Anti-overheating memory card and camera

Abstract

An upper metal shell is provided with a first accommodating groove, and the top wall of the first accommodating groove is recessed to form a first fixed mounting groove; the lower metal shell is provided with a second accommodating groove, and the top wall of the second accommodating groove is recessed to form a second fixed mounting groove; heat conduction pads are arranged in the first fixed mounting groove and the second fixed mounting groove; when the lower metal shell and the upper metal shell are connected in a sealed mode, the printed circuit board assembly is located in a sealed space formed by the lower metal shell and the upper metal shell and makes contact with the heat conduction pads, and therefore heat generated by the printed circuit board assembly is transmitted to the metal shell and the upper metal shell through the heat conduction pads at the top and the bottom. Heat conducted by the heat conduction pad is quickly and effectively dissipated to air or an external metal structure of the memory card, so that the local temperature of the chip is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of camera memory cards, and in particular to an overheat-proof memory card and a camera. Background Art

[0002] CFExpress Type B memory card is a Class B memory card launched by the CFA Association. Class B memory cards are mainly used in high-end cameras and camcorders, mainly as storage units of cameras to store pictures and videos. As the resolution and continuous shooting of camera products continue to increase, the bandwidth requirements for storage units are getting higher and higher. The performance of corresponding memory cards is also constantly improving, and the improvement in performance brings about an increase in power consumption. Under the same size and volume, the power consumption increases, and the stability and reliability requirements of the memory card are relatively high. If the temperature is too high, the memory card may fly away or enter temperature control, and the performance will drop significantly instantly.

[0003] CFExpress Type B memory card is a PCIe interface with 2-channel high-speed transmission channels. In order to meet the ever-increasing requirements for storage bandwidth, CFExpress Type B memory cards are also constantly being upgraded. The latest CFA4.0 standard mentions that CFExpress Type B supports PCIe4.0 x2, with a maximum transmission speed of 4GB / S. High bandwidth and high performance also bring about an increase in the power consumption of memory cards. The power consumption of CFExpress Type B memory cards under the CFA4.0 standard can reach 6.5W. The size of the CFExpress Type B memory card is only 29.6mm x38.5mm x 3.8mm. This is equivalent to a small memory card that is only slightly larger than a thumb, with a power consumption of 6.5W. When the temperature of the chip inside the memory card rises sharply, if the power consumption remains unchanged, the temperature of the memory card will reach several hundred degrees, directly crashing and burning the memory card.

[0004] In addition, the current memory card products are composed of PCBA with electronic components, and the shell is mainly composed of a plastic middle frame and upper and lower stainless steel sheets, which has a poor heat dissipation effect. When the memory card starts working, the heat of the chip inside the memory card cannot be dissipated in time. The temperature of the chip will rise relatively high, and the thermal conductivity of plastic and stainless steel sheets is relatively poor. The temperature of the chip inside the memory card and the temperature of the external environment will be quite different, resulting in a relatively high chip temperature that exceeds the rated working environment. Therefore, in actual applications, many users will encounter the situation that when using high-performance memory cards for high-speed continuous shooting or recording, the camera will often prompt that the memory card is overheated, or the memory card is stuck or crashed. Utility Model Content

[0005] The embodiments of the present application provide a memory card and a camera that prevent overheating, so as to solve the problem in the related art that the housing is mainly composed of a plastic middle frame and upper and lower stainless steel sheets, and the heat dissipation effect is relatively poor, resulting in the camera frequently prompting that the memory card is overheated, or the memory card is stuck or crashes when performing high-speed continuous shooting or video recording.

[0006] In a first aspect, there is provided a memory card for preventing overheating, comprising:

[0007] The upper metal shell has a first receiving groove, and the top wall of the first receiving groove is recessed to form a first fixed installation groove;

[0008] The lower metal shell has a second receiving groove, and the top wall of the second receiving groove is recessed to form a second fixed installation groove; the lower metal shell is sealed and connected to the upper metal shell, and the first receiving groove and the second receiving groove form a sealed space; thermal pads are provided in the first fixed installation groove and the second fixed installation groove;

[0009] The printed circuit board assembly is located in the sealed space, and the top and bottom of the printed circuit board assembly are in close contact with the thermal pad.

[0010] In some embodiments, the size of the thermal pad is equal to the size of the first fixed installation groove and the second fixed installation groove.

