Matrix type LED module

Abstract

The utility model provides a matrix type LED module. The matrix type LED module comprises a conductive substrate, wherein the surface of the conductive substrate is provided with a corresponding conductive circuit based on the design of the matrix type LED module; the matrix type LED module comprises a conductive substrate and at least one integrated light source, a plurality of LED chips are integrally packaged in the integrated light source, the integrated light source is matched with the conductive circuit on the conductive substrate, and the matrix type LED module is obtained by welding the integrated light source on the conductive substrate. The LED chips are integrated and packaged into the integrated light source, and then the integrated light source is integrally transferred and welded on the conductive substrate, so that the welding yield and efficiency are higher, the projection effect is better, and multi-point independent control can be conveniently realized.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a matrix LED module. Background Art

[0002] LED has become an ideal light source to replace traditional light sources due to its small size, low power consumption, high brightness, and environmental protection. The application of LED light sources is very flexible. It can be made into various forms of point, line, and surface matrices, and it is also very convenient to control. LED has been widely used in the field of automotive lighting, such as vehicle headlights. The internal matrix LED module can achieve variable and precise lighting of the front area, which is widely favored by car companies.

[0003] At present, the packaging methods of matrix LED modules generally include the following three types:

[0004] 1. Cut some wafers (containing multiple LEDs) and mount fluorescent films on their surfaces, then weld them to the control base plate, and finally build a protective structure around the LEDs to protect them and prevent light leakage. This packaging method is complex, especially welding is difficult, has low yield and high cost.

[0005] 2. Use a whole ceramic base plate as the control base plate, and then weld the packaged LED to the ceramic base plate. This packaging method makes the control route design on the ceramic base plate complex and costly.

[0006] 3. Directly weld the packaged independent light source to the control base plate. In this packaging method, the gaps between light sources are large, the number of light sources that can be packaged in a limited space is limited, and the arrangement is more difficult. Utility Model Content

[0007] In order to overcome the above shortcomings, the utility model provides a matrix LED module, which effectively reduces the packaging difficulty and improves the yield.

[0008] The technical solution provided by the utility model is:

[0009] A matrix LED module, comprising:

[0010] A conductive substrate, the surface of which is configured with corresponding conductive circuits based on the design of the matrix LED module;

[0011] At least one integrated light source, wherein a plurality of LED chips are integrated and packaged in the integrated light source, and the integrated light source matches the conductive circuit on the conductive substrate, and a matrix LED module is obtained by welding the integrated light source to the conductive substrate.

[0012] In this technical solution, the LED chip is first integrated and packaged into an integrated light source, and then the integrated light source is transferred and welded as a whole on a conductive substrate. The welding yield and efficiency are higher, and the projection effect is better, which facilitates the realization of multi-point independent control. Compared with the packaging method of directly welding the independent light source obtained by packaging to the control base plate, the LED chips can be arranged more tightly under this packaging method, which effectively solves the problem of fewer pixel points (LED chips) due to space limitations, and improves the flexibility of pixel point arrangement and space utilization. When a printed circuit board (PCB) is used as a conductive substrate, compared with the technical solution of cutting wafers (containing multiple LEDs) and ceramic base plates, the circuit design layout on the conductive substrate of this packaging method is more flexible, the process is simpler, the yield is high and the cost is low.

[0013] Further preferably, the matrix LED module is configured with a plurality of integrated light sources, and the plurality of integrated light sources are welded on the conductive substrate by splicing and combining to obtain the matrix LED module.

[0014] In this technical solution, according to the needs of the matrix LED module, multiple integrated light sources are welded to the surface of the conductive substrate by splicing, and the shape of the matrix LED module can be flexibly adjusted to further improve the flexibility and yield of the packaging.

[0015] Further preferably, the integrated light source comprises:

[0016] A plurality of regularly arranged LED chips, each of which has a light-emitting top surface, a light-emitting side surface, and an electrode surface opposite to the light-emitting top surface, and each of the plurality of LED chips is oriented in the same direction;

[0017] A light conversion layer covering the light emitting surfaces of the plurality of LED chips;

[0018] The covering part covers the light-emitting side of the LED chip to expose the electrode surface of the LED chip, and the covering part contains light-reflecting particles.

[0019] In this technical solution, the integrated light source obtained by this packaging method can greatly reduce the spacing between chips (up to within 50 microns), and more pixels can be designed and arranged in a limited space. And based on this packaging method, it is convenient to perform special-shaped cutting according to needs. In addition, the covering part formed around the chip makes its light output direction more directional and has higher illumination. Compared with the traditional packaging method, after the light source is welded to the surface of the conductive substrate, there is no need to surround the chip with high-reflectivity white glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of an example structure of an integrated light source in the utility model;

[0021] Figure 2 This is a schematic diagram of another example structure of the integrated light source in the utility model;

[0022] Figure 3 This is a schematic diagram of another example structure of the integrated light source in the utility model.

