Memory chip testing device and memory chip testing system

Abstract

The utility model discloses a memory chip testing device, which comprises a bearing assembly used for bearing a memory chip to be tested and a power supply module used for supplying power to the memory chip, an accommodating cavity is formed in a body, one surface, bearing the memory chip, of the bearing assembly covers an opening of the accommodating cavity, and the accommodating cavity is closed. The temperature control assembly is used for regulating the temperature of the accommodating cavity; the humidity regulation and control assembly is used for regulating and controlling the humidity in the accommodating cavity; the temperature control assembly and the humidity regulation and control assembly are electrically connected and controlled to work. In the technical scheme of the embodiment, the temperature control assembly is matched with the humidity regulation and control assembly, so that proper humidity and temperature test conditions can be created in the accommodating cavity. In addition, the utility model also discloses a memory chip test system.

Description

Technical Field

[0001] The utility model relates to the technical field of chips, in particular to a storage chip testing device and a storage chip testing system. Background Art

[0002] With the rapid development of information technology, memory chips, especially SPI NAND FLASH chips, have become the focus of the industry due to their high stability, low cost and wide application. These chips play a key role in various electronic devices, from portable devices to large data centers, all relying on their high performance and reliability.

[0003] At present, the low temperature test of SPI NAND FLASH chips usually adopts the method of placing the chips directly in a low temperature environment. This test is to simulate the chip performance under extreme climate conditions and ensure that the chip can work stably in various environments. The test equipment usually includes a carrier component to hold the chip, and place it in a low temperature environment during the test.

[0004] However, existing low-temperature testing methods have significant drawbacks. In a low-temperature environment, moisture on the surface of the memory chip and in the air easily condenses into ice, which may affect the electrical properties of the chip and lead to inaccurate test results. Utility Model Content

[0005] The main purpose of the utility model is to provide a memory chip testing device, which aims to solve the problem that in a low-temperature environment, moisture on the surface of the memory chip and in the air easily condenses into ice, affecting the electrical characteristics of the chip and causing inaccurate test results.

[0006] To achieve the above object, the utility model provides a memory chip testing device, the memory chip testing device comprising:

[0007] A carrying component, the carrying component is used to carry the memory chip to be tested;

[0008] A power module, electrically connected to the carrier assembly, and used to supply power to the memory chip to be tested located on the carrier assembly;

[0009] A body, wherein a receiving cavity is formed inside the body, and a cover on a side of the carrying assembly carrying the storage chip is disposed at an opening of the receiving cavity to close the receiving cavity;

[0010] A temperature control component, the output end of which is connected to the body and is used to adjust the temperature of the accommodating cavity;

[0011] A humidity control component is disposed in the accommodating cavity and is used to control the humidity in the accommodating cavity;

[0012] A main controller is arranged on the bearing component, and the main controller is electrically connected to and controls the operation of the temperature control component and the humidity control component.

[0013] In some embodiments, the temperature control component includes:

[0014] A refrigeration component, the output end of which is connected to the body and is used to adjust the temperature in the accommodating cavity;

[0015] A temperature control component, provided on the body or the refrigeration component, electrically connected to the main controller and the refrigeration component, and used to control the operation of the refrigeration component;

[0016] The humidity control component comprises:

[0017] A dehumidification component is disposed in the accommodating chamber and is electrically connected to the main controller to adjust the humidity in the accommodating chamber under the control of the main controller.

[0018] In some embodiments, the temperature control component is a PID controller.

[0019] In some embodiments, the temperature control component further includes:

[0020] a temperature sensor, disposed in the accommodating chamber and electrically connected to the main controller, the temperature sensor being used to feed back the temperature in the accommodating chamber to the main controller;

[0021] The humidity control component also includes:

[0022] A humidity sensor is disposed in the accommodating cavity and spaced apart from the temperature sensor. The humidity sensor is electrically connected to the main controller and is used to feed back the humidity in the accommodating cavity.

[0023] In some embodiments, the temperature sensor and the humidity sensor are integrated into a module, and the module is installed in the accommodating cavity;

[0024] Wherein, the module is electrically connected to the main controller and is used to feed back the environmental parameters in the accommodating chamber.

[0025] In some embodiments, the bearing assembly includes:

[0026] A carrier plate, the carrier plate cover is arranged at the opening of the accommodating cavity, and the surface of the carrier plate is provided with at least two test sockets for carrying the memory chip;

[0027] Wherein, the main controller is arranged on a side of the carrying plate facing away from the test seat.