[0011] In some embodiments, the printed circuit board assembly includes a circuit board, on which a controller and a memory are disposed;

[0012] The thermal pad is projected onto the printed circuit board assembly to cover the controller and the memory.

[0013] In some embodiments, the number of the controllers is , and the number of the memories is four;

[0014] The controller is located on the top surface of the circuit board and is correspondingly connected to two memories located on the top surface and two memories located on the bottom surface of the circuit board.

[0015] In some embodiments, the upper metal shell and the lower metal shell are both made of aluminum alloy.

[0016] In some embodiments, the outer ring of the upper metal shell is provided with an opening on both sides of the width direction thereof, and the opening extends along the length direction of the upper metal shell; the outer ring of the upper metal shell is provided with an interface groove;

[0017] A bump is provided at the designed position of the end face where the outer ring of the lower metal shell contacts the upper metal shell; the designed position is the projection area of ​​the interface groove on the end face; the vertical distance between the top of the bump and the bottom face of the lower metal shell is 0.85-0.95mm.

[0018] In some embodiments, the vertical distance between the top of the bump and the bottom surface of the lower metal housing is 0.9 mm.

[0019] In some embodiments, a first side needle retaining groove vertically penetrating the outer ring of the upper metal shell is provided on the bottom wall surface of the opening;

[0020] The outer ring of the lower metal shell is provided with a second side needle stopper groove located directly below the first side needle stopper groove, and the vertical depth of the second side needle stopper groove is less than the thickness of the outer ring of the lower metal shell.

[0021] In some embodiments, of the two side walls of the first side pin blocking slot and the second side pin blocking slot in the length direction of the memory card, the side wall near the insertion end of the memory card is an angled surface;

[0022] The included angles between the beveled surface and the vertical surfaces of the first side needle retaining slot and the second side needle retaining slot are obtuse angles.

[0023] In a second aspect, a camera is provided, comprising: a memory card that is protected against overheating.

[0024] The beneficial effects of the technical solution provided by this application include:

[0025] The embodiment of the present application provides a memory card and a camera that prevent overheating. The upper metal shell has a first accommodating groove, and the top wall of the first accommodating groove is recessed to form a first fixed installation groove; the lower metal shell has a second accommodating groove, and the top wall of the second accommodating groove is recessed to form a second fixed installation groove; thermal pads are provided in the first fixed installation groove and the second fixed installation groove; when the lower metal shell is sealed and connected to the upper metal shell, the printed circuit board assembly is located in the sealed space formed by the two and contacts the thermal pad, so that the heat generated by the printed circuit board assembly is transferred to the metal shell and the upper metal shell through the top and bottom thermal pads, and at the same time, the good thermal conductivity of metal is utilized to quickly and effectively dissipate the heat conducted by the thermal pad to the air or the external metal structure of the memory card, thereby reducing the local temperature of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A schematic diagram of an explosion-proof memory card for preventing overheating provided in an embodiment of the present application;

[0028] Figure 2A schematic diagram of thermal simulation of a memory card with an existing structure;

[0029] Figure 3 A schematic diagram of thermal simulation of a memory card for preventing overheating provided by an embodiment of the present application;

[0030] Figure 4 A schematic diagram of the PCBA hardware solution provided in the embodiment of the present application;

[0031] Figure 5 An overheat-proof memory card provided in an embodiment of the present application;

[0032] Figure 6 A schematic diagram of the structure of the opening, the first side needle retaining slot and the second side needle retaining slot provided in an embodiment of the present application;

[0033] Figure 7 A schematic diagram of the overall structure of a memory card that prevents overheating provided by an embodiment of the present application;

[0034] Figure 8 A schematic diagram of distinguishing an upper metal shell and a lower metal shell in the overall structure of an overheat-proof memory card provided in an embodiment of the present application.

[0035] In the figure: 1. upper metal shell; 2. first accommodating groove; 3. vertical surface; 4. lower metal shell; 5. second accommodating groove; 6. second fixed installation groove; 7. thermal pad; 8. printed circuit board assembly; 800, circuit board; 801, controller; 802, memory; 9. opening; 10. first side pin blocking groove; 11. second side pin blocking groove; 12. bevel surface; 13. interface groove; 14. bump. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0037] It should be understood that the specific memory card targeted by this application is CFExpress Type B.