[0023] Figure 4 This is a schematic diagram of another example structure of the integrated light source in the utility model.

[0024] Reference numerals:

[0025] 10-integrated light source, 11-first integrated light source, 12-second integrated light source, 13-third integrated light source, 14-fourth integrated light source, 15-fifth integrated light source, 16-sixth integrated light source, 17-seventh integrated light source, 18-eighth integrated light source, 19-ninth integrated light source, 20-tenth integrated light source. DETAILED DESCRIPTION

[0026] In order to more clearly illustrate the implementation cases of the utility model or the technical solutions in the prior art, the specific implementation methods of the utility model will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0027] An embodiment of the utility model is a matrix LED module, comprising: a conductive substrate, a surface of which is configured with corresponding conductive circuits based on the design of the matrix LED module; at least one integrated light source, wherein a plurality of LED chips are encapsulated in the integrated light source, and the integrated light source matches the conductive circuits on the conductive substrate, and the matrix LED module is obtained by welding the integrated light source to the conductive substrate.

[0028] In this embodiment, the conductive substrate is a base plate of any material with a conductive circuit configured on the surface, such as planar epoxy molding compound (EMC), sheet molding compound (SMC), Al2O3 ceramic, AlN ceramic, metal-based PCB, etc. In order to reduce the cost and complexity of the conductive circuit design, a PCB board can be used as a conductive substrate, and the conductive circuit configured on its surface is designed according to the control requirements of the matrix LED module, which is not specifically limited here, and can even be designed as an independent pixel control circuit.

[0029] The integrated light source may be pre-integrated and packaged with multiple LED chips, and the packaging method may also be selected according to application requirements. In one embodiment, the integrated light source includes: multiple regularly arranged LED chips, the LED chips having a light-emitting top, a light-emitting side (the side does not emit light) and an electrode surface opposite to the light-emitting top, and the multiple LED chips are oriented in the same direction; a light conversion layer covering the light-emitting top of the multiple LED chips; and a covering portion covering the light-emitting side of the LED chip, exposing the electrode surface of the LED chip.

[0030] In this embodiment, the LED chip is a flip-chip structure chip, which is firmly connected and electrically conductive to the conductive substrate by AuSn or SnAgCu eutectic welding. The light conversion layer is doped with light conversion materials, and the composition of the light conversion material can be at least one or more of the following: garnet phosphor, nitrogen oxide phosphor, aluminate phosphor, nitride phosphor, sulfide phosphor, KSF (K2SiF6: Mn) phosphor, etc. The luminous color of the integrated light source is mainly adjusted by the chip band, the ratio and concentration of green, yellow and red phosphors, and the thickness of the encapsulation glue layer. It is not specifically limited here and can be determined according to needs in the application.

[0031] The coating is formed around the LED chip, which is a mixture of resin and light-reflecting particles. It protects the LED chip while having a high reflectivity, reflects the light emitted around the LED chip back, and makes the light of the integrated light source emit from the light-emitting surface of the LED chip, thereby improving the light-emitting efficiency of the integrated light source and making the light-emitting direction more directional. The resin can be a thermosetting resin such as a thermosetting silicone resin, an epoxy resin, a thermosetting polyimide resin, a phenolic resin, a urea resin, a melamine resin, an unsaturated polyester resin, a diallyl phthalate resin, a thermosetting polyurethane resin, etc., preferably a thermosetting silicone resin and an epoxy resin. The light-reflecting component is generally a white inorganic pigment, such as oxides such as titanium dioxide, zinc oxide, and zirconium oxide, carbonates such as lead white (lead carbonate), calcium carbonate, clay minerals such as kaolin (kaolinite), etc., preferably titanium dioxide. The reflectivity of the coating is mainly determined by the concentration of the light-reflecting particles and the thickness of the coating, and can be adjusted according to the light reflectivity requirements (such as a reflectivity of more than 95%) in the application. In other embodiments, the covering portion may cover the periphery of the light conversion layer in addition to the light emitting side of the LED chip, and the upper surface may be flush with the upper surface of the light conversion layer. In order to improve the light extraction efficiency, a reflective cup or other structure may be provided around the LED chip.

