Backlight source module with multiple heat dissipation assemblies

Abstract

The invention provides a backlight source module with multiple heat dissipation assemblies, and relates to the technical field of LCD screen backlight, a semiconductor chilling plate is powered on to generate low temperature, cooling liquid in a storage cavity is cooled through a fin heat dissipation disc, and a control panel controls a PCB magnetic board to be powered on periodically at regular time; the PCB magnetic plate can enable a metal sheet at the bottom end of an elastic rubber film to be attracted downwards, the elastic rubber film is pulled by the metal sheet to deform, when the PCB magnetic plate is powered off, the elastic rubber film is reset under the action of elasticity, cooling liquid entering a liquid pumping cavity is squeezed into a flow guide groove after the elastic rubber film is reset, and the cooling liquid enters the flow guide groove. And the four flow guide grooves are formed in the aluminum alloy supporting plate, so that the flowing distance of the cooling liquid is reduced by three quarters, the heat absorption capacity of a single strand of cooling liquid is improved, the heat dissipation effect is more uniform, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of LCD screen backlight, and more specifically, particularly relates to a backlight source module with multiple heat dissipation components. Background Art

[0002] In today's electronic display technology, the backlight module is a key component of liquid crystal display devices (LCD), and its performance and reliability play a vital role in display quality and device life. With the continuous development of display technology, higher resolution, larger screen size and brighter display effects have become the mainstream demand of the market. However, these advances have also brought a significant problem - a significant increase in heat generation.

[0003] When the backlight module is working, the internal light source such as the light-emitting diode (LED) will generate a lot of heat. If this heat cannot be dissipated in time and effectively, the excessive temperature will affect the luminous efficiency and life of the LED. The accumulation of heat may also cause the performance of the optical film layer inside the backlight module to deteriorate. For example, the diffusion film, brightness enhancement film, etc. may deform, age or discolor due to high temperature, affecting the uniform distribution of light and the brightness enhancement effect.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a backlight module with multiple heat dissipation components is provided, so as to achieve a more practical purpose. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a backlight module with multiple heat dissipation components to solve the above problems.

[0006] A backlight module with multiple heat dissipation components includes an aluminum alloy support plate, a guide groove, a pump liquid cavity, an elastic rubber membrane, a reflux port, a metal sheet, a PCB magnetic plate, a storage cavity, a heat conductive sheet, a patch temperature sensor, a fin heat sink, a semiconductor cooling sheet, a control board, a resistance heating sheet, a backlight luminous module, a check rubber membrane petal, and a coolant.

[0007] Preferably, four guide grooves are evenly opened on the upper surface of the aluminum alloy pallet, four pump liquid chambers are opened on the upper surface of the aluminum alloy pallet, the reflux port is opened in the middle of the aluminum alloy pallet, and the storage chamber is opened inside the aluminum alloy pallet; the coolant is filled in the guide grooves, the pump liquid chamber, the reflux port, and the storage chamber; the guide grooves, the pump liquid chamber, the reflux port, and the storage chamber are interconnected.

[0008] Preferably, the elastic rubber membrane is fixedly mounted inside the pump fluid chamber, and the metal sheet is fixedly mounted on the bottom end of the elastic rubber membrane.

[0009] Preferably, the four PCB magnetic plates are fixedly mounted inside the aluminum alloy support plate, and the fin heat sink is fixedly mounted inside the storage cavity; the four PCB magnetic plates are respectively located directly below the four elastic rubber membranes, and the fin heat sink is located directly below the return port.

[0010] Preferably, the heat conducting sheet is fixedly mounted on the top end of the aluminum alloy support plate by means of a sealant, and the semiconductor cooling sheet is fixedly mounted on the bottom end of the fin heat sink.

[0011] Preferably, the backlight source light-emitting module is fixedly mounted on the top of the heat-conducting sheet, and the patch temperature sensor is fixedly mounted between the heat-conducting sheet and the backlight source light-emitting module.

[0012] Preferably, the control panel is fixedly mounted on the bottom end of the aluminum alloy support plate.

[0013] Preferably, the resistance heating plate is fixedly mounted around the aluminum alloy support plate.

