Section bar vapor chamber radiator

By adopting vacuum cavity and capillary structure in the profile heat sink, combined with the design of multi-directional heat sink, the installation limitations of existing heat sinks are solved, and efficient heat conduction and dissipation are achieved, which enhances the Installation stability, adapt to different application scenarios.

CN222320248UActive Publication Date: 2025-01-07李奕伯
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Patent Information

Application Number
CN202421117421.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-22
Publication Date
2025-01-07
Estimated Expiration
2034-05-22

AI Technical Summary

Technical Problem

The installation and application scenarios of existing heat-efficient plate radiators are relatively limited, and it is difficult to meet the heat dissipation needs of high heat flow density, resulting in an increase in the temperature of the power device and affecting the service life.

Method used

A profile heat-sink plate radiator was designed. The radiator body with a square structure has a vacuum cavity and a capillary structure. The working medium vaporizes and expands after being heated and conducts heat, and achieves high efficiency through multiple radiators extending in different directions. Thermal dissipation increases the flexibility of the installation slot to suit various installation environments.

Benefits of technology

It realizes efficient heat conduction and dissipation, enhances the installation stability and adaptability of the radiator, meets the needs of different users, and extends the service life of the power device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of radiators, and particularly discloses a section bar vapor chamber radiator which comprises a radiator body, the radiator body is of a square structure and is provided with a vacuum inner cavity, and a capillary structure is arranged in the vacuum inner cavity of the radiator body. A plurality of first cooling fins extending in the first direction are arranged on one side of the radiator body, a plurality of second cooling fins extending in the second direction are arranged on the other side of the radiator body, the first direction is opposite to the second direction, and a first installation groove is formed in the first end of the radiator body. A second mounting groove is formed in the second end of the radiator body, the notch of the first mounting groove faces the direction parallel to the first direction, and the notch of the second mounting groove faces the direction perpendicular to the second direction; according to the scheme, through the infiltration effect of the capillary structure, the working medium in the vacuum inner cavity can be conveyed to the whole heating area; meanwhile, the first radiating fins and the second radiating fins are arranged in parallel, so that the profile vapor chamber radiator can adapt to various installation environments more flexibly, and the requirements of different users are met.
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Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a profiled heat spreader radiator. Background Art

[0002] With the rapid development of semiconductor technology, the integration of high-power components is getting higher and higher, the power density is getting higher and higher, the heat generated during operation is getting larger and larger, and the heat flux density is getting higher and higher. Conventional heat sinks can hardly meet the heat dissipation needs of high heat flux density. If the heat generated by the power device cannot be dissipated quickly and in time, the chip temperature in the power device will increase, which will cause the working efficiency to be reduced and the service life to be shortened, and even cause the device to be damaged and fail.

[0003] In the related art, a heat spreader is usually used for heat dissipation, which uses the phase change principle to achieve rapid heat transfer and dissipation, and has the characteristics of high heat dissipation efficiency and good heat dissipation uniformity. However, the installation and application scenarios of the heat spreader in the related art are relatively limited. Utility Model Content

[0004] The utility model discloses a profiled vapor chamber radiator, which aims to solve the technical problem that the installation and application scenarios of the radiator in the related art are relatively limited.

[0005] In order to solve the above problems, the utility model adopts the following technical solutions:

[0006] The present application provides a profiled heat spreader heat sink, which includes a heat spreader body, the heat spreader body is a square structure, the heat spreader body has a vacuum inner cavity, and the heat spreader body is provided with a capillary structure in the vacuum inner cavity; one side of the heat spreader body is provided with a plurality of first heat sinks extending along a first direction, and the other side of the heat spreader body is provided with a plurality of second heat sinks extending along a second direction, and the first direction is opposite to the second direction; the heat spreader body is provided with a first mounting groove at its first end, and the heat spreader body is provided with a second mounting groove at its second end, the notch of the first mounting groove is oriented parallel to the first direction, and the notch of the second mounting groove is oriented perpendicular to the second direction.

[0007] Furthermore, the radiator body is further provided with a third mounting groove at the first end thereof, and the groove opening direction of the third mounting groove is perpendicular to the groove opening direction of the first mounting groove.

[0008] Further, the vacuum inner cavity includes a first cavity segment and a second cavity segment, wherein the first cavity segment extends perpendicular to the first direction, and the second cavity segment is inclined relative to the first direction; the second cavity segment extends between the second mounting groove and the third mounting groove, and the plurality of second heat sinks include a first part and a second part, wherein the first part corresponds to the second cavity segment, and the second part corresponds to the second mounting groove.

