Clamping seat mechanism, semiconductor adsorption assembly and semiconductor carrying equipment

Abstract

The utility model belongs to the technical field of semiconductor processing, and discloses a clamping seat mechanism, a semiconductor adsorption assembly and semiconductor carrying equipment, the clamping seat mechanism is used for detachably connecting a suction cup mechanism, a blocking arm and an extension arm mechanism of the semiconductor adsorption assembly, and the clamping seat mechanism is provided with a clamping seat air channel; one end of the clamping seat air passage is communicated with the extension arm air passage, and the other end is communicated with a sucker air passage of the sucker mechanism. According to the clamping seat mechanism, the connection reliability among the suction cup mechanism, the blocking arm and the extension arm mechanism can be improved so as to ensure the airflow stability of the suction cup mechanism, and the semiconductor adsorption assembly is provided with the clamping seat mechanism, so that the semiconductor adsorption assembly is convenient to assemble into a whole; the semiconductor carrying equipment is provided with the semiconductor adsorption assembly and is convenient to assemble, and the position precision of wafer carrying is high.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a clamping seat mechanism, a semiconductor adsorption component and semiconductor handling equipment. Background Art

[0002] In semiconductor processing equipment, semiconductors need to go through multiple different process steps, and usually a manipulator is used to complete the transfer of wafers between various reaction chambers. Wafer handling manipulators often use Bernoulli suction cups to absorb wafers. The bottom surface of the Bernoulli suction cup is provided with multiple suction holes. The suction holes blow out high-speed gas to reduce the pressure between the suction cup and the wafer, forming a pressure above the wafer that is less than the pressure below the wafer, thereby generating suction and allowing the wafer to be absorbed by the suction cup; during the absorption process, the wafer stopper abuts against the wafer to prevent the wafer from slipping. Due to the limited reach of the Bernoulli suction cup, for some larger reaction chambers, it is necessary to expand the area where the Bernoulli suction cup can absorb the wafer through an extension arm. The connection reliability between the Bernoulli suction cup, the wafer stopper and the extension arm will affect the air path sealing of the Bernoulli suction cup and the position accuracy of the extension arm. The air path sealing will affect the air flow stability of the adsorption hole, which will in turn affect the position stability of the Bernoulli suction cup to absorb the wafer. Utility Model Content

[0003] One purpose of the utility model is to provide a clamping seat mechanism that can solve the problem of insufficient connection reliability between the extension arm of the existing wafer handling robot and the Bernoulli suction cup and wafer blocking feet, which in turn affects the position stability of the Bernoulli suction cup sucking the wafer.

[0004] To achieve this purpose, the present invention adopts the following technical solutions:

[0005] A clamping seat mechanism is provided for installing a suction cup mechanism, a blocking arm and an extension arm mechanism. The clamping seat mechanism can be detachably connected to the suction cup mechanism, the blocking arm and the extension arm mechanism at the same time. The clamping seat mechanism is provided with a clamping seat airway, one end of which can be connected to the extension arm airway of the extension arm mechanism, and the other end can be connected to the suction cup airway of the suction cup mechanism.

[0006] In one of the embodiments, the clamping seat mechanism includes a clamping seat and a mounting seat, the clamping seat is used to clamp the suction cup mechanism, the mounting seat is used to clamp the blocking arm, and the mounting seat is detachable from the clamping seat.

[0007] In one embodiment, the mounting seat includes a first connecting seat and a second connecting seat, the first connecting seat and the second connecting seat are connected to form a mounting groove, and the blocking arm is clamped in the mounting groove.

[0008] In one of the embodiments, a first avoidance groove is formed on the clamping seat, and the clamping seat mechanism further includes a first fastener, and the first fastener passes through the bottom of the first avoidance groove to connect the clamping seat and the mounting seat.

[0009] In one embodiment, the clamping seat includes a first clamping plate and a second clamping plate that are detachably connected, and a clamping groove with an opening is formed between the first clamping plate and the second clamping plate. The suction cup mechanism can be clamped in the clamping groove through the opening, and the clamping groove is connected to the other end of the clamping seat air channel away from the extension arm air channel; the suction cup mechanism is provided with a suction cup air inlet connected to the suction cup air channel, and the suction cup air inlet can be located in the clamping groove.

[0010] In one embodiment, the clamping groove is arranged on the second clamping plate, the clamping seat air channel is arranged on the first clamping plate, and the first clamping plate is also provided with an air containing cavity connected to the clamping seat air channel, the air containing cavity is connected to the clamping groove, and the air containing cavity is used to accommodate the filter element.

