Flash memory marking device
By introducing detection and marking modules into flash memory to distinguish the bit flip blocks, the problem of decreasing the number of erasable times caused by the indistinguishable flash memory test method is solved, and the service life of the memory is extended.
Patent Information
- Application Number
- CN202420868627.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-04-24
AI Technical Summary
Existing flash memory testing methods cannot effectively distinguish and mark blocks with bit flip phenomenon, resulting in a decrease in the number of erasable blocks, which in turn affects the service life of the memory.
A flash memory marking device is designed, including a detection module and a marking module in a microcontroller, which is used to detect and mark blocks in the flash memory where bit flip phenomenon occurs, thereby distinguishing the application scenarios of different blocks and avoiding damage caused by frequent rewrittening.
By distinguishing and reasonably allocating bit-flipped and unflipped blocks, the service life of flash memory is extended, the formation of bad blocks is prevented, and the stability and reliability of the memory is improved.
Smart Images
Figure CN222337931U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of flash memory, in particular to a flash memory marking device. Background Art
[0002] Flash memory is widely used as a carrier for storing information in various fields such as routers, optical modems, energy storage boards, etc. due to its advantages such as large capacity, fast rewrite speed, and many erasable times. The requirements for its quality are also getting higher and higher. Flash memory often needs to be tested before leaving the factory.
[0003] At present, the test of flash memory by storage manufacturers is to write the graphic algorithm, and then read the graphic algorithm in the flash memory for verification. If the read data is consistent with the written data, the storage function of the storage chip is judged to be intact. However, due to media failure, electromagnetic interference, communication noise and other reasons, the data may be disturbed during the transmission or storage process, resulting in the wrong bit being written or read. At this time, ECC (Error-Correcting Code) is needed to help detect and correct these errors by adding additional redundant information to the data. After ECC error correction, the above test method is used to test the flash memory after error correction, and the measured result is still that the storage function is intact.
[0004] However, even after ECC error correction, the stability and reliability of the block with bit flipping inside the flash memory will still deteriorate, resulting in a decrease in the number of times the block can be erased and written. If it is not distinguished from the block without bit flipping, and the block is mounted in a partition that needs to be frequently erased and written, it will quickly become a bad block. When the number of bad blocks reaches a certain level, the entire flash memory will become unusable. Utility Model Content
[0005] The main purpose of the utility model is to provide a flash memory marking device, aiming to solve the problem that the existing marking device fails to distinguish blocks with bit flipping.
[0006] To achieve the above object, the utility model provides a flash memory marking device, the flash memory marking device comprising:
[0007] A single-chip microcomputer, the single-chip microcomputer includes a detection module and a marking module, the detection module is electrically connected to the flash memory to be tested, and is used to detect blocks in the flash memory to be tested where bit flipping occurs; the marking module is electrically connected to the detection module and the flash memory to be tested, and the marking module can mark blocks where bit flipping occurs.
[0008] In some embodiments, the single chip microcomputer further includes a fault diagnosis module, which is electrically connected to the single chip microcomputer and is used to diagnose the flash memory to be tested.
[0009] In some embodiments, the flash memory marking device further includes a host computer, and the host computer is communicatively connected to the single-chip microcomputer.
[0010] In some embodiments, an automation module is provided in the host computer, and the automation module is used to start and stop the single-chip microcomputer and output test data to the user end.
[0011] In some embodiments, the host computer is communicatively connected to the single chip microcomputer via a USB interface.
[0012] In some embodiments, the flash memory marking device further includes a temperature control module and a heating element electrically connected to the temperature control module, the temperature control module is electrically connected to the single chip computer, and the temperature control module is used to control the heating power of the heating element.
[0013] In some embodiments, the flash memory marking device further includes a test socket, the test socket is electrically connected to the single-chip computer, and the flash memory to be tested is arranged on the test socket.
[0014] In some embodiments, there are several test sockets, and the single chip microcomputer is electrically connected to the several test sockets via an SPI bus.
