BGA welding positioning device

Abstract

The utility model relates to the technical field of BGA welding. The BGA welding positioning device comprises a base, a mounting rod is arranged at the top of the base in the vertical direction, a supporting seat is rotatably arranged at the top of the mounting rod, a mounting seat is slidably arranged on the supporting seat, a lifting rod is slidably arranged on the mounting seat, and a connecting seat is arranged at the bottom of the lifting rod. A mounting frame is rotationally arranged at the bottom of the connecting base, a lampshade is arranged on the mounting frame, and a color laser lamp is arranged in the lampshade. The chip welding device has the advantages that the lampshade, the color laser lamp, the suction cup and the vacuum pump are arranged, the color laser lamp emits light after being powered on, the light forms a rectangular-frame-shaped aperture on a circuit board to be welded after passing through the through groove, and therefore the welding position of a chip is positioned.

Description

Technical Field

[0001] The utility model relates to the technical field of BGA welding, in particular to a BGA welding positioning device. Background Art

[0002] BGA chips are widely used in highly integrated electronic products. If short circuits, empty solder joints, etc. occur in the BGA chips, the function of the circuit board will be affected. Usually, the circuit board is clamped and positioned by a positioning device to ensure stability during the welding process.

[0003] The current BGA soldering positioning device is usually composed of a positioning plate installed on a workbench, an electric telescopic rod installed on the positioning plate, and a clamping plate installed at the output end of the electric telescopic rod. That is, the circuit board is placed in the limit groove opened on the top of the positioning plate, and the electric telescopic rod is started to drive the clamping plate to clamp and position the circuit board to ensure stability during the soldering process.

[0004] In the existing BGA packaging process, the chip is placed on the top of the welding place, and the welding position of the chip is located by the wire frame outside the welding place. However, in the actual manual operation process, it is impossible to place the chip in the middle of the welding area very accurately, and the operation is time-consuming and labor-intensive, which reduces the efficiency of packaging. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art, the present application provides a BGA soldering positioning device.

[0006] The present application provides a BGA soldering positioning device, which adopts the following technical solution:

[0007] A BGA welding positioning device comprises a base, wherein a mounting rod is arranged on the top of the base in a vertical direction, a support seat is rotatably arranged on the top of the mounting rod, a mounting seat is slidably arranged on the support seat, a lifting rod is slidably arranged on the mounting seat in the vertical direction, a connecting seat is arranged at the bottom of the lifting rod, a mounting frame is rotatably arranged at the bottom of the connecting seat, a lampshade is arranged on the mounting frame, a color laser lamp is arranged inside the lampshade, a rectangular through groove is provided at the bottom of the lampshade, a supporting rod is arranged at the bottom of the mounting frame and located at the center position in the vertical direction, a suction cup is arranged at the bottom of the supporting rod, a vacuum pump is arranged on the supporting seat, an air pipe is connected to the suction cup, and one end of the air pipe away from the vacuum pump is connected to the vacuum pump, a connecting rod is horizontally arranged on the mounting rod, a raw material seat is arranged on the connecting rod, a placement groove for placing chips is provided on the raw material seat, a lifting component for driving the lifting rod to move is arranged on the mounting seat, and an adjustment component for adjusting the rotation angle of the mounting frame is arranged on the connecting seat.

[0008] By adopting the above technical solution, when it is necessary to locate the welding position of the chip, the support seat is rotated so that the suction cup is located directly above the placement groove, and then the chip is placed in the placement groove, the position of the suction cup is adjusted by the lifting assembly, and then the vacuum pump is started so that the chip is adsorbed and grasped by the suction cup, and then the support seat is rotated again so that the chip is located above the circuit board to be welded. At this time, the color laser light is powered on, and the color laser light emits light after being powered on. After the light passes through the through groove, it will form an aperture in the shape of a rectangular frame on the circuit board to be welded, and then the position of the mounting frame is adjusted by the adjustment assembly so that the aperture is aligned with the position to be welded, thereby locating the welding position of the chip, and finally the chip is placed at the welding position by the lifting assembly, and then the vacuum pump is turned off to separate the suction cup from the chip.

[0009] Optionally, the lifting assembly includes a gear and a rack, the rack is arranged along the length direction of the lifting rod, the gear is rotatably arranged on the top of the mounting seat through a rotating shaft, and the gear is meshed with the rack, a first screw wheel is coaxially arranged at one end of the rotating shaft, a mounting groove is opened on the lifting rod along its length direction, a fixing rod is threadedly arranged on the mounting seat, a flexible fixing plate is arranged at one end of the fixing rod, and a second hand wheel is arranged at the other end, and the flexible fixing plate abuts against the groove wall of the mounting groove.

