PCB module structure for optimizing electromagnetic wave radiation

Abstract

The utility model relates to the technical field of millimeter wave radars, in particular to a PCB (printed circuit board) module structure for optimizing electromagnetic wave radiation, which comprises a metal shell and a shell cover, the shell cover is provided with a signal emission surface and is detachably arranged with the metal shell, and the shell cover is provided with a PCB parallel to the metal shell, a square-shaped partition plate is further arranged between the PCB and the shell cover, a plurality of warping plates are hinged to the partition plate, a plurality of clamping plates are perpendicularly arranged at the end, facing the shell cover, of the metal shell, the end faces of the warping plates are perpendicular to the clamping plates, and the warping plates can warp up and abut against the PCB when making contact with the clamping plates. According to the utility model, the bottom of the PCB is provided with a layer of separator plate, and the PCB is jacked up by using the warping plate on the separator plate when the shell cover is assembled, so that the warping degree of the PCB is weakened through hard contact, the contact degree between the PCB and the shell is improved, and the possibility of generating a gap is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of millimeter wave radars, and in particular to a PCB module structure for optimizing electromagnetic wave radiation. Background Art

[0002] With the increasing degree of automobile electrification in modern society, more and more electronic devices are being used in automobiles, such as engine control units, in-vehicle entertainment systems, navigation systems, etc. However, these electronic devices will generate electromagnetic radiation during their operation, which may have adverse effects on other electronic devices and wireless communication systems. How to reduce this adverse effect is crucial to ensuring the normal operation of automotive electronic systems and personal safety.

[0003] The prior art discloses an invention patent with a publication number of CN216718689U and a patent name of a millimeter-wave radar module structure, which specifically discloses that a cover body is fixed on the shell, and a first limit portion and a second limit portion are formed on the periphery of the contact surface with the shell from the outside to the inside; the shell and the cover body form an accommodating cavity, and a deformable limit portion is formed on the periphery of the contact position with the cover body from the outside to the inside; the first PCB is clamped and fixed in the accommodating cavity by the second limit portion and the heat dissipation portion; the second PCB is clamped and fixed in the accommodating cavity by the heat dissipation portion and the shell; when the cover body and the shell are installed in place, the deformable limit portion is deformed by pressure and inserted between the first limit portion and the second limit portion.

[0004] The above solution has a simple structure, is easy to assemble, and is fixedly connected by welding technology, which can avoid the defects of the prior art and improve production efficiency.

[0005] In the above technology, the Faraday cage effect is formed by directly bonding the metal back cover to the bare copper area of ​​the PCB board edge to achieve shielding of electromagnetic radiation. However, in the actual production or storage process, the PCB and the metal shell will inevitably produce a certain degree of warping, and the overall end surface is not flat, and the energy of electromagnetic wave radiation is directly related to the length of the gap. Dimensional tolerance and board warping will cause the PCB and the metal shell to not fit completely, and high-frequency electromagnetic waves will leak out along the gap, affecting the shielding effect. Utility Model Content

[0006] Technical issues solved

[0007] In view of the above-mentioned shortcomings of the prior art, the utility model provides a PCB module structure for optimizing electromagnetic wave radiation, which can solve the problem in the prior art that the gap between the millimeter wave radar PCB and the shell caused by warping will affect the shielding effect.

[0008] Technical Solution

[0009] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0010] The utility model provides a PCB module structure for optimizing electromagnetic wave radiation, comprising a metal shell and a shell cover, wherein the shell cover is provided with a signal transmitting surface and is detachably arranged with the metal shell, and the shell cover is provided with a PCB board parallel to the metal shell; wherein a U-shaped partition is further provided between the PCB board and the shell cover, and a plurality of seesaw plates are hinged on the partition plate, a plurality of card plates are vertically provided at one end of the metal shell toward the shell cover, the end surface of the seesaw plate is perpendicular to the card plate, and the seesaw plate can be tilted and abutted against the PCB board when in contact with the card plate.

