Power semiconductor module packaging structure

Abstract

The utility model discloses a power semiconductor module packaging structure which comprises a bottom plate, four corners of the bottom plate are fixedly connected with supporting rods, the top ends of the supporting rods are fixedly connected with a top plate, the upper surface of the bottom plate is fixedly connected with supporting legs, and the upper ends of the supporting legs are fixedly connected with a lower connecting plate. Two pneumatic push rods are fixedly connected to the lower surface of the top plate, the telescopic ends of the two pneumatic push rods are fixedly connected with an upper connecting plate, an upper mold and a lower mold are arranged between the upper connecting plate and the lower connecting plate, cooling grooves are formed in the upper mold and the lower mold, and the upper mold is fixedly connected with the lower surface of the upper connecting plate; the lower mold is fixedly connected with the upper surface of the lower connecting plate, the upper surface of the upper connecting plate and the lower surface of the lower connecting plate are both fixedly connected with heat dissipation mechanisms, the heat dissipation mechanisms are arranged to cool epoxy resin after epoxy resin injection molding is completed so that the epoxy resin can be cooled more rapidly, the working efficiency is improved, and meanwhile heat dissipation is rapid.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a power semiconductor module packaging structure. Background Art

[0002] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors.

[0003] In the prior art, the patent application number is CN214489343U, which discloses a semiconductor module packaging device, including a base and a first fixing member, a clamping assembly and a second fixing member installed on the base, the base is used to place a mold with a semiconductor module to be welded, the first fixing member, the clamping assembly and the second fixing member are arranged along a first direction, the mold is located between the first fixing member and the clamping assembly, and the first fixing member, the clamping assembly and the second fixing member cooperate to generate a force on the mold to clamp the semiconductor module to be welded. The semiconductor module packaging device in the utility model places the mold with the semiconductor module to be welded on the base, and the mold with the semiconductor module to be welded is clamped by the cooperation of the first fixing member, the clamping assembly and the second fixing member, so that the parallelism of the semiconductor module after welding is very good, the welding yield rate is improved, and the welding efficiency is greatly improved.

[0004] With respect to the above scheme, the following technical problems exist: during the manufacturing process of power semiconductors, they need to be packaged, and molding is required in the packaging process. At this time, a power semiconductor module packaging structure is required. When the power semiconductor packaging structure in the prior art is molded, it is necessary to use epoxy resin to injection mold the semiconductor module. After the injection molding, the epoxy resin needs to be cooled before the next process can be carried out, which greatly affects the efficiency of the packaging. Therefore, the power semiconductor module packaging structure in the prior art has the defect of low efficiency. Utility Model Content

[0005] The purpose of the utility model is to provide a power semiconductor module packaging structure to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a power semiconductor module packaging structure, comprising a bottom plate, wherein the four corners of the bottom plate are fixedly connected to support rods, the top ends of the support rods are fixedly connected to the top plate, the upper surface of the bottom plate is fixedly connected to support legs, the upper ends of the support legs are fixedly connected to the lower connecting plate, the lower surface of the top plate is fixedly connected to two pneumatic push rods, the telescopic ends of the two pneumatic push rods are fixedly connected to the upper connecting plate, an upper mold and a lower mold are arranged between the upper connecting plate and the lower connecting plate, and the interiors of the upper mold and the lower mold are A cooling groove is provided, the upper mold is fixedly connected to the lower surface of the upper connecting plate, the lower mold is fixedly connected to the upper surface of the lower connecting plate, the upper surface of the upper connecting plate and the lower surface of the lower connecting plate are both fixedly connected with a heat dissipation mechanism, the upper connecting plate and the upper mold are provided with injection ports, the injection ports extend to the outside and are fixedly connected to the surface with a control valve, the side end of the bottom plate is fixedly connected to a water tank, the upper end of the water tank is fixedly connected to a water pump, the water inlet of the water pump is connected to the water tank, and a number of pipes connect the heat dissipation mechanism, the upper mold, the lower mold and the water tank in series.

