Circuit board structure for straight-through module

Abstract

The circuit board structure for the straight-through module comprises a circuit board body, the circuit board body comprises a first layer circuit board, a first dielectric layer and a second layer circuit board from top to bottom in sequence, upper end gold pinhole groups and lower end gold pinhole groups which are of the same structure are arranged at the corresponding positions of the first layer circuit board and the second layer circuit board, and the upper end gold pinhole groups and the lower end gold pinhole groups are arranged on the first layer circuit board and the second layer circuit board. The upper end gold pinhole group and the lower end gold pinhole group are arranged at the middle positions of the first layer of circuit board and the second layer of circuit board, the circuit board body is of a rectangular structure, and grounding bonding pads are respectively arranged at four end corner positions of the circuit board body. The circuit board structure for the straight-through module provided by the utility model is simple and compact in structural layout, adopts a double-layer circuit board structure to carry out wiring connection on the upper gold pinhole group and the lower gold pinhole group, and the circuit board body is provided with a grounding bonding pad which can be conducted and grounded with the straight-through module, so that low-frequency signal transmission is increased; and crosstalk elements are additionally arranged for signal transmission weak points, so that crosstalk between ports is reduced, and the signal transmission speed is improved.

Description

Technical Field

[0001] The utility model relates to the field of network direct-through modules, in particular to a circuit board structure for direct-through modules. Background Art

[0002] Nowadays, both industrial networks and household conventional electronic devices require network signals, which cannot be separated from the connection of network cables. However, sometimes due to the requirements of the installation environment or the use environment, two network interfaces need to be connected. At this time, a network pass-through module is used. The circuit boards in the existing network pass-through modules are complicatedly arranged and the crosstalk between the ports is large, which affects the overall transmission rate. Utility Model Content

[0003] The utility model aims to provide a circuit board structure for a through module to solve the technical problems in the background technology.

[0004] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions:

[0005] A circuit board structure for a straight-through module comprises a circuit board body, wherein the circuit board body comprises a first circuit board layer, a first dielectric layer and a second circuit board layer from top to bottom, an upper gold pin hole group and a lower gold pin hole group of the same structure are arranged at corresponding positions on the first circuit board layer and the second circuit board layer, the upper gold pin hole group and the lower gold pin hole group are arranged in the middle of the first circuit board layer and the second circuit board layer, the circuit board body is a rectangular structure, and grounding pads are respectively installed at the four end corners of the circuit board body, the grounding pads penetrate the first circuit board layer and the second circuit board layer, the upper gold pin hole group and the lower gold pin hole group are between the upper and lower grounding pads, the upper gold pin hole group and the lower gold pin hole group each have eight gold pin connection holes and are respectively connected, and the gold pins on the upper gold pin hole group and the lower gold pin hole group are arranged in two rows, upper and lower, in an alternating manner.

[0006] The upper end gold pinhole group is, from left to right, the first gold pinhole at the upper end, the second gold pinhole at the upper end, the third gold pinhole at the upper end, the fourth gold pinhole at the upper end, the fifth gold pinhole at the upper end, the sixth gold pinhole at the upper end, the seventh gold pinhole at the upper end and the eighth gold pinhole at the upper end; the lower end gold pinhole group is, from right to left, the first gold pinhole at the lower end, the second gold pinhole at the lower end, the third gold pinhole at the lower end, the fourth gold pinhole at the lower end, the fifth gold pinhole at the lower end, the sixth gold pinhole at the lower end, the seventh gold pinhole at the lower end and the eighth gold pinhole at the lower end; a first line pair crosstalk group is provided between the fourth gold pinhole at the upper end and the sixth gold pinhole at the lower end on the first layer circuit board.

[0007] Corner portions are provided at upper and lower ends of the right side of the first line pair crosstalk group, which are respectively a first corner and a second corner.

[0008] A copper cladding layer is provided below the second corner position of the first line pair crosstalk group.

[0009] The line width of the first line pair crosstalk group is 0.2-0.3 mm.

[0010] The ground pad is a rectangular structure.

[0011] The four corner positions of the circuit board body are respectively provided with mounting holes, which penetrate the first layer circuit board, the first dielectric layer and the second layer circuit board. The upper end gold pin hole group and the lower end gold pin hole group are between the upper and lower mounting holes.

[0012] Compared with the prior art, the utility model provides a circuit board structure for a straight-through module, which has a simple and compact structural layout, adopts a double-layer circuit board structure to connect the upper and lower groups of gold pinholes, has a high overall assembly density and a small size, and has a grounding pad on the circuit board body, which can be connected to the straight-through module for grounding, thereby increasing low-frequency signal transmission, and adding interference elements to weak points in signal transmission, thereby reducing crosstalk between ports, increasing signal transmission speed, and improving the characteristic impedance of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 : Schematic diagram of the layered structure of the circuit board body of the present application;

[0014] Figure 2 : Schematic diagram of the front structure of the first layer circuit board;

[0015] Figure 3 : Schematic diagram of the front structure of the second layer circuit board. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0017] Specific embodiment 1: Please refer to Figures 1 to 3 In an embodiment of the utility model, a circuit board structure for a through module includes a circuit board body, which is composed of a first circuit board 1, a first dielectric layer 3 and a second circuit board 2 from top to bottom. The first circuit board 1 and the second circuit board 2 are provided with an upper gold pinhole group 4 and a lower gold pinhole group 5 of the same structure at corresponding positions. The upper gold pinhole group 4 and the lower gold pinhole group 5 are arranged in the middle of the first circuit board 1 and the second circuit board 2. The circuit board body is a rectangular structure. Grounding pads 7 are respectively installed at the four end corners of the circuit board body. The grounding pads 7 penetrate the first circuit board 1 and the second circuit board 2. The grounding pads 7 are of a rectangular structure and are connected to the through module for grounding to increase low-frequency signal transmission.