[0028] In some embodiments, a surface of the carrier plate on which the test seat is provided is coated with a triple-conformal coating.

[0029] In some embodiments, the main controller includes:

[0030] A data acquisition module, the data acquisition module is electrically connected to the module, the data acquisition module obtains environmental parameters in the accommodating cavity through the module, and is also electrically connected to the bearing assembly, and is used to collect test data of the storage chip;

[0031] The data processing module controls the operation of the temperature control component and the humidity control component according to the environmental parameters, and performs the read and write operations of the storage chip and the processing of the test data.

[0032] In some embodiments, the data acquisition module includes a microcontroller, the microcontroller is an STM32H7 microcontroller, and the data processing module is a single-chip microcomputer.

[0033] The utility model further proposes a memory chip testing system, comprising a host computer and the aforementioned memory chip testing device, wherein the host computer is communicatively connected to the main controller to send a test instruction to the main controller.

[0034] In the technical solution of the utility model, the bearing component cover is set on the main body to close the accommodating cavity of the main body, so that the main body has the conditions for creating a low-temperature environment, and then the temperature control component and the humidity adjustment component are set on the main body to create suitable humidity and temperature test conditions in the accommodating cavity. These conditions are further regulated and maintained by the main controller to ensure that the temperature and humidity of the test environment remain stable. In this way, the probability of moisture on the surface of the storage chip and in the air condensing into ice in a low-temperature test environment is reduced, and the accuracy of the test results is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a structural schematic diagram of a storage chip testing device in one embodiment of the utility model;

[0036] Figure 2 This is a schematic diagram of the back structure of the mainboard in one embodiment of the utility model;

[0037] Figure 3 This is a structural schematic diagram of a storage chip testing device in another embodiment of the utility model;

[0038] Figure 4 This is a structural schematic diagram of a storage chip testing device in another embodiment of the utility model;

[0039] Figure 5 It is a structural schematic diagram of a storage chip testing device in one embodiment of the utility model.

[0040] Description of Figure Numbers:

[0041] 100, bearing assembly; 102, bearing plate; 104, test socket; 200, power module; 300, main body; 400, temperature control assembly; 402, refrigeration component; 406, temperature sensor; 404, temperature control component; 500, humidity control assembly; 502, dehumidification component; 506, humidity sensor; 508, module; 600, main controller; 602, data acquisition module; 604, data processing module; 700, host computer; 300a, accommodating cavity; F, storage chip.

[0042] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the scheme in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0044] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0045] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0046] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0047] See also Figure 1 and Figure 5 , Figure 1This is a schematic diagram of the structure of a memory chip F test device in an embodiment of the present utility model. Figure 5 It is a structural schematic diagram of a storage chip testing device in one embodiment of the utility model.

[0048] The present utility model embodiment provides a memory chip F testing device, the memory chip F testing device comprising:

[0049] A carrying assembly 100, the carrying assembly 100 is used to carry a memory chip F to be tested;

[0050] The power module 200 is electrically connected to the carrier assembly 100 and is used to supply power to the memory chip F to be tested located on the carrier assembly 100;

[0051] The body 300 has a receiving cavity 300a therein, and a side of the carrying assembly 100 carrying the memory chip F is covered at the opening of the receiving cavity 300a to close the receiving cavity 300a;

[0052] A temperature control component 400, the output end of which is connected to the body 300, and is used to adjust the temperature of the accommodating cavity 300a;

[0053] The humidity control component 500 is disposed inside the accommodating chamber 300a and is used to control the humidity inside the accommodating chamber 300a;

[0054] The main controller 600 is disposed on the carrier assembly 100 , and the main controller 600 is electrically connected to and controls the operation of the temperature control assembly 400 and the humidity control assembly 500 .

[0055] In this embodiment, the carrier assembly 100 is mainly used to carry the memory chip F to be tested and to provide an installation place for the main controller; and during the test process, it also needs to be covered on the main body 300 to close the accommodating cavity 300a, so that the accommodating cavity 300a becomes a closed low-temperature chamber. Therefore, the carrier assembly 100 should be made of a material that can maintain physical stability and mechanical strength at extremely low temperatures. For example, high-performance plastics such as polyimide (Polyimide) or polytetrafluoroethylene (PTFE) are used. These materials can maintain good performance even at liquid nitrogen temperatures as low as -196°C.