[0015] In some embodiments, the flash memory marking device further includes a power supply module, which is electrically connected to the test socket and is used to provide electrical energy to the test socket.
[0016] In some embodiments, the power supply module includes a plurality of power on-off switches, and the power supply module is electrically connected to a plurality of the test sockets through the plurality of power on-off switches.
[0017] The utility model technology arranges that a single-chip microcomputer is electrically connected to a flash memory device to be tested. By arranging a detection module and a marking module in the single-chip microcomputer, the detection module detects blocks with bit flipping phenomenon in the flash memory device to be tested, and the marking module marks the blocks with bit flipping phenomenon, thereby realizing the distinction between various blocks in the flash memory device, making it convenient for staff to mount blocks without bit flipping marks in partitions that need to be frequently erased and written, and to mount blocks with bit flipping marks in read-only partitions or other partitions with lower erasing and writing frequencies, thereby improving the service life of the flash memory device. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a structural schematic diagram of an embodiment of a flash memory marking device of the utility model;
[0019] Figure 2 It is a structural schematic diagram of another embodiment of the flash memory marking device of the utility model;
[0020] Figure 3 This is a structural schematic diagram of another embodiment of the flash memory marking device of the utility model;
[0021] Figure 4 It is a structural schematic diagram of another embodiment of the flash memory marking device of the utility model.
[0022] Reference numerals:
[0023] 100, single chip microcomputer; 110, detection module; 120, marking module; 130, fault diagnosis module; 200, flash memory to be tested; 300, host computer; 310, automation module; 400, temperature control module; 500, heating element; 600, test socket; 700, power supply module DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the scheme in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0026] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.
[0027] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0028] The utility model provides a flash memory marking device, referring to Figure 1 , the flash memory marking device comprises:
[0029] The single-chip microcomputer 100 includes a detection module 110 and a marking module 120. The detection module 110 is electrically connected to the flash memory 200 to be tested, and is used to detect blocks in the flash memory 200 to be tested where bit flipping occurs; the marking module 120 is electrically connected to the detection module 110 and the flash memory 200 to be tested, and the marking module 120 can mark blocks where bit flipping occurs.
[0030] When the marking device is powered on, the detection module 110 in the single-chip computer 100 first checks the blocks in the flash memory step by step to determine whether there is a block in which a bit flip has occurred (hereinafter referred to as a weak block). If a weak block is detected, its position information is sent to the marking module 120, and the marking module 120 marks the weak block. Exemplarily, the specific marking method can be to change the first byte from FF to AA or BB in the spare area of the first page, the second page or the last page in the weak block.
[0031] Therefore, during the application process of the flash memory after marking, the application platform can scan each block of the flash memory. If a byte change is detected in a block, it can be known that it is a weak block with bit flipping, and then the addresses of the marked and unmarked blocks are remapped, and the application scenarios of each block are reasonably allocated to improve the service life of the entire flash memory. For example, for application scenarios that require high device stability and reliability, such as routers, optical modems and other network devices, these platforms are running Linux systems stored in flash memory. The Linux system is mainly composed of uboot partitions, kernel partitions and rootfs partitions. During the operation of the operating system, the uboot partition and kernel partition rarely need to be erased and written. They are generally read-only attributes and can only be read and viewed, but cannot be modified or saved, to prevent accidental modifications to important files; the rootfs partition is a file management system partition, and the flash memory will be frequently erased and written. The marked weak blocks are allocated to the uboot partition and kernel partition, and the unmarked blocks are allocated to the rootfs partition, which can ensure that the weak blocks can still be used for a long time, thereby preventing them from becoming bad blocks and preventing the entire flash memory from being unusable.
[0032] The utility model technology sets the single-chip computer 100 to be electrically connected with the flash memory 200 to be tested. By setting the detection module 110 and the marking module 120 in the single-chip computer 100, the detection module 110 detects the blocks with bit flipping phenomenon in the flash memory 200 to be tested, and the marking module 120 marks the blocks with bit flipping phenomenon, so as to distinguish the blocks in the flash memory, and facilitate the staff to mount the blocks without bit flipping marks in the partitions that need to be frequently erased and written, and to mount the blocks with bit flipping marks in the read-only partition or other partitions with lower erasing and writing frequency, thereby improving the service life of the flash memory.