[0010] By adopting the above technical solution, when the position of the suction cup needs to be adjusted, the staff rotates the first twist wheel, and the rotation of the first twist wheel will drive the rotating shaft to rotate, and the rotation of the rotating shaft will drive the gear to rotate, and the rotation of the gear will drive the rack to move, so that the lifting rod can move in the vertical direction for lifting and lowering. When the lifting rod moves to the specified position, the second hand wheel is turned, and the rotation of the second hand wheel will drive the fixing rod to move, so that the flexible fixing plate abuts against the groove wall of the installation groove, thereby fixing the current position of the lifting rod.

[0011] Optionally, the adjustment assembly includes a worm wheel and a worm, the worm wheel is arranged on the top of the mounting frame, the worm is rotatably arranged on one side of the connecting seat, and the worm is meshed with the worm wheel, and a third hand wheel is coaxially arranged at one end of the worm.

[0012] By adopting the above technical solution, when it is necessary to adjust the position of the chip and the suction cup so that they coincide with the position to be welded on the circuit board, the staff turns the third hand wheel, and the rotation of the third hand wheel will drive the worm to rotate, and the rotation of the worm will drive the worm wheel to rotate, and the rotation of the worm wheel will drive the mounting frame to rotate, thereby adjusting the position of the suction cup to align with the position to be welded on the circuit board.

[0013] Optionally, a connecting shaft is provided at the bottom of the support seat, and the connecting shaft is rotatably set on the mounting rod. An abutment rod is passed through the mounting rod, and the abutment rod is connected to the mounting rod through a thread, and one end of the abutment rod abuts on the connecting shaft, and a wrench is provided at the other end, and a handle is provided on the support seat.

[0014] By adopting the above technical solution, when the staff needs to rotate the support seat, the staff turns the wrench to move the abutment rod away from the connecting shaft, and then the staff can hold the handle and rotate the support seat. After the staff moves the support seat to the specified angle, they turn the wrench to make the end of the abutment rod abut on the connecting shaft.

[0015] Optionally, a screw rod is rotatably arranged on the support seat along its length direction, the screw rod is threadedly connected to the mounting seat, one end of the screw rod is extended to the outside of the support seat, and a fourth hand wheel is coaxially arranged.

[0016] By adopting the above technical solution, the staff rotates the fourth hand wheel, which will drive the screw to rotate during the rotation of the fourth hand wheel, and the screw will drive the mounting seat to move along the length direction of the screw, thereby adjusting the position of the chip to facilitate alignment with the position to be welded.

[0017] Optionally, the raw material seat is fixed on the connecting rod by bolts.

[0018] By adopting the above technical solution, the staff can replace different raw material seats according to the size of the chip.

[0019] Optionally, the bottom of the mounting frame is in a cross shape, and the support rod is arranged at the center position of the bottom of the mounting frame.

[0020] By adopting the above technical solution, when the color laser light emits light through the rectangular through slot and is blocked by the cross-shaped mounting frame, a cross-shaped shadow spot will appear on the circuit board, making it easier for staff to align the chip.

[0021] Optionally, a universal shaping hose is provided on the mounting rod, and an operation light is provided at one end of the universal shaping hose away from the mounting rod.

[0022] By adopting the above technical solution, the universal shaped hose can be easily bent so that the operating light is directed to the direction where supplementary light is needed. The operating light can supplement the ambient light and facilitate the operation of the staff.

[0023] The utility model has the following advantages:

[0024] 1. By setting up a lampshade, a color laser lamp, a suction cup and a vacuum pump, the color laser lamp emits light after being powered on. After the light passes through the through slot, it will form a rectangular frame-shaped aperture on the circuit board to be welded. Then, the position of the mounting frame is adjusted by adjusting the components so that the aperture is aligned with the welding position to locate the welding position of the chip. Finally, the chip is placed at the welding position by the lifting component, and then the vacuum pump is turned off to separate the suction cup from the chip to ensure that the chip is located in the center of the packaging area, thereby improving the accuracy of the chip packaging position;

[0025] 2. By setting the raw material seat and the placement groove, the suction cup can grab the neatly placed chips, so that the chips can be placed in the packaging position more accurately;

[0026] 3. By setting up a universal shaping hose and an operating light, supplementary lighting can be provided to facilitate the placement of the chip by the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0028] Figure 2 This is a schematic diagram of the installation structure of the lifting assembly of the utility model;