[0011] In one embodiment, the first clamping plate comprises an upper plate body and a sealing cover plate, the air-containing cavity is arranged through the upper plate body, and the sealing cover plate is detachably connected to the upper plate body to close one end of the air-containing cavity so that the other end of the air-containing cavity is connected to the clamping groove; and / or,

[0012] The clamping seat mechanism also has a third fastener, which passes through one end of the extension arm mechanism and is connected to the clamping seat, so that the air outlet end of the extension arm airway is connected to the air containing cavity.

[0013] The second object of the utility model is to provide a semiconductor adsorption component, which has a clamping seat mechanism that can improve the connection reliability between the suction cup mechanism, the blocking arm and the extension arm mechanism, facilitates assembly into one, and ensures the airflow stability of the suction cup mechanism.

[0014] To achieve this purpose, the second aspect of the utility model adopts the following technical solutions:

[0015] A semiconductor adsorption assembly is provided, comprising a clamping seat mechanism as described above, wherein the semiconductor adsorption assembly also comprises a suction cup mechanism, a blocking arm and an extension arm mechanism, wherein a suction cup air channel is provided on the suction cup mechanism, the suction cup mechanism is used to adsorb wafers, and the blocking arm is used to block the wafers, the suction cup mechanism, the extension arm mechanism and the blocking arm are all detachably connected to the clamping seat mechanism, and the blocking arm is extended around the suction cup mechanism, the extension arm mechanism is provided with an extension arm air channel connected to an external air source, and one end of the clamping seat air channel of the clamping seat mechanism is connected to the extension arm air channel.

[0016] In one embodiment, the blocking arm has a mounting portion connected to the clamping seat mechanism, and a buffer is provided between the mounting portion and the clamping seat mechanism.

[0017] In one embodiment, the surface of the mounting portion is provided with anti-slip protrusions; and / or,

[0018] The blocking arm further comprises a blocking portion and an extending portion, wherein the blocking portion surrounds the suction cup mechanism to block the wafer, two ends of the extending portion are respectively connected to the blocking portion and the mounting portion, the extending portion is L-shaped and the mounting portion is vertically connected to the end of the extending portion to form a U-shaped structure; and / or,

[0019] The semiconductor adsorption assembly has two blocking arms, and the two blocking arms are symmetrically arranged on both sides of the suction cup mechanism; and / or,

[0020] The semiconductor adsorption assembly further includes a third fastener, the third fastener passes through the extension arm mechanism to be detachably connected to the clamping seat mechanism; and / or,

[0021] The buffer member is a rubber pad, and the rubber pad is embedded in the mounting groove of the clamping seat mechanism or wrapped on the mounting portion.

[0022] The third object of the utility model is to provide semiconductor handling equipment, which has a semiconductor adsorption component that can improve the connection reliability between the suction cup mechanism, the blocking arm and the extension arm mechanism, ensure the airflow stability of the suction cup mechanism, and improve the position accuracy of the semiconductor handling equipment in handling wafers.

[0023] To achieve this purpose, the third aspect of the present invention adopts the following technical solutions:

[0024] A semiconductor handling device is provided, comprising the semiconductor adsorption component as described above. The semiconductor handling device further comprises a manipulator, and the manipulator is detachably connected to the semiconductor adsorption component.

[0025] Beneficial effects of the utility model:

[0026] The clamping seat mechanism, semiconductor adsorption assembly and semiconductor handling equipment provided by the utility model, the clamping seat mechanism is used for detachably connecting the extension arm mechanism, the suction cup mechanism and the blocking arm of the semiconductor adsorption assembly, so as to facilitate assembly into a whole. The clamping seat mechanism is used as the installation reference, so that the suction cup mechanism, the extension arm mechanism and the blocking arm are installed as a whole, and the connection reliability between the suction cup mechanism, the blocking arm and the extension arm mechanism is guaranteed. The blocking arm is extended around the suction cup mechanism, and the relative position of the blocking arm and the suction cup mechanism is fixed by the clamping seat mechanism. The position limit of the blocking arm can accurately adjust and limit the position of the wafer on the suction cup mechanism, so as to ensure the uniqueness of the position of the wafer on the suction cup mechanism. The clamping seat is used as an intermediate adapter of the air path, so as to realize the connection between the suction cup airway of the suction cup mechanism and the extension arm airway of the extension arm mechanism, so as to ensure the reliability and sealing of the air path connection, and then ensure the airflow stability of the suction cup airway, avoid the unstable airflow from affecting the position accuracy of the wafer, and improve the position accuracy of the wafer on the suction cup mechanism.