[0056] The structural design of the carrier assembly 100 should take into account the ease of installation and removal of the memory chip F, while ensuring good thermal contact between the chip and the temperature control assembly 400 during the test process. The design can use a groove or a clamping mechanism to fix the memory chip F.

[0057] In order to effectively conduct heat from the memory chip F to the temperature control assembly 400, the carrier assembly 100 should have good thermal conductivity. It is possible to consider adding a filler with high thermal conductivity, such as graphite or metal powder, to the assembly material to improve the thermal conduction efficiency.

[0058] In summary, the design and material selection of the carrier assembly 100 are crucial to ensure the normal operation of the memory chip F test device in a low temperature environment. By optimizing the low temperature resistance and thermal conductivity of the carrier assembly 100, the accuracy and reliability of the test can be improved.

[0059] The power module 200 in this embodiment is mainly used to provide a stable and precise power supply for the memory chip F placed on the carrier assembly 100. Usually, a digital precision power supply can be used, which can provide programmable output voltage and current, as well as high-precision voltage and current control functions. Based on this, the power module 200 can also include a user interface that allows operators to easily set and monitor output parameters.

[0060] In addition, the power module 200 can be provided with overload protection and short circuit protection functions to prevent accidental damage to the memory chip F or the test device. Through the above design, the power module 200 can provide reliable power support for the memory chip F test, ensure the stability and accuracy of the power supply during the test, and thus improve the credibility of the test results.

[0061] In this embodiment, the body 300 is mainly used to accommodate the temperature control component 400 and the humidity control component 500, and to create a low-temperature test environment with suitable humidity under the cooperation of the temperature control component 400 and the humidity control component 500. The material thereof is generally made of a material with good insulation and low-temperature resistance, such as polycarbonate or stainless steel. These materials can not only withstand the influence of the low-temperature test environment, but also maintain the integrity and stability of the structure.

[0062] In the process of creating a low-temperature test environment with suitable humidity, it is necessary to ensure the sealing performance of the body 300 and the carrier assembly 100 at all times to ensure the stability of the test environment. Therefore, a sealing strip or a gasket can be set at the position where the body 300 is connected to the carrier assembly 100 to prevent the entry of external air and the leakage of internal humidity.

[0063] Furthermore, in order to make the test environment more stable, the body 300 can be wrapped with a heat-insulating material, such as polyurethane foam or glass wool. These materials have good heat-insulating properties and can effectively prevent the influence of the external temperature on the test environment. In addition, a vacuum layer, a reflective coating, etc. can also be used. In this way, the test environment can be effectively isolated from the external temperature, ensuring that the temperature and humidity of the test environment are controlled according to predetermined parameters, thereby ensuring the accuracy and reliability of the memory chip F test.

[0064] In this embodiment, the temperature control component 400 is designed to reduce the temperature of the accommodating cavity 300a, wherein the temperature control component 400 can use compressor refrigeration or semiconductor refrigeration; if the airtightness of the main body 300 is taken into consideration, the temperature inside the accommodating cavity 300a can be reduced by cold conduction, for example, through a heat pipe or a heat exchanger, which can conduct cold from the cooling source to the inside of the accommodating cavity 300a without directly contacting the storage chip F.

[0065] In this embodiment, the humidity control component 500 is used to maintain the humidity in the receiving chamber 300a within an ideal range, which is necessary for the performance test of some memory chips F. For example, it can use a humidity-sensitive material or a humidity sensor 506 to monitor the humidity level and adjust the humidity through an electronic control system. For example, an ultrasonic humidifier or a desiccant is used to increase or decrease the humidity in the receiving chamber 300a.

[0066] In some cases where the standard humidity control component 500 cannot be used, it is possible to consider using a traditional physical moisture absorption or dehumidification material, such as a silica gel desiccant, as an alternative. The above methods can effectively control the humidity in the accommodating cavity 300a. This is very important for simulating the humidity conditions that the memory chip F may encounter in actual use, and can ensure the accuracy and reliability of the test results.

[0067] In this embodiment, the main controller 600 mainly controls the temperature control component 400 and the humidity control component 500 through electrical connection and controls the operation of the two to ensure that the temperature and humidity of the test environment meet the preset test standards. In order to improve the efficiency and stability of signal transmission, in this embodiment, the main controller 600 can be directly set on the carrier component 100.