[0029] Figure 3 This is a schematic diagram of the installation structure of the installation frame of the utility model;

[0030] Figure 4 This is a schematic diagram of the installation structure of the color laser light of the utility model;

[0031] In the figure: 1. base; 11. mounting rod; 12. support seat; 13. mounting seat; 14. lifting rod; 15. connecting seat; 16. mounting frame; 17. lampshade; 18. color laser light; 19. through slot; 2. support rod; 21. suction cup; 22. vacuum pump; 23. air pipe; 24. connecting rod; 25. raw material seat; 26. placement slot; 3. lifting assembly; 31. gear; 32. rack; 33. rotating shaft; 34. first screw wheel; 35. mounting slot; 36. fixing rod; 37. flexible fixing plate; 38. second hand wheel; 4. adjustment assembly; 41. worm gear; 42. worm; 43. third hand wheel; 5. connecting shaft; 51. abutment rod; 52. wrench; 53. handle; 6. screw rod; 61. fourth hand wheel; 62. bolt; 63. universal shaping hose; 64. operation light. DETAILED DESCRIPTION

[0032] The present invention is further described below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following description.

[0033] like Figures 1 to 4As shown, a BGA soldering positioning device comprises a base 1, a mounting rod 11 is mounted on the top of the base 1 along the vertical direction, a support seat 12 is rotatably mounted on the top of the mounting rod 11, a mounting seat 13 is slidably mounted on the support seat 12, a lifting rod 14 is slidably mounted on the mounting seat 13 along the vertical direction, a connecting seat 15 is mounted on the bottom of the lifting rod 14, a mounting frame 16 is rotatably mounted on the bottom of the connecting seat 15, a lampshade 17 is mounted on the mounting frame 16, and a color laser light 18 is mounted inside the lampshade 17. In this embodiment, a red color laser light is used. Color laser lamp 18, in other embodiments, color laser lamp 18 of other colors can also be used, the bottom of lampshade 17 is provided with rectangular through slot 19, the bottom of mounting frame 16 and in the center position are provided with support rod 2 in vertical direction, the bottom of support rod 2 is provided with suction cup 21, vacuum pump 22 is provided on support seat 12, air pipe 23 is connected and provided on suction cup 21, one end of air pipe 23 away from vacuum pump 22 is connected with vacuum pump 22, connecting rod 24 is provided with horizontal installation on mounting rod 11, raw material is provided on connecting rod 24 The raw material seat 25 is provided with a placement groove 26 for placing the chip, the mounting seat 13 is provided with a lifting component 3 for driving the lifting rod 14 to move, and the connecting seat 15 is provided with an adjusting component 4 for adjusting the rotation angle of the mounting frame 16; when it is necessary to locate the welding position of the chip, the support seat 12 is rotated so that the suction cup 21 is located directly above the placement groove 26, and then the chip is placed in the placement groove 26, the position of the suction cup 21 is adjusted by the lifting component 3, and then the vacuum pump 22 is started, so that the chip is sucked and caught by the suction cup 21, and then Then rotate the support seat 12 so that the chip is located above the circuit board to be welded. At this time, power on the color laser lamp 18, which emits light after power on. After the light passes through the through slot 19, it will form an aperture in the shape of a rectangular frame on the circuit board to be welded. Then adjust the position of the mounting frame 16 by adjusting the component 4 so that the aperture is aligned with the position to be welded, thereby positioning the welding position of the chip. Finally, place the chip at the welding position through the lifting component 3, and then turn off the vacuum pump 22 to separate the suction cup 21 from the chip.

[0034] like Figures 1 to 4As shown, the lifting assembly 3 includes a gear 31 and a rack 32. The rack 32 is arranged along the length direction of the lifting rod 14. The gear 31 is rotatably installed on the top of the mounting seat 13 through a rotating shaft 33, and the gear 31 is meshed with the rack 32. A first screw wheel 34 is coaxially installed at one end of the rotating shaft 33. A mounting groove 35 is opened on the lifting rod 14 along its length direction. A fixing rod 36 is threadedly installed on the mounting seat 13. A flexible fixing sheet 37 is installed at one end of the fixing rod 36, and a second hand wheel 38 is installed at the other end. The flexible fixing sheet 37 abuts against the groove wall of the mounting groove 35. When it is necessary to adjust When adjusting the position of the suction cup 21, the staff rotates the first tightening wheel 34. During the rotation of the first tightening wheel 34, the rotating shaft 33 is driven to rotate. During the rotation of the rotating shaft 33, the gear 31 is driven to rotate. During the rotation of the gear 31, the rack 32 is driven to move, so that the lifting rod 14 moves along the vertical direction for lifting. When the lifting rod 14 moves to the specified position, the second hand wheel 38 is turned. During the rotation of the second hand wheel 38, the fixing rod 36 is driven to move, so that the flexible fixing sheet 37 abuts against the groove wall of the mounting groove 35, thereby fixing the current position of the lifting rod 14.

