Aluminum alloy finger for grabbing graphite plate in semiconductor industry

Abstract

The utility model discloses an aluminum alloy finger for grabbing a graphite disc in the semiconductor industry, which comprises a graphite disc grabbing module, the graphite disc grabbing module comprises a support plate and two groups of fingers extending out of one end of the support plate, a laser hole is formed in one group of fingers, a laser is accommodated in the laser hole, and the other group of fingers extend out of the support plate. A receiver hole is formed in the other set of fingers, a receiver is contained in the receiver hole, and the laser device is matched with the receiver. Due to the fact that the laser devices and the receivers are arranged in multiple sets, the distance between the two fingers can be monitored, the phenomenon that the distance between the finger on the side close to the supporting plate and the finger on the side far away from the supporting plate is not uniform is avoided, the O-shaped groove is arranged to be of an inner-layer structure and an outer-layer structure, the inner-layer structure is in direct contact with the graphite disc, and the outer-layer structure is used for assembling the friction ring. Good contact connectivity between fingers and the graphite plate can be achieved, and the possibility that the graphite plate slides off and is damaged is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of graphite disk mobile equipment, in particular to an aluminum alloy finger for grabbing a graphite disk in the semiconductor industry. Background Art

[0002] Semiconductor equipment generally uses manipulators to automatically transfer wafers, that is, the manipulator automatically transfers wafers that need to be processed by semiconductor processes into the process chamber, or automatically transfers wafers that have been processed by semiconductor processes out of the process chamber. In this process, semiconductor fingers play an important role in transporting wafers, but conventional semiconductor fingers are generally used to pick up and place wafers, with limited carrying capacity and restricted use. Their shortcomings are very obvious. They cannot be used in situations where graphite trays need to be picked up and placed, which greatly reduces work efficiency and affects the normal progress of subsequent work.

[0003] For example, the patent with publication number CN219066801U discloses a wafer handling finger, which specifically discloses "a wafer handling finger, comprising: a handling plate, the handling plate is provided with an insert slot, the insert slot is a circular slot, and is located at the end of the handling plate; and a handling block, the handling block is fixed on the insert slot, and four are provided in a circular array, the handling block is provided with a handling rod and a handling boss, the handling rod is arranged on one side of the handling block, the handling boss is arranged at the end of the handling rod, and the top surface of the handling boss is located above the handling rod, which is used to abut against the back side of the wafer". The technical solution realizes "the wafer handling finger provided by the utility model realizes the grasping of the wafer by four symmetrically arranged claws, the contact area between the claws and the wafer is small, which does not affect the wafer, and can effectively lock the wafer to prevent the wafer from slipping, and the end is open, which is convenient for insertion into the equipment".

[0004] However, in actual use, this patent has the disadvantage that it can only transport wafers but not graphite disks. It cannot be used in situations where graphite disks need to be taken and placed, which greatly reduces work efficiency and affects the normal progress of subsequent work. There is room for improvement. Utility Model Content

[0005] The purpose of the utility model is to provide an aluminum alloy finger for grabbing graphite disks in the semiconductor industry, which can realize the transportation of graphite disks and solve the problem in the prior art that conventional semiconductor fingers cannot be flexibly used for the transportation of graphite disks between wafer boxes and cannot adapt to the process requirements of graphite disk transportation in the semiconductor industry.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an aluminum alloy finger for grabbing a graphite disk in the semiconductor industry, comprising a graphite disk grabbing module, wherein the graphite disk grabbing module comprises a support plate and two groups of fingers extending from one end of the support plate, wherein a laser hole is opened inside the fingers of one group and a laser is accommodated inside the laser hole, and a receiver hole is opened inside the fingers of the other group and a receiver is accommodated inside the receiver hole, and the laser is adapted to the receiver.

[0007] As a further solution of the utility model: a plurality of groups of O-shaped grooves are provided on one side of the finger, and friction rings are movably connected inside the plurality of groups of O-shaped grooves.

[0008] As a further solution of the utility model: it also includes a balance rod, wherein two groups of the balance rods are provided and are respectively placed at both ends of the finger, and the outer side of the balance rod is screwed and connected with a nut.