[0032] In an integrated light source, each LED chip has the same light emission direction and the same electrode orientation. After being transferred as a whole to the surface of the conductive circuit, it can be used for SMT patch technology (surface mount technology), which can greatly improve production efficiency and capacity compared to independent packaging technical solutions. The shape of the integrated light source is determined by the conductive circuit configured on the surface of the conductive substrate (matrix LED module requirements). The number of integrated light sources and the number of LED chips packaged inside each integrated light source can be determined by the packaging process. If the packaging process can meet the packaging requirements, only one integrated light source can be configured, and the integrated light source can be transferred and packaged to form a matrix LED module. In such as Figure 1 In the example, the integrated light source 10 is a whole, and the integrated light source is transferred to the surface of the conductive substrate for welding to obtain a matrix LED module.

[0033] The present embodiment is obtained by improving the above-mentioned embodiment. In the present embodiment, a plurality of integrated light sources are arranged in the matrix LED module. The plurality of integrated light sources are welded on a conductive substrate by splicing and combining to obtain the matrix LED module.

[0034] In this embodiment, a matrix LED module is obtained by packaging by configuring multiple integrated light sources. During packaging, each integrated light source can be transferred to the surface of the conductive substrate one by one for welding and packaging, or each integrated light source can be transferred to the surface of the conductive substrate and then welded. In applications where the matrix LED module has a large number of pixels, this splicing packaging method can greatly improve the transfer efficiency of the integrated light sources.

[0035] In such Figure 2 In the example, three integrated light sources are combined and packaged in the matrix LED module, namely the first integrated light source 11, the second integrated light source 12 and the third integrated light source 13 as shown in the figure, wherein the first integrated light source 11 is a rectangular integrated light source formed by 6 LED chips on the left, the third integrated light source 13 is a rectangular integrated light source formed by 6 LED chips on the right, and the integrated light source in the middle is the second integrated light source 12.

[0036] In such Figure 3 In the example, three integrated light sources are combined and packaged in the matrix LED module, namely the fourth integrated light source 14, the fifth integrated light source 15 and the sixth integrated light source 16 as shown in the figure, wherein the fourth integrated light source 14 is a rectangular integrated light source formed by 14 LED chips on the left, the sixth integrated light source 16 is a rectangular integrated light source formed by 14 LED chips on the right, and the middle integrated light source is the fifth integrated light source 15.

[0037] In such Figure 4In the example, four integrated light sources are packaged in combination in the matrix LED module, namely the seventh integrated light source 17, the eighth integrated light source 18, the ninth integrated light source 19 and the tenth integrated light source 20 as shown in the figure, wherein the seventh integrated light source 17 is a rectangular integrated light source formed by six LED chips on the left, the tenth integrated light source 20 is a rectangular integrated light source formed by six LED chips on the right, and the eighth integrated light source 18 and the ninth integrated light source 19 are in the middle.

[0038] The above is just a rational way to splice three integrated light sources. In practical applications, based on the appearance of the matrix LED module, the transfer efficiency of the integrated light source and other factors, the integrated light sources can be combined arbitrarily, and no specific restrictions are made here.

[0039] It should be noted that the above embodiments can be freely combined as needed. The above is only a preferred implementation of the utility model. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the utility model, and these improvements and modifications should also be regarded as the protection scope of the utility model.

Claims

1. A matrix LED module, characterized in that: include: A conductive substrate, the surface of which is configured with corresponding conductive circuits based on the design of the matrix LED module; At least one integrated light source, wherein a plurality of LED chips are integrated and packaged in the integrated light source, and the integrated light source matches the conductive circuit on the conductive substrate, the LED chip is a flip-chip structure chip, and in the integrated light source, the light emitting direction of each LED chip is the same, and the electrode orientation is also the same, and the LED chips are transferred as a whole to the surface of the conductive circuit, and a matrix LED module is obtained by welding the integrated light source to the conductive substrate; When a plurality of integrated light sources are arranged in the matrix LED module, the plurality of integrated light sources are welded on the conductive substrate by splicing and combining to obtain the matrix LED module.

2. The matrix LED module according to claim 1, wherein: The integrated light source comprises: A plurality of regularly arranged LED chips, each of which has a light-emitting top surface, a light-emitting side surface, and an electrode surface opposite to the light-emitting top surface, and each of the plurality of LED chips faces the same direction; A light conversion layer covering the light emitting surfaces of the plurality of LED chips; The covering portion is used to cover the light-emitting side of the LED chip to expose the electrode surface of the LED chip, and the covering portion contains light-reflecting particles.

3. The matrix LED module according to claim 2, wherein: The light reflecting particles are titanium dioxide.

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