[0011] Furthermore, a tin dot arrangement is arranged on one end surface of the PCB board facing the metal shell.

[0012] Furthermore, an annular groove is formed along the outer edge of one end of the metal shell facing the shell cover, and a sealing ring which can be embedded in the annular groove is arranged on the end surface of the shell cover.

[0013] Furthermore, a seesaw is hingedly connected in the middle of each of the four sides of the partition, and the upper end of the seesaw is located below the PCB board and is staggered therewith.

[0014] Furthermore, a clamping block is arranged on the inner end surface of the sealing ring, and a clamping opening which cooperates with the clamping block is arranged on the side end surface of the clamping plate.

[0015] Furthermore, four first limiting grooves are arranged at the bottom end of the PCB board, the four first limiting grooves are arranged corresponding to each seesaw respectively, and each first limiting groove is inclined upward from the middle of the PCB board toward the side end of the PCB board.

[0016] Furthermore, each of the seesaws is provided with a second limiting groove at one end facing the clamping plate, and each of the second limiting grooves is inclined downward from the middle of the seesaw toward the side end of the seesaw.

[0017] Furthermore, the tin spot arrangement includes a plurality of tin spots arranged at intervals along the length direction or the width direction of the PCB board, and the plurality of tin spots arranged in the same direction are divided into two columns, and the two columns of tin spots are staggered with each other.

[0018] Beneficial Effects

[0019] Compared with the known public technology, the technical solution provided by the utility model has the following advantages:

[0020] Beneficial effects:

[0021] The utility model sets a partition at the bottom of the PCB board, and uses the seesaw on the partition to lift the PCB board when the upper and shell covers are assembled, thereby weakening the warping degree of the PCB board through hard contact, improving the contact degree between the PCB board and the shell, and reducing the possibility of gap generation;

[0022] By arranging tin dots on the PCB board and using the ductility of tin to fill the warpage of the PCB board and the tolerance of the flatness between the PCB board and the shell, the shielding effect is further guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a schematic diagram of the overall structure of the radar in the embodiment of the utility model;

[0025] Figure 2 In the embodiment of the utility model Figure 1 Schematic diagram of the structure at A in the middle;

[0026] Figure 3 It is a schematic diagram of the overall structure of the radar in the embodiment of the utility model when viewed from above;

[0027] Figure 4 In the embodiment of the utility model Figure 3 Schematic diagram of the structure at B in the middle;

[0028] Figure 5 It is a schematic diagram of the assembly structure of the upper shell cover in the embodiment of the utility model;

[0029] Figure 6 It is a schematic diagram of a partial cross-sectional structure of a radar in an embodiment of the utility model;

[0030] Figure 7 It is a front cross-sectional schematic diagram of the seesaw structure in the embodiment of the utility model.

[0031] The numbers in the figure represent: 1, metal shell; 10, annular groove; 11, card plate; 111, bayonet; 2, shell cover; 20, sealing ring; 201, card block; 21, PCB board; 211, tin point arrangement; 212, first limiting groove; 22, partition; 221, rocker plate; 222, second limiting groove. DETAILED DESCRIPTION

[0032] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0033] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0035] In the description of this embodiment, the terms "upper", "lower", "left", "right", etc., and the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplified operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0036] The utility model is further described below in conjunction with embodiments.

[0037] Example:

[0038] In order to ensure that automotive electronic equipment meets the requirements of automotive electromagnetic radiation standards, the prior art usually adopts the method of adding a shielding cover on the PCB board or using metal upper and lower covers in the structure for complete shielding and suppression. However, when the appearance size is small and the shielding cover and metal upper and lower covers cannot be used, such as a product in which the shell is a combination of a plastic shell and a metal shell, the electromagnetic radiation generated by the electronic equipment in the working state usually adopts the following method: a metal back cover / upper cover is directly bonded to the bare copper area of ​​the edge of the PCB board to form a Faraday cage effect, thereby shielding the electromagnetic radiation. The present application is based on a product in which the shell is a combination of a plastic shell and a metal shell.

