Probe card processing device and probe card

Abstract

The utility model belongs to the technical field of probe card machining, and particularly relates to a probe card machining device and a probe card, the probe card machining device comprises a machining platform, the probe card machining device further comprises an adjusting mechanism, the adjusting mechanism comprises an adjusting assembly and a fixing platform, the adjusting assembly is arranged on the machining platform, and the fixing platform is arranged on the side, away from the machining platform, of the adjusting assembly; the fixed platform can move under the adjustment of the adjusting assembly, and a wafer can be placed on one side, far away from the adjusting assembly, of the fixed platform; the fixing mechanism comprises a supporting seat and a fixing assembly, the supporting seat is arranged on the machining platform and surrounds the adjusting mechanism, a through hole is formed in the side, away from the machining platform, of the supporting seat, the fixing assembly is arranged on the side, away from the machining platform, of the supporting seat, and when the circuit board is arranged on the fixing assembly, the circuit board covers at least part of the through hole, and the adjusting assembly is adjusted. Therefore, the fixing platform corresponds to the alignment hole on the circuit board. According to the scheme, the precision of the probe card is improved by utilizing the probe card processing device.

Description

Technical Field

[0001] The present application belongs to the technical field of probe card processing, and specifically relates to a probe card processing device and a probe card. Background Art

[0002] In recent years, semiconductor process technology has advanced by leaps and bounds, and has now advanced to below 32nm. At present, products emphasize lightness, thinness, and compactness. ICs are getting smaller and smaller, with more and more powerful functions and more and more pins. In order to reduce the area occupied by chip packaging and improve IC performance, flip-chip packaging is currently widely used in graphics chips, chipsets, memory, and CPUs. The above-mentioned high-end packaging methods are expensive. If the chip can be tested before packaging and defective products are found in the wafer, they will be marked and discarded before the later packaging process, which can save unnecessary packaging costs.

[0003] In the process of producing the probe card, the PCB substrate needs to be fixed, and then a plurality of probes need to be fixed on the PCB substrate to complete the production of the probe card. However, the probe card produced by the existing probe card processing device has insufficient precision. Utility Model Content

[0004] The purpose of the present application is to provide a probe card processing device and a probe card, and to improve the accuracy of the probe card by using the probe card processing device.

[0005] In a first aspect, the present application provides a probe card processing device, the probe card processing device comprising a processing platform, and the probe card processing device further comprising:

[0006] The adjustment mechanism comprises an adjustment component and a fixed platform, wherein the adjustment component is arranged on the processing platform, the fixed platform is arranged on a side of the adjustment component away from the processing platform, and the fixed platform can move under the adjustment of the adjustment component, and a wafer can be placed on the side of the fixed platform away from the adjustment component;

[0007] The fixing mechanism includes a support seat and a fixing component. The support seat is arranged on the processing platform and is arranged around the adjustment mechanism. A through hole is provided on the side of the support seat away from the processing platform. The fixing component is arranged on the side of the support seat away from the processing platform. When the circuit board is arranged on the fixing component, the circuit board covers at least part of the through hole. The adjusting component is adjusted to make the fixing platform correspond to the alignment hole on the circuit board.

[0008] In an exemplary embodiment of the present application, the adjustment component is capable of adjusting the positional relationship of the fixed platform in the first direction, the second direction and the third direction;

[0009] The first direction, the second direction and the third direction are perpendicular to each other.

[0010] In an exemplary embodiment of the present application, the support seat includes a support platform and a plurality of support columns arranged around the adjustment mechanism, the support platform is arranged on a side of the support column away from the processing platform, and the support platform is provided with the through hole for exposing the fixing platform;

[0011] The fixing assembly includes a fixing part, and the fixing part includes a main body, a supporting part and a clamping part. The main body is arranged on the supporting platform away from the processing platform. The supporting part and the clamping part are both arranged on the main body. The supporting part is provided with a fixing position. When the circuit board is placed in the fixing position, the clamping part clamps and fixes the circuit board at the clamping part and the supporting part.