[0068] During the extreme low temperature environment test, first, the operator installs the memory chip F to be tested onto the carrier assembly 100. Then the carrier assembly 100 and the memory chip F are placed in the accommodating cavity 300a of the main body 300, and ensure that the opening of the accommodating cavity 300a is covered by one side of the memory chip F on the carrier assembly 100 to form a closed test environment. Furthermore, the power module 200 is electrically connected to the carrier assembly 100 to supply power to the memory chip F. The power module 200 provides stable and accurate power to perform necessary electrical tests on the chip. After completing the above preparation steps, the test environment can be set up.

[0069] During the setting of the test environment, the main controller 600 starts the temperature control component 400 to adjust the temperature in the accommodating chamber 300a to a preset value. The temperature control component 400 may use compressor refrigeration or semiconductor refrigeration to meet different test requirements. At the same time, the humidity control component 500 adjusts the humidity in the accommodating chamber 300a to ensure that the test environment meets the test standards of the memory chip F to enter the test phase.

[0070] During the test execution phase, the main controller 600 controls the operation of the temperature control component 400 and the humidity control component 500 according to a preset test program, and monitors the performance indicators of the memory chip F. During the test, the main controller 600 collects the test data of the memory chip F and transmits it to an external device or network through an interface for analysis and recording.

[0071] After the test is completed, the main controller 600 turns off the temperature control component 400 and the humidity control component 500, and gradually restores the environment in the accommodating chamber 300a to room temperature. After the environment in the accommodating chamber 300a is stable, the operator can safely remove the memory chip F. Through the above steps, the memory chip F test device can perform a comprehensive performance test on the memory chip F in a precisely controlled environment. The coordination between the various components not only ensures the accuracy and reliability of the test, but also improves the automation and efficiency of the test process. This test device is of great significance for evaluating the stability and reliability of the memory chip F in extreme environments.

[0072] In the technical solution of this embodiment, the bearing assembly 100 is covered on the body 300 to close the accommodating cavity 300a of the body 300, so that the body 300 has the conditions for manufacturing a low-temperature environment, and then the temperature control assembly 400 and the humidity adjustment assembly are arranged on the body 300 to create suitable humidity and temperature test conditions in the accommodating cavity 300a. These conditions are further regulated and maintained by the main controller 600 to ensure that the temperature and humidity of the test environment remain stable. In this way, it is avoided that the moisture on the surface of the storage chip F and in the air condenses into ice in a low-temperature test environment, which may affect the electrical characteristics of the chip, thereby reducing the probability of inaccurate test results.

[0073] Continue reading Figure 1 In this embodiment, the temperature control component 400 includes:

[0074] A cooling member 402, the output end of which is connected to the body 300, and is used to adjust the temperature in the accommodation cavity 300a;

[0075] The temperature control component 404 is provided in the body 300 or the refrigeration component 402, and is electrically connected to the main controller 600 and the refrigeration component 402, and is used to control the operation of the refrigeration component 402;

[0076] The humidity control assembly 500 includes:

[0077] The dehumidification component 502 is disposed in the accommodating chamber 300 a , and is electrically connected to the main controller 600 to adjust the humidity in the accommodating chamber 300 a under the control of the main controller 600 .

[0078] In this embodiment, the refrigeration component 402 is preferably a compressor refrigeration. The principle of compressor refrigeration is mainly based on the physical properties of the refrigerant. The refrigerant will undergo phase change under different pressures, thereby absorbing or releasing heat. In this process, there are mainly steps of compression, condensation, expansion and evaporation. In this embodiment, the reason why compressor refrigeration is adopted is that the compressor refrigeration system usually has a high energy efficiency ratio, can effectively convert energy for refrigeration, and this system can provide a continuous and stable refrigeration effect.

[0079] In this embodiment, when manufacturing the test environment, the main controller 600 issues a command, the temperature control component 404 starts and adjusts the operation of the refrigeration component 402 to achieve the preset temperature condition. At the same time, the main controller 600 also controls the operation of the dehumidification component 502 to ensure that the humidity in the accommodating chamber 300a meets the test requirements. The refrigeration component 402 works in conjunction with the humidity control component 500 and achieves fine adjustment of the test environment temperature and humidity through precise electronic control.