[0039] Refer to the attached Figure 1-7As shown, this scheme proposes a PCB module structure for optimizing electromagnetic wave radiation, which mainly includes a metal shell 1 and a shell cover 2. The shell cover 2 is provided with a shielding surface and a signal transmitting surface, and is made of partially wave-transparent material. It is a well-known technology and will not be elaborated on here.

[0040] The shell cover 2 and the metal shell 1 are fixed to each other by screws, and a PCB board 21 parallel to the metal shell 1 is arranged on the shell cover 2 , and a tin point is arranged on one end of the PCB board 21 facing the metal shell 1 .

[0041] However, in the actual manufacturing and SMT process, the PCB board 21 will introduce deformation and thus produce a certain degree of warping, and the contact surface with the metal shell 1 will not be completely fitted. In addition, the metal shell 1 will also have unevenness within the allowable range during the manufacturing process, and the tolerance under the normal uneven state is about ±0.15mm. Therefore, when assembling the metal shell 1 and the PCB board 21, there will be a certain degree of gap in the contact between the metal shell 1 and the PCB board 21, and the wavelengths of electromagnetic waves in different frequency bands are different. The gap length allowed by EMC must be much less than one twentieth of the wavelength. Therefore, the energy of electromagnetic wave radiation is directly related to the length of the gap, that is, the dimensional tolerance causes the PCB and the metal shell 1 to be unable to fit completely, and the electromagnetic waves in the high-frequency band will leak out along the gap, affecting the overall shielding effect.

[0042] Therefore, in the present case, in order to reduce such influence, a U-shaped partition 22 is further provided between the PCB board 21 and the shell cover 2. The partition 22 is fixed to the shell cover 2 by screws or gluing. When placed, the PCB board 21 will fall into the middle cavity of the partition 22. A rocker 221 is hinged in the middle of each of the four sides of the partition 22. The PCB board 21 will be placed on the upper end of the four rockers 221. The upper end of the rocker 221 is located below the PCB board 21 and is offset therefrom.

[0043] Four card plates 11 are vertically arranged at one end of the metal shell 1 facing the shell cover 2. The four card plates 11 and the four seesaw plates 221 are matched one by one. The end surface of each seesaw plate 221 is perpendicular to the card plate 11. At the same time, when the metal shell 1 and the shell cover 2 are matched, the seesaw plate 221 contacts the card plate 11, so that the seesaw plate 221 is tilted and abuts against the end surface of the PCB board 21, so that the board surface of the PCB board 21 is in conflict with the metal shell 1, which improves the degree of fitting and reduces the warping of the PCB board 21.

[0044] In this case, an annular groove 10 is formed along the outer edge of the metal shell 1 at one end facing the shell cover 2 , and a sealing ring 20 which can be embedded in the annular groove 10 is provided on the end surface of the shell cover 2 .

[0045] A block 201 is provided on the inner end surface of the sealing ring 20, and a bayonet 111 that cooperates with the block 201 is provided on the side end surface of the card board 11. When the upper and shell covers are in contact and cooperation, the synchronous movement of the card board 11 will first make the rocker 221 tilt up and contact the end surface of the PCB board 21. Since the card board 11 is made of plastic in this case, the bayonet 111 on the card board 11 will then cooperate and fix with the block 201 to prevent the rebound of the PCB board 21 from affecting the assembly tightness between the upper and shell covers.

[0046] At the same time, in this case, in order to prevent the seesaw 221 from rotating at an excessively large angle, four first limit grooves 212 are provided at the bottom end of the PCB board 21, and each seesaw 221 is provided with a second limit groove 222 at one end facing the card board 11, and the four first limit grooves 212 and the second limit grooves 222 are all distributed in a rectangular shape.