[0009] Further, among the second heat sinks of the first portion, an end portion of the second heat sink adjacent to the second portion is recessed into ends of two adjacent second heat sinks.

[0010] Furthermore, a working medium is arranged in the vacuum cavity, and the working medium is acetone.

[0011] Furthermore, the heat sink body is provided with longitudinally extending reinforcing ribs in the vacuum cavity, the upper ends of the reinforcing ribs are lower than the upper surface of the heat sink body, and the lower ends of the reinforcing ribs are higher than the lower surface of the heat sink body.

[0012] Furthermore, the reinforcing rib is provided with a hollow structure which transversely penetrates the reinforcing rib.

[0013] Furthermore, the profile vapor chamber heat sink further comprises an end cover, and the end cover covers the upper opening of the vacuum cavity.

[0014] Furthermore, the profile vapor chamber radiator further comprises a sealing valve, and the sealing valve is arranged at the upper opening of the vacuum inner cavity.

[0015] Furthermore, the sealing valve includes a valve body, a stud and a sealing steel ball, wherein the valve body has a first hole section and a second hole section that are coaxially connected, the aperture of the first hole section is larger than the aperture of the second hole section, the sealing steel ball is arranged in the first hole section, the stud is threadedly engaged in the first hole section, and the stud is configured to spin the sealing steel ball to seal the second hole section.

[0016] The technical solution adopted by the utility model can achieve the following beneficial effects:

[0017] The profile heat spreader heat sink of the present application provides a capillary structure in the vacuum cavity. The capillary structure soaks the working medium and can deliver the working medium to the entire heating area. When the heat from the heat source is transferred to the heating area, the working medium in the vacuum cavity vaporizes after being heated and rapidly expands to fill the vacuum cavity, and then transfers the heat to the first heat sink and the second heat sink, thereby transferring the heat to the external environment through the first heat sink and the second heat sink. When the working medium contacts the cavity wall with a lower temperature, condensation occurs. The condensed working medium can flow back to the bottom of the vacuum cavity under the action of gravity to perform the evaporation and condensation cycle again.

[0018] At the same time, by arranging the first heat sink and the second heat sink on both sides of the radiator body in parallel, the radiator body can form a second mounting groove at its second end which is perpendicular to the groove direction of the first mounting groove. In this way, the profile heat spreader radiator can be more flexibly adapted to various installation environments and meet the needs of different users. Moreover, the groove directions of the first mounting groove and the second mounting groove are different. When they are jointly applied to the installation arrangement of the entire profile heat spreader radiator, the stability of the overall structure of the profile heat spreader radiator after installation and fixation can be enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is one of the structural schematic diagrams of the radiator body of the embodiment of the present application;

[0021] Figure 2 This is the second structural schematic diagram of the radiator body of the embodiment of the present application;

[0022] Figure 3 is a schematic structural diagram of a profile vapor chamber heat sink according to an embodiment of the present application;

[0023] Figure 4 is a schematic structural diagram of a sealing valve according to an embodiment of the present application;

[0024] Figure 5 is a schematic diagram of the flow of the working medium in the embodiment of the present application;

[0025] Figure 6 This is the third structural schematic diagram of the radiator body of the embodiment of the present application.

[0026] In the figure:

[0027] 100, radiator body; 100a, heating area; 110, vacuum cavity; 130, first heat sink; 140, second heat sink; 150, first mounting groove; 160, second mounting groove; 170, third mounting groove; 180, reinforcing rib; 200, end cover; 300, sealing valve; 310, valve body; 311, first hole section; 312, second hole section; 320, stud; 330, sealing steel ball; 400, capillary structure; 500, working medium. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the utility model.

[0029] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0030] In the development history of bipolar device heat sinks, it has gone through three stages: profile heat sinks, profile heat pipe heat sinks and profile VC vapor chamber heat sinks. Among them, the profile VC vapor chamber heat sink absorbs heat through the evaporation and condensation of liquid substances. It has higher heat dissipation efficiency and can more effectively control the temperature of bipolar devices. In addition, the profile VC vapor chamber heat sink can also take away the heat of the heating element from all directions, optimize the heat dissipation efficiency, and make the entire heating element more balanced and more stable.

[0031] The following is combined with Figures 1 to 6 , the profile heat sink provided in the embodiment of the present application is described in detail through specific embodiments and application scenarios.

[0032] See also Figure 1 to Figure 3 The present application provides a profile vapor chamber radiator, the profile vapor chamber radiator disclosed comprises a radiator body 100, wherein, see Figure 1The radiator body 100 is a square structure, and the radiator body 100 can be formed by processing an aluminum profile. The radiator body 100 has a vacuum inner cavity 110. The radiator body 100 has a heating area 100a at a position corresponding to the vacuum inner cavity 110. The outer wall surface of the heating area 100a is used to connect with the heat source, that is, the heat emitted by the heat source can be first conducted to the heating area 100a.