[0012] In an exemplary embodiment of the present application, the fixing assembly includes a first fixing member and a second fixing member, the first fixing member and the second fixing member are arranged opposite to each other, the circuit board is overlapped on the fixing position of the first fixing member and overlapped on the fixing position of the second fixing member, and the circuit board is clamped by using the clamping part of the first fixing member and / or the clamping part of the second fixing member.

[0013] In an exemplary embodiment of the present application, a receiving groove is formed between the support portion and the body, and the receiving groove can provide a buffer space when the circuit board is placed in the fixed position.

[0014] In an exemplary embodiment of the present application, the probe card processing device further includes:

[0015] The clamping mechanism is spaced apart from the adjusting mechanism and the fixing mechanism. The clamping mechanism comprises an adjusting portion and a clamping portion. The clamping portion is used to clamp the blade probe. The clamping portion can move under the adjusting action of the adjusting portion.

[0016] In an exemplary embodiment of the present application, the probe card processing device also includes a first locking mechanism, which is arranged on the processing platform. The first locking mechanism includes a locking platform and a locking assembly. The adjustment mechanism and the fixing mechanism are both arranged on the locking platform. The locking assembly is connected to the locking platform, and the locking platform can be locked and fixed under the action of the locking assembly.

[0017] In an exemplary embodiment of the present application, the probe card processing device also includes a second locking mechanism, which includes a locking platform and a locking knob, the clamping mechanism is connected to the locking platform, and the locking knob can lock the position of the clamping mechanism on the locking platform.

[0018] In an exemplary embodiment of the present application, the probe card processing device also includes a processing seat and a rotating handle for fixing the observation mechanism, the rotating handle is arranged on the processing seat and is spaced apart from the fixing mechanism and the adjustment mechanism, and the processing platform is arranged on the processing seat.

[0019] A second aspect of the present application provides a probe card manufactured using any one of the probe card processing devices described above, wherein the probe card comprises a blade probe and a circuit board, wherein the blade probe is disposed on the circuit board.

[0020] This application scheme has the following beneficial effects:

[0021] The present application scheme includes a probe card processing device and a probe card. The probe card processing device includes an adjusting mechanism and a fixing mechanism. The adjusting mechanism includes an adjusting component and a fixing platform. The adjusting component can adjust the relative position of the fixing platform, and a wafer can be placed on the side of the fixing platform away from the processing platform; the fixing mechanism includes a supporting seat and a fixing component. The supporting seat is arranged on the processing platform and is arranged around the outer side of the adjusting mechanism, that is, the adjusting component and the fixing platform are located in this supporting seat, and the supporting seat has a supporting platform. A through hole for exposing the fixing platform is provided on the supporting platform, that is, the adjusting component can adjust the fixed platform to move in the through hole, and the fixing component is provided with a fixing position. When the circuit board is placed in this fixed position, the position of the fixing platform is adjusted by the adjusting component, so that the wafer on the fixing platform corresponds to the alignment hole of the circuit board, that is: the position of the wafer on the fixing platform can be adjusted according to the alignment hole on the circuit board, so that the wafer corresponds to the alignment hole, thereby improving the alignment accuracy of the wafer and the alignment hole, so as to ensure the subsequent production accuracy of the probe card, thereby improving the accuracy of the probe card.

[0022] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0023] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A schematic diagram of the main structure of a probe card processing device provided in the first embodiment of the present application is shown;

[0026] Figure 2 Shows Figure 1 A schematic diagram of the enlarged structure of the clamping part and the supporting part at center A;

[0027] Figure 3 A schematic diagram of the three-dimensional structure of a probe card processing device provided in the first embodiment of the present application is shown;

[0028] Figure 4 A schematic structural diagram of the separation of the circuit board and the fixing assembly provided in the first embodiment of the present application is shown.