[0014] Preferably, a plurality of non-return rubber diaphragms are fixedly installed inside the guide groove.

[0015] Preferably, the wiring of the PCB magnetic plate, the patch temperature sensor, the semiconductor cooling plate and the resistance heating plate are fixedly connected to the control board by soldering.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] In the present invention, the structural design of each component is extremely simple. Its manufacturing process directly uses stamping and etching processes, and can be matched with existing components, so that large-scale production can be carried out, thus significantly reducing production costs and creating extremely favorable conditions for its large-scale promotion in the market.

[0018] In the present invention, a resistance heating sheet is provided. During installation, screen adhesive is applied around the aluminum alloy support plate. The display screen is placed on top of the thermal conductive sheet and pressed downward to be bonded through the screen adhesive. During the bonding process, the control board energizes the resistance heating sheet. The resistance wire inside the resistance heating sheet generates heat after being energized, thereby increasing the temperature of the adhesive and improving the adhesion of the adhesive, making the display screen and the backlight assembly more securely installed. Similarly, during later disassembly and repair, the control board energizes the resistance heating sheet to heat and melt the adhesive, so that it can be disassembled for repair. The resistance heating sheet generates high temperature to melt the adhesive, thereby achieving the effect of facilitating installation and disassembly and repair.

[0019] In the present invention, a fin heat sink, a semiconductor cooling plate and four guide grooves are provided. The semiconductor cooling plate is energized to generate a low temperature to cool the cooling liquid inside the storage cavity through the fin heat sink. The cooling liquid inside the guide groove will take away the heat generated by the backlight source light-emitting module through the heat conductive plate. The cooling liquid in the four guide grooves will finally flow back to the storage cavity from the reflux port under the extrusion of the elastic rubber film. When the cooling liquid enters the storage cavity, it will pass through the fin heat sink. The fin heat sink can increase the contact area with the cooling liquid, so that the semiconductor cooling plate can quickly cool the cooling liquid. During the flow of the cooling liquid, the temperature of the cooling liquid will increase with the increase of the flow distance because it continuously absorbs the heat generated by the backlight source light-emitting module, which will cause uneven heat dissipation of the backlight source light-emitting module. Four guide grooves are provided on the aluminum alloy support plate, which reduces the flow distance of the cooling liquid by three quarters, and can dissipate heat to the backlight source light-emitting module at the same time from the four corners of the aluminum alloy support plate, so that the heat absorption capacity of a single stream of cooling liquid is improved, which not only makes the heat dissipation effect more uniform but also improves the heat dissipation efficiency.

[0020] In the present invention, by providing a chip temperature sensor, the temperature emitted by the backlight source light-emitting module can be accurately identified. When the chip temperature sensor detects that the temperature of the backlight source light-emitting module is too high, the control board will increase the power-on frequency of the PCB magnetic plate and the working efficiency of the semiconductor refrigeration plate, so that the coolant can be cooled and flowed quickly, so as to improve the heat dissipation efficiency until the backlight source light-emitting module is cooled down and returns to the rated working temperature. The temperature of the backlight source light-emitting module is monitored by the chip temperature sensor, so that the intelligent temperature control is achieved to enable the backlight source light-emitting module to continuously maintain the rated working temperature.

[0021] In the present invention, the power transmission is realized by innovatively using a PCB magnetic plate. Its working principle is consistent with that of a PCB motor, which is to use the copper traces on a printed circuit board (PCB) to make an electromagnetic coil to generate a magnetic field, so that the thickness of the PCB magnetic plate is only between one and two millimeters, the groove depth of the guide groove and the pump liquid cavity is set to four millimeters, and the groove depth of the storage cavity is also four millimeters, thereby making the overall thickness of the aluminum alloy support plate one centimeter. It is these carefully designed dimensions that greatly reduce the thickness of the entire structure and successfully achieve the excellent effect of making it lighter and thinner. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a schematic diagram of the structure of the patch temperature sensor of the present invention;

[0024] Figure 3 It is a schematic diagram of the structure of the aluminum alloy support plate of the present invention;