[0007] Preferably, the heat dissipation mechanism includes a first water tank, a second water tank, a heat dissipation fan and an aluminum extruded heat sink. The first water tank is fixedly mounted on the upper surface of the upper connecting plate, and the second water tank is fixedly mounted on the lower surface of the lower connecting plate.

[0008] Preferably, the surfaces of the first water tank and the second water tank are both fixedly connected with aluminum extruded heat sinks, and the upper end of the first water tank and the lower end of the second water tank are both fixedly connected with cooling fans.

[0009] Preferably, the water outlet of the water pump is fixedly connected to a water outlet pipe, the water outlet pipe extends to the interior of the second water tank, a first connecting pipe is fixedly connected between the second water tank and the first water tank, and the first connecting pipe is arranged at an end away from the water outlet pipe.

[0010] Preferably, the first water tank has one end away from the first connecting pipe fixedly connected to a second connecting pipe, and the second connecting pipe bypasses the control valve and extends to a cooling groove provided inside the upper mold.

[0011] Preferably, a third connecting pipe is arranged between the upper mold and the lower mold, one end of the third connecting pipe is fixedly connected to the cooling groove in the upper mold, the other end of the third connecting pipe is connected to the cooling groove in the lower mold, and the end of the cooling groove inside the lower mold away from the third connecting pipe is fixedly connected to a return water pipe, and the end of the return water pipe is fixedly connected to the water tank.

[0012] Beneficial Effects

[0013] The utility model provides a power semiconductor module packaging structure, which has the following beneficial effects:

[0014] 1. The packaging structure provides a heat dissipation mechanism to cool the epoxy resin after injection molding, so that the epoxy resin can be cooled more quickly, thereby increasing work efficiency. At the same time, through rapid heat dissipation, the external temperature of the device during packaging can be effectively reduced, preventing aging caused by long-term overheating and extending the service life of the device.

[0015] 2. This packaging structure can quickly transfer the heat generated by the power semiconductor module to the circulating water by setting the outlet pipe and the return pipe, and discharge it through the outlet pipe, thereby effectively reducing the operating temperature of the module and improving the heat dissipation effect. At the same time, the water circulation can effectively save the use of water resources. Especially for large-scale industrial applications, the water resources saved will be considerable. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the front section structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the front section structure of the upper mold and the lower mold of the utility model;

[0018] Figure 3 It is a schematic diagram of the top structure of the upper connecting plate of the utility model.

[0019] In the figure: 1. bottom plate; 2. support rod; 3. top plate; 4. support leg; 5. lower connecting plate; 6. pneumatic push rod; 7. upper connecting plate; 8. upper mold; 9. lower mold; 10. cooling trough; 11. heat dissipation mechanism; 12. injection port; 13. control valve; 14. water storage tank; 15. water pump; 16. first water tank; 17. second water tank; 18. cooling fan; 19. aluminum extruded heat sink; 20. water outlet pipe; 21. first connecting pipe; 22. second connecting pipe; 23. third connecting pipe; 24. return pipe. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-3The utility model provides a technical solution: a power semiconductor module packaging structure, including a bottom plate 1, four corners of the bottom plate 1 are fixedly connected with support rods 2, the top of the support rods 2 is fixedly connected with a top plate 3, the upper surface of the bottom plate 1 is fixedly connected with support legs 4, the upper ends of the support legs 4 are fixedly connected with a lower connecting plate 5, the lower surface of the top plate 3 is fixedly connected with two pneumatic push rods 6, the telescopic ends of the two pneumatic push rods 6 are fixedly connected with an upper connecting plate 7, and an upper mold 8 is arranged between the upper connecting plate 7 and the lower connecting plate 5 The lower mold 9, the upper mold 8 and the lower mold 9 are all provided with cooling grooves 10, the upper mold 8 is fixedly connected to the lower surface of the upper connecting plate 7, the lower mold 9 is fixedly connected to the upper surface of the lower connecting plate 5, the upper connecting plate 7 and the upper mold 8 are provided with injection ports 12, the injection ports 12 extend to the outside and are fixedly connected to the surface with a control valve 13, the pneumatic push rod 6 pushes the upper connecting plate 7 and the upper mold 8 downward, the upper mold 8 and the lower mold 9 are fitted, and the epoxy resin is injected into the mold through the injection port 12.