[0029] Description of reference numerals:

[0030] 10. Probe card processing device; 110. Processing platform; 120. Adjustment mechanism; 121. Adjustment assembly; 122. Fixing platform; 130. Fixing mechanism; 131. Support seat; 1311. Support platform; 1312. Support column; 132. Fixing assembly; 1320. Fixing member; 1320a. First fixing member; 1320b. Second fixing member; 1321. Body; 1322. Supporting part; 132 3. Clamping part; 133. Through hole; 134. Accommodating groove; 140. Clamping mechanism; 141. Adjusting part; 142. Clamping part; 143. Adjusting arm; 150. First locking mechanism; 151. Locking platform; 152. Locking assembly; 160. Second locking mechanism; 161. Locking platform; 162. Locking knob; 170. Processing seat; 180. Rotating handle; 20. Circuit board; 210. Alignment hole. DETAILED DESCRIPTION

[0031] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0032] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] In this application, unless otherwise clearly specified and limited, the terms "assembly", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0035] Embodiment 1

[0036] The first embodiment of the present application provides a probe card processing device 10, which is mainly used for processing a probe card. The probe card processing device 10 can effectively improve the accuracy of the probe card. The probe card includes a blade probe and a circuit board 20. The blade probe is welded to the solder joint of the circuit board 20 by welding. In this process, the blade probe needs to be aligned with the wafer to complete the production of the probe card.

[0037] Therefore, in order to improve the machining accuracy of the probe card, see Figure 1 As shown, the probe card processing device 10 includes:

[0038] The processing platform 110 is a horizontal plane.

[0039] The adjusting mechanism 120 includes an adjusting component 121 and a fixed platform 122. Both the adjusting component 121 and the fixed platform 122 are arranged on the processing platform 110. The fixed platform 122 is arranged on a side of the adjusting component 121 away from the processing platform 110. The fixed platform 122 can move under the adjustment of the adjusting component 121. A wafer can be placed on a side of the fixed platform 122 away from the adjusting component 121. The wafer can correspond to the blade probe and the circuit board 20 when the subsequent circuit board 20 is welded with the subsequent blade probe.

[0040] The fixing mechanism 130 includes a support seat 131 and a fixing assembly 132. The support seat 131 is arranged on the processing platform 110 and is arranged around the outer side of the adjustment mechanism 120. A support platform 1311 is provided on the side of the support seat 131 away from the processing platform 110. The support platform 1311 is provided with a through hole 133 for exposing the fixing platform 122. The opening area of ​​this through hole 133 is greater than or equal to the area of ​​this fixing platform 122. The fixing component 132 is arranged on a side of the supporting platform 1311 away from the processing platform 110. The fixing component 132 has a fixed position. When the circuit board 20 is placed in this fixed position, the position of the fixing platform 122 in the through hole 133 can be controlled by adjusting the adjusting component 121. By changing the position of the fixing platform 122, the alignment relationship between the wafer and the circuit board 20 can be changed, so that the alignment holes 210 of the wafer and the circuit board 20 correspond to each other, so that the subsequent blade probe corresponds to the wafer and the circuit board 20. The alignment accuracy of the alignment hole 210 of the wafer and the circuit board 20 is improved by adjusting the component 121, and the alignment accuracy of the blade probe and the circuit board 20 is improved, thereby improving the accuracy of the probe card.

[0041] It is understandable that the position of the fixed platform 122 can be adjusted at will by adjusting the component 121, which can ensure that when the circuit board 20 is in any fixed position, the alignment holes 210 of the wafer and the circuit board 20 can correspond to each other, thereby improving the alignment accuracy and further improving the accuracy of the probe card.

[0042] Please continue to see Figure 1 As shown, the support seat 131 may also include a support column 1312 extending in the thickness direction of the processing platform 110, and a support platform 1311 is provided on the side of the support column 1312 away from the processing platform 110, that is, the support platform 1311 is supported on the processing platform 110 by the support column 1312. In addition, a plurality of support columns 1312 are arranged around the adjustment mechanism 120; that is, a plurality of support columns 1312 surround and form a receiving space, and the adjustment mechanism 120 is arranged in the receiving space.

