first chip (210) and / or the second chip (220) and the flexible circuit board (400).

2. The fingerprint recognition component according to claim 1, characterized in that: The first chip (210) and the second chip (220) are electrically connected; The first chip (210) is used to collect fingerprint image data, and the second chip (220) is used to process the fingerprint image data.

3. The fingerprint recognition component according to claim 1, characterized in that: The lower surface of the first chip (210) is provided with at least one first bonding pad (211); At least one second solder pad (410) is provided on the upper surface of the flexible circuit board (400), and the first solder pad (211) corresponds to the second solder pad (410) in a one-to-one manner; The conductive member (300) comprises a first sub-conductive member (310), the upper surface of the first sub-conductive member (310) is bonded to the first pad (211), and the lower surface of the first sub-conductive member (310) is bonded to the second pad (410).

4. The fingerprint recognition component according to claim 3, characterized in that: At least one third pad (221) is provided on the lower surface of the second chip (220); At least one fourth solder pad (420) is provided on the upper surface of the flexible circuit board (400), and the third solder pad (221) corresponds to the fourth solder pad (420) in a one-to-one manner; The conductive member (300) further comprises a second sub-conductive member (320), wherein the upper surface of the second sub-conductive member (320) is bonded to the third pad (221), and the lower surface of the second sub-conductive member (320) is bonded to the fourth pad (420).

5. The fingerprint recognition component according to claim 4, characterized in that: The first sub-conductive component (310) and the second sub-conductive component (320) are anisotropic conductive adhesive films.

6. The fingerprint recognition component according to claim 3, characterized in that: A plurality of the first pads (211) are arranged side by side at a first preset interval.

7. The fingerprint recognition component according to claim 4, characterized in that: The plurality of third pads (221) are arranged side by side at a second preset interval.

8. The fingerprint recognition component according to claim 1, characterized in that: At least one circuit is arranged on the flexible circuit board (400), and the circuit is used to conduct the first chip (210) and the second chip (220).

9. The fingerprint recognition component according to claim 1, characterized in that: The fingerprint recognition component further comprises a support member (500), the upper surface of the support member (500) being connected to the lower surface of the flexible circuit board (400), and at least a portion of the support member (500) being located below the first chip (210) and the second chip (220).

10. An electronic device, characterized in that: The electronic device comprises a cover plate (110), a screen (100), a support assembly (120), a middle frame (130), and a fingerprint recognition assembly according to any one of claims 1 to 9, wherein the fingerprint recognition assembly is suitable for being installed below the screen (100); The lower surface of the cover plate (110) is connected to the upper surface of the screen (100), and the screen (100) includes a fingerprint recognition area; The upper surface of the support component (120) is connected to the lower surface of the screen (100), and the support component (120) has a light-transmitting hole (121), and the light-transmitting hole (121) is located below the fingerprint recognition area; The middle frame (130) comprises a bottom wall (131), the upper surface of the bottom wall (131) is provided with a mounting groove (132), the mounting groove (132) is located below the fingerprint recognition area, and the first chip (210) and the second chip (220) are both located in the mounting groove (132).

11. The electronic device according to claim 10, characterized in that: There is a first preset distance between the upper surface of the first chip (210) and the upper surface of the second chip (220) and the lower surface of the screen (100).

12. The electronic device according to claim 11, characterized in that: The first preset distance is not less than 0.2 mm and not more than 0.3 mm.

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