[0018] The upper end gold pin hole group 4 and the lower end gold pin hole group 5 are between the upper and lower ground pads 7. The upper end gold pin hole group 4 and the lower end gold pin hole group 5 each have eight gold pin connection holes and are respectively connected correspondingly. The gold pins on the upper end gold pin hole group 4 and the lower end gold pin hole group 5 are divided into two rows and arranged alternately.

[0019] The upper end gold pinhole group 4 includes, from left to right, the upper first gold pinhole 401, the upper second gold pinhole 402, the upper third gold pinhole 403, the upper fourth gold pinhole 404, the upper fifth gold pinhole 405, the upper sixth gold pinhole 406, the upper seventh gold pinhole 407 and the upper eighth gold pinhole 408, and the lower end gold pinhole group 5 includes, from right to left, the lower first gold pinhole 501, the lower second gold pinhole 502, the lower third gold pinhole 503, The fourth gold pin hole 504 at the lower end, the fifth gold pin hole 505 at the lower end, the sixth gold pin hole 506 at the lower end, the seventh gold pin hole 507 at the lower end and the eighth gold pin hole 508 at the lower end, a first line pair cross-talk group 6 is provided between the fourth gold pin hole 404 at the upper end and the sixth gold pin hole 506 at the lower end on the first layer circuit board 1, and the line width of the first line pair cross-talk group 6 is 0.2-0.3mm. In the present embodiment, the line width of the first line pair cross-talk group 6 is 0.22mm.

[0020] Corner portions are provided at the upper and lower ends of the right side of the first line pair crosstalk group 6, which are respectively a first corner 601 and a second corner 602. The setting of the corner structure can reduce electromagnetic wave interference and ensure the accuracy of signal transmission.

[0021] A copper clad layer A is provided below the second corner 602 of the first line pair crosstalk group 6. The structure of the copper clad layer A is a triangular area structure. The copper clad layer A is provided to increase electromagnetic interference shielding while avoiding interference caused by the second corner 602.

[0022] The four corners of the circuit board body are respectively provided with mounting holes 8, which penetrate the first circuit board 1, the first dielectric layer 3 and the second circuit board 2. The upper end gold pin hole group 4 and the lower end gold pin hole group 5 are between the upper and lower mounting holes 8.

[0023] Compared with the prior art, the utility model provides a circuit board structure for a straight-through module, which has a simple and compact structural layout, adopts a double-layer circuit board structure to connect the upper and lower groups of gold pinholes, has a high overall assembly density and a small size, and has a grounding pad on the circuit board body, which can be connected to the straight-through module for grounding, thereby increasing low-frequency signal transmission, and adding interference elements to weak points in signal transmission, thereby reducing crosstalk between ports, increasing signal transmission speed, and improving the characteristic impedance of the printed circuit board.

[0024] It is obvious to those skilled in the art that the present invention is not limited to the details of the foregoing exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0025] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A circuit board structure for a through module, characterized in that: The invention comprises a circuit board body, which comprises a first circuit board layer, a first dielectric layer and a second circuit board layer from top to bottom, an upper gold pin hole group and a lower gold pin hole group of the same structure are arranged at corresponding positions on the first circuit board layer and the second circuit board layer, the upper gold pin hole group and the lower gold pin hole group are arranged in the middle of the first circuit board layer and the second circuit board layer, the circuit board body is a rectangular structure, and grounding pads are respectively installed at the four end corners of the circuit board body, the grounding pads penetrate the first circuit board layer and the second circuit board layer, the upper gold pin hole group and the lower gold pin hole group are between the upper and lower grounding pads, the upper gold pin hole group and the lower gold pin hole group each have eight gold pin connection holes and are respectively connected correspondingly, and the gold pins on the upper gold pin hole group and the lower gold pin hole group are arranged in two rows, upper and lower, in an alternating manner.

2. A circuit board structure for a through module according to claim 1, characterized in that: The upper end gold pinhole group is, from left to right, the first gold pinhole at the upper end, the second gold pinhole at the upper end, the third gold pinhole at the upper end, the fourth gold pinhole at the upper end, the fifth gold pinhole at the upper end, the sixth gold pinhole at the upper end, the seventh gold pinhole at the upper end and the eighth gold pinhole at the upper end; the lower end gold pinhole group is, from right to left, the first gold pinhole at the lower end, the second gold pinhole at the lower end, the third gold pinhole at the lower end, the fourth gold pinhole at the lower end, the fifth gold pinhole at the lower end, the sixth gold pinhole at the lower end, the seventh gold pinhole at the lower end and the eighth gold pinhole at the lower end; a first line pair crosstalk group is provided between the fourth gold pinhole at the upper end and the sixth gold pinhole at the lower end on the first layer circuit board.

3. A circuit board structure for a through module according to claim 2, characterized in that: Corner portions are provided at upper and lower ends of the right side of the first line pair crosstalk group, which are respectively a first corner and a second corner.

4. A circuit board structure for a through module according to claim 3, characterized in that: A copper cladding layer is provided below the second corner position of the first line pair crosstalk group.

5. A circuit board structure for a through module according to claim 4, characterized in that: The line width of the first line pair crosstalk group is 0.2-0.3 mm.

6. A circuit board structure for a through module according to claim 5, characterized in that: The ground pad is a rectangular structure.

7. A circuit board structure for a through module according to claim 6, characterized in that: The four corner positions of the circuit board body are respectively provided with mounting holes, which penetrate the first layer circuit board, the first dielectric layer and the second layer circuit board. The upper end gold pin hole group and the lower end gold pin hole group are between the upper and lower mounting holes.

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