[0043] For example, the support seat 131 includes four support columns 1312 extending in the thickness direction of the processing platform 110, and the heights of the four support columns 1312 in the thickness direction of the processing platform 110 are the same, so that the support platform 1311 is a horizontal plane. In addition, the support columns 1312 are arranged around the adjustment mechanism 120, and there is an adjustment gap between adjacent support columns 1312, through which the adjustment component 121 can be adjusted, and then the position of the fixed platform 122 can be adjusted.

[0044] This adjustment component 121 can adjust the position relationship of the fixed platform 122 in the first direction, the second direction and the third direction, and the first direction, the second direction and the third direction are perpendicular to each other; that is, the fixed platform 122 can be adjusted in different directions through the adjustment component 121 to improve the alignment accuracy between the wafer and the alignment hole 210.

[0045] For example, the adjustment component 121 can adjust the position of the fixed platform 122 in front and back, up and down, left and right directions.

[0046] For example, the first direction and the second direction are adjustments on the horizontal plane, and the third direction can be an adjustment in the thickness direction of the processing platform 110; that is, the first direction, the second direction and the third direction can correspond to the X-axis, the Y-axis and the Z-axis. The position of the fixed platform 122 in the first direction, the second direction and the third direction can be adjusted by adjusting the component 121, thereby improving the alignment accuracy of the alignment hole 210 between the wafer and the circuit board 20, so as to improve the alignment accuracy of the subsequent connection between the blade probe and the circuit board 20, thereby improving the accuracy of the probe card.

[0047] The fixing assembly 132 includes a fixing member 1320, see Figure 2 As shown, the fixing member 1320 includes a body 1321, a support portion 1322 and a clamping portion 1323. The body 1321 is disposed on a side of the support platform 1311 away from the processing platform 110, that is, the body 1321 is disposed on the support platform 1311. The support portion 1322 and the clamping portion 1323 are both disposed on the body 1321, and the support portion 1322 and the clamping portion 1323 are disposed at intervals from each other. A fixing position is provided on the support portion 1322. When the circuit board 20 is placed at the fixing position, the clamping portion 1323 is used to clamp and fix the circuit board 20 at the clamping portion 1323 and the support portion 1322, so as to ensure the stability of the circuit board 20 on the fixing assembly 132, prevent the circuit board 20 from moving randomly on the fixing assembly 132, ensure the alignment accuracy of the alignment hole 210 on the wafer and the circuit board 20, and further ensure the docking accuracy of the blade probe and the circuit board 20, thereby improving the accuracy of the probe card.

[0048] See also Figure 3 and Figure 4 As shown, in order to ensure the stability of the circuit board 20 on the fixing component 132, this fixing component 132 includes a first fixing member 1320a and a second fixing member 1320b, and the first fixing member 1320a and the second fixing member 1320b are respectively arranged on the opposite sides of the supporting platform 1311, and the opposite ends of the circuit board 20 are respectively arranged on the fixing positions of the first fixing member 1320a and the second fixing member 1320b to support the circuit board 20, and the fixing positions of the first fixing member 1320a and the second fixing member 1320b are located on the same horizontal plane to ensure that the circuit board 20 is on a horizontal plane, thereby ensuring the subsequent welding accuracy.

[0049] It can be understood that when the circuit board 20 is placed in the fixing position of the first fixing member 1320a and the fixing position of the second fixing member 1320b, the clamping portion 1323 of the first fixing member 1320a and / or the clamping portion 1323 of the second fixing member 1320b can be used to clamp and fix the opposite ends of the circuit board 20 so as to clamp and fix the circuit board 20 at the two fixing members 1320; that is, the circuit board 20 can be fixed by using one of the first fixing member 1320a and the second fixing member 1320b, or the circuit board 20 can be fixed by using the first fixing member 1320a and the second fixing member 1320b at the same time.