[0025] Figure 4 It is a schematic diagram of the side cross-sectional structure of the aluminum alloy support plate of the present invention;

[0026] Figure 5 It is a schematic diagram of the structure of the semiconductor refrigeration sheet of the present invention;

[0027] Figure 6 It is a schematic diagram of the cross-sectional structure of the bottom surface of the aluminum alloy support plate of the present invention;

[0028] Figure 7 is a schematic diagram of the structure of the elastic rubber membrane of the present invention;

[0029] Figure 8 It is a schematic diagram of the structure of the fin heat sink of the present invention;

[0030] Fig. 9 The present invention Figure 3 A schematic diagram of the enlarged structure at point A;

[0031] Fig.10 It is a schematic diagram of the structure of the resistance heating sheet of the present invention.

[0032] In the figure, the correspondence between the component names and the figure numbers is: 1. Aluminum alloy support plate; 2. Guide groove; 3. Pump liquid chamber; 4. Elastic rubber membrane; 5. Reflow port; 6. Metal sheet; 7. PCB magnetic plate; 8. Storage chamber; 9. Heat conductive sheet; 11. Chip temperature sensor; 12. Fin heat sink; 13. Semiconductor refrigeration sheet; 14. Control board; 15. Resistive heating sheet; 16. Backlight module; 17. Check rubber membrane petal; 18. Cooling liquid. DETAILED DESCRIPTION

[0033] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0034] See also Figure 1 - Fig.10The present invention provides a backlight module with multiple heat dissipation components, including an aluminum alloy support plate 1, a guide groove 2, a pump liquid cavity 3, an elastic rubber membrane 4, a reflux port 5, a metal sheet 6, a PCB magnetic plate 7, a storage cavity 8, a heat conductive sheet 9, a patch temperature sensor 11, a fin heat sink 12, a semiconductor cooling sheet 13, a control board 14, a resistance heating sheet 15, a backlight light-emitting module 16, a check rubber membrane petal 17, and a coolant 18. Four guide grooves 2 are evenly opened on the aluminum alloy support plate 1. The surface, four pump liquid chambers 3 are opened on the upper surface of the aluminum alloy support plate 1, the reflux port 5 is opened in the middle of the aluminum alloy support plate 1, the storage chamber 8 is opened inside the aluminum alloy support plate 1, the coolant 18 is filled in the guide groove 2, the pump liquid chamber 3, the reflux port 5, and the storage chamber 8, the guide groove 2, the pump liquid chamber 3, the reflux port 5, and the storage chamber 8 are interconnected, the elastic rubber membrane 4 is fixedly installed inside the pump liquid chamber 3, the metal sheet 6 is fixedly installed at the bottom end of the elastic rubber membrane 4, and the four PCB magnetic plates 7 are fixedly installed on the aluminum Inside the alloy support plate 1, the fin heat sink 12 is fixedly installed inside the storage cavity 8; the four PCB magnetic plates 7 are respectively located directly below the four elastic rubber membranes 4, the fin heat sink 12 is located directly below the return port 5, the heat conductive sheet 9 is fixedly installed on the top of the aluminum alloy support plate 1 through sealant, the semiconductor cooling sheet 13 is fixedly installed on the bottom of the fin heat sink 12, the backlight source light-emitting module 16 is fixedly installed on the top of the heat conductive sheet 9, the patch temperature sensor 11 is fixedly installed between the heat conductive sheet 9 and the backlight source light-emitting module 16, the control board 14 is fixedly installed on the bottom of the aluminum alloy support plate 1, the resistance heating sheet 15 is fixedly installed around the aluminum alloy support plate 1, and a plurality of check rubber membrane petals 17 are fixedly installed inside the guide groove 2, and the wiring of the PCB magnetic plate 7, the patch temperature sensor 11, the semiconductor cooling sheet 13 and the resistance heating sheet 15 are fixedly connected to the control board 14 through soldering, and the high temperature generated by the resistance heating sheet 15 melts the adhesive, thereby achieving the effect of easy installation and disassembly.