[0027] The semiconductor adsorption assembly includes the semiconductor adsorption assembly described above, and the connection reliability and relative position stability between the suction cup mechanism, the extension arm mechanism and the blocking arm are ensured by the clamping seat mechanism. Moreover, the clamping seat serves as an intermediate adapter of the air path, which ensures the reliability and sealing of the air path between the suction cup airway of the suction cup mechanism and the extension arm airway, thereby preventing the unstable airflow of the suction cup mechanism from affecting the position accuracy of the wafer, and improving the assembly convenience of the semiconductor handling equipment and the position accuracy of the wafer being handled. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural perspective view of a semiconductor adsorption assembly provided by an embodiment of the utility model;

[0029] Figure 2 It is a schematic diagram of the structural disassembly of a semiconductor adsorption component provided by an embodiment of the utility model;

[0030] Figure 3 It is a structural schematic diagram of a blocking arm provided by an embodiment of the utility model installed in a clamping seat mechanism;

[0031] Figure 4 It is a schematic diagram of the structural disassembly of the clamping seat mechanism provided in an embodiment of the utility model.

[0032] In the figure:

[0033] 1. Suction cup mechanism; 11. Suction cup airway; 12. Adsorption hole; 13. Suction cup air inlet;

[0034] 2. blocking arm; 21. mounting portion; 22. buffer member; 23. blocking portion; 24. extension portion; 25. blocking foot;

[0035] 3. Clamping seat mechanism; 31. Clamping seat; 311. First avoidance groove; 312. First clamping plate; 3121. Air chamber; 3122. Upper plate body; 3123. Sealing cover plate; 3124. Sealing ring; 313. Second clamping plate; 314. Clamping groove; 315. Clamping seat airway; 32. Mounting seat; 321. First connecting seat; 322. Second connecting seat; 323. Mounting groove; 324. Second avoidance groove; 33. First fastener; 34. Second fastener; 4. Extension arm mechanism; 41. Extension arm airway; 5. Third fastener. DETAILED DESCRIPTION

[0036] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0037] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0040] like Figures 1 to 4 As shown, the present embodiment first provides a clamping seat mechanism 3, which is used to install the suction cup mechanism 1, the blocking arm 2 and the extension arm mechanism 4. The suction cup mechanism 1 is provided with a suction cup airway 11 connected to an external air source to adsorb the wafer; the blocking arm 2 is used to block the wafer to prevent the wafer from sliding on the suction cup mechanism 1; the extension arm mechanism 4 is provided with an extension arm airway 41 connected to an external air source to increase the adsorption range that the suction cup mechanism 1 can reach. The clamping seat mechanism 3 can be detachably connected to the suction cup mechanism 1, the blocking arm 2 and the extension arm mechanism 4 at the same time, which is convenient for assembly. The clamping seat mechanism 3 is used as the installation reference, so that the suction cup mechanism 1, the extension arm mechanism 4 and the blocking arm 2 are installed as a whole, ensuring the connection reliability between the suction cup mechanism 1, the blocking arm 2 and the extension arm mechanism 4. Moreover, the clamping seat mechanism 3 ensures that the relative position of the blocking arm 2 and the suction cup mechanism 1 is fixed, and the limit of the blocking arm 2 can accurately adjust and limit the position of the wafer on the suction cup mechanism 1, thereby ensuring the uniqueness of the position of the wafer on the suction cup mechanism 1. The extension arm mechanism 4 is provided with an extension arm airway 41 connected to an external air source, and the clamping seat mechanism 3 is provided with a clamping seat airway 315, one end of the clamping seat airway 315 is connected to the extension arm airway 41, and the other end is connected to the suction cup airway 11 of the suction cup mechanism 1. The clamping seat 31 is used as an intermediate adapter of the airway to achieve stable connection between the suction cup airway 11 and the extension arm airway 41, ensuring the reliability and sealing of the airway connection, thereby ensuring the airflow stability of the suction cup airway 11, avoiding the influence of unstable airflow on the position accuracy of the wafer, and improving the position accuracy of the wafer on the suction cup mechanism 1.