[0033] like Figure 2 As shown, in some embodiments, the single chip microcomputer 100 further includes a fault diagnosis module 130 , and the fault diagnosis module 130 is electrically connected to the single chip microcomputer 100 and is used to diagnose the flash memory 200 to be tested.
[0034] The fault diagnosis module 130 can perform a comprehensive test on the flash memory 200 to be tested, for example, detect whether there are bad blocks in the flash memory 200 to be tested; perform a read / write speed test on the flash memory 200 to be tested, and test the read and write speeds, including sequential read / write speeds and random read / write speeds; test the performance and life of the flash memory after multiple write operations by executing a large number of write operations; simulate sudden power outages to ensure the consistency and reliability of the data in the flash memory in the event of power outages or accidents; test the error detection and repair functions of the flash memory device, including bad block management, data integrity checking, and automatic repair mechanisms, etc.
[0035] By setting up a fault diagnosis module 130 in the single-chip computer 100, it is possible to detect various aspects of the performance of the flash memory 200 under test while marking weak blocks, making it convenient for staff to retrieve test data and make targeted adjustments to problems that occur in the flash memory 200 under test in a timely manner.
[0036] like Figure 2 As shown, in some embodiments, the flash memory marking device further includes a host computer 300, and the host computer 300 is in communication connection with the single-chip computer 100. By adding the host computer 300, the single-chip computer 100 only needs to simply process various data of the marking process, including the ID of the flash memory to be tested, whether it contains weak blocks, the number and position of weak blocks, etc., and then transmit the processed data to the host computer 300 for further analysis and processing, so as to improve the detection efficiency of the entire marking device.
[0037] like Figure 2 As shown, in some embodiments, the host computer 300 is provided with an automation module 310, and the automation module 310 is used to start and stop the single-chip microcomputer 100 and output the detection data to the user end. The host computer 300 can realize the automatic control of the entire test process through the automation module 310, including sending instructions to the single-chip microcomputer 100, so that the single-chip microcomputer 100 starts or stops the detection and marking of the flash memory 200 to be tested, and automatically analyzes and outputs the results, which reduces the burden on the staff and improves the work efficiency.
[0038] like Figure 2 As shown, in some embodiments, the host computer 300 is connected to the single-chip microcomputer 100 through a USB interface. The USB interface is a universal serial bus interface that can be used to connect a computer and other external devices.
[0039] The USB interface usually supports high-speed data transmission, high transmission efficiency, and supports hot-swap function, so the staff can plug and unplug the USB device without shutting down the computer or device. The host computer 300 is connected to the single-chip computer 100 through the USB interface, which facilitates the single-chip computer 100 to quickly transmit the test data to the host computer 300 for storage, processing, and analysis, so that the staff can quickly obtain the test results and improve work efficiency.
[0040] like Figure 3 As shown, in some embodiments, the flash memory marking device also includes a temperature control module 400 and a heating element 500 electrically connected to the temperature control module 400 , the temperature control module 400 is electrically connected to the single chip computer 100 , and the temperature control module 400 is used to control the heating power of the heating element 500 .
[0041] Since weak blocks in the flash memory 200 to be tested are more easily detected at higher temperatures, a heating element 500 is provided to increase the internal temperature of the flash memory marking device, so as to facilitate the detection module 110 to detect weak blocks and improve work efficiency. However, excessively high temperatures may cause damage to various internal components, so the internal temperature is monitored in real time by the temperature control module 400, and the heating power of the heating element is adjusted accordingly. The maximum temperature threshold is usually 85°C, which can be adjusted according to the product data sheet, and this embodiment does not limit this.
