GPP chip splitting structure

Abstract

The utility model discloses a GPP chip splitting structure, which relates to the technical field of chip manufacturing, and comprises a GPP chip, a silicon wafer or a passivation glass layer is fixedly connected onto the GPP chip, a mask sheet is arranged on the silicon wafer or the passivation glass layer, an accommodating blind hole is arranged at the lower part of the mask sheet, an adaptive groove is arranged at the lower part of the mask sheet, and the accommodating blind hole is communicated with the adaptive groove. And a tightening ring is fixedly connected in the adaptive groove, and the tightening ring has elasticity. Through the arrangement of the adaptive groove and the tightening ring, the precision of the accommodating blind hole can be reduced, it is ensured that the mask sheet can be fastened on a silicon wafer or a passivation glass layer, it is ensured that splitting is carried out smoothly, and the reject ratio is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip manufacturing, in particular to a GPP chip split structure. Background Art

[0002] In the related art, CN 205069593 U discloses a GPP chip split structure, comprising a GPP chip, a silicon wafer or a passivation glass layer, and a mask wafer; a silicon wafer or a passivation glass layer is fixed on the GPP chip; a blind hole is provided at the bottom of the mask wafer, and the shape of the blind hole structure is completely consistent with that of the silicon wafer or the passivation glass layer. The mask wafer is tightly pressed and covered on the silicon wafer or the passivation glass layer, so that the silicon wafer or the passivation glass layer is embedded in the blind hole at the bottom of the mask wafer.

[0003] However, in this structure, the blind hole accuracy requirement of the mask sheet is relatively high, and it is easy for the silicon sheet or the passivation glass layer to be incompletely protected, thereby affecting the integrity of the split sheet and making it inconvenient to use. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, one of the purposes of the utility model is to provide a GPP chip splitting structure, which can reduce the precision of accommodating blind holes by setting up adapter grooves and tightening rings, ensure that the mask sheet can be fastened to the silicon wafer or the passivation glass layer, ensure the smooth splitting, and reduce the defective rate.

[0005] One of the purposes of the utility model is achieved by the following technical solution: a GPP chip splitting structure, comprising a GPP chip, a silicon wafer or a passivation glass layer is fixedly connected to the GPP chip, a mask sheet is arranged on the silicon wafer or the passivation glass layer, a blind hole is arranged at the lower part of the mask sheet, an adapting groove is arranged at the lower part of the mask sheet, a tightening ring is fixedly connected in the adapting groove, and the tightening ring is elastic. By setting the adapting groove and the tightening ring, the precision of the blind hole can be reduced, the mask sheet can be fastened to the silicon wafer or the passivation glass layer, the smooth splitting can be ensured, and the defective rate can be reduced.

[0006] According to the GPP chip splitting structure, the thickness of the adapting groove is 1 / 3 of the thickness of the mask sheet.

[0007] According to the GPP chip splitting structure, the receiving blind hole is adapted to the silicon wafer or the passivation glass layer. Beneficial Effects

[0008] Compared with the prior art, the present invention can reduce the precision of accommodating blind holes by setting up adapter grooves and tightening rings, ensure that the mask sheet can be fastened to the silicon wafer or the passivation glass layer, ensure smooth chipping, and reduce the defective rate.

[0009] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0011] Figure 1 This is a schematic diagram of the structure of a GPP chip split structure of the utility model;

[0012] Figure 2 This is a structural schematic diagram of a tightening ring and a mask sheet of a GPP chip split structure of the utility model;

[0013] Figure 3 It is a schematic diagram of the structure of a tightening ring and a mask sheet of a GPP chip split structure according to the utility model from a bottom perspective;

[0014] Figure 4 This is an enlarged view of the adapting groove part of a GPP chip split structure of the utility model.

[0015] Legend:

[0016] 1. Silicon wafer or passivation glass layer; 2. GPP chip; 3. Tightening ring; 4. Mask sheet; 401. Accommodating blind hole; 402. Adapter groove. DETAILED DESCRIPTION

[0017] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0018] Reference Figure 1-4The utility model embodiment provides a GPP chip split structure, which includes a GPP chip 2, a silicon wafer or a passivation glass layer 1 is fixedly connected to the GPP chip 2, a mask sheet 4 is arranged on the silicon wafer or the passivation glass layer 1, a blind hole 401 is arranged at the lower part of the mask sheet 4, and the blind hole 401 is adapted to the silicon wafer or the passivation glass layer 1, and an adapting groove 402 is arranged at the lower part of the mask sheet 4, and the thickness of the adapting groove 402 is 1 / 3 of the thickness of the mask sheet 4, and the adapting groove 402 A tightening ring 3 is fixedly connected inside, and the tightening ring 3 is elastic. When in use, the mask sheet 4 is completely covered on the silicon wafer or the passivation glass layer 1, and the precision of the blind hole 401 can be reduced. When the blind hole 401 is large, the tightening ring 3 can provide a tightening force in the inner radial direction. When the blind hole 401 is small, the tightening ring 3 can expand outward to adapt to the silicon wafer or the passivation glass layer 1, thereby ensuring that the mask sheet 4 can provide good protection performance and reduce the defect rate. By setting the adapting groove 402 and the tightening ring 3, the precision of the blind hole 401 can be reduced, ensuring that the mask sheet 4 can be fastened to the silicon wafer or the passivation glass layer 1, ensuring the smooth cracking, and reducing the defect rate.

[0019] Working principle: When in use, the mask sheet 4 completely covers the silicon wafer or the passivation glass layer 1, and can reduce the accuracy of the blind hole 401. When the blind hole 401 is larger, the tightening ring 3 can provide an inner radial tightening force. When the blind hole 401 is smaller, the tightening ring 3 can expand outward to adapt to the silicon wafer or the passivation glass layer 1, thereby ensuring that the mask sheet 4 can provide good protection performance and reduce the defective rate.

[0020] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A GPP chip splitting structure, comprising a GPP chip (2), a silicon wafer or a passivation glass layer (1) being fixedly connected to the GPP chip (2), a mask sheet (4) being arranged on the silicon wafer or the passivation glass layer (1), characterized in that: The lower part of the mask sheet (4) is provided with a accommodating blind hole (401), the lower part of the mask sheet (4) is provided with an adapting groove (402), a tightening ring (3) is fixedly connected in the adapting groove (402), and the tightening ring (3) is elastic.

2. A GPP chip splitting structure according to claim 1, characterized in that: The thickness of the adaptation groove (402) is 1 / 3 of the thickness of the mask sheet (4).

3. A GPP chip splitting structure according to claim 1, characterized in that: The receiving blind hole (401) is adapted to the silicon wafer or the passivation glass layer (1).

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