[0038] The current status of CFExpress Type B memory card is: CFExpress Type B memory card is a PCIe interface with 2-channel high-speed transmission channel. In order to meet the ever-increasing requirements for storage bandwidth, CFExpress Type B memory cards are also constantly upgrading. The latest CFA4.0 standard mentions that CFExpress Type B supports PCIe4.0 x2, with a maximum transmission speed of 4GB / S. High bandwidth and high performance also bring about an increase in the power consumption of memory cards. The power consumption of CFExpressType B memory cards under the CFA4.0 standard can reach 6.5W. The size of the CFExpress Type B memory card is only 29.6mm x 38.5mmx 3.8mm. This is equivalent to a small memory card that is only slightly larger than a thumb, with a power consumption of 6.5W. When the temperature of the chip inside the memory card rises sharply, if the power consumption remains unchanged, the temperature of the memory card will reach several hundred degrees, directly crashing and burning the memory card.

[0039] The embodiments of the present application provide a memory card and a camera that prevent overheating, so as to solve the problem in the related art that the outer shell is mainly composed of a plastic middle frame and upper and lower stainless steel sheets, and the heat dissipation effect is relatively poor, resulting in the camera frequently prompting that the memory card is overheated, or the memory card is stuck or crashes when performing high-speed continuous shooting or video recording.

[0040] See also Figure 1 , a memory card for preventing overheating, comprising:

[0041] The upper metal housing 1 has a first receiving groove 2, and the top wall of the first receiving groove 2 is recessed to form a first fixed installation groove;

[0042] The lower metal shell 4 has a second receiving groove 5, and the top wall of the second receiving groove 5 is recessed to form a second fixed installation groove 6; the lower metal shell 4 is sealed and connected to the upper metal shell 1, and the first receiving groove 2 and the second receiving groove 5 form a sealed space; the first fixed installation groove and the second fixed installation groove 6 are both provided with a thermal pad 7;

[0043] The printed circuit board assembly 8 is located in the sealed space, and the top and bottom thereof are in close contact with the thermal pad 7 .

[0044] Since the upper metal shell 1 has a first accommodating groove 2, the top wall of the first accommodating groove 2 is recessed to form a first fixed installation groove; the lower metal shell 4 has a second accommodating groove 5, the top wall of the second accommodating groove 5 is recessed to form a second fixed installation groove 6; thermal pads 7 are provided in the first fixed installation groove and the second fixed installation groove 6; when the lower metal shell 4 is sealed and connected to the upper metal shell 1, the printed circuit board assembly 8 is located in the sealed space formed by the two and contacts with the thermal pad 7, so that the heat generated by the printed circuit board assembly 8 is transferred to the metal shell 4 and the upper metal shell 1 through the top and bottom thermal pads 7, and at the same time, the good thermal conductivity of metal is utilized to quickly and effectively dissipate the heat conducted by the thermal pad 7 to the air or the external metal structure of the memory card, thereby reducing the local temperature of the chip.

[0045] You can refer to Figure 2 About existing memory card thermal simulation, and Figure 3 The thermal simulation of the memory card of this application can be compared; we take the power consumption of 3.5W under the maximum performance of the memory card as an example. Under the maximum performance, without speed reduction, the power consumption of 3.5W is kept unchanged. The heat dissipation effect of the memory card of the new invention method is significantly improved compared with the existing memory card. Through thermal simulation, it can be clearly found that the temperature of the internal chip of the existing memory card reaches 136.3 degrees, and the temperature of the internal chip of the memory card of the new invention method is 95.7 degrees. The temperature of the internal chip of the memory card of the new invention method is reduced by 40.6 degrees. The temperature is greatly reduced, so that the memory card can better exert its maximum performance. It does not cause the phenomenon of speed reduction or memory card running away due to excessive temperature.

[0046] In some preferred embodiments, in order to further improve the heat dissipation effect, the following settings are provided:

[0047] The size of the thermal pad 7 is equal to that of the first fixed mounting groove and the second fixed mounting groove 6; the first fixed mounting groove and the second fixed mounting groove 6 provide a fixing effect, which is convenient for assembly and ensures that the thermal pad 7 is in close contact with the controller 801 and the memory 802 after packaging.

[0048] The printed circuit board assembly 8 includes a circuit board 800, on which a controller 801 and a memory 802 are provided; the thermal pad 7 is projected onto the printed circuit board assembly 8 to cover the controller 801 and the memory 802; since the source of heat generated by the memory card is the controller 801 and the memory 802, the thermal pad 7 needs to be in contact with the controller 801 and the memory 802 to ensure maximum heat transfer.

