Gold wire bonding clamp for product micro-assembly

Abstract

The embodiment of the utility model provides a product micro-assembly gold wire bonding clamp which comprises the components of a heating platform which is provided with a groove which is matched with the appearance of a product to be micro-assembled; and the temperature control structure comprises a temperature display and a temperature controller, the temperature controller is used for controlling the temperature of the heating table, and the temperature display is used for displaying the temperature of the heating table. The groove matched with the appearance of the to-be-micro-assembled product is formed in the heating table, the depth, the avoiding hole and the size of the groove are designed according to the product, the to-be-micro-assembled product can be conveniently placed, the temperature of the heating table is controlled through the temperature control structure, the to-be-micro-assembled product is placed in the groove in the heating table after being baked and preheated through the baking oven, and therefore the micro-assembled product can be conveniently heated. The heating table accurately controls the temperature and wraps the product, so that the temperature of the product to be micro-assembled is guaranteed to the maximum extent, the welding quality of the product is guaranteed, and meanwhile, the welding efficiency of batch products can be improved.

Description

Technical Field

[0001] The present invention relates to the field of micro-assembly technology, and in particular to a product micro-assembly gold wire bonding fixture. Background Art

[0002] At present, in the micro-assembly gold wire bonding assembly of microwave, millimeter wave or terahertz wave components, it is necessary to bond the bare tube core, make electrical connections, etc. The assembly fixture needs to dissipate heat quickly for the assembled products. If heated in an incubator or using the heating mechanism on the bonding machine, it cannot be guaranteed that the product reaches the appropriate welding temperature, which in turn affects the welding quality of the product. Summary of the invention

[0003] In view of this, an embodiment of the present specification provides a product micro-assembly gold wire bonding fixture, which facilitates the placement of the product to be micro-assembled by opening a groove on the heating table that matches the shape of the product to be micro-assembled. The temperature of the heating table is controlled by a temperature control structure to maximize the temperature of the product to be micro-assembled, thereby ensuring the product welding quality and improving the welding efficiency of batch products.

[0004] The embodiments of this specification provide the following technical solutions: a product micro-assembly gold wire bonding fixture, comprising:

[0005] A heating platform, wherein the heating platform is provided with a groove matching the shape of the product to be micro-assembled;

[0006] A temperature control structure, the temperature control structure includes a temperature display and a temperature controller, the temperature controller is used to control the temperature of the heating platform, and the temperature display is used to display the temperature of the heating platform.

[0007] Preferably, the groove is arranged on the top of the heating platform, and the edge of the groove includes a plurality of U-shaped segments, and adjacent U-shaped segments are connected by arc segments.

[0008] Preferably, the temperature controller adjusts the temperature of the heating stage in real time so that the temperature of the heating stage is within the range of ±5° C. of the gold wire bonding temperature of the product.

[0009] Preferably, the fixture further comprises a power controller, and the power controller is used to control the on and off of the heating platform, the temperature display and the temperature controller.

[0010] Preferably, the fixture further comprises a base, the heating platform is mounted on a first side of the top of the base via a support frame, and the temperature display, temperature controller and power controller are all mounted on a second side of the top of the base.

[0011] Preferably, the clamp further comprises a protective fence, and the protective fence is arranged on the top of the heating platform.

[0012] Preferably, the clamp further comprises a thermal insulation pad, and the thermal insulation pad is arranged in the protective fence.

[0013] Preferably, the thermal insulation pad comprises an asbestos pad.

[0014] Preferably, an electric heating coil is provided in the heating platform, and the electric heating coil is located below the groove.

[0015] Preferably, the product is a bare tube core of a microwave, millimeter wave or terahertz wave product.