[0041] In one embodiment, the clamping seat mechanism 3 includes a clamping seat 31 and a mounting seat 32. The clamping seat 31 is used to clamp the suction cup mechanism 1, and the mounting seat 32 is used to clamp the blocking arm 2. The mounting seat 32 is detachable from the clamping seat 31. This modular processing and assembly method can reduce the processing difficulty of the clamping seat mechanism 3.

[0042] Specifically, the mounting base 32 includes a first connecting base 321 and a second connecting base 322, which are connected to form a mounting groove 323. The first connecting base 321 and the second connecting base 322 can be arranged up and down, or left and right, and are not limited to the drawings of this embodiment. The blocking arm 2 is clamped in the mounting groove 323, and then the first connecting base 321 and the second connecting base 322 are connected by the second fastener 34, so that the blocking arm 2 can be easily disassembled.

[0043] In order to reduce the length requirement of the second fastener 34 and make the first connection seat 321 and the second connection seat 322 easy to install, a second avoidance groove 324 is provided on the first connection seat 321 or the second connection seat 322, and the second fastener 34 is arranged in the second avoidance groove 324. The second avoidance groove 324 reduces the thickness that the second fastener 34 needs to pass through on the first connection seat 321 or the second connection seat 322, so a second fastener 34 with a shorter length can be used, making the clamping seat mechanism 3 lightweight.

[0044] Similarly, in one embodiment, a first avoidance groove 311 is also opened on the clamping seat 31, and the clamping seat mechanism 3 also includes a first fastener 33, which passes through the bottom of the first avoidance groove 311 to connect the clamping seat 31 and the mounting seat 32, thereby reducing the length requirement of the first fastener 33 and further making the clamping seat mechanism 3 lightweight.

[0045] The first fastener 33 can connect the clamping seat 31 and the mounting seat 32 while penetrating the first connecting seat 321 and the second connecting seat 322 to increase the connection reliability between the first connecting seat 321 and the second connecting seat 322 and provide more stable clamping of the blocking arm 2.

[0046] In order to improve the convenience of assembly and disassembly and position stability of the suction cup mechanism 1, the clamping seat 31 includes a first clamping plate 312 and a second clamping plate 313 that are detachably connected. A clamping groove 314 with an opening is formed between the first clamping plate 312 and the second clamping plate 313. The suction cup mechanism 1 can be clamped in the clamping groove 314 through the opening. The clamping groove 314 is connected to the other end of the clamping seat airway 315 away from the extension arm airway 41. The suction cup mechanism 1 is provided with a suction cup air inlet 13 connected to the suction cup airway 11. Therefore, when the suction cup mechanism 1 is clamped in the clamping groove 314, the suction cup air inlet 13 of the suction cup mechanism 1 can be located in the clamping groove 314, and the suction cup airway 11 of the suction cup mechanism 1 is connected to the extension arm airway 41 through the clamping seat airway 315. By locking the first clamping plate 312 and the second clamping plate 313, the suction cup mechanism 1 can be fixed, and the clamping seat 31 is easy to disassemble and assemble. By improving the processing accuracy and installation accuracy of the first clamping plate 312 and the second clamping plate 313 , the sealing between the suction cup air passage 11 and the extension arm air passage 41 can be ensured, thereby improving the position accuracy of the suction cup mechanism 1 in sucking the wafer.

[0047] Specifically, the clamping groove 314 is arranged on the second clamping plate 313, the clamping seat air passage 315 is arranged on the first clamping plate 312, and the first clamping plate 312 is also provided with an air chamber 3121 connected to the clamping seat air passage 315, the air chamber 3121 is connected to the clamping groove 314, and the air chamber 3121 has a certain volume, and can accommodate a filter element (not shown in the figure) to improve the cleanliness of the gas and avoid contamination of the wafer. When the suction cup mechanism 1 is clamped in the clamping groove 314, the suction cup air inlet 13 of the suction cup mechanism 1 is located in the clamping groove 314 and aligned with the air chamber 3121, so as to achieve the connection of the air path.

[0048] In order to reduce the difficulty of assembly, the first clamping plate 312 includes an upper plate body 3122 and a sealing cover plate 3123. The air chamber 3121 is arranged through the upper plate body 3122. The sealing cover plate 3123 is detachably connected to the upper plate body 3122 to close one end of the air chamber 3121, so that the other end of the air chamber 3121 is connected to the clamping groove 314. In this way, a filter can be placed into the air chamber 3121 from the upper plate body 3122, and then the air chamber 3121 is blocked by the sealing cover plate 3123. A sealing ring 3124 is provided between the upper plate body 3122 and the sealing cover plate 3123 to improve the sealing performance of the air chamber 3121.