[0049] Furthermore, the upper metal shell 1 and the lower metal shell 4 are both made of aluminum alloy, taking advantage of the characteristics of aluminum alloy that it is easy to process and has good heat dissipation effect.

[0050] Furthermore, to reduce heat generation at the source, the following settings are available:

[0051] The number of controllers 801 is one, and the number of memories 802 is four;

[0052] The controller 801 is located on the top surface of the circuit board 800 , and is correspondingly connected to the two memories 802 located on the top surface and the two memories 802 located on the bottom surface of the circuit board 800 .

[0053] Among them, printed circuit board assembly 8 is a PCBA with a low power consumption solution; PCBA: adopts Lianyun MAP1602 dramless low power consumption solution, with 4 BGA132 packaged nand flash memories on the outside. The maximum capacity can support 4TB. The maximum performance supports PCIe GEN4X2. The interface speed can support 4GB / s, and the maximum power consumption under full performance is less than 3.5W. High performance and low power consumption, reducing heat generation, the average power consumption and performance ratio reaches 1.1GB / W, which is equivalent to 1W power consumption and performance of 1.1GB / s. PCBA hardware solution such as Figure 4 shown.

[0054] In some preferred embodiments, the lower metal shell 4 and the upper metal shell 1 are made of aluminum alloy to improve the heat conductivity and quickly conduct the heat inside the memory card to the external environment. In addition, the shape of the memory card shell is also specially optimized:

[0055] The thickness of the memory card opening will affect the insertion and ejection of the memory card in the camera, especially the tightness of the card slot varies between different manufacturers. If you use a 1.0 thickness shell on a camera, the memory card will not be ejected smoothly after being pressed. This is because the 1.0 thickness will be stuck very tightly when inserted into the card slot, causing it to not be ejected. After changing the opening depth of this device, the test insertion and extraction is very smooth, and there is no phenomenon of being stuck and not being able to eject. The specific settings are as follows:

[0056] An opening 9 is respectively provided on both sides of the outer ring of the upper metal shell 1 in the width direction thereof, and the opening 9 extends along the length direction of the upper metal shell 1 .

[0057] An interface groove 13 is provided on the outer ring of the upper metal shell 1;

[0058] A protrusion 14 is provided at the designed position of the end surface where the outer ring of the lower metal shell 4 contacts the upper metal shell 1; the designed position is the projection area of ​​the interface groove 13 projected on the end surface; the vertical distance between the top of the protrusion 14 and the bottom surface of the lower metal shell 4 is 0.85-0.95mm; most preferably, the vertical distance between the top of the protrusion 14 and the bottom surface of the lower metal shell 4 is 0.9mm, such as Figure 1The mark H indicates the vertical distance. This is equivalent to reducing the thickness of the lower metal shell 4 while keeping the size of the through hole formed by the interface slot 13 and the bump 14 unchanged. After changing the thickness of the lower metal shell 4, the thickness of the entire memory card is reduced, and the pressing force between the memory card and the camera card slot is reduced, so that the test insertion and removal is very smooth, and there is no phenomenon of being stuck and unable to be ejected.

[0059] in Figure 7 and Figure 8 The structure of the upper metal shell 1 and the lower metal shell 4 after the box cover is sealed can be shown. Since the upper metal shell 1 and the lower metal shell 4 are sealed and connected after actual production, refer to Figure 7 , which is not easy to distinguish, so in order to facilitate the distinction, we use Figure 8 It can be seen that the vertical distance H between the protrusion 14 and the bottom surface of the lower metal shell 4 is schematically shown.

[0060] The opening 9 is the part where the memory card contacts the clamping member in the card slot in the camera, which will not be explained in detail here. Figure 1 The mark a in the middle and the mark b in the width direction. The outer circle above is shown as mark c.

[0061] The end of the memory card that contacts the card slot inside the camera is generally the insertion end, and the end away from the insertion end in the length direction is the push-in end.

[0062] Furthermore, the stop pins of the memory card slots in most cameras are sloped, while the stop pins of some camera memory card slots are straight-legged. Therefore, when the side stop pin slot 10 of the memory card has a straight opening, when the card is pulled out of the camera, the side stop pin slot 10 and the stop pin are subjected to obvious force, which can easily cause excessive fatigue to the stop pin of the camera memory card slot during insertion and removal, thereby affecting the service life of the camera memory card slot. The side stop pin slot 10 of the present device is changed to an oblique angle, so that the force between the card and the stop pin is relatively small during insertion and removal, which will not cause excessive fatigue to the stop pin, thereby greatly improving the service life of the camera memory card slot. You can also refer to Figure 1 , Figure 5 and Figure 6 , the specific settings are as follows:

[0063] A first side needle blocking groove 10 is provided on the bottom wall of the opening 9 and vertically penetrates the outer ring of the upper metal shell 1;

[0064] A second side needle stopper groove 11 is provided on the outer ring of the lower metal shell 4 and is located directly below the first side needle stopper groove 10 . The vertical depth of the second side needle stopper groove 11 is less than the thickness of the outer ring of the lower metal shell 4 .