[0022] The upper surface of the upper connecting plate 7 and the lower surface of the lower connecting plate 5 are both fixedly connected with a heat dissipation mechanism 11, and the heat dissipation mechanism 11 includes a first water tank 16, a second water tank 17, a heat dissipation fan 18 and an aluminum extruded heat sink 19. The first water tank 16 is fixedly installed on the upper surface of the upper connecting plate 7, and the second water tank 17 is fixedly installed on the lower surface of the lower connecting plate 5. The surfaces of the first water tank 16 and the second water tank 17 are both fixedly connected with aluminum extruded heat sinks 19, and the upper end of the first water tank 16 and the lower end of the second water tank 17 are both fixedly connected with heat dissipation fans 18. The aluminum extruded heat sinks 19 arranged on the surfaces of the first water tank 16 and the second water tank 17 cool the water flow when it passes through, and the heat dissipation fan 18 continues to rotate to cool the entire box body and the aluminum extruded heat sink 19. By setting the heat dissipation mechanism 11 to cool the epoxy resin after the epoxy resin injection molding is completed, the epoxy resin is cooled more quickly, which increases the work efficiency. At the same time, through rapid heat dissipation, the external temperature of the device during packaging can be effectively reduced, and aging caused by long-term overheating can be prevented, thereby extending the service life of the device.

[0023] A water storage tank 14 is fixedly connected to the side end of the bottom plate 1, a water pump 15 is fixedly connected to the upper end of the water storage tank 14, a water outlet of the water pump 15 is fixedly connected to a water outlet pipe 20, the water outlet pipe 20 extends to the inside of the second water tank 17, a first connecting pipe 21 is fixedly connected between the second water tank 17 and the first water tank 16, and the first connecting pipe 21 is arranged at an end away from the water outlet pipe 20. A second connecting pipe 22 is fixedly connected to an end of the first water tank 16 away from the first connecting pipe 21, and the second connecting pipe 22 bypasses the control valve 13 and extends to the cooling groove 10 opened in the upper mold 8. A third connecting pipe 23 is arranged between the upper mold 8 and the lower mold 9, one end of the third connecting pipe 23 is fixedly connected to the cooling groove 10 in the upper mold 8, and the other end of the third connecting pipe 23 is connected to the cooling groove 10 in the lower mold 9.

[0024] The cooling groove 10 inside the lower mold 9 is fixedly connected to a return water pipe 24 at one end away from the third connecting pipe 23, and the end of the return water pipe 24 is fixedly connected to the water tank 14. The water pump 15 draws water from the water tank 14, and the water flows into the second water tank 17 through the outlet pipe 20 for cooling. The water then flows through the first connecting pipe 21 to the first water tank 16 for secondary cooling, and then the water flows into the cooling groove 10 opened inside the upper mold 8 and the lower mold 9 to cool the epoxy resin inside the mold. Finally, the water flows back to the water tank 14 through the return water pipe 24. By setting the outlet pipe 20 and the return water pipe 24, the heat generated by the power semiconductor module can be quickly transferred to the circulating water and discharged through the outlet pipe 20, thereby effectively reducing the operating temperature of the module and improving the heat dissipation effect. At the same time, water circulation can effectively save the use of water resources. Especially for large-scale industrial applications, the saved water resources will be considerable.