[0049] The clamping seat mechanism 3 realizes the detachable connection of the extension arm mechanism 4 through the third fastener 5. The third fastener 5 is a screw, which passes through one end of the extension arm mechanism 4 and is threadedly connected to the clamping seat 31 of the clamping seat mechanism 3, and is easy to disassemble and assemble, so that the air outlet end of the extension arm airway 41 is connected to the air receiving cavity 3121. In this way, the installation of the extension arm mechanism 4 and the suction cup mechanism 1 is realized through a clamping seat 31, and it is ensured that the extension arm airway 41 is connected to the suction cup airway 11 of the suction cup mechanism 1 through the air receiving cavity 3121 and the clamping groove 314.

[0050] The embodiment of the utility model secondly provides a semiconductor adsorption component, which includes the above-mentioned clamping seat mechanism 3. The semiconductor adsorption component also includes a suction cup mechanism 1, an extension arm mechanism 4 and a blocking arm 2, which can be detachably connected to the clamping seat mechanism 3 for easy assembly. The suction cup mechanism 1 is provided with a suction cup airway 11 connected to an external air source, and a suction hole 12 is provided at the end of the suction cup airway 11 to generate suction. The suction cup mechanism 1 can use the suction force to adsorb the wafer from above the wafer. The blocking arm 2 is used to block the wafer to prevent the wafer from slipping on the suction cup mechanism 1.

[0051] The clamping seat mechanism 3 is used as the installation reference to make the suction cup mechanism 1, the extension arm mechanism 4 and the blocking arm 2 installed as a whole, so as to ensure the connection reliability between the suction cup mechanism 1, the blocking arm 2 and the extension arm mechanism 4. The blocking arm 2 is extended around the suction cup mechanism 1, and the relative position of the blocking arm 2 and the suction cup mechanism 1 is fixed by the clamping seat mechanism 3. The limit of the blocking arm 2 can accurately adjust and limit the position of the wafer on the suction cup mechanism 1, so as to ensure the uniqueness of the position of the wafer on the suction cup mechanism 1. The extension arm mechanism 4 is provided with an extension arm airway 41 connected to the external air source, and one end of the clamping seat airway 315 of the clamping seat mechanism 3 is connected to the extension arm airway 41. The clamping seat 31 is used as an intermediate adapter of the airway to realize the connection between the suction cup airway 11 of the suction cup mechanism 1 and the extension arm airway 41, so as to ensure the reliability and sealing of the airway connection, thereby ensuring the airflow stability of the suction cup airway 11, avoiding the influence of unstable airflow on the position accuracy of the wafer, and improving the position accuracy of the wafer on the suction cup mechanism 1.

[0052] It should be noted that the suction cup mechanism 1 includes but is not limited to a Bernoulli suction cup structure, and may also be a vacuum suction cup that generates suction through a vacuum generator; the extension arm mechanism 4 extends in the horizontal direction, thereby expanding the reach of the suction cup mechanism 1. This embodiment does not limit the specific structures of the suction cup mechanism 1 and the extension arm mechanism 4.

[0053] In one embodiment, the barrier arm 2 has a mounting portion 21 connected to the clamping seat mechanism 3, and a buffer 22 is arranged between the mounting portion 21 and the clamping seat mechanism 3. The mounting portion 21 is used to realize the installation of the barrier arm 2, for example, the mounting portion 21 can be connected to the clamping seat mechanism 3 by structures such as clamping fixation and clamping fixation. Since the mounting portion 21 is in direct contact with the clamping seat mechanism 3, a buffer 22 is arranged between the mounting portion 21 and the clamping seat mechanism 3, and the buffer 22 has a certain flexibility and can provide a buffering force. When the fastening torque borne by the mounting portion 21 is large, the buffer 22 provides protection for the mounting portion 21, and the fastening torque will not directly act on the barrier arm 2, so as to avoid the brittle barrier arm 2 from being crushed, so that the barrier arm 2 can be reliably installed and not easily damaged, and the installation reliability of the barrier arm 2 on the clamping seat mechanism 3 is improved. The flexible buffer 22 also increases the friction between the mounting portion 21 and the clamping seat mechanism 3, and the barrier arm 2 will not be displaced when colliding with the wafer during operation, and the blocking limit accuracy of the barrier arm 2 is high.