[0050] In the examples of this application, see Figure 4 As shown, the two ends of the circuit board 20 are fixed by the clamping part 1323 of the first fixing member 1320a and the clamping part 1323 of the second fixing member 1320b respectively, so as to ensure the stability of the circuit board 20, prevent the circuit board 20 from sliding randomly, and ensure the manufacturing accuracy of the probe card.

[0051] In addition, see Figure 2 As shown, a receiving groove 134 is formed between the support portion 1322 and the main body 1321. The receiving groove 134 can provide a buffer space when the circuit board 20 is placed in a fixed position, that is, the circuit board 20 has a certain distance from the main body 1321, thereby avoiding collision between the circuit board 20 and the main body 1321 during processing and causing damage, thereby ensuring the integrity of the circuit board 20.

[0052] In the embodiment of the present application, the probe card processing device 10 also includes a clamping mechanism 140, and the clamping mechanism 140 is spaced apart from the adjustment mechanism 120 and the fixing mechanism 130. The clamping structure includes an adjustment portion 141 and a clamping portion 142. The clamping portion 142 is used to clamp the blade probe. The clamping portion 142 can move under the adjustment action of the adjustment portion 141 to adjust the alignment accuracy of the blade probe with the wafer and the alignment hole 210, thereby improving the alignment accuracy of the blade probe with the circuit board 20, that is, improving the accuracy of the probe card.

[0053] Understandably, see Figure 3 As shown, the clamping mechanism 140 further includes an adjusting arm 143, which is connected to the adjusting portion 141 and the clamping portion 1323. The position of the clamping portion 1323 can be changed by adjusting the arm 143. The adjusting portion 141 can still adjust the position of the clamping portion 1323 in the first direction, the second direction and the third direction, that is, adjust the position of the clamping portion 1323 in the X-axis, the Y-axis and the Z-axis.

[0054] For example, the adjustment portion 141 adjusts the positional relationship of the clamping portion 1323 in front and back, left and right, and up and down.

[0055] In addition, see Figure 3 As shown, the probe card processing device 10 further includes a first locking mechanism 150, which can be used to lock the positional relationship of the adjustment mechanism 120 and the positional relationship of the fixing mechanism 130, and the first locking mechanism 150 is disposed on the processing platform 110. The first locking mechanism 150 includes a locking platform 151 and a locking assembly 152, and both the adjustment mechanism 120 and the fixing mechanism 130 are disposed on the locking platform 151, and the locking assembly 152 is connected to the locking platform 151. The locking platform 151 can be locked and fixed under the action of the locking assembly 152, so as to fix the positions of the adjustment mechanism 120 and the fixing mechanism 130 on the processing platform 110, avoid relative displacement between the adjustment mechanism 120 and the fixing mechanism 130, and ensure the alignment accuracy of the alignment holes 210 on the wafer and the circuit board 20.

[0056] It is understandable that the locking knob 162 in the locking assembly 152 can be used to loosen or tighten it clockwise or counterclockwise, thereby controlling the locking platform 151 to move or preventing the locking platform 151 from moving.

[0057] Accordingly, see Figure 3 or Figure 4 As shown, the probe card processing device 10 also includes a second locking mechanism 160, which includes a locking platform 161 and a locking knob 162. The clamping mechanism 140 is connected to the locking platform 161, and the locking knob 162 can lock the position of the clamping mechanism 140 on the locking platform 161 to ensure the relative position of the clamping mechanism 140 and the processing platform 110.

[0058] In addition, the probe card processing device 10 also includes a processing seat 170 and a rotating handle 180 for fixing the observation mechanism. The rotating handle 180 is arranged on the processing seat 170, and the processing platform 110 is arranged on the processing seat 170. The rotating handle 180 is spaced apart from the fixing mechanism 130 and the adjusting mechanism 120 to avoid mutual interference.