[0065] Of the two side walls of the first side pin blocking slot 10 and the second side pin blocking slot 11 in the length direction of the memory card, the side wall near the insertion end of the memory card is a bevel surface 12;

[0066] The included angle between the bevel surface 12 and the vertical surfaces 3 of the first side needle retaining groove 10 and the second side needle retaining groove 11 is an obtuse angle.

[0067] Through the above configuration, the memory card of the present application can be used in memory card slots of different types of cameras, thereby increasing the service life.

[0068] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0069] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0070] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A memory card for preventing overheating, characterized in that: It includes: An upper metal shell (1) having a first accommodating groove (2), wherein a top wall of the first accommodating groove (2) is recessed to form a first fixing and mounting groove; The lower metal shell (4) has a second receiving groove (5), and the top wall of the second receiving groove (5) is recessed to form a second fixed installation groove (6); the lower metal shell (4) is sealedly connected to the upper metal shell (1), and the first receiving groove (2) and the second receiving groove (5) form a sealed space; and a thermal conductive pad (7) is provided in each of the first fixed installation groove and the second fixed installation groove (6); A printed circuit board assembly (8) is located in the sealed space, and the top and bottom are in close contact with the thermal pad (7).

2. The overheat-proof memory card according to claim 1, wherein: The size of the thermal conductive pad (7) is equal to the size of the first fixed installation groove and the second fixed installation groove (6).

3. The overheat-proof memory card according to claim 1, wherein: The printed circuit board assembly (8) comprises a circuit board (800), and a controller (801) and a memory (802) are provided on the circuit board (800); The thermal pad (7) is projected onto the printed circuit board assembly (8) to cover the controller (801) and the memory (802).

4. The overheat-proof memory card according to claim 3, wherein: The number of the controller (801) is one, and the number of the memories (802) is four; The controller (801) is located on the top surface of the circuit board (800), and is correspondingly connected to two memories (802) located on the top surface and two memories (802) located on the bottom surface of the circuit board (800).

5. The overheat-proof memory card according to claim 1, wherein: The upper metal shell (1) and the lower metal shell (4) are both made of aluminum alloy.

6. The overheat-proof memory card according to claim 1, wherein: The outer ring of the upper metal shell (1) is provided with an opening (9) on both sides in the width direction thereof, and the opening (9) extends along the length direction of the upper metal shell (1); the outer ring of the upper metal shell (1) is provided with an interface groove (13); A protrusion (14) is provided at a designed position on the end surface where the outer ring of the lower metal shell (4) contacts the upper metal shell (1); the designed position is a projection area of ​​the interface groove (13) projected on the end surface; and the vertical distance between the top of the protrusion (14) and the bottom surface of the lower metal shell (4) is 0.85-0.95 mm.

7. The overheat-proof memory card according to claim 6, wherein: The vertical distance between the top of the protrusion (14) and the bottom surface of the lower metal shell (4) is 0.9 mm.

8. The overheat-proof memory card according to claim 6, wherein: A first side needle retaining groove (10) is provided on the bottom wall surface of the opening (9) and vertically penetrates the outer ring of the upper metal shell (1); The outer ring of the lower metal shell (4) is provided with a second side needle stopper groove (11) located directly below the first side needle stopper groove (10), and the vertical depth of the second side needle stopper groove (11) is less than the thickness of the outer ring of the lower metal shell (4).

9. The overheat-proof memory card according to claim 8, wherein: Of the two side walls of the first side needle blocking slot (10) and the second side needle blocking slot (11) in the length direction of the memory card, the side wall close to the insertion end of the memory card is an angled surface (12); The included angle between the bevel surface (12) and the vertical surfaces (3) of the first side needle retaining slot (10) and the second side needle retaining slot (11) is an obtuse angle.

10. A camera, characterized in that: It includes: An overheat-proof memory card as claimed in any one of claims 1 to 9.

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