[0054] The material of the buffer member 22 is rubber, which has good wear resistance, high temperature resistance, elasticity, and chemical stability, and is suitable for the working conditions of a semiconductor reaction chamber.

[0055] Furthermore, the surface of the mounting portion 21 is provided with anti-slip protrusions, which can be formed by sandblasting a quartz material, further increasing the friction between the mounting portion 21 and the buffer 22, thereby preventing the buffer 22 from detaching from the mounting portion 21, and also preventing the blocking arm 2 from colliding with the wafer during operation and causing changes in angle and position.

[0056] The buffer 22 is a rubber pad, which is embedded in the mounting groove 323 or wrapped on the mounting portion 21. The buffer 22 can be two semi-cylindrical structures, which are respectively embedded and bonded in the mounting grooves 323 of the first connecting seat 321 and the second connecting seat 322. When the first connecting seat 321 and the second connecting seat 322 are closed and connected, the buffers 22 with the two semi-cylindrical structures can wrap the mounting portion 21; or, the buffer 22 is a cylindrical rubber ring, which is wrapped and sleeved on the mounting portion 21 and embedded in the mounting groove 323 with the mounting portion 21.

[0057] In one embodiment, the blocking arm 2 also includes a blocking portion 23 and an extension portion 24. The blocking portion 23 surrounds the suction cup mechanism 1 to block the wafer, and its length and curvature are set according to the size of the wafer. The blocking portion 23 also has a plurality of spaced blocking feet 25 to contact the wafer, reduce the contact area with the wafer, and reduce contact scratches on the wafer. The two ends of the extension portion 24 are respectively connected to the blocking portion 23 and the mounting portion 21. The extension portion 24 is L-shaped and the mounting portion 21 is vertically connected to the end of the extension portion 24 to form a U-shaped structure, which improves the structural stability of the blocking arm 2. Moreover, the extension portion 24 is away from the clamping seat mechanism 3 to avoid touching the blocking arm 2 when the clamping seat mechanism 3 is disassembled and assembled, which is safer.

[0058] Optionally, the semiconductor adsorption component has two blocking arms 2, and the two blocking arms 2 are symmetrically arranged on both sides of the suction cup mechanism 1 to perform surrounding limiting on the wafer.

[0059] Finally, the embodiment of the utility model also provides a semiconductor handling equipment, which includes the above-mentioned semiconductor adsorption assembly. The semiconductor handling equipment also includes a manipulator, which is detachably connected to the semiconductor adsorption assembly. The semiconductor adsorption assembly ensures the connection reliability and relative position stability between the suction cup mechanism 1, the extension arm mechanism 4 and the blocking arm 2 through the clamping seat mechanism 3. Moreover, the clamping seat 31 serves as an intermediate adapter of the air path, which ensures the reliability and sealing of the air path connection between the suction cup airway 11 of the suction cup mechanism 1 and the extension arm airway 41, avoids the unstable airflow of the suction cup mechanism 1 from affecting the position accuracy of the wafer, and improves the position accuracy of the semiconductor handling equipment in handling the wafer.

[0060] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A clamping seat mechanism, used for mounting a suction cup mechanism (1), a blocking arm (2) and an extension arm mechanism (4), characterized in that: The clamping seat mechanism (3) can be detachably connected to the suction cup mechanism (1), the blocking arm (2) and the extension arm mechanism (4) at the same time. The clamping seat mechanism (3) is provided with a clamping seat air channel (315). One end of the clamping seat air channel (315) can be connected to the extension arm air channel (41) of the extension arm mechanism (4), and the other end can be connected to the suction cup air channel (11) of the suction cup mechanism (1).

2. The clamping seat mechanism according to claim 1, characterized in that: The clamping seat mechanism (3) comprises a clamping seat (31) and a mounting seat (32); the clamping seat (31) is used to clamp the suction cup mechanism (1); the mounting seat (32) is used to clamp the blocking arm (2); and the mounting seat (32) is detachable from the clamping seat (31).

3. The clamping seat mechanism according to claim 2, characterized in that: The mounting seat (32) comprises a first connecting seat (321) and a second connecting seat (322); the first connecting seat (321) and the second connecting seat (322) are connected to form a mounting groove (323); the blocking arm (2) is clamped in the mounting groove (323).