[0080] In this way, a highly controllable low-temperature test environment is provided. At the same time, by maintaining a stable temperature and humidity environment, test errors caused by environmental fluctuations can be avoided, and the repeatability and reliability of the test can be improved.

[0081] Further, the temperature control component 404 is a PID controller. The PID controller is a classic feedback control system, which consists of three main control strategies: proportional (P), integral (I) and differential (D), where:

[0082] 1. Proportional (P): The controller output is proportional to the error signal, that is, the larger the current error, the stronger the controller response.

[0083] 2. Integral (I): The controller output is proportional to the accumulated time of the error signal, which helps to eliminate steady-state errors and ensure that the system can eventually reach the set value.

[0084] 3. Derivative (D): The controller output is proportional to the rate of change of the error signal, which helps predict the future trend of the error and make adjustments in advance.

[0085] In this way, the PID controller can accurately control and maintain the temperature of the test environment through the synergistic effect of its proportional, integral and differential links, ensuring the stability of the test environment.

[0086] In order to further ensure the stability of the test environment, it is necessary to detect the humidity and temperature in the receiving chamber 300a in real time, which can be detected by using sensors, such as Figure 1 As shown, the temperature control assembly 400 also includes:

[0087] The temperature sensor 406 is disposed in the accommodating chamber 300a and is electrically connected to the main controller 600. The temperature sensor 406 is used to feed back the temperature in the accommodating chamber 300a to the main controller 600;

[0088] The humidity control assembly 500 further includes:

[0089] The humidity sensor 506 is disposed in the accommodating chamber 300a and is spaced apart from the temperature sensor 406. The humidity sensor 506 is electrically connected to the main controller 600 and is used to feedback the humidity in the accommodating chamber 300a.

[0090] In this embodiment, in order to ensure the stability of the test environment, the temperature sensor 406 and the humidity sensor 506 play a key role in real-time monitoring of the environment in the accommodation cavity 300a, wherein the temperature sensor 406 can be a thermocouple, a thermistor (such as PT100 or NTC), or a semiconductor temperature sensor 406. Among them, the thermocouple determines the temperature by measuring the thermoelectric potential difference between two different metals; the thermistor changes its resistance value according to the temperature change; the semiconductor sensor detects the temperature by using the property that the conductivity of the semiconductor material changes with the temperature. These sensors usually respond quickly, have high accuracy, can work in a wide temperature range, and are suitable for precise temperature control and monitoring.

[0091] Commonly used humidity sensors 506 include capacitive humidity sensors 506 and resistive humidity sensors 506. The capacitive humidity sensor 506 measures the effect of air humidity on capacitance, while the resistive humidity sensor 506 measures the change in resistance caused by humidity change.

[0092] In summary, both types of sensors are able to provide continuous and accurate humidity readings, are responsive to environmental changes, and help maintain a constant humidity in the test environment.

[0093] In this embodiment, by electrically connecting these sensors to the main controller 600, the temperature and humidity in the accommodating chamber 300a can be monitored and adjusted in real time to ensure the stability of the test environment. This is crucial for the reliability test of the memory chip F, because they usually need to be evaluated under specific temperature and humidity conditions. This real-time monitoring and control capability not only improves the accuracy of the test, but also enhances the degree of automation of the test process, thereby improving the overall test efficiency and reliability.

[0094] See also Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the back structure of the mainboard in one embodiment of the utility model. Figure 3 FIG. 1 is a schematic diagram of the structure of a memory chip F testing device in another embodiment of the present invention.

[0095] The temperature sensor 406 and the humidity sensor 506 are integrated into a module 508, and the module 508 is installed in the accommodation cavity 300a;

[0096] The module 508 is electrically connected to the main controller 600 and is used to feed back the environmental parameters in the accommodating cavity 300a.

[0097] In this embodiment, the temperature sensor 406 and the humidity sensor 506 are integrated into a module 508, which can adopt a temperature and humidity sensor 506 module 508: this module 508 usually includes a temperature sensor 406 and a humidity sensor 506, which are designed to work on the same chip or in a closely connected unit. This embodiment adopts this integration method because the integrated module 508 is usually lower in cost than a separate sensor because they can share some circuits, and a module 508 is easier to install and maintain than two separate sensors.