[0035] like Figures 1 to 4 As shown, the adjustment component 4 includes a worm wheel 41 and a worm 42, the worm wheel 41 is installed on the top of the mounting frame 16, the worm 42 is rotatably installed on one side of the connecting seat 15, and the worm 42 is meshed with the worm wheel 41, and a third hand wheel 43 is coaxially installed at one end of the worm 42; when it is necessary to adjust the position of the chip and the suction cup 21 so that they coincide with the position to be welded on the circuit board, the staff rotates the third hand wheel 43, and the rotation of the third hand wheel 43 will drive the worm 42 to rotate, and the rotation of the worm 42 will drive the worm wheel 41 to rotate, and the rotation of the worm wheel 41 will drive the mounting frame 16 to rotate, thereby adjusting the position of the suction cup 21 to align it with the position to be welded on the circuit board.

[0036] like Figures 1 to 4 As shown, a connecting shaft 5 is installed at the bottom of the support seat 12, and the connecting shaft 5 is rotatably installed on the mounting rod 11. An abutting rod 51 is passed through the mounting rod 11, and the abutting rod 51 is connected to the mounting rod 11 through a thread, and one end of the abutting rod 51 abuts on the connecting shaft 5, and a wrench 52 is installed on the other end, and a handle 53 is installed on the support seat 12; when the staff needs to rotate the support seat 12, the staff rotates the wrench 52 to make the abutting rod 51 move away from the connecting shaft 5, and then the staff can hold the handle 53 and then rotate the support seat 12. After the staff moves the support seat 12 to a specified angle, the staff rotates the wrench 52 to make the end of the abutting rod 51 abut on the connecting shaft 5.

[0037] like Figures 1 to 4As shown, a screw rod 6 is rotatably installed on the support seat 12 along its own length direction, the screw rod 6 is threadedly connected to the mounting seat 13, one end of the screw rod 6 is extended to the outside of the support seat 12, and a fourth hand wheel 61 is coaxially installed; the staff rotates the fourth hand wheel 61, and the screw rod 6 is driven to rotate during the rotation of the fourth hand wheel 61, and the mounting seat 13 is driven to move along the length direction of the screw rod 6 during the rotation of the screw rod 6, thereby adjusting the position of the chip to facilitate its alignment with the position to be welded.

[0038] like Figures 1 to 4 As shown, the raw material holder 25 is fixedly mounted on the connecting rod 24 by bolts 62; the staff can replace different raw material holders 25 according to the size of the chip.

[0039] like Figures 1 to 4 As shown, the bottom of the mounting frame 16 is in a cross shape, and the support rod 2 is installed at the center position of the bottom of the mounting frame 16; when the color laser light 18 emits light through the rectangular through slot 19 and is blocked by the cross-shaped mounting frame 16, a cross-shaped shadow spot will appear on the circuit board, making it easier for the staff to align the chip.

[0040] like Figures 1 to 4 As shown, a universal shaped hose 63 is installed on the mounting rod 11, and an operating light 64 is installed at one end of the universal shaped hose 63 away from the mounting rod 11; the universal shaped hose 63 can be easily bent so that the operating light 64 faces the direction where supplementary light is needed. The operating light 64 can supplement the ambient light and facilitate operation by the staff.

[0041] The implementation principle of this embodiment is: when it is necessary to locate the welding position of the chip, rotate the support seat 12 so that the suction cup 21 is located directly above the placement groove 26, and then place the chip in the placement groove 26, adjust the position of the suction cup 21 through the lifting component 3, and then start the vacuum pump 22, so that the chip is adsorbed and grasped by the suction cup 21, and then rotate the support seat 12 so that the chip is located above the circuit board to be welded. At this time, the color laser lamp 18 is powered on, and the color laser lamp 18 emits light after being powered on. After the light passes through the through groove 19, it will form an aperture in the shape of a rectangular frame on the circuit board to be welded. Then, the position of the mounting frame 16 is adjusted by the adjustment component 4, so that the aperture is aligned with the position to be welded, thereby locating the welding position of the chip, and finally, the chip is placed at the welding position through the lifting component 3, and then the vacuum pump 22 is turned off to separate the suction cup 21 from the chip.