[0025] Instructions for use: First, start the pneumatic push rod 6 to push the upper connecting plate 7 and the upper mold 8 downward, so that the upper mold 8 and the lower mold 9 fit together, and the epoxy resin is injected into the mold through the injection port 12. After the injection is completed, the water pump 15 draws water from the water storage tank 14, and the water flows through the outlet pipe 20 into the second water tank 17 for cooling. The water then flows through the first connecting pipe 21 to the first water tank 16 for secondary cooling. The water then flows into the cooling groove 10 opened inside the upper mold 8 and the lower mold 9 to cool the epoxy resin inside the mold. Finally, the water flows back to the water storage tank 14 through the return pipe 24.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A power semiconductor module packaging structure, comprising a base plate (1), characterized in that: The four corners of the bottom plate (1) are fixedly connected to support rods (2), the top ends of the support rods (2) are fixedly connected to the top plate (3), the upper surface of the bottom plate (1) is fixedly connected to support legs (4), the upper ends of the support legs (4) are fixedly connected to the lower connecting plate (5), the lower surface of the top plate (3) is fixedly connected to two pneumatic push rods (6), the telescopic ends of the two pneumatic push rods (6) are fixedly connected to the upper connecting plate (7), an upper mold (8) and a lower mold (9) are arranged between the upper connecting plate (7) and the lower connecting plate (5), cooling grooves (10) are provided inside the upper mold (8) and the lower mold (9), and the upper mold (8) is fixedly connected to the lower surface of the upper connecting plate (7). The lower mold (9) is fixedly connected to the upper surface of the lower connecting plate (5); the upper surface of the upper connecting plate (7) and the lower surface of the lower connecting plate (5) are both fixedly connected with a heat dissipation mechanism (11); the upper connecting plate (7) and the upper mold (8) are provided with an injection port (12); the injection port (12) extends to the outside and is fixedly connected to a control valve (13) on the surface; the side end of the bottom plate (1) is fixedly connected to a water storage tank (14); the upper end of the water storage tank (14) is fixedly connected to a water pump (15); the water inlet of the water pump (15) is connected to the water storage tank (14); and a plurality of pipelines connect the heat dissipation mechanism (11), the upper mold (8), the lower mold (9) and the water storage tank (14) in series.

2. A power semiconductor module packaging structure according to claim 1, characterized in that: The heat dissipation mechanism (11) comprises a first water tank (16), a second water tank (17), a heat dissipation fan (18) and an aluminum extruded heat sink (19); the first water tank (16) is fixedly mounted on the upper surface of the upper connecting plate (7), and the second water tank (17) is fixedly mounted on the lower surface of the lower connecting plate (5).

3. A power semiconductor module packaging structure according to claim 2, characterized in that: Aluminum extruded heat sinks (19) are fixedly connected to the surfaces of the first water tank (16) and the second water tank (17), and a cooling fan (18) is fixedly connected to the upper end of the first water tank (16) and the lower end of the second water tank (17).

4. A power semiconductor module packaging structure according to claim 3, characterized in that: The water outlet of the water pump (15) is fixedly connected to a water outlet pipe (20), the water outlet pipe (20) extends to the interior of the second water tank (17), a first connecting pipe (21) is fixedly connected between the second water tank (17) and the first water tank (16), and the first connecting pipe (21) is arranged at an end away from the water outlet pipe (20).

5. A power semiconductor module packaging structure according to claim 4, characterized in that: A second connecting pipe (22) is fixedly connected to one end of the first water tank (16) away from the first connecting pipe (21); the second connecting pipe (22) bypasses the control valve (13) and extends into a cooling groove (10) provided inside the upper mold (8).

6. A power semiconductor module packaging structure according to claim 5, characterized in that: A third connecting pipe (23) is arranged between the upper mold (8) and the lower mold (9); one end of the third connecting pipe (23) is fixedly connected to the cooling groove (10) in the upper mold (8); the other end of the third connecting pipe (23) is connected to the cooling groove (10) in the lower mold (9); one end of the cooling groove (10) in the lower mold (9) away from the third connecting pipe (23) is fixedly connected to a return pipe (24); the end of the return pipe (24) is fixedly connected to the water storage tank (14).

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