[0098] Continue reading Figure 2 In this embodiment, the bearing assembly 100 includes:

[0099] A carrier plate 102, which covers the opening of the accommodating cavity 300a and has at least two test sockets 104 for carrying the memory chip F;

[0100] The main controller 600 is disposed on a side of the carrier board 102 facing away from the test socket 104 .

[0101] In this embodiment, the carrier board 102 is used as a circuit board, which provides a stable and reliable platform for carrying the memory chip F and various devices. In the above embodiments, it is mentioned that the main board should be made of materials that can maintain physical stability and mechanical strength at extremely low temperatures. For example, high-performance plastics such as polyimide or polytetrafluoroethylene (PTFE) can be used, which can maintain good performance even at liquid nitrogen temperatures as low as -196°C.

[0102] In addition, in the present embodiment, at least two test sockets 104 are designed on the carrier board 102, and these test sockets 104 are used to fix and connect the memory chip F to be tested. These test sockets 104 can be socket-type, which is convenient for the rapid installation and replacement of the memory chip F. Of course, in some embodiments, the number of test sockets 104 can be more, such as 10, 16, 20, etc. For example, the test socket 104 designed to support multiple SPI interfaces can test 16 SPI NAND FLASH chips at the same time, thereby improving the test efficiency and work efficiency.

[0103] In this embodiment, when there are many test sockets 104, the power module 200 is allowed to control the power supply of each test socket 104 individually, or to supply power to multiple test sockets 104 at the same time. In this way, it is possible to select to supply power individually or simultaneously according to the test requirements. For example, when performing tests on different types of memory chips F, the test durations of different types of memory chips F are different, and the power module 200 can disconnect the power supply of the memory chip F after the test is completed to avoid waste of electric energy.

[0104] When batch testing of multiple memory chips F is required, powering multiple test sockets 104 simultaneously can significantly improve test efficiency and shorten test cycles. By centralized power supply, the number of power modules 200 required can also be reduced, thereby reducing costs and space requirements.

[0105] Furthermore, to increase the life of the carrier board 102, a three-conformal coating may be applied to one side of the carrier board 102 where the test socket 104 is provided. The three-conformal coating may be a waterproof, dustproof and anti-corrosion coating to ensure the stability and service life of the back of the motherboard in a low temperature environment for a long time.

[0106] See also Figure 3 , Figure 3 FIG. 1 is a schematic diagram of the structure of a memory chip F testing device in another embodiment of the present invention.

[0107] The main controller 600 includes:

[0108] The data acquisition module 602 is electrically connected to the module 508. The data acquisition module 602 obtains the environmental parameters in the accommodation cavity 300a through the module 508 and is also electrically connected to the carrier assembly 100 to collect the test data of the storage chip F;

[0109] The data processing module 604 controls the operation of the temperature control component 400 and the humidity control component 500 according to the environmental parameters, and performs the read and write operations of the storage chip F and the processing of the test data.

[0110] In this embodiment, the data acquisition module 602 mainly obtains the environmental parameters (temperature and humidity information) in the accommodation chamber 300a through the module 508 (i.e., the temperature control component 400 and the humidity control component 500), and then transmits the data to the data processing module 604. After receiving the collected data, the data processing module 604 processes the data according to the preset algorithm and logic. This includes calibration and filtering of the temperature and humidity data, and parsing and analyzing the read and write data of the storage chip F. At the same time, the temperature control component 400 and the humidity control component 500 are controlled according to these parameters to maintain an ideal test environment.

[0111] Furthermore, the data acquisition module 602 includes a microcontroller, which is an STM32H743 microcontroller, and the data processing module 604 is a single chip microcomputer.

[0112] In the present embodiment, the reason why the STM32H7 series microcontroller is selected is that it has a high-performance ARMCortex-M7 core, rich peripherals and interfaces, and a strong processing capability to meet the needs of supporting multiple SPI NANDFLASH (storage chip F) tests at the same time. When collecting data, the environmental parameters such as temperature and humidity of the closed cavity of the low-temperature environment, as well as the read-write operation and verification data of the SPI NAND FLASH chip are collected in real time through its built-in analog-to-digital converter (ADC) and other peripherals.

[0113] The microcontroller processes data according to preset algorithms and logics, and finally generates a detailed test report. Testers can evaluate and judge whether the SPI NAND FLASH can work normally and whether its performance is stable in a low-temperature environment based on the test report.