[0033] In the embodiment of the present application, a working medium 500 (for example, water or acetone) is disposed in the vacuum cavity 110, and a capillary structure 400 is disposed in the vacuum cavity 110. For example, see Figure 1 , Figure 2 and Figure 5 The capillary structure 400 can be extended longitudinally, and the capillary structure 400 can be attached to the inner wall surface of the vacuum cavity 110 near the heating area 100a. Based on the capillary phenomenon of the capillary structure 400, the capillary structure 400 soaks the working medium 500 and can deliver the working medium 500 to the entire heating area 100a. In this way, when the heat of the heat source is transferred to the heating area 100a, the working medium 500 in the vacuum cavity 110 will be vaporized after being heated and will expand rapidly to fill the vacuum cavity 110. In other words, this method can quickly generate a large amount of gaseous working medium 500 that fills the vacuum cavity 110, and will absorb a large amount of heat in the process, thereby effectively reducing the temperature of the heat source. When the steam contacts the cavity wall with a lower temperature, it begins to condense and release heat. During the condensation process, the working medium 500 changes from gas to liquid, and releases the previously absorbed heat at the same time.

[0034] Please continue to see Figure 1 and Figure 2 A plurality of first heat sinks 130 extending along a first direction are disposed on one side of the heat sink body 100, and a plurality of second heat sinks 140 extending along a second direction are disposed on the other side of the heat sink body 100. The first direction is opposite to the second direction. The first heat sinks 130 and the second heat sinks 140 can quickly transfer the heat in the vacuum cavity 110 to the surrounding environment, further reducing the temperature of the vacuum cavity 110, thereby realizing effective heat dissipation.

[0035] The radiator body 100 is provided with a first mounting groove 150 at its first end, and the notch of the first mounting groove 150 is oriented in the same direction as the first direction. The first end of the radiator body 100 is the end position of the radiator body 100 in the first direction, and the entire profile heat spreader radiator can be connected and fixed to the mounting bracket of the external environment through the first mounting groove 150. For example, a connection block can be placed in the first mounting groove 150, and the threaded connector can pass through the mounting bracket and threadedly cooperate with the connection block, so as to connect and fix the profile heat spreader radiator to the mounting bracket.

[0036] In the embodiment of the present application, the radiator body 100 is provided with a second mounting groove 160 at its second end, and the notch direction of the second mounting groove 160 is perpendicular to the second direction, wherein the second end of the radiator body 100 is the end position of the radiator body 100 in the second direction. It can be understood that the second heat sink 140 and the first heat sink 130 extend opposite to each other, so that the radiator body 100 at its second end and at the positions on both sides of the second direction can form the setting area of ​​the second mounting groove 160, and the notch direction of the second mounting groove 160 can be perpendicular to the second direction.

[0037] Based on the above scheme, by arranging the capillary structure 400 in the vacuum cavity 110, the capillary structure 400 soaks the working medium 500 and can deliver the working medium 500 to the entire heating area 100a. When the heat of the heat source is transferred to the heating area 100a, the working medium 500 in the vacuum cavity 110 is vaporized after being heated and rapidly expands to fill the vacuum cavity 110. In this process, a large amount of heat can be rapidly absorbed, and the temperature of the heat source can be effectively reduced. At the same time, by arranging the first heat sink 130 and the second heat sink 140 in parallel, the radiator body 100 can form a second mounting groove 160 at its second end that is perpendicular to the groove direction of the first mounting groove 150. In this way, the profile heat spreader radiator can be more flexibly adapted to various installation environments and meet the needs of different users. In addition, the groove directions of the first mounting groove 150 and the second mounting groove 160 are different. When they are jointly applied to the installation arrangement of the entire profile heat spreader radiator, the stability of the overall structure of the profile heat spreader radiator after installation and fixation can be enhanced.

[0038] In a further technical solution, the radiator body 100 is further provided with a third mounting groove 170 at its first end, and the slot orientation of the third mounting groove 170 is perpendicular to the slot orientation of the first mounting groove 150. Exemplarily, the slot orientation of the third mounting groove 170 is consistent with the slot orientation of the second mounting groove 160. It can be understood that when the entire profile heat sink radiator does not have the conditions for using the first mounting groove 150 for installation and fixation, the third mounting groove 170 adjacent to the first mounting groove 150 can be flexibly used to achieve the installation and fixation of the profile heat sink radiator, which has the characteristic of strong installation flexibility.