[0035] The PCB magnetic plate 7 is used for power transmission. When in use, the semiconductor refrigeration sheet 13 is energized to generate low temperature to cool the coolant 18 in the storage chamber 8 through the fin heat sink 12. The control board 14 controls the PCB magnetic plate 7 to periodically power on. When the PCB magnetic plate 7 is energized, the metal coil inside the PCB magnetic plate 7 will generate electromagnetic force. The principle is the same as that of the existing PCB motor. The PCB magnetic plate 7 will make the metal sheet 6 at the bottom of the elastic rubber membrane 4 adsorb downward, and the elastic rubber membrane 4 is pulled by the metal sheet 6 to deform, so that negative pressure is formed inside the pump liquid chamber 3. When negative pressure is formed inside the pump liquid chamber 3, the coolant 18 in the storage chamber 8 will be sucked into the pump liquid chamber 3. When the PC When the B magnetic plate 7 is powered off, the elastic rubber membrane 4 will reset under the action of elasticity. After the elastic rubber membrane 4 is reset, the coolant 18 entering the pump liquid chamber 3 will be squeezed into the guide groove 2, so that the low-temperature coolant 18 can move along the guide groove 2. The coolant 18 inside the guide groove 2 will take away the heat generated by the backlight source light-emitting module 16 through the heat conductive sheet 9. The coolant 18 in the four guide grooves 2 will finally flow back to the storage chamber 8 through the reflux port 5 under the squeezing of the elastic rubber membrane 4. When the coolant 18 enters the storage chamber 8, it will pass through the fin heat sink 12. The fin heat sink 12 can increase the contact area with the coolant 18, so that the semiconductor refrigeration sheet 13 can quickly cool the coolant 18.

[0036] During the flow of the coolant 18, the temperature of the coolant 18 will increase with the increase of the flow distance, which will cause uneven heat dissipation of the backlight module 16. Four guide grooves 2 are provided on the aluminum alloy support plate 1 to reduce the flow distance of the coolant 18 by three quarters, and the backlight module 16 can be cooled from the four corners of the aluminum alloy support plate 1 at the same time, so that the heat absorption capacity of a single stream of coolant 18 is improved, which not only makes the heat dissipation effect more uniform but also improves the heat dissipation efficiency. During the circulation of the coolant 18, the non-return rubber diaphragm 17 allows the coolant 18 to flow in one direction only, avoiding the backflow of the coolant 18. Flow, the chip temperature sensor 11 is located between the heat conductive sheet 9 and the backlight module 16, and can accurately identify the temperature emitted by the backlight module 16. When the chip temperature sensor 11 detects that the temperature of the backlight module 16 is too high, the control board 14 will increase the power-on frequency of the PCB magnetic plate 7 and the working efficiency of the semiconductor refrigeration sheet 13, so that the coolant 18 can be cooled and flowed quickly, so as to improve the heat dissipation efficiency until the backlight module 16 cools down and returns to the rated working temperature. The temperature of the backlight module 16 is monitored by the chip temperature sensor 11, so that the intelligent temperature control can make the backlight module 16 continue to maintain the rated working temperature.

[0037] During production, stamping equipment can be used to directly punch out the guide groove 2, the pump liquid cavity 3, and the reflux port 5 on the aluminum alloy support plate 1. The PCB magnetic plate 7 and the resistance heating plate 15 are all simple metal wire coils and resistance wire coils etched inside the PCB. The structure is simple. The elastic rubber film 4, the metal sheet 6, the heat conductive plate 9, the fin heat sink 12, the semiconductor refrigeration plate 13, and the control board 14 are all simple structures or existing low-cost components, which achieves the effect of reducing production costs. The PCB magnetic plate 7 is used for power transmission. The thickness of the PCB magnetic plate 7 is only one to two millimeters. The groove depth of the guide groove 2 and the pump liquid cavity 3 is four millimeters, and the groove depth of the storage cavity 8 is four millimeters. The overall thickness of the aluminum alloy support plate 1 is one centimeter, which greatly reduces the thickness of the overall structure and achieves a lighter and thinner effect.