[0042] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Any technician familiar with the field can make many possible changes and modifications to the technical solution of the utility model by using the above-mentioned technical content without departing from the scope of the technical solution of the utility model, or modify it into an equivalent embodiment of equivalent changes. Therefore, any changes, modifications, equivalent changes and modifications made to the above embodiments based on the technology of the utility model without departing from the content of the technical solution of the utility model shall fall within the protection scope of the technical solution of the utility model.

Claims

1. A BGA soldering positioning device, characterized in that: The invention comprises a base (1), wherein a mounting rod (11) is arranged on the top of the base (1) along the vertical direction, a support seat (12) is rotatably arranged on the top of the mounting rod (11), a mounting seat (13) is slidably arranged on the support seat (12), a lifting rod (14) is slidably arranged on the mounting seat (13) along the vertical direction, a connecting seat (15) is arranged on the bottom of the lifting rod (14), a mounting frame (16) is rotatably arranged on the bottom of the connecting seat (15), a lampshade (17) is arranged on the mounting frame (16), a color laser light (18) is arranged inside the lampshade (17), a rectangular through slot (19) is provided at the bottom of the lampshade (17), and the bottom of the mounting frame (16) and located at the center along the vertical direction are A support rod (2) is arranged in a vertical direction, a suction cup (21) is arranged at the bottom of the support rod (2), a vacuum pump (22) is arranged on the support seat (12), an air pipe (23) is arranged in communication with the suction cup (21), and one end of the air pipe (23) away from the vacuum pump (22) is connected to the vacuum pump (22), a connecting rod (24) is arranged horizontally on the mounting rod (11), a raw material seat (25) is arranged on the connecting rod (24), and a placement groove (26) for placing a chip is opened on the raw material seat (25), a lifting component (3) for driving the lifting rod (14) to move is arranged on the mounting seat (13), and an adjustment component (4) for adjusting the rotation angle of the mounting frame (16) is arranged on the connecting seat (15).

2. A BGA soldering positioning device according to claim 1, characterized in that: The lifting assembly (3) comprises a gear (31) and a rack (32), wherein the rack (32) is arranged along the length direction of the lifting rod (14), the gear (31) is rotatably arranged on the top of the mounting seat (13) via a rotating shaft (33), and the gear (31) is meshed with the rack (32), one end of the rotating shaft (33) is coaxially provided with a first screw wheel (34), the lifting rod (14) is provided with a mounting groove (35) along its length direction, and a fixing rod (36) is threadedly connected to the mounting seat (13), one end of the fixing rod (36) is provided with a flexible fixing sheet (37), and the other end is provided with a second hand wheel (38), and the flexible fixing sheet (37) is in contact with the groove wall of the mounting groove (35).

3. A BGA soldering positioning device according to claim 1, characterized in that: The adjustment assembly (4) comprises a worm wheel (41) and a worm (42), wherein the worm wheel (41) is arranged on the top of the mounting frame (16), the worm (42) is rotatably arranged on one side of the connecting seat (15), and the worm (42) is meshed with the worm wheel (41), and a third hand wheel (43) is coaxially arranged at one end of the worm (42).

4. A BGA soldering positioning device according to claim 3, characterized in that: A connecting shaft (5) is provided at the bottom of the support seat (12), the connecting shaft (5) is rotatably arranged on the mounting rod (11), an abutment rod (51) is passed through the mounting rod (11), the abutment rod (51) is connected to the mounting rod (11) via a thread, one end of the abutment rod (51) abuts against the connecting shaft (5), and a wrench (52) is provided at the other end, and a handle (53) is provided on the support seat (12).

5. A BGA soldering positioning device according to claim 3, characterized in that: A screw rod (6) is rotatably arranged on the support seat (12) along its length direction, the screw rod (6) is threadedly connected to the mounting seat (13), one end of the screw rod (6) is extended to the outside of the support seat (12), and a fourth hand wheel (61) is coaxially arranged thereon.

6. A BGA soldering positioning device according to claim 5, characterized in that: The raw material seat (25) is fixedly arranged on the connecting rod (24) by means of bolts (62).

7. A BGA soldering positioning device according to claim 6, characterized in that: The bottom of the mounting frame (16) is in a cross shape, and the support rod (2) is arranged at the center position of the bottom of the mounting frame (16).

8. A BGA soldering positioning device according to claim 1, characterized in that: The mounting rod (11) is provided with a universal shaped hose (63), and an operating light (64) is provided at one end of the universal shaped hose (63) away from the mounting rod (11).

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