[0114] The utility model further proposes a memory chip F testing system, such as Figure 4 As shown, it includes a host computer 700 and the aforementioned memory chip F test device. The specific structure of the memory chip F test device refers to the above embodiment. Since the memory chip F test system adopts all the technical solutions of all the above embodiments, it at least has all the technical effects brought by the technical solutions of the above embodiments, which will not be repeated here. Among them, the host computer 700 is connected to the main controller 600 for sending test instructions to the main controller 600.

[0115] In this embodiment, the host computer 700 is connected to the main controller 600 for communication. In addition to sending test instructions to the main controller 600, the host computer 700 also receives the test report generated by the single-chip microcomputer and can display it in real time on the display screen for real-time observation by the user. The memory chip F test system of this embodiment adopts the memory chip test device of the above embodiment, which avoids the condensation of moisture on the surface of the memory chip F and in the air into ice in a low-temperature test environment, which may affect the electrical characteristics of the chip, thereby reducing the probability of inaccurate test results.

[0116] The above description is only a partial or preferred embodiment of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.

Claims

1. A memory chip testing device, characterized in that: include: A carrying component, the carrying component is used to carry the memory chip to be tested; A power module, electrically connected to the carrier assembly, and used to supply power to the memory chip to be tested located on the carrier assembly; A body, wherein a receiving cavity is formed inside the body, and a cover on a side of the carrying assembly carrying the storage chip is disposed at an opening of the receiving cavity to close the receiving cavity; A temperature control component, the output end of which is connected to the body and is used to adjust the temperature of the accommodating cavity; A humidity control component is disposed in the accommodating cavity and is used to control the humidity in the accommodating cavity; A main controller is arranged on the bearing component, and the main controller is electrically connected to and controls the operation of the temperature control component and the humidity control component.

2. The memory chip testing device according to claim 1, characterized in that: The temperature control component comprises: A refrigeration component, the output end of which is connected to the body and is used to adjust the temperature in the accommodating cavity; A temperature control component, provided on the body or the refrigeration component, electrically connected to the main controller and the refrigeration component, and used to control the operation of the refrigeration component; The humidity control component comprises: A dehumidification component is disposed in the accommodating chamber and is electrically connected to the main controller to adjust the humidity in the accommodating chamber under the control of the main controller.

3. The memory chip testing device according to claim 2, characterized in that: The temperature control component is a PID controller.

4. The memory chip testing device according to claim 2, characterized in that: The temperature control component also includes: a temperature sensor, disposed in the accommodating chamber and electrically connected to the main controller, the temperature sensor being used to feed back the temperature in the accommodating chamber to the main controller; The humidity control component also includes: A humidity sensor is disposed in the accommodating cavity and spaced apart from the temperature sensor. The humidity sensor is electrically connected to the main controller and is used to feed back the humidity in the accommodating cavity.

5. The memory chip testing device according to claim 4, characterized in that: The temperature sensor and the humidity sensor are integrated into a module, and the module is installed in the accommodating cavity; Wherein, the module is electrically connected to the main controller and is used to feed back the environmental parameters in the accommodating chamber.

6. The memory chip testing device according to claim 2, characterized in that: The bearing assembly comprises: A carrier plate, the carrier plate cover is arranged at the opening of the accommodating cavity, and the surface of the carrier plate is provided with at least two test sockets for carrying the memory chip; Wherein, the main controller is arranged on a side of the carrying plate facing away from the test seat.

7. The memory chip testing device according to claim 6, characterized in that: The side of the carrier plate provided with the test seat is coated with a triple-conformal coating.

8. The memory chip testing device according to claim 5, characterized in that: The main controller comprises: A data acquisition module, the data acquisition module is electrically connected to the module, the data acquisition module obtains environmental parameters in the accommodating cavity through the module, and is also electrically connected to the bearing assembly, and is used to collect test data of the storage chip; The data processing module controls the operation of the temperature control component and the humidity control component according to the environmental parameters, and performs the read and write operations of the storage chip and the processing of the test data.

9. The memory chip testing device according to claim 8, characterized in that: The data acquisition module comprises a microcontroller, the microcontroller is an STM32H7 microcontroller, and the data processing module is a single chip microcomputer.

10. A memory chip testing system, characterized in that: It comprises a host computer and the storage chip testing device according to any one of claims 1 to 9, wherein the host computer is communicatively connected to the main controller so as to send a test instruction to the main controller.

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