[0038] Working principle:

[0039] In the first step, during production, stamping equipment can be directly used to stamp out the guide groove 2, pump liquid cavity 3, reflux port 5 on the aluminum alloy support plate 1. The PCB magnetic plate 7 and the resistance heating plate 15 are all simple metal wire coils and resistance wire coils etched inside the PCB. The structure is simple. The elastic rubber film 4, metal sheet 6, thermal conductive sheet 9, fin heat sink 12, semiconductor refrigeration sheet 13, and control board 14 are all simple structures or existing low-cost components, thereby achieving the effect of reducing production costs.

[0040] In the second step, during installation, apply screen adhesive glue around the aluminum alloy support plate 1, place the display screen on top of the thermal conductive sheet 9 and press downward to bond it with the screen adhesive glue. During the bonding process, the control board 14 energizes the resistance heating sheet 15. The resistance wire inside the resistance heating sheet 15 generates heat after being energized, which increases the temperature of the adhesive glue and improves the adhesion of the adhesive glue, making the display screen and backlight assembly more securely installed. Similarly, during later disassembly and repair, the control board 14 energizes the resistance heating sheet 15 to heat and melt the adhesive glue, so that it can be disassembled for repair. The resistance heating sheet 15 generates high temperature to melt the adhesive glue, thereby achieving the effect of facilitating installation and disassembly and repair.

[0041] The third step, when in use, the semiconductor refrigeration sheet 13 is energized to generate low temperature to cool the coolant 18 inside the storage chamber 8 through the fin heat sink 12, and the control board 14 controls the PCB magnetic plate 7 to periodically power on. When the PCB magnetic plate 7 is energized, the metal coil inside the PCB magnetic plate 7 will generate electromagnetic force. The principle is the same as that of the existing PCB motor. The PCB magnetic plate 7 will make the metal sheet 6 at the bottom of the elastic rubber membrane 4 adsorb downward, and the elastic rubber membrane 4 is pulled by the metal sheet 6 to deform, so that a negative pressure is formed inside the pump liquid chamber 3. When a negative pressure is formed inside the pump liquid chamber 3, the coolant 18 inside the storage chamber 8 will be sucked into the pump liquid chamber 3. When the PCB magnetic plate 7 is powered off, The elastic rubber membrane 4 will be reset under the action of elasticity. When the elastic rubber membrane 4 is reset, the coolant 18 entering the pump liquid chamber 3 will be squeezed into the guide groove 2, so that the low-temperature coolant 18 can move along the guide groove 2. The coolant 18 inside the guide groove 2 will take away the heat generated by the backlight source light-emitting module 16 through the heat conductive sheet 9. The coolant 18 in the four guide grooves 2 will finally flow back to the storage chamber 8 through the reflux port 5 under the squeezing of the elastic rubber membrane 4. When the coolant 18 enters the storage chamber 8, it will pass through the fin heat sink 12. The fin heat sink 12 can increase the contact area with the coolant 18, so that the semiconductor refrigeration sheet 13 can quickly cool the coolant 18.

[0042] In the fourth step, during the flow of the coolant 18, the temperature of the coolant 18 will increase with the increase of the flow distance because it continuously absorbs the heat generated by the backlight module 16, which will cause uneven heat dissipation of the backlight module 16. Four guide grooves 2 are provided on the aluminum alloy support plate 1 to reduce the flow distance of the coolant 18 by three quarters. The backlight module 16 can be cooled from the four corners of the aluminum alloy support plate 1 at the same time, thereby improving the heat absorption capacity of the single stream of coolant 18, which not only makes the heat dissipation effect more uniform but also improves the heat dissipation efficiency. During the circulation of the coolant 18, the non-return rubber diaphragm 17 allows the coolant 18 to flow in one direction only, thereby preventing the coolant 18 from flowing back.

[0043] In the fifth step, the chip temperature sensor 11 is located between the heat conductive sheet 9 and the backlight module 16, and can accurately identify the temperature emitted by the backlight module 16. When the chip temperature sensor 11 detects that the temperature of the backlight module 16 is too high, the control board 14 will increase the power-on frequency of the PCB magnetic plate 7 and the working efficiency of the semiconductor refrigeration sheet 13, so that the coolant 18 can be cooled and flowed quickly, so as to improve the heat dissipation efficiency until the backlight module 16 cools down and returns to the rated working temperature. The temperature of the backlight module 16 is monitored by the chip temperature sensor 11, so that the intelligent temperature control is achieved to enable the backlight module 16 to continuously maintain the rated working temperature.