4. The clamping seat mechanism according to claim 2, characterized in that: The clamping seat (31) is provided with a first avoidance groove (311), and the clamping seat mechanism (3) further comprises a first fastener (33), wherein the first fastener (33) passes through the bottom of the first avoidance groove (311) to connect the clamping seat (31) and the mounting seat (32).

5. The clamping seat mechanism according to claim 2, characterized in that: The clamping seat (31) comprises a first clamping plate (312) and a second clamping plate (313) which are detachably connected, a clamping groove (314) having an opening is formed between the first clamping plate (312) and the second clamping plate (313), and the suction cup mechanism (1) can be clamped in the clamping groove (314) via the opening, and the clamping groove (314) is connected to the other end of the clamping seat airway (315) away from the extension arm airway (41); the suction cup mechanism (1) is provided with a suction cup air inlet (13) connected to the suction cup airway (11), and the suction cup air inlet (13) can be located in the clamping groove (314).

6. The clamping seat mechanism according to claim 5, characterized in that: The clamping groove (314) is arranged on the second clamping plate (313), and the clamping seat air channel (315) is arranged on the first clamping plate (312). The first clamping plate (312) is also provided with an air accommodating cavity (3121) connected to the clamping seat air channel (315), and the air accommodating cavity (3121) is connected to the clamping groove (314), and the air accommodating cavity (3121) is used to accommodate a filter element.

7. The clamping seat mechanism according to claim 6, characterized in that: The first clamping plate (312) comprises an upper plate body (3122) and a sealing cover plate (3123), the air-containing cavity (3121) is arranged through the upper plate body (3122), and the sealing cover plate (3123) is detachably connected to the upper plate body (3122) to close one end of the air-containing cavity (3121), so that the other end of the air-containing cavity (3121) is connected to the clamping groove (314); and / or, The clamping seat mechanism (3) also has a third fastener (5), which passes through one end of the extension arm mechanism (4) and is connected to the clamping seat (31), so that the air outlet end of the extension arm airway (41) is connected to the air containing cavity (3121).

8. A semiconductor adsorption component, characterized in that: It comprises a clamping seat mechanism as described in any one of claims 1 to 7, and the semiconductor adsorption component also comprises a suction cup mechanism (1), a blocking arm (2) and an extension arm mechanism (4), the suction cup mechanism (1) is provided with a suction cup airway (11), the suction cup mechanism (1) is used to adsorb wafers, and the blocking arm (2) is used to block the wafers, the suction cup mechanism (1), the extension arm mechanism (4) and the blocking arm (2) are all detachably connected to the clamping seat mechanism (3), and the blocking arm (2) is extended around the suction cup mechanism (1), the extension arm mechanism (4) is provided with an extension arm airway (41) connected to an external air source, and one end of the clamping seat airway (315) of the clamping seat mechanism (3) is connected to the extension arm airway (41).

9. The semiconductor adsorption assembly according to claim 8, characterized in that: The blocking arm (2) has a mounting portion (21) connected to the clamping seat mechanism (3), and a buffer member (22) is provided between the mounting portion (21) and the clamping seat mechanism (3).

10. The semiconductor adsorption assembly according to claim 9, characterized in that: The surface of the mounting portion (21) is provided with anti-slip protrusions; and / or, The blocking arm (2) further comprises a blocking portion (23) and an extending portion (24), wherein the blocking portion (23) surrounds the suction cup mechanism (1) to block the wafer, and two ends of the extending portion (24) are respectively connected to the blocking portion (23) and the mounting portion (21), the extending portion (24) is L-shaped and the mounting portion (21) is vertically connected to the end of the extending portion (24) to form a U-shaped structure; and / or, The semiconductor adsorption component comprises two blocking arms (2), and the two blocking arms (2) are symmetrically arranged on both sides of the suction cup mechanism (1); and / or, The semiconductor adsorption assembly further comprises a third fastener (5), wherein the third fastener (5) passes through the extension arm mechanism (4) to be detachably connected to the clamping seat mechanism (3); and / or, The buffer member (22) is a rubber pad, and the rubber pad is embedded in the mounting groove (323) of the clamping seat mechanism (3) or wrapped on the mounting portion (21).

11. Semiconductor handling equipment, characterized in that It comprises the semiconductor adsorption assembly as described in any one of claims 8 to 10, and the semiconductor handling equipment further comprises a manipulator, and the manipulator is detachably connected to the semiconductor adsorption assembly.

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