[0059] It can be understood that the alignment relationship between the wafer and the alignment hole 210 of the circuit board 20, as well as the alignment relationship between the blade probe and the alignment hole 210 of the circuit board 20 can be adjusted through this observation mechanism, and the positional relationship between the fixed platform 122 and the clamping mechanism 140 can be adjusted as needed so that the alignment holes 210 on the wafer and the circuit board 20 correspond to each other, and the blade probe on the clamping mechanism 140 corresponds to the alignment hole 210 and the wafer.

[0060] It is worth mentioning that the processing seat 170 can be formed by splicing a plurality of profiles, and a roller or a support can be provided at the end of the profile close to the ground. The position of the probe card processing device 10 can be moved at will through the roller, making transportation more convenient, and the processing seat 170 can be well fixed on the ground through the support.

[0061] In addition, in the process of making the probe card, the wafer needs to be placed under the alignment hole 210 of the circuit board 20, that is, the fixing platform 122 and the supporting platform 1311 are not located in the same horizontal plane. Then, the blade probe on the clamping mechanism 140 is aligned with the welding point of the circuit board 20, and after confirming that the welding point position of the blade probe and the circuit board 20 is correct, welding is performed to weld the blade probe to the circuit board 20.

[0062] The preparation process of the probe card includes:

[0063] 1. The wafer is placed on the fixed platform 122;

[0064] 2. The blade probe is fixed on the clamping portion 1323;

[0065] 3. Adjustment of the position of the alignment hole 210 and wafer between the blade probe and the circuit board 20, that is, adjusting the relationship between the wafer on the fixed platform 122 and the alignment hole 210 of the circuit board 20 by adjusting the adjustment component 121, and adjusting the alignment relationship between the clamping portion 1323 and the alignment hole 210 in the circuit board 20 by the adjustment portion 141, so that the wafer and the blade probe are accurately aligned, and the wafer and the alignment hole 210 of the circuit board 20 are precisely aligned, thereby improving the manufacturing accuracy of the probe card.

[0066] 4. Welding the blade probe to the welding point on the circuit board 20; when the alignment hole 210 of the blade probe and the circuit board 20 and the position of the wafer are fixed, the blade probe is fixed to the circuit board 20 by welding.

[0067] 5. After the welding points of the blade probe and the circuit board 20 are welded, the welding quality of the blade probe and the circuit board 20 is confirmed.

[0068] If the welding quality is good, the needle is ground using a needle grinder to reduce its flatness from 15μm to 5μm.

[0069] If the welding quality is not good, re-weld the blade probe and welding point.

[0070] The present application scheme can achieve adjustment of the accuracy of the alignment hole 210 on the wafer and the circuit board 20 before the blade probe is welded through the probe card processing device 10. When welding the blade probe, the adjustment part 141 can be used to adjust the position of the blade probe, the alignment hole 210 and the wafer. The whole can be used flexibly, the position of the blade probe and the circuit board 20 is accurate, the precision is greatly improved, and the welding accuracy can be controlled below 5μm to 15μm.

[0071] Embodiment 2

[0072] A second embodiment of the present application provides a probe card, which is manufactured using the probe card processing device 10 in the first embodiment.

[0073] This probe card is the interface between the electronic test system and the semiconductor wafer. Typically, the probe card is mechanically docked with probes and electrically connected to the tester. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, allowing the circuits to be tested and verified at the wafer level, usually before they are cut and packaged. It usually consists of a printed circuit board 20 (PCB) and some form of contact element, usually metal, but may also be made of other materials.

[0074] For example, a probe card is provided in the second embodiment of the present application, and the probe card includes a circuit board 20 and a blade probe, and the blade probe is welded on the welding point of the circuit board 20. The probe card processing device 10 in the first embodiment can improve the alignment accuracy between the blade probe and the circuit board 20, and improve the alignment accuracy between the alignment hole 210 of the circuit board 20 and the wafer, thereby improving the accuracy of the manufactured probe card.