[0009] As a further solution of the utility model: the O-shaped groove includes an inner and outer layer structure, wherein the inner layer structure is directly in contact with the graphite disk, and the outer layer structure is for assembling the friction ring.

[0010] As a further solution of the utility model: an in-situ detector is arranged on one side of the support plate, and the in-situ detector is used for in-situ detection of the graphite disk.

[0011] As a further solution of the utility model: it also includes a wafer grabbing module and a flip module, the wafer grabbing module is used to transport the wafer, and the flip module is used to flip the wafer to achieve the combination of the wafer and the graphite disk.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. Since there are multiple groups of lasers and receivers, the distance between two fingers can be monitored to avoid uneven distance between the fingers on the side close to the support plate and the fingers on the side far from the support plate;

[0014] 2. By setting the O-shaped groove as an inner and outer two-layer structure, with the inner layer directly in contact with the graphite disk and the outer layer for the friction ring assembly, the finger and the graphite disk can achieve better contact and connectivity, reducing the possibility of damage to the graphite disk due to slipping;

[0015] 3. On the one hand, by providing two sets of balance bars, the spacing between the proximal and distal ends of the fingers can be kept uniform. On the other hand, the balance bars can also strengthen the distal ends of the fingers by virtue of reinforcing ribs, thereby ensuring that the fingers can be used normally for a long time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure in the embodiment of the utility model;

[0017] Figure 2 This is a schematic diagram of the exploded structure of the graphite disk grabbing module in the embodiment of the utility model;

[0018] Figure 3 This is a structural schematic diagram of a graphite disk grabbing module in an embodiment of the utility model;

[0019] Figure 4 For the utility model embodiment Figure 2 The enlarged view of point A in the middle;

[0020] In the figure: 10, graphite disk grabbing module; 20, wafer grabbing module; 30, flip module; 1, support plate; 11, in-place detector; 2, finger; 21, laser hole; 22, receiver hole; 23, O-groove; 3, balance bar; 4, friction ring; 5, laser; 6, receiver; 7, nut. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In the description of the present utility model, it should be noted that, for those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0023] Reference Figure 1 , Figure 2 As shown, in an embodiment of the utility model, an aluminum alloy finger for grabbing a graphite disk in the semiconductor industry includes a graphite disk grabbing module 10, and the graphite disk grabbing module 10 includes a support plate 1 and two groups of fingers 2 extending from one end of the support plate 1, one group of the fingers 2 has a laser hole 21 opened inside and a laser 5 is accommodated inside the laser hole 21, and the other group of the fingers 2 has a receiver hole 22 opened inside and a receiver 6 is accommodated inside the receiver hole 22, and the laser 5 is adapted to the receiver 6.

[0024] Other embodiments of the present invention: Figure 2 and Figure 3 The laser 5 can be a commonly used infrared laser, and the receiver 6 can be a commonly used laser grid. Since there are multiple groups of lasers 5 and receivers 6, the distance between two fingers 2 can be monitored to avoid uneven distances between the fingers 2 on the side close to the support plate 1 and the fingers 2 on the side far from the support plate 1.

[0025] As a further solution of the utility model: a plurality of groups of O-shaped grooves 23 are opened on one side of the finger 2, and the interiors of the plurality of O-shaped grooves 23 are movably connected with friction rings 4. The O-shaped grooves 23 include an inner and outer layer structure, wherein the inner layer structure directly contacts the graphite disk, and the outer layer structure is for assembling the friction ring 4.

[0026] Other embodiments of the present invention: Figure 2 and Figure 4 By setting the O-shaped groove 23 as an inner and outer two-layer structure, with the inner layer structure directly contacting the graphite disk and the outer layer structure for assembling the friction ring 4, better contact connectivity between the finger 2 and the graphite disk can be achieved, reducing the possibility of damage to the graphite disk due to slipping.

[0027] As a further solution of the utility model, it also includes a balancing rod 3, wherein two groups of the balancing rod 3 are provided and are respectively disposed at two ends of the finger 2, and a nut 7 is screwed and connected to the outer side of the balancing rod 3.

[0028] Other embodiments of the present invention: Figure 2 and Figure 3 On the one hand, by providing two sets of balance bars 3, the spacing between the proximal and distal ends of the fingers 2 can be kept uniform. On the other hand, the balance bars 3 can also strengthen the distal ends of the fingers 2 by virtue of the reinforcing ribs, thereby ensuring that the fingers 2 can be used normally for a long time.