[0039] In the examples of this application, see Figure 2The vacuum cavity 110 includes a first cavity section and a second cavity section, wherein the first cavity section extends perpendicularly to the first direction, the second cavity section is inclined relative to the first direction, and the second cavity section extends between the second mounting groove 160 and the third mounting groove 170. With such a configuration, when the size of the entire profile heat spreader is determined, while ensuring the convenience of installation, the layout space of the vacuum cavity 110 and the distribution number of the first heat sink 130 and the second heat sink 140 can be expanded as much as possible, thereby ensuring the efficient heat dissipation effect of the profile heat spreader.

[0040] In the examples of this application, please continue to refer to Figure 2 , the plurality of second heat sinks 140 include a first part and a second part, the first part and the second part respectively include a plurality of second heat sinks 140, wherein the first part corresponds to the second cavity section, and the second part corresponds to the second mounting groove 160. On the one hand, through the provision of the second heat sink 140 of the second part, it is necessary to shift the opening position of the second mounting groove 160 toward the inner side of the radiator body 100 to avoid the second heat sink 140 of the second part, so as to avoid the second mounting groove 160 being excessively provided at the end position close to the second end and affecting the stability of the overall structure of the radiator body 100. On the other hand, through the provision of the second heat sink 140 of the second part, the heat dissipation area between the entire radiator body 100 and the external environment can be increased as much as possible, thereby improving the heat dissipation efficiency of the profile heat sink radiator.

[0041] In a further technical solution, among the several second heat sinks 140 of the first part, the end of the second heat sink 140 adjacent to the second part is recessed in the ends of the two adjacent second heat sinks 140. In this way, the recessed design can make the second heat sink 140 more stable during molding and demolding, thereby improving the molding yield of the radiator body 100.

[0042] In the embodiment of the present application, the capillary structure 400 may be a pressed wire mesh, a carbon fiber, a capillary copper mesh, a sintered metal powder or a capillary groove.

[0043] In the embodiment of the present application, the working medium 500 is preferably acetone. On the one hand, acetone, as the evaporating and condensing working medium 500, has a low boiling point, and acetone is more easily converted from liquid to gas, thereby absorbing more heat, which can improve the heat dissipation efficiency of the entire profile heat sink; on the other hand, acetone is relatively stable and has no corrosive effect on profiles, especially aluminum profiles, thereby ensuring the heat dissipation efficiency of the profile heat sink.

[0044] In the optional embodiments of this application, see Figure 2 and Figure 5The vacuum cavity 110 may be an integral through-type structure, so that when the heat source is dissipated, the gaseous working medium 500 in the vacuum cavity 110 may be rapidly diffused into the vacuum cavity 110 .

[0045] In the optional embodiments of this application, see Figure 6 The radiator body 100 is provided with longitudinally extending reinforcing ribs 180 between the vacuum inner chamber 110. The reinforcing ribs 180 can improve the strength, stability and rigidity of the entire radiator body 100 structure and prevent the radiator body 100 from being greatly deformed. The upper end of the reinforcing rib 180 is lower than the upper surface of the radiator body 100, and the lower end of the reinforcing rib 180 is higher than the lower surface of the radiator body 100. The reinforcing rib 180 is recessed relative to the upper and lower surfaces of the radiator body 100 to form a flow gap for the working medium.

[0046] In a further technical solution, when reinforcing ribs 180 are provided in the vacuum cavity 110, a plurality of hollow structures (not shown in the figure) that transversely penetrate the reinforcing ribs 180 may also be provided on the reinforcing ribs 180. In this way, it can ensure the reinforcement effect of the structure of the entire radiator body 100 and at the same time ensure that the evaporated gaseous working medium can quickly diffuse into the vacuum cavity 110 for heat exchange.

[0047] In the examples of this application, see Figure 3 The profile heat sink also includes an end cover 200 and a sealing valve 300. The end cover 200 is arranged at the opening of the vacuum cavity 110, and the sealing valve 300 is arranged at the upper opening of the vacuum cavity 110. After the end cover 200 and the sealing valve 300 are assembled to the opening of the vacuum cavity 110, the opening of the vacuum cavity 110 can be sealed by welding and gluing, thereby ensuring that the internal environment of the vacuum cavity 110 is isolated from the external environment and avoiding leakage of the working medium.