[0075] In the description of this specification, the description with reference to the terms "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0076] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and description of the present application should fall within the scope of the patent of this application.

Claims

1. A probe card processing device, comprising a processing platform, characterized in that: The probe card processing device also includes: The adjustment mechanism comprises an adjustment component and a fixed platform, wherein the adjustment component is arranged on the processing platform, the fixed platform is arranged on a side of the adjustment component away from the processing platform, and the fixed platform can move under the adjustment of the adjustment component, and a wafer can be placed on the side of the fixed platform away from the adjustment component; The fixing mechanism includes a support seat and a fixing component. The support seat is arranged on the processing platform and is arranged around the adjustment mechanism. A through hole is provided on the side of the support seat away from the processing platform. The fixing component is arranged on the side of the support seat away from the processing platform. When the circuit board is arranged on the fixing component, the circuit board covers at least part of the through hole. The adjusting component is adjusted to make the fixing platform correspond to the alignment hole on the circuit board.

2. The probe card processing device according to claim 1, characterized in that: The adjustment component is capable of adjusting the positional relationship of the fixed platform in the first direction, the second direction and the third direction; The first direction, the second direction and the third direction are perpendicular to each other.

3. The probe card processing device according to claim 1, characterized in that: The support seat comprises a support platform and a plurality of support columns arranged around the adjustment mechanism, the support platform is arranged on a side of the support column away from the processing platform, and the support platform is provided with the through hole for exposing the fixing platform; The fixing assembly includes a fixing part, and the fixing part includes a main body, a supporting part and a clamping part. The main body is arranged on the supporting platform away from the processing platform. The supporting part and the clamping part are both arranged on the main body. The supporting part is provided with a fixing position. When the circuit board is placed in the fixing position, the clamping part clamps and fixes the circuit board at the clamping part and the supporting part.

4. The probe card processing device according to claim 3, characterized in that: The fixing assembly includes a first fixing member and a second fixing member, the first fixing member and the second fixing member are arranged opposite to each other, the circuit board is overlapped on the fixing position of the first fixing member and overlapped on the fixing position of the second fixing member, and the circuit board is clamped by the clamping part of the first fixing member and / or the clamping part of the second fixing member.

5. The probe card processing device according to claim 3, characterized in that: A receiving groove is formed between the supporting portion and the main body, and the receiving groove can provide a buffer space when the circuit board is placed in the fixed position.

6. The probe card processing device according to any one of claims 1 to 5, characterized in that: The probe card processing device also includes: The clamping mechanism is spaced apart from the adjusting mechanism and the fixing mechanism. The clamping mechanism comprises an adjusting portion and a clamping portion. The clamping portion is used to clamp the blade probe. The clamping portion can move under the adjusting action of the adjusting portion.

7. The probe card processing device according to any one of claims 1 to 5, characterized in that: The probe card processing device also includes a first locking mechanism, which is arranged on the processing platform. The first locking mechanism includes a locking platform and a locking assembly. The adjustment mechanism and the fixing mechanism are both arranged on the locking platform. The locking assembly is connected to the locking platform, and the locking platform can be locked and fixed under the action of the locking assembly.

8. The probe card processing device according to claim 6, characterized in that: The probe card processing device further includes a second locking mechanism, which includes a locking platform and a locking knob. The clamping mechanism is connected to the locking platform, and the locking knob can lock the position of the clamping mechanism on the locking platform.

9. The probe card processing device according to claim 1, characterized in that: The probe card processing device also includes a processing seat and a rotating handle for fixing the observation mechanism. The rotating handle is arranged on the processing seat and is spaced apart from the fixing mechanism and the adjusting mechanism. The processing platform is arranged on the processing seat.

10. A probe card manufactured by using the probe card processing device according to any one of claims 1 to 9, characterized in that: The probe card includes a blade probe and a circuit board, and the blade probe is arranged on the circuit board.

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