[0016] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above technical solutions adopted in the embodiments of this specification include at least:

[0017] A groove that matches the shape of the product to be micro-assembled is opened on the heating table. The depth, avoidance hole and size of the groove are designed according to the product to facilitate the placement of the product to be micro-assembled. The temperature of the heating table is controlled by a temperature control structure. The product to be micro-assembled is placed in the groove on the heating table after being preheated by baking in an oven. The heating table accurately controls the temperature and wraps the product for placement, thereby maximizing the temperature of the product to be micro-assembled, thereby ensuring the product welding quality and improving the welding efficiency of batch products. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a structural schematic diagram of the product micro-assembly gold wire bonding fixture provided by the application;

[0020] Figure 2 It is a side structural schematic diagram of the micro-assembly gold wire bonding fixture provided by the present application;

[0021] Figure 3 It is a schematic diagram of the heating platform structure of the micro-assembly gold wire bonding fixture provided by the present application;

[0022] Figure 4 It is a cross-sectional view of the heating stage of the micro-assembly gold wire bonding fixture provided by the present application;

[0023] Figure 5 It is a schematic diagram of the protective fence structure of the product micro-assembly gold wire bonding fixture provided by this application;

[0024] Figure 6It is a cross-sectional view of the protective fence of the micro-assembly gold wire bonding fixture provided in this application.

[0025] In the figure, 1. heating table; 2. groove; 3. temperature controller; 4. temperature display; 5. power controller; 6. protective fence; 61. first fence; 62. second fence; 7. base; 8. thermal insulation pad; 9. support frame. DETAILED DESCRIPTION

[0026] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0027] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0028] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0029] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0030] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects described may be practiced without these specific details.

[0031] The technical solutions provided by various embodiments of the present application are described below in conjunction with the accompanying drawings.

[0032] like Figure 1-Figure 2 As shown, a product micro-assembly gold wire bonding fixture includes:

[0033] A heating platform 1, wherein the heating platform 1 is provided with a groove 2 matching the shape of the product to be micro-assembled;

[0034] The temperature control structure includes a temperature display 4 and a temperature controller 3 . The temperature controller 3 is used to control the temperature of the heating platform 1 , and the temperature display 4 is used to display the temperature of the heating platform 1 .

[0035] A groove 2 matching the shape of the product to be micro-assembled is opened on the heating table 1. The depth, avoidance hole and size of the groove 2 are designed according to the product, which is convenient for placing the product to be micro-assembled. The temperature of the heating table 1 is controlled by the temperature control structure. The temperature controller 3 adjusts the temperature of the heating table 1. The temperature display 4 displays the temperature of the heating table 1, which is convenient for the staff to intuitively understand the temperature of the heating table 1. The product to be micro-assembled is placed in the groove 2 on the heating table 1 after being preheated by baking in an oven. The heating table 1 accurately controls the temperature. The heating table 1 wraps the product and places it, so as to maximize the temperature of the product to be micro-assembled, thereby ensuring the product welding quality and improving the welding efficiency of batch products.

[0036] It should be noted that the heating table 1 is a heating table 1 of a specific structure. The groove 2 opened inside the heating table 1 matches the shape of the specific component to be assembled. The shape of the groove 2 is determined according to the shape of the product, and one groove 2 corresponds to the same batch of products.

[0037] like Figure 1-Figure 4 As shown, in some embodiments, the groove 2 is arranged on the top of the heating table 1, and the edge of the groove 2 includes a plurality of U-shaped segments, and the adjacent U-shaped segments are connected by arc segments. By opening a groove 2 for placing the product on the top of the heating table 1, the edge of the groove 2 includes a plurality of U-shaped segments and a plurality of arc segments, which is convenient for fitting with the shape of the product.

[0038] It should be noted that the groove 2 is a symmetrical structure, and the four groups of U-shaped segments are connected by four groups of arc segments.

[0039] like Figure 1-Figure 2As shown, in some embodiments, the temperature controller 3 adjusts the temperature of the heating platform 1 in real time, so that the temperature of the heating platform 1 is within the range of ±5°C of the gold wire bonding temperature of the product. The temperature of the heating platform 1 is controlled in real time by the temperature controller 3, so that the temperature of the heating platform 1 remains constant within the range of ±5°C, thereby controlling the temperature of the assembled product and ensuring that the product completes gold wire bonding within a certain temperature range.

[0040] It should be noted that the temperature of the temperature controller 3 can be set manually.

[0041] like Figure 1-Figure 2 As shown, in some embodiments, the clamp also includes a power controller 5, and the power controller 5 is used to control the power on and off of the heating platform 1, the temperature display 4 and the temperature controller 3. By setting the power controller 5, the power controller 5 is used to control the power on and off to ensure safety.