[0044] The sixth step is to use PCB magnetic plate 7 for power transmission. The thickness of PCB magnetic plate 7 is only one to two millimeters. The groove depth of guide groove 2 and pump liquid cavity 3 is four millimeters. The groove depth of storage cavity 8 is four millimeters. The overall thickness of aluminum alloy support plate 1 is one centimeter, which greatly reduces the thickness of the overall structure and achieves a lighter and thinner effect.

[0045] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A backlight module with multiple heat dissipation components, comprising an aluminum alloy support plate (1), a guide groove (2), a pump liquid cavity (3), an elastic rubber membrane (4), a reflux port (5), a metal sheet (6), a PCB magnetic plate (7), a storage cavity (8), a heat conducting sheet (9), a patch temperature sensor (11), a fin heat sink (12), a semiconductor cooling sheet (13), a control board (14), a resistance heating sheet (15), a backlight light-emitting module (16), a non-return rubber membrane petal (17), and a cooling liquid (18).

2. A backlight module with multiple heat dissipation components as claimed in claim 1, characterized in that: The four guide grooves (2) are evenly arranged on the upper surface of the aluminum alloy support plate (1), the four pump liquid chambers (3) are arranged on the upper surface of the aluminum alloy support plate (1), the reflux port (5) is arranged in the middle of the aluminum alloy support plate (1), the storage chamber (8) is arranged inside the aluminum alloy support plate (1), and the coolant (18) is filled in the guide grooves (2), the pump liquid chambers (3), the reflux port (5), and the storage chamber (8); The guide groove (2), the pump liquid chamber (3), the reflux port (5) and the storage chamber (8) are interconnected.

3. A backlight module with multiple heat dissipation components as claimed in claim 1, characterized in that: The elastic rubber membrane (4) is fixedly mounted inside the pump liquid chamber (3), and the metal sheet (6) is fixedly mounted at the bottom end of the elastic rubber membrane (4).

4. A backlight module with multiple heat dissipation components as claimed in claim 1, characterized in that: The four PCB magnetic plates (7) are fixedly mounted inside the aluminum alloy support plate (1), and the fin heat sink (12) is fixedly mounted inside the storage cavity (8); The four PCB magnetic plates (7) are respectively located directly below the four elastic rubber membranes (4), and the fin heat sink (12) is located directly below the return port (5).

5. A backlight module with multiple heat dissipation components as claimed in claim 1, characterized in that: The heat conducting sheet (9) is fixedly mounted on the top end of the aluminum alloy support plate (1) by means of a sealant, and the semiconductor cooling sheet (13) is fixedly mounted on the bottom end of the fin heat sink (12).

6. A backlight module with multiple heat dissipation components as claimed in claim 1, characterized in that: The backlight source light-emitting module (16) is fixedly mounted on the top of the heat-conducting sheet (9), and the patch temperature sensor (11) is fixedly mounted between the heat-conducting sheet (9) and the backlight source light-emitting module (16).

7. A backlight module with multiple heat dissipation components as claimed in claim 1, characterized in that: The control panel (14) is fixedly mounted on the bottom end of the aluminum alloy support plate (1).

8. A backlight module with multiple heat dissipation components as claimed in claim 1, characterized in that: The resistance heating plate (15) is fixedly mounted on the four sides of the aluminum alloy support plate (1).

9. A backlight module with multiple heat dissipation components as claimed in claim 1, characterized in that: The plurality of non-return rubber diaphragms (17) are fixedly mounted inside the guide groove (2).

10. A backlight module with multiple heat dissipation components as claimed in claim 1, characterized in that: The wiring of the PCB magnetic plate (7), the patch temperature sensor (11), the semiconductor cooling plate (13) and the resistance heating plate (15) are fixedly connected to the control board (14) by soldering.

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