[0029] As a further solution of the utility model: an in-situ detector 11 is provided on one side of the support plate 1, and the in-situ detector 11 is used for in-situ detection of the graphite disk, and also includes a wafer grabbing module 20 and a Flip module 30. The wafer grabbing module 20 is used to transport the wafer, and the Flip module 30 is used to flip the wafer to achieve the combination of the wafer and the graphite disk.

[0030] Other embodiments of the present invention: Figure 3 , sends a signal to the robot arm processing chip and drives the wafer grabbing module 20 to fork the wafer or graphite disk, and then drives the wafer grabbing module 20 to flip through the Flip module 30 and flip the wafer or graphite disk onto the graphite disk grabbing module 10. Since the in-situ detector 11 is a proximity switch, it can detect the presence of a graphite disk on the graphite disk grabbing module 10, thereby realizing the transportation of the wafer or graphite disk.

[0031] The working principle of the utility model is: the manipulator sends a signal to the robot arm processing chip and drives the wafer grabbing module 20 to fork the wafer or graphite disk, and then drives the wafer grabbing module 20 to flip through the Flip module 30 and flip the wafer or graphite disk onto the graphite disk grabbing module 10. Since the in-situ detector 11 is a proximity switch, it can detect the presence of a graphite disk on the graphite disk grabbing module 10, thereby realizing the transportation of the wafer or graphite disk.

[0032] Since the laser 5 can be a commonly used infrared laser and the receiver 6 can be a commonly used laser grid, and since there are multiple groups of lasers 5 and receivers 6, the distance between two fingers 2 can be monitored to avoid uneven distances between the fingers 2 on the side close to the support plate 1 and the fingers 2 on the side far from the support plate 1.

[0033] Furthermore, by configuring the O-shaped groove 23 to have an inner and outer double-layer structure, with the inner layer directly contacting the graphite disk and the outer layer being provided for assembling the friction ring 4 , better contact connectivity between the finger 2 and the graphite disk can be achieved, reducing the possibility of the graphite disk slipping and being damaged.

[0034] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An aluminum alloy finger for grabbing graphite disks in the semiconductor industry, characterized in that: The invention comprises a graphite disk grasping module (10), wherein the graphite disk grasping module (10) comprises a support plate (1) and two groups of fingers (2) extending from one end of the support plate (1), wherein a laser hole (21) is provided inside one group of the fingers (2) and a laser (5) is accommodated inside the laser hole (21), and a receiver hole (22) is provided inside the other group of the fingers (2) and a receiver (6) is accommodated inside the receiver hole (22), and the laser (5) and the receiver (6) are compatible.

2. The aluminum alloy finger for grabbing graphite disks in the semiconductor industry according to claim 1, characterized in that: A plurality of groups of O-shaped grooves (23) are provided on one side of the finger (2), and friction rings (4) are movably connected inside the plurality of groups of O-shaped grooves (23).

3. The aluminum alloy finger for grabbing graphite disks in the semiconductor industry according to claim 2, characterized in that: It also comprises a balancing rod (3), wherein two groups of the balancing rod (3) are provided and are respectively disposed at two ends of the finger (2), and a nut (7) is screwed and connected to the outer side of the balancing rod (3).

4. The aluminum alloy finger for grabbing graphite disks in the semiconductor industry according to claim 3, characterized in that: The O-shaped groove (23) comprises an inner and outer layer structure, wherein the inner layer structure is in direct contact with the graphite disk, and the outer layer structure is used for assembling the friction ring (4).

5. The aluminum alloy finger for grabbing graphite disks in the semiconductor industry according to claim 4, characterized in that: An on-site detector (11) is provided on one side of the support plate (1), and the on-site detector (11) is used for on-site detection of the graphite disk.

6. The aluminum alloy finger for grabbing graphite disks in the semiconductor industry according to claim 5, characterized in that: It also comprises a wafer grabbing module (20) and a flip module (30), wherein the wafer grabbing module (20) is used to carry the wafer, and the flip module (30) is used to flip the wafer to achieve the combination of the wafer and the graphite disk.

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