[0042] like Figure 1-Figure 2 As shown, in some embodiments, the clamp also includes a base 7, the heating platform 1 is installed on the first side of the top of the base 7 through a support frame 9, and the temperature display 4, the temperature controller 3 and the power controller 5 are all installed on the second side of the top of the base 7. By setting the base 7, the heating platform 1 is set on the right side of the top of the base 7, and the temperature display 4, the temperature controller 3 and the power controller 5 are all set on the left side of the top of the base 7, so as to avoid the heating platform 1 from affecting the temperature display 4, the temperature controller 3 and the power controller 5.

[0043] like Figure 1-Figure 2 and Figure 5-Figure 6 As shown, in some embodiments, the clamp also includes a protective fence 6, and the protective fence 6 is arranged on the top of the heating platform 1. The protective fence 6 separates the heating platform 1 from the heating platform 1, which can protect the heating platform and the operator.

[0044] It should be noted that the protective fence 6 includes a first fence 61 for protecting the groove 2 and a second fence 62 for protecting the heating platform 1 .

[0045] like Figure 2 As shown, in some embodiments, the clamp further includes a thermal insulation pad 8, and the thermal insulation pad 8 is disposed in the protective fence 6. By providing the thermal insulation pad 8, a heat insulation effect can be achieved to prevent heat from being dissipated, and at the same time, the staff can be prevented from directly contacting the heating part of the hot platform.

[0046] In some embodiments, the thermal insulation pad 8 includes an asbestos pad. By using an asbestos pad as the thermal insulation pad 8, asbestos is a fiber material with good thermal insulation properties. At the same time, the asbestos pad has good thermal stability and can maintain its thermal insulation properties for a long time at high temperature without obvious performance degradation.

[0047] like Figure 1-Figure 2 As shown, in some embodiments, an electric heating coil is arranged in the heating table 1, and the electric heating coil is located below the groove 2. By arranging the electric heating coil inside the heating table 1 and the electric heating coil is located below the groove 2, it can be ensured that the heat generated by the electric heating coil can be dissipated to the product in the groove 2, ensuring that the product is in a suitable temperature environment.

[0048] In some embodiments, the product is a bare die of a microwave, millimeter wave, or terahertz wave product.

[0049] The same or similar parts between the various embodiments in this specification can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the method embodiment described later, since it corresponds to the system, the description is relatively simple, and the relevant parts can be referred to the partial description of the system embodiment.

[0050] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A product micro-assembly gold wire bonding fixture, characterized in that: include: A heating platform, wherein the heating platform is provided with a groove matching the shape of the product to be micro-assembled; A temperature control structure, the temperature control structure comprising a temperature display and a temperature controller, the temperature controller is used to control the temperature of the heating platform, and the temperature display is used to display the temperature of the heating platform; The groove is arranged on the top of the heating platform, and the edge of the groove includes a plurality of U-shaped segments, and adjacent U-shaped segments are connected by arc segments.

2. The product micro-assembly gold wire bonding fixture according to claim 1, characterized in that: The temperature controller adjusts the temperature of the heating stage in real time so that the temperature of the heating stage is within the range of ±5°C of the gold wire bonding temperature of the product.

3. The product micro-assembly gold wire bonding fixture according to claim 1, characterized in that: The fixture further comprises a power controller, which is used to control the on and off of the heating platform, the temperature display and the temperature controller.

4. The product micro-assembly gold wire bonding fixture according to claim 3, characterized in that: The fixture also includes a base, the heating platform is installed on a first side of the top of the base through a support frame, and the temperature display, temperature controller and power controller are all installed on a second side of the top of the base.

5. The product micro-assembly gold wire bonding fixture according to any one of claims 1 to 4, characterized in that: The clamp also includes a protective fence, which is arranged on the top of the heating platform.

6. The product micro-assembly gold wire bonding fixture according to claim 5, characterized in that: The clamp also includes a heat insulating pad, which is arranged in the protective fence.

7. The product micro-assembly gold wire bonding fixture according to claim 6, characterized in that: The thermal insulation pad includes an asbestos pad.

8. The product micro-assembly gold wire bonding fixture according to claim 1, characterized in that: An electric heating coil is arranged in the heating platform, and the electric heating coil is located below the groove.

9. The product micro-assembly gold wire bonding fixture according to claim 1, characterized in that: The product is a bare tube core of a microwave, millimeter wave or terahertz wave product.

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