[0048] In a further technical solution, the sealing valve 300 includes a valve body 310, a stud 320 and a sealing steel ball 330. The valve body 310 has a first hole section 311 and a second hole section 312 that are coaxially connected. The aperture of the first hole section 311 is larger than the aperture of the second hole section 312. The sealing steel ball 330 is arranged in the first hole section 311. The stud 320 is threadedly engaged in the first hole section 311. The stud 320 is configured to spin the sealing steel ball 330 to seal the second hole section 312. Through the sealing valve 300, the vacuum cavity 110 can be evacuated. Specifically, liquid working medium can be injected into the vacuum cavity 110 through the first hole section 311 and the second hole section 312 to heat the radiator body 100. The liquid working medium reaches the boiling point and changes to a gaseous state. Other working media can discharge the air through the first hole section 311 and the second hole section 312. When the air is exhausted, the sealing steel ball 330 and the stud 320 are quickly inserted, and the stud 320 is screwed in to push the sealing steel ball to achieve the sealing of the second hole section 312. After the radiator body 100 is cooled, the gaseous working medium condenses and returns to a liquid state and is deposited below the vacuum cavity 110, thereby achieving a vacuum state in the area above the vacuum cavity 110, which can effectively remove the air in the system and prevent ice blockage. At the same time, it can eliminate the influence of air on the heat transfer of the working medium and improve the heat dissipation efficiency of the entire profile heat sink.

[0049] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0050] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A profile vapor chamber radiator, characterized in that: The heat sink comprises a heat sink body (100), the heat sink body (100) is a square structure, the heat sink body (100) has a vacuum inner cavity (110), and the heat sink body (100) is provided with a capillary structure in the vacuum inner cavity (110); A plurality of first heat sinks (130) extending along a first direction are disposed on one side of the heat sink body (100), and a plurality of second heat sinks (140) extending along a second direction are disposed on the other side of the heat sink body (100), wherein the first direction is opposite to the second direction; The radiator body (100) is provided with a first mounting groove (150) at its first end, and the radiator body (100) is provided with a second mounting groove (160) at its second end, the notch of the first mounting groove (150) is oriented parallel to the first direction, and the notch of the second mounting groove (160) is oriented perpendicular to the second direction.

2. The profile vapor chamber radiator according to claim 1, characterized in that: The radiator body (100) is further provided with a third mounting groove (170) at its first end, and the groove opening direction of the third mounting groove (170) is perpendicular to the groove opening direction of the first mounting groove (150).

3. The profile vapor chamber radiator according to claim 2, characterized in that: The vacuum inner chamber (110) comprises a first chamber section and a second chamber section, wherein the first chamber section extends perpendicularly to the first direction, and the second chamber section is inclined relative to the first direction; The second cavity section extends between the second mounting groove (160) and the third mounting groove (170), and the plurality of second heat sinks (140) include a first part and a second part, wherein the first part corresponds to the second cavity section, and the second part corresponds to the second mounting groove (160).

4. The profile vapor chamber radiator according to claim 3, characterized in that: In the second heat sink (140) of the first portion, an end portion of the second heat sink (140) adjacent to the second portion is recessed into ends of two adjacent second heat sinks (140).

5. The profile vapor chamber heat sink according to claim 1, characterized in that: A working medium is arranged in the vacuum inner cavity (110), and the working medium is acetone.

6. The profile vapor chamber heat sink according to claim 1, characterized in that: The heat sink body (100) is provided with longitudinally extending reinforcing ribs (180) in the vacuum inner cavity (110), the upper end of the reinforcing ribs (180) is lower than the upper surface of the heat sink body (100), and the lower end of the reinforcing ribs (180) is higher than the lower surface of the heat sink body (100).

7. The profile vapor chamber heat sink according to claim 6, characterized in that: The reinforcing rib (180) is provided with a hollow structure that transversely penetrates the reinforcing rib (180).

8. The profile vapor chamber heat sink according to claim 1, characterized in that: It also includes an end cover (200), wherein the end cover (200) covers the upper opening of the vacuum inner cavity (110).

9. The profile vapor chamber heat sink according to claim 1, characterized in that: It also includes a sealing valve (300), wherein the sealing valve (300) is arranged at the upper opening of the vacuum inner chamber (110).

10. The profile vapor chamber heat sink according to claim 9, characterized in that: The sealing valve (300) comprises a valve body (310), a stud (320) and a sealing steel ball (330); wherein: The valve body (310) comprises a first hole section (311) and a second hole section (312) which are coaxially connected, the aperture of the first hole section (311) being larger than the aperture of the second hole section (312), the sealing steel ball (330) being arranged in the first hole section (311), the stud (320) being threadedly engaged in the first hole section (311), and the stud (320) being configured to spin the sealing steel ball (330) to seal the second hole section (312).