[0042] like Figure 4 As shown, in some embodiments, the flash memory marking device further includes a test socket 600, the test socket 600 is electrically connected to the single-chip computer 100, and the flash memory 200 to be tested is arranged on the test socket 600. The test socket 600 is provided to facilitate the connection between the flash memory 200 to be tested and the single-chip computer 100, and different types of interfaces can be provided on the test socket 600 to detect and mark different types of flash memories 200 to be tested.
[0043] like Figure 4 As shown, in some embodiments, there are several test sockets 600, and the single-chip microcomputer 100 is connected to the several test sockets 600 via the SPI bus. The single-chip microcomputer 100 is electrically connected to the several test sockets 600 using the SPI bus, and multiple flash memory devices 200 to be tested can be tested at the same time, with simple communication and fast data transmission rate.
[0044] like Figure 4 As shown, in some embodiments, the flash memory device marking device further includes a power supply module 700, and the power supply module 700 is electrically connected to the test socket 600, and is used to provide power to the test socket 600. Since the working voltages of different models of the flash memory devices 200 to be tested produced by different manufacturers are different, generally the working voltage range of the flash memory devices 200 to be tested with a rated voltage of 3.3V is 2.7V-3.6V, and the working voltage range of the flash memory devices 200 to be tested with a rated voltage of 1.8V is 1.7V-1.95V, so different voltages are provided to the flash memory devices 200 to be tested with different models through the power supply module 700, so that the test process can proceed smoothly and avoid failures.
[0045] like Figure 4 As shown, in some embodiments, the power supply module 700 includes a plurality of power on-off switches, and the power supply module 700 is electrically connected to a plurality of the test sockets 600 respectively through the plurality of power on-off switches.
[0046] When a test abnormality / failure occurs in the flash memory 200 to be tested on any test socket 600, the power supply module 700 can control the power on / off switch corresponding to the test socket 600 to cut off the power to it and perform maintenance to eliminate the fault. Other test sockets 600 can still operate as usual, reducing the impact of a single test socket 600 failure on the overall test progress and improving work efficiency.
[0047] The above description is only a partial or preferred embodiment of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.
Claims
1. A flash memory marking device, characterized in that: It comprises a single chip microcomputer, which comprises a detection module and a marking module. The detection module is electrically connected to a flash memory to be tested and is used to detect blocks in the flash memory to be tested where bit flipping occurs. The marking module is electrically connected to the detection module and the flash memory to be tested and can mark blocks where bit flipping occurs.
2. The flash memory marking device according to claim 1, characterized in that: The single chip microcomputer further comprises a fault diagnosis module, which is electrically connected to the single chip microcomputer and is used for diagnosing the flash memory to be tested.
3. The flash memory marking device according to claim 2, characterized in that: The flash memory marking device also includes a host computer, which is communicatively connected with the single-chip microcomputer.
4. The flash memory marking device according to claim 3, characterized in that: The host computer is provided with an automation module, and the automation module is used to start and stop the single chip microcomputer and output test data to the user end.
5. The flash memory marking device according to claim 4, characterized in that: The host computer is connected to the single-chip computer through a USB interface.
6. The flash memory marking device according to any one of claims 1 to 5, characterized in that: The flash memory marking device further comprises a temperature control module and a heating element electrically connected to the temperature control module. The temperature control module is electrically connected to the single chip computer, and the temperature control module is used to control the heating power of the heating element.
7. The flash memory marking device according to claim 1, characterized in that: The flash memory marking device further comprises a test socket, the test socket is electrically connected to the single chip computer, and the flash memory to be tested is arranged on the test socket.
8. The flash memory marking device according to claim 7, characterized in that: There are several test sockets, and the single chip microcomputer is electrically connected to the several test sockets via an SPI bus.
9. The flash memory marking device according to claim 8, characterized in that: The flash memory marking device further comprises a power supply module, which is electrically connected to the test socket and is used to provide electrical energy to the test socket.
10. The flash memory marking device according to claim 9, characterized in that: The power supply module includes a plurality of power on-off switches, and the power supply module is electrically connected to a plurality of test sockets through the plurality of power on-off switches.