[0047] The four first limiting grooves 212 are respectively provided for each seesaw 221, and each first limiting groove 212 is respectively inclined upward from the middle of the PCB board 21 toward the side end of the PCB board 21, and each second limiting groove 222 is respectively inclined downward from the middle of the seesaw 221 toward the side end of the seesaw 221, so that during the rotation of the seesaw 221, both side ends of the hinge point of the seesaw 221 will have a maximum rotation value, that is, when the two side ends of the seesaw 221 respectively contact the groove walls of the first limiting groove 212 and the second limiting groove 222, the maximum rotation angle will be reached, and the seesaw 221 will also be restricted by the two groove bodies to prevent the two side ends of the seesaw 221 from being separated from the corresponding contact surfaces.

[0048] Furthermore, a tin dot arrangement 211 is provided on one end surface of the PCB board 21 facing the metal shell 1, and the tolerance of the warpage of the PCB and the flatness of the metal shell 1 are filled by the ductility of tin. In addition, the tin dot arrangement 211 includes a plurality of tin dots arranged at intervals along the length direction or the width direction of the PCB board 21, and the plurality of tin dots arranged in the same direction are divided into two columns, and the two columns of tin dots are staggered with each other, thereby ensuring the contact area between the tin dots and the shell. In practice, the height of the finally formed tin dots can be controlled by controlling the amount of tin on the tin dots, so that the gaps in the size chain can be filled by the tin dots.

[0049] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some of the technical features therein by equivalents. These modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A PCB module structure for optimizing electromagnetic wave radiation, characterized in that: include: Metal shell (1); A shell cover (2), wherein the shell cover (2) is provided with a signal transmission surface and is detachably arranged with the metal shell (1), and a PCB board (21) parallel to the metal shell (1) is provided on the shell cover (2); A U-shaped partition (22) is further arranged between the PCB board (21) and the shell cover (2), and a plurality of seesaws (221) are hingedly connected to the partition (22); a plurality of card plates (11) are vertically arranged at one end of the metal shell (1) facing the shell cover (2); the end surface of the seesaw (221) is perpendicular to the card plate (11), and the seesaw (221) can be tilted and abutted against the PCB board (21) when in contact with the card plate (11).

2. The PCB module structure for optimizing electromagnetic wave radiation according to claim 1, characterized in that: A tin dot arrangement (211) is provided on one end surface of the PCB board (21) facing the metal shell (1).

3. The PCB module structure for optimizing electromagnetic wave radiation according to claim 2, characterized in that: An annular groove (10) is provided along the outer edge of one end of the metal shell (1) facing the shell cover (2), and a sealing ring (20) which can be embedded in the annular groove (10) is provided on the end surface of the shell cover (2).

4. The PCB module structure for optimizing electromagnetic wave radiation according to claim 3, characterized in that: A seesaw (221) is hingedly connected in the middle of each of the four sides of the partition (22), and the upper end of the seesaw (221) is located below the PCB board (21) and is staggered therewith.

5. The PCB module structure for optimizing electromagnetic wave radiation according to claim 4, characterized in that: A clamping block (201) is provided on the inner end surface of the sealing ring (20), and a clamping opening (111) matching with the clamping block (201) is provided on the side end surface of the clamping plate (11).

6. The PCB module structure for optimizing electromagnetic wave radiation according to claim 5, characterized in that: Four first limiting grooves (212) are arranged at the bottom end of the PCB board (21), the four first limiting grooves (212) are arranged corresponding to each seesaw (221), and each first limiting groove (212) is inclined upward from the middle of the PCB board (21) toward the side end of the PCB board (21).

7. The PCB module structure for optimizing electromagnetic wave radiation according to claim 6, characterized in that: Each of the seesaw plates (221) is provided with a second limiting groove (222) at one end facing the clamping plate (11), and each of the second limiting grooves (222) is inclined downward from the middle of the seesaw plate (221) toward the side end of the seesaw plate (221).

8. A PCB module structure for optimizing electromagnetic wave radiation according to claim 2 or 7, characterized in that: The tin spot arrangement (211) comprises a plurality of tin spots arranged at intervals along the length direction or the width direction of the PCB board (21), and the plurality of tin spots arranged in the same direction are divided into two columns, and the two columns